ROHM TT8K1

1.5V Drive Nch MOSFET
TT8K1
 Structure
Silicon N-channel MOSFET
 Dimensions (Unit : mm)
TSST8
Features
1) Low On-resistance.
2) High power package.
3) 1.5V drive.
(8)
(7)
(6)
(5)
(1)
(2)
(3)
(4)
Abbreviated symbol : K01
 Application
Switching
 Inner circuit
 Packaging specifications
Type
Package
Code
Basic ordering unit (pieces)
TT8K1
Taping
TR
3000

(1) Tr1 Source
(2) Tr1 Gate
(3) Tr2 Source
(4) Tr2 Gate
(5) Tr2 Drain
(6) Tr2 Drain
(7) Tr1 Drain
(8) Tr1 Drain
 Absolute maximum ratings (Ta = 25C)
<It is the same ratings for the Tr1 and Tr2.>
Parameter
Drain-source voltage
Drain current
Source current
(Body Diode)
Symbol
Limits
Unit
VDSS
20
V
V
VGSS
10
Continuous
ID
2.5
A
Pulsed
Continuous
IDP
Is
*1
10
0.8
A
A
Pulsed
Isp
*1
10
A
PD
*2
1.25
1.0
150
55 to +150
W / TOTAL
W / ELEMENT
C
C
Gate-source voltage
Power dissipation
Channel temperature
Range of storage temperature
(7)
(8)
Tch
Tstg
∗2
(6)
(5)
∗2
∗1
(1)
∗1
(2)
(3)
(4)
∗1 ESD PROTECTION DIODE
∗2 BODY DIODE
*1 Pw10s, Duty cycle1%
*2 Mounted on a ceramic board.
 Thermal resistance
Parameter
Channel to Ambient
Symbol
*
Rth (ch-a)
Limits
Unit
100
125
°C / W /TOTAL
°C / W /ELEMENT
*Mounted on a ceramic board.
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1/5
2010.07 - Rev.A
TT8K1
Data Sheet
 Electrical characteristics (Ta = 25C)
<It is the same characteristics for the Tr1 and Tr2.>
Parameter
Symbol
Min.
Typ.
Max.
Unit
IGSS
-
-
10
A
VGS=10V, VDS=0V
Gate-source leakage
Drain-source breakdown voltage V (BR)DSS
20
-
-
V
ID=1mA, VGS=0V
IDSS
-
-
1
A
VDS=20V, VGS=0V
VGS (th)
0.3
-
1
V
VDS=10V, ID=1mA
-
52
72
-
65
90
Zero gate voltage drain current
Gate threshold voltage
Static drain-source on-state
resistance
Conditions
*
RDS (on)
ID=2.5A, VGS=4.5V
m
ID=2.5A, VGS=2.5V
-
85
120
-
100
140
l Yfs l*
2.7
-
-
S
ID=2.5A, VDS=10V
Input capacitance
Ciss
-
260
-
pF
VDS=10V
Output capacitance
Coss
-
65
-
pF
VGS=0V
Reverse transfer capacitance
Crss *
-
35
-
pF
f=1MHz
Turn-on delay time
td(on) *
-
9
-
ns
ID=1.2A, VDD 10V
tr *
-
17
-
ns
VGS=4.5V
td(off) *
-
28
-
ns
RL 8.3
tf *
-
17
-
ns
RG=10
Total gate charge
Qg *
-
3.6
-
nC
ID=2.5A, VDD 10V
Gate-source charge
Gate-drain charge
Qgs *
Qgd *
-
0.7
0.6
-
nC
nC
VGS=4.5V RL 4
RG=10
Forward transfer admittance
Rise time
Turn-off delay time
Fall time
ID=1.2A, VGS=1.8V
ID=0.5A, VGS=1.5V
*Pulsed
Body diode characteristics (Source-Drain) (Ta = 25C)
<It is the same characteristics for the Tr1 and Tr2.>
Parameter
Symbol
Min.
Typ.
Max.
