10-PZ12B2A040MR01-M330L68Y target datasheet flowBOOST 0 SiC 1200V/ 40mΩ Features flowBOOST 0 SiC TM ● Rohm SiC-Power MOSFET´s and Schottky Diodes ● Dual Boost Topology ● Ultra Low Inductance with Integrated DC-capacitors ● Extremely Fast Switching with No "Tail" Current ● Solderless Press-fit Mounting Technology ● Temperature sensor Schematic Target Applications ● Solar Inverter ● Power Supply Types ● 10-PZ12B2A040MR01-M330L68Y Maximum Ratings Tj=25°C, unless otherwise specified Parameter Condition Symbol Value Unit 1200 V 30 A 160 A 58 W T1, T3 Boost MOSFET Drain to source breakdown voltage DC drain current Pulsed drain current VDS ID IDpulse Tj=Tjmax Th=80°C tp limited by Tjmax Ptot Gate-source peak voltage VGS -6 / 22 V Tjmax 150 °C VRRM 1200 V 33 A 96 A 80 W 175 °C Maximum Junction Temperature Tj=Tjmax Th=80°C Power dissipation D2, D4 Boost Diode Peak Repetitive Reverse Voltage DC forward current IF Tj=Tjmax Repetitive peak forward current IFRM tp limited by Tjmax Power dissipation per Diode Ptot Tj=Tjmax Maximum Junction Temperature copyright Vincotech Tjmax 1 Th=80°C Th=80°C Revision: 1 10-PZ12B2A040MR01-M330L68Y target datasheet Maximum Ratings Tj=25°C, unless otherwise specified Parameter Condition Symbol Value Unit 1600 V 30 A 370 A 39 W Tjmax 150 °C VMAX 1000 V Storage temperature Tstg -40…+125 °C Operation temperature under switching condition Top -40…+(Tjmax - 25) °C 4000 V D1,D3 Protection diode VRRM Tc=25°C IF Tj=Tjmax Surge forward current IFSM tp=10ms Power dissipation per Diode Ptot Tj=Tjmax Peak Repetitive Reverse Voltage DC forward current Maximum Junction Temperature Th=80°C Th=80°C C1, C2 Max.DC voltage Thermal Properties Insulation Properties Insulation voltage Vis Comparative tracking index CTI copyright Vincotech t=2s DC voltage >200 2 Revision: 1 10-PZ12B2A040MR01-M330L68Y target datasheet Characteristic Values Parameter Conditions Symbol VGE [V] or VGS [V] Vr [V] or VCE [V] or VDS [V] Value IC [A] or IF [A] or ID [A] Tj Min Typ Unit Max T1, T3 Boost MOSFET Static drain to source ON resistance Rds(on) Gate threshold voltage V(GS)th 18 20 VDS=VGS 0,0088 Gate to Source Leakage Current Igss -6/22 0 Zero Gate Voltage Drain Current Idss 0 1200 Turn On Delay Time Rise Time Turn off delay time Fall time td(ON) tr td(OFF) tf Turn-on energy loss per pulse Eon Turn-off energy loss per pulse Eoff Total gate charge Qg Gate to source charge Qgs Rgoff=tbd Ω Rgon=tbd Ω Tj=25°C Tj=125°C Tj=25°C Tj=125°C Tj=25°C Tj=125°C Tj=25°C Tj=125°C Tj=25°C Tj=125°C Tj=25°C Tj=125°C Tj=25°C Tj=125°C Tj=25°C Tj=125°C Tj=25°C Tj=125°C Tj=25°C Tj=125°C 40 62,5 1,6 200 0,8 tbd tbd tbd tbd tbd tbd tbd tbd tbd tbd tbd tbd 20 Tj=25°C µA ns mWs 54 Qgd 62 Input capacitance Ciss 3700 Output capacitance Coss Reverse transfer capacitance Crss Internal Gate Resistance RG RthJH V nA 212 400 18 Gate to drain charge Thermal resistance chip to heatsink per chip mΩ 4 f=100kHz 0 1000 Tj=25°C nC 350 pF 40 f=1MHz UAC=25mV 3,15 Ω Preapplied Phase change material 1,20 K/W D2, D4 Boost Diode Diode forward voltage VF Reverse leakage current IRM Reverse recovery time trr Reverse recovered charge Peak rate of fall of recovery current 20 1200 Qrr di(rec)max /dt Reverse recovery energy Erec Thermal resistance chip to heatsink per chip RthJH Rgon=tbd Ω Preapplied Phase change material Tj=25°C Tj=150°C Tj=25°C Tj=175°C Tj=25°C Tj=150°C Tj=25°C Tj=150°C Tj=25°C Tj=150°C Tj=25°C Tj=150°C Tj=25°C 1,5 1,9 20 240 tbd tbd tbd tbd tbd tbd tbd tbd V 400 A ns µC A/µs mWs K/W 1,15 D1,D3 Protection diode Diode forward voltage Thermal resistance chip to heatsink per chip copyright Vincotech VF RthJH 13 Preapplied Phase change material Tj=25°C Tj=125°C 1 0,9 1,8 3 1,21 1,1 V K/W Revision: 1 10-PZ12B2A040MR01-M330L68Y target datasheet Characteristic Values Parameter Conditions Symbol VGE [V] or VGS [V] Vr [V] or VCE [V] or VDS [V] Value IC [A] or IF [A] or ID [A] Tj Min Typ Unit Max C1, C2 C 100 nF Rated resistance R 22000 Ω Deviation of R100 ∆R/R C value Thermistor R100 R100=1486 Ω Tj=25°C P Power dissipation constant -5 5 % Tc=100°C 200 mW Tc=100°C 2 mW/K A-value B(25/50) Tol. ±3% Tj=25°C 3950 K B-value B(25/100) Tol. ±3% Tj=25°C 3996 K Vincotech NTC Reference copyright Vincotech Tj=25°C 4 B Revision: 1 10-PZ12B2A040MR01-M330L68Y target datasheet Ordering Code and Marking - Outline - Pinout Ordering Code & Marking Version w/o thermal paste 12mm housing Press-fit pin Ordering Code 10-PZ12B2A040MR01-M330L68Y in DataMatrix as M330L68Y in packaging barcode as M330L68Y Outline Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 Pin table X 0 3 6 8,5 18,5 21 28,5 31,5 33,2 33,2 33,2 33,2 31,5 28,5 21 18,5 8,5 6 3 0 0 0 Y Function 22,2 22,2 22,2 22,2 22,2 22,2 22,2 22,2 19,2 16,7 5,5 3 0 0 0 0 0 0 0 0 9,6 12,6 S1 G1 DCDCDC+ DC+ NC NC IN1 IN1 IN2 IN2 NC NC DC+ DC+ DCDCG3 S3 Th1 Th2 Pinout copyright Vincotech 5 Revision: 1 10-PZ12B2A040MR01-M330L68Y target datasheet PRODUCT STATUS DEFINITIONS Datasheet Status Target Product Status Definition Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. The data contained is exclusively intended for technically trained staff. DISCLAIMER The information given in this datasheet describes the type of component and does not represent assured characteristics. For tested values please contact Vincotech.Vincotech reserves the right to make changes without further notice to any products herein to improve reliability, function or design. Vincotech does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. LIFE SUPPORT POLICY Vincotech products are not authorised for use as critical components in life support devices or systems without the express written approval of Vincotech. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in labelling can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. copyright Vincotech 6 Revision: 1