V23990-P690-G12-PM target datasheet flowCON 2 1200V/150A Features Flow 2 housing ● Input rectifier with brake ● With flowPACK 2 up to 30 kW inverters ● Press-fir pins for easy assembly Target Applications Schematic ● Motor Drive ● Power Generation Types ● V23990-P690-G12-PM Maximum Ratings Tj=25°C, unless otherwise specified Parameter Condition Symbol Value Unit 1600 V 174 160 A 2000 A 13600 A2s 209 317 W Tjmax 150 °C VRRM 1600 V 150 180 A 1250 A 7810 A 2s 198 300 W 130 °C Input Rectifier Diode Repetitive peak reverse voltage VRRM DC forward current IFAV Surge forward current IFSM I2t-value I2t Power dissipation per Diode Ptot Maximum Junction Temperature Tj=Tjmax Th=80°C Tc=80°C tp=10ms Tj=25°C Tj=Tjmax Th=80°C Tc=80°C Input Rectifier Thyristor Repetitive peak reverse voltage Forward average current IFAV Surge forward current IFSM I2t-value I2t Power dissipation per Thyristor Ptot Maximum Junction Temperature copyright Vincotech sine,d=0.5 Tj=Tjmax Th=80°C Tc=80°C tp=10ms Tj=25°C Tj=Tjmax Tjmax 1 Th=80°C Tc=80°C Revision: 1 V23990-P690-G12-PM target datasheet Maximum Ratings Tj=25°C, unless otherwise specified Parameter Condition Symbol Value Unit 1200 V 114 120 A 300 A 200 A 245 372 W ±20 V Brake Transistor Collector-emitter break down voltage DC collector current Repetitive peak collector current VCE IC ICpuls Power dissipation per IGBT Ptot Gate-emitter peak voltage VGE Maximum Junction Temperature Tc=80°C tp limited by Tjmax VCE ≤ 1200V, Tj ≤ Top max Turn off safe operating area Short circuit ratings Th=80°C Tj=Tjmax Th=80°C Tc=80°C Tj=Tjmax tSC Tj≤150°C 10 VCC VGE=15V 360 µs V 175 °C 1200 V 12 12 A 15 A 38 58 W 150 °C Tjmax Brake Inverse Diode Peak Repetitive Reverse Voltage DC forward current VRRM IF Tc=25°C Th=80°C Tc=80°C Tj=Tjmax Repetitive peak forward current IFRM tp limited by Tjmax Brake Inverse Diode Ptot Tj=Tjmax Maximum Junction Temperature Th=80°C Tc=80°C Tjmax Brake Diode Peak Repetitive Reverse Voltage VRRM Tj=25°C 1200 Th=80°C Tc=80°C V 58 77 A 100 A 109 165 W Tjmax 175 °C Storage temperature Tstg -40…+125 °C Operation temperature under switching condition Top -40…+(Tjmax - 25) °C 4000 V Creepage distance min 12,7 mm Clearance min 12,7 mm DC forward current IF Tj=Tjmax Repetitive peak forward current IFRM tp limited by Tjmax Power dissipation per Diode Ptot Tj=Tjmax Maximum Junction Temperature Th=80°C Tc=80°C Thermal Properties Insulation Properties Insulation voltage Comparative tracking index copyright Vincotech Vis t=2s DC voltage CTI >200 2 Revision: 1 V23990-P690-G12-PM target datasheet Characteristic Values Parameter Conditions Symbol VGE [V] or VGS [V] Vr [V] or VCE [V] or VDS [V] Value IC [A] or IF [A] or ID [A] Tj Min Typ Unit Max Input Rectifier Diode Forward voltage VF Threshold voltage (for power loss calc. only) Vto Slope resistance (for power loss calc. only) rt Reverse current Ir Thermal resistance chip to heatsink per chip RthJH Thermal resistance chip to heatsink per chip RthJC 106 1600 Tj=25°C Tj=125°C Tj=25°C Tj=125°C Tj=25°C Tj=125°C Tj=25°C Tj=125°C 1,24 1,20 0,95 0,78 1,70 2,49 0,1 Thermal grease thickness≤50um λ = 1 W/mK V V mΩ mA 0,33 K/W 0,22 Input Rectifier Thyristor Forward voltage VF Threshold voltage (for power loss calc. only) Vto 125 Slope resistance (for power loss calc. only) rt 125 Reverse current Gate controlled delay time Ig=100mA 125 Ir 1500 tGD 1072 Ig=1A; dIg/dt=1A/us; Gate controlled rise time tGR Critical rate of rise of off-state voltage (dv/dt)cr Critical rate of rise of on-state current (di/dt)cr Circuit commutated turn-off time tq Holding current IH Latching current IL Gate trigger voltage VGT Gate trigger current IGT Gate non-trigger voltage VGD Gate non-trigger current IGD Thermal resistance chip to heatsink per chip RthJH Thermal resistance chip to case per chip RthJC copyright Vincotech Rg=33Ω Thermal grease thickness≤50um λ = 1 W/mK Tj=25°C Tj=125°C Tj=25°C Tj=125°C Tj=25°C Tj=125°C Tj=25°C Tj=125°C Tj=25°C Tj=125°C Tj=25°C Tj=125°C Tj=25°C Tj=125°C Tj=25°C Tj=125°C Tj=25°C Tj=125°C Tj=25°C Tj=125°C Tj=25°C Tj=125°C Tj=25°C Tj=125°C Tj=25°C Tj=125°C Tj=25°C Tj=125°C Tj=25°C Tj=125°C 0,8 1,32 1,27 1,08 0,98 0,0020 0,0023 1,55 V V mΩ 450 1 mA µs 2 µs 200 1000 V/µs A/µs µs 157 150 mA 300 mA 2 V 150 mA 0,25 10 V mA 0,25 K/W 0,17 3 Revision: 1 V23990-P690-G12-PM target datasheet Characteristic Values Parameter Conditions Symbol VGE [V] or VGS [V] Vr [V] or VCE [V] or VDS [V] Value IC [A] or IF [A] or ID [A] Tj Unit Min Typ Max 5 5,8 6,5 Brake Transistor Gate emitter threshold voltage VGE(th) VCE=VGE 0,004 Collector-emitter saturation voltage VCE(sat) 15 Collector-emitter cut-off incl diode ICES 0 1200 Gate-emitter leakage current IGES 20 0 Integrated Gate resistor Rgint Turn-on delay time td(on) Rise time Turn-off delay time Fall time 100 tf Turn-on energy loss per pulse Eon Turn-off energy loss per pulse Eoff Input capacitance Cies Output capacitance Coss Reverse transfer capacitance Crss Gate charge QGate Thermal resistance chip to heatsink per chip RthJH Thermal resistance chip to case per chip RthJC 2,20 2,75 600 Rgoff=X Ω Rgon=X Ω 600 ±15 100 Tj=25°C Tj=150°C Tj=25°C Tj=150°C Tj=25°C Tj=150°C Tj=25°C Tj=150°C Tj=25°C Tj=150°C Tj=25°C Tj=150°C V V 13,4 7,5 tr td(off) Tj=25°C Tj=150°C Tj=25°C Tj=150°C Tj=25°C Tj=150°C Tj=25°C Tj=150°C µA nA Ω tbd tbd ns tbd tbd tbd mWs tbd 7210 f=1MHz 25 0 Tj=25°C 377 Tj=25°C 800 pF 327 Thermal grease thickness≤50um λ = 1 W/mK nC 0,39 K/W 0,26 Brake Inverse Diode Diode forward voltage VF Thermal resistance chip to heatsink per chip RthJH Thermal resistance chip to case per chip RthJC 10 Tj=25°C Tj=125°C 1 Thermal grease thickness≤50um λ = 1 W/mK 1,59 1,54 2,3 V 1,83 K/W 1,20 Brake Diode Diode forward voltage Reverse leakage current Peak reverse recovery current VF Ir trr Reverse recovered charge Qrr 1200 Rgon=X Ω Rgon=0 Ω 15 300 di(rec)max /dt Reverse recovery energy Erec Thermal resistance chip to heatsink per chip RthJH Thermal resistance chip to case per chip RthJC copyright Vincotech Rgon=X Ω IRRM Reverse recovery time Peak rate of fall of recovery current 50 Thermal grease thickness≤50um λ = 1 W/mK 20 Tj=25°C Tj=150°C Tj=25°C Tj=150°C Tj=25°C Tj=150°C Tj=25°C Tj=150°C Tj=25°C Tj=150°C Tj=25°C Tj=150°C Tj=25°C Tj=150°C 1 1,69 1,71 2,3 250 tbd tbd tbd tbd tbd V µA A ns µC A/µs mWs 0,87 K/W 0,58 4 Revision: 1 V23990-P690-G12-PM target datasheet Ordering Code and Marking - Outline - Pinout Ordering Code & Marking Version Ordering Code in DataMatrix as in packaging barcode as without thermal paste 17mm housing V23990-P690-G12-PM P690G12 P690G12 Outline Pinout copyright Vincotech 5 Revision: 1 V23990-P690-G12-PM target datasheet PRODUCT STATUS DEFINITIONS Datasheet Status Target Preliminary Final Product Status Definition Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. The data contained is exclusively intended for technically trained staff. First Production This datasheet contains preliminary data, and supplementary data may be published at a later date. Vincotech reserves the right to make changes at any time without notice in order to improve design. The data contained is exclusively intended for technically trained staff. Full Production This datasheet contains final specifications. Vincotech reserves the right to make changes at any time without notice in order to improve design. The data contained is exclusively intended for technically trained staff. DISCLAIMER The information given in this datasheet describes the type of component and does not represent assured characteristics. For tested values please contact Vincotech.Vincotech reserves the right to make changes without further notice to any products herein to improve reliability, function or design. Vincotech does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. LIFE SUPPORT POLICY Vincotech products are not authorised for use as critical components in life support devices or systems without the express written approval of Vincotech. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in labelling can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. copyright Vincotech 6 Revision: 1