VSD
-
-
1.2
Forward Voltage
Unit
Conditions
V
Is=2.5A, VGS=0V
*Pulsed
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2/5
2010.07- Rev.A
Data Sheet
TT8K1
 Electrical characteristic curves
3
VGS= 2.5V
VGS= 2.0V
VGS= 1.8V
VGS= 1.5V
2
VGS= 1.2V
1
10
4
VGS= 4.5V
VGS= 2.5V
VGS= 1.8V
3
VGS= 1.5V
2
VGS= 1.2V
1
0.6
0.8
1
0.001
0
Ta= 25°C
Pulsed
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[mΩ]
1000
VGS= 1.5V
VGS= 1.8V
VGS= 2.5V
VGS= 4.5V
100
10
0.01
0.1
1
1000
2
10
DRAIN-CURRENT : ID[A]
Fig.7 Static Drain-Source On-State
Resistance vs. Drain Current( Ⅳ)
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0.5
1.5
2
Fig.3 Typical Transfer Characteristics
VGS= 4.5V
Pulsed
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= 25°C
10
0.1
1
10
1000
VGS= 2.5V
Pulsed
VGS= 1.5V
Pulsed
10
0.01
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= 25°C
10
0.1
1
10
DRAIN-CURRENT : ID[A]
Fig.8 Static Drain-Source On-State
Resistance vs. Drain Current( Ⅴ)
3/5
0.1
1
10
DRAIN-CURRENT : ID[A]
100
0.01
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= 25°C
100
Fig.5 Static Drain-Source On-State
Resistance vs. Drain Current( Ⅱ)
1000
1
Fig.2 Typical Output Characteristics( Ⅱ)
0.01
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[mΩ]
10
1
0
10
DRAIN-CURRENT : ID[A]
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= 25°C
0.1
8
100
10
100
0.01
6
GATE-SOURCE VOLTAGE : VGS[V]
DRAIN-CURRENT : ID[A]
VGS= 1.8V
Pulsed
4
DRAIN-SOURCE VOLTAGE : VDS[V]
Fig.4 Static Drain-Source On-State
Resistance vs. Drain Current( Ⅰ)
1000
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= 25°C
0.01
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[mΩ]
0.4
Fig.1 Typical Output Characteristics( Ⅰ)
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[mΩ]
0.1
Fig.6 Static Drain-Source On-State
Resistance vs. Drain Current( Ⅲ)
FORWARD TRANSFER ADMITTANCE : |Yfs| [S]
0.2
DRAIN-SOURCE VOLTAGE : VDS[V]
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[mΩ]
1
0
0
VDS= 10V
Pulsed
VGS= 1.0V
VGS= 1.0V
0
Ta=25°C
Pulsed
DRAIN CURRENT : ID[A]
VGS= 4.5V
4
5
Ta=25°C
Pulsed
DRAIN CURRENT : ID[A]
DRAIN CURRENT : ID[A]
5
10
VDS= 10V
Pulsed
1
Ta=25°C
Ta=25°C
Ta=75°C
Ta=125°C
0.1
0.01
0.1
1
10
DRAIN-CURRENT : ID[A]
Fig.9 Forward Transfer Admittance
vs. Drain Current
2010.07 - Rev.A
Data Sheet
VGS=0V
Pulsed
1
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= 25°C
0.1
0.01
0
0.5
1
200
ID= 2.5A
150
ID= 1.25A
100
50
1.5
100
td(off)
td(on)
10
1
0
5
10
GATE-SOURCE VOLTAGE : VGS[V]
Fig.10 Reverse Drain Current
vs. Sourse-Drain Voltage
0.01
0.1
1
10
DRAIN-CURRENT : ID[A]
Fig.11 Static Drain-Source On-State
Resistance vs. Gate Source Voltage
5
Ta=25°C
VDD=10V
VGS=4.5V
RG=10Ω
Pulsed
tf
t
0
SOURCE-DRAIN VOLTAGE : VSD [V]
Fig.12 Switching Characteristics
1000
CAPACITANCE : C [pF]
GATE-SOURCE VOLTAGE : VGS [V]
1000
Ta=25°C
Pulsed
SWITCHING TIME : t [ns]
SOURCE CURRENT : Is [A]
10
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(ON)[mΩ]
TT8K1
4
3
2
Ta=25°C
VDD=10V
ID=2.5A
RG=10Ω
Pulsed
1
0
0
1
2
3
4
Ciss
100
Crss
Coss
10
5
TOTAL GATE CHARGE : Qg [nC]
Fig.13 Dynamic Input Characteristics
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Ta=25°C
f=1MHz
VGS=0V
0.01
0.1
1
10
100
DRAIN-SOURCE VOLTAGE : VDS[V]
Fig.14 Typical Capacitance
vs. Drain-Source Voltage
4/5
2010.07 - Rev.A
TT8K1
Data Sheet
 Measurement circuits
Pulse width
VGS
ID
VDS
90%
50%
10%
VGS
VDS
RL
50%
10%
D.U.T.
VDD
RG
10%
90%
td(on)
ton
Fig.1-1 Switching time measurement circuit
90%
td(off)
tr
tf
toff
Fig.1-2 Switching waveforms
VG
VGS
ID
VDS
RL
D.U.T.
IG(Const.)
RG
Qg
VGS
Qgs
Qgd
VDD
Charge
Fig.2-1 Gate charge measurement circuit
Fig.2-2 Gate Charge Waveform
 Notice
This product might cause chip aging and breakdown under the large electrified environment. Please consider to design
ESD protection circuit.
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5/5
2010.07- Rev.A
Notice
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R1010A