ROHM RCX120N25

Data Sheet
10V Drive Nch MOSFET
RCX120N25
 Structure
Silicon N-channel MOSFET
 Dimensions (Unit : mm)
TO-220FM
φ3.2
10.0
4.5
1.2
1.3
14.0
2.5
8.0
15.0
Features
1) Low on-resistance.
2) High speed switching.
3) Gate-source voltage VGSS garanteed to be ±30V
12.0
2.8
0.8
2.54
2.54
2.6
0.75
(1) (2) (3)
4) High Power Package (TO-220FM).
 Application
Switching
 Inner circuit
∗1
 Packaging specifications
Type
Package
Code
Bulk
500

Basic ordering unit (pieces)
RCX120N25
(1) Gate
(2) Drain
(3) Souce
 Absolute maximum ratings (Ta = 25C)
Symbol
Parameter
Drain-source voltage
VDSS
Gate-source voltage
VGSS
Limits
Unit
250
30
V
V
ID
*3
12
A
Avalanche current
IDP
IS
ISP
IAS
*1
48
12
48
6
A
A
A
A
Avalanche energy
Power dissipation(Tc=25C)
EAS
PD
*2
10.5
40
mJ
W
Channel temperature
Range of storage temperature
Tch
Tstg
150
55 to 150
C
C
Limits
3.125
Unit
C / W
Drain current
Source current
(Body Diode)
Continuous
Pulsed
Continuous
Pulsed
*3
*1
*2
(1)
(2)
(3)
1 BODY DIODE
*1 Pw10s, Duty cycle1%
*2 L
500H, VDD=50V, RG=25T ch=25C
*3 Limited only by maximum channel temperature allowed.
 Thermal resistance
Parameter
Channel to Case
Symbol
Rth (ch-c) *
* T C=25C
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
1/6
2011.10 - Rev.A
Data Sheet
RCX120N25
 Electrical characteristics (Ta = 25C)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Conditions
-
-
100
nA
VGS=30V, VDS=0V
250
-
-
V
ID=1mA, V GS=0V
IDSS
-
-
10
A
VDS=250V, VGS=0V
VGS (th)
3
-
5
V
VDS=10V, ID=1mA
RDS (on)*
-
180
235
l Yfs l*
3.25
-
-
S
ID=6A, VDS=10V
Input capacitance
Ciss
-
1800
-
pF
VDS=25V
Output capacitance
Coss
-
100
-
pF
VGS=0V
Reverse transfer capacitance
Crss
-
60
-
pF
f=1MHz
Turn-on delay time
td(on) *
-
33
-
ns
ID=6A, VDD 125V
tr *
-
65
-
ns
VGS=10V
td(off) *
-
45
-
ns
RL=20.83
tf *
-
20
-
ns
RG=10
Total gate charge
Qg *
-
35
-
nC
ID=12A,
Gate-source charge
Qgs *
Qgd *
-
15
-
nC
VDD 125V
-
12
-
nC
VGS=10V
Gate-source leakage
IGSS
Drain-source breakdown voltage V(BR)DSS
Zero gate voltage drain current
Gate threshold voltage
Static drain-source on-state
resistance
Forward transfer admittance
Rise time
Turn-off delay time
Fall time
Gate-drain charge
m ID=6A, VGS=10V
*Pulsed
Body diode characteristics (Source-Drain) (Ta = 25C)
Parameter
Forward Voltage
Symbol
VSD *
Min.
-
Typ.
-
Max.
1.5
Unit
V
Conditions
Is=12A, VGS=0V
*Pulsed
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
2/6
2011.10 - Rev.A
Data Sheet
RCX120N25
Electrical characteristic curves (Ta=25C)
Fig.1 Typical Output Characteristics (Ⅰ)
Fig.2 Typical Output Characteristics (Ⅱ)
15
6
Ta=25°C
Pulsed
Ta=25°C
Pulsed
VGS=10.0V
5
VGS=10.0V
VGS=8.0V
VGS=8.0V
Drain Current : ID [A]
Drain Current : ID [A]
10
VGS=7.0V
5
VGS=6.5V
VGS=7.0V
4
3
2
VGS=6.5V
1
VGS=6.0V
VGS=6.0V
0
0
0
1
2
3
4
5
6
7
8
9
10
0
0.1
0.2
Drain-Source Voltage : VDS [V]
0.4
0.5
0.6
0.7
0.8
0.9
1
Fig.4 Gate Threshold Voltage vs. Channel Temperature
Fig.3 Typical Transfer Characteristics
8
100
VDS=10V
pulsed
VDS=10V
ID=1mA
pulsed
Gate Threshold Voltage : VGS(th) [V]
10
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
1
Drain Currnt : ID [A]
0.3
Drain-Source Voltage : VDS [V]
0.1
0.01
0.001
6
4
2
0.0001
0
0.00001
0
1
2
3
4
5
6
7
8
9
-50
10
0
Fig.5 Static Drain-Source On-State Resistance vs. Drain Current
100
150
Fig.6 Static Drain-Source On-State Resistance vs. Channel Temperature
10
0.5
Static Drain-Source On-State Resistance :RDS(on)[Ω]
VGS=10V
pulsed
Static Drain-Source On-State Resistance
RDS(on) [Ω]
50
Channel Temperature : T ch [℃]
Gate-Source Voltage : VGS [V]
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
1
0.1
0.01
0.001
VGS=10V
pulsed
0.4
0.3
ID=12A
0.2
ID=6A
0.1
0
0.01
0.1
1
10
100
-50
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
0
50
100
150
Channel Temperature : Tch [℃]
Drain Current : ID [A]
3/6
2011.10 - Rev.A
Data Sheet
RCX120N25
Fig.8 Source Current vs. Source-Drain Voltage
Fig.7 Forward Transfer Admittance vs. Drain Current
100
100
VGS=0V
pulsed
10
10
Source Current : Is [A]
Forward Transfer Admittance:Yfs [S]
VDS=10V
pulsed
1
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
0.1
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
1
0.1
0.01
0.01
0.01
0.1
1
10
0
100
0.5
Drain Current : ID [A]
Fig.9 Static Drain-Source On-State Resistance vs. Gate-Source Voltage
2
10000
VDD≒125V
VGS=10V
RG=10Ω
Ta=25°C
Pulsed
Ta=25°C
Pulsed
0.3
1000
ID=12.0A
Switching Time : t [ns]
Static Drain-Source On-State Resistance
RDS(on)[Ω]
1.5
Fig.10 Switching Characteristics
0.4
ID=6.0A
0.2
0.1
tf
td(off)
100
td(on)
10
tr
1
0
0
5
10
15
0.01
20
0.1
Gate-Source Voltage : VGS [V]
1
10
100
Drain Current : ID [A]
Fig.12 Typical Capacitance vs. Drain-Source Voltage
Fig.11 Dynamic Input Characteristics
10000
15
Ta=25°C
VDD=125V
ID=12A
Pulsed
1000
Capacitance : C [pF]
Gate-Source Voltage : VGS [V]
1
Source-Drain Voltage : VSD [V]
10
Ciss
100
Coss
5
Crss
10
Ta=25°C
f=1MHz
VGS=0V
1
0
0
5
10
15
20
25
30
35
40
45
50
0.01
55
1
10
100
1000
Drain-Source Voltage : VDS [V]
Total Gate Charge : Qg [nC]
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
0.1
4/6
2011.10 - Rev.A
Data Sheet
RCX120N25
Fig.14 Maximum Safe Operating Area
Fig.13 Reverse Recovery Time vs. Source Current
Operation in this area is limited by RDS(on)
(VGS = 10V)
100
1000
10
Drain Current : ID [ A ]
Reverse Recovery Time : trr [ns]
Ta=25°C
Vgs=0V
di/dt=100A/us
Pulsed
100
PW = 100μs
1
PW = 1ms
PW = 10ms
0.1
DC Operation
Ta=25°C
Single Pulse
0.01
10
1
10
0.1
100
1
10
100
1000
Drain-Source Voltage : VDS [ V ]
Source Current : IS [A]
Fig.15 Normalized Transient Thermal Resistance v.s. Pulse Width
Normalized Transient Thermal Resistance : r(t)
10
Ta=25°C
Single Pulse
1
0.1
0.01
0.001
Rth(ch-a)=80.3°C/W
Rth(ch-a)(t)=r(t)×Rth(ch-a)
0.0001
0.0001
0.001
0.01
0.1
1
10
100
1000
Pulse width : Pw (s)
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
5/6
2011.10 - Rev.A
Data Sheet
RCX120N25
 Measurement circuits
Pulse width
VGS
ID
VDS
90%
50%
10%
VGS
VDS
RL
50%
10%
D.U.T.
VDD
RG
10%
90%
td(on)
90%
td(off)
tr
ton
tf
toff
Fig.1-2 Switching Waveforms
Fig.1-1 Switching Time Measurement Circuit
VG
VGS
ID
VDS
RL
Qg
VGS
D.U.T.
IG(Const.)
Qgs
Qgd
VDD
Charge
Fig.2-2 Gate Charge Waveform
Fig.2-1 Gate Charge Measurement Circuit
VGS
IAS
VDS
V(BR)DSS
D.U.T.
RG
L
VDD
IAS
VDD
EAS =
Fig.3-1 Avalanche Measurement Circuit
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
1
2
2
L IAS
V(BR)DSS
V(BR)DSS - VDD
Fig.3-2 Avalanche Waveform
6/6
2011.10 - Rev.A
Notice
Notes
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
R1120A