ROHM RSJ650N10

Data Sheet
4V Drive Nch MOSFET
RSJ650N10
 Structure
Silicon N-channel MOSFET
 Dimensions (Unit : mm)
LPTS
10.1
1.3
13.1
9.0
Features
1) Low on-resistance.
2) High power package.
3) 4V drive.
4.5
2.54
0.4
0.78
2.7
5.08
(1)
(2)
1.2
3.0
1.0
1.24
(3)
 Application
Switching
 Packaging specifications
Package
Code
Basic ordering unit (pieces)
RSJ650N10
Type
 Inner circuit
Taping
TL
1000

∗1
∗2
(1) Gate
(2) Drain
(3) Source
 Absolute maximum ratings (Ta = 25C)
Symbol
Parameter
Drain-source voltage
VDSS
Gate-source voltage
Drain current
Source current
(Body Diode)
Continuous
Pulsed
Continuous
Pulsed
Power dissipation
Channel temperature
Range of storage temperature
VGSS
ID *3
IDP *1
IS *3
ISP
PD
*1
Limits
Unit
100
20
65
V
V
A
130
65
130
A
A
A
100
W
Tch
Tstg
150
55 to 150
C
C
Symbol
Limits
Unit
Rth (ch-c)*
1.25
C / W
*2
(1)
(2)
(3)
∗1 ESD PROTECTION DIODE
∗2 BODY DIODE
*1 PW 10s, Duty cycle1%
*2 TC=25°C
*3 Please use within the range of SOA.
 Thermal resistance
Parameter
Channel to Case
* T C=25°C
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© 2011 ROHM Co., Ltd. All rights reserved.
1/6
2011.06 - Rev.A
Data Sheet
RSJ650N10
 Electrical characteristics (Ta = 25C)
Parameter
Gate-source leakage
Symbol
Min.
Typ.
Max.
Unit
IGSS
-
-
10
A
Drain-source breakdown voltage V(BR)DSS
Conditions
VGS=20V, VDS=0V
100
-
-
V
ID=1mA, V GS=0V
IDSS
-
-
1
A
VDS=100V, VGS=0V
VGS (th)
1
-
2.5
V
Static drain-source on-state
resistance
*
RDS (on)
-
6.5
9.1
-
7
9.8
Forward transfer admittance
l Yfs l*
45
-
-
S
VDS=10V, ID=32.5A
Input capacitance
Ciss
-
10780
-
pF
VDS=25V
Output capacitance
Coss
-
785
-
pF
VGS=0V
Reverse transfer capacitance
Crss
-
560
-
pF
f=1MHz
Turn-on delay time
td(on)*
-
45
-
ns
VDD 50V, I D=32.5A
tr *
-
170
-
ns
VGS=10V
td(off)*
-
640
-
ns
RL=1.54
tf *
-
480
-
ns
RG=10
Total gate charge
Qg *
-
260
-
nC
VDD 50V, I D=32.5A
Gate-source charge
Qgs *
Qgd *
-
24
60
-
nC
nC
VGS=10V
Gate-drain charge
Min.
Typ.
Max.
-
-
1.5
Zero gate voltage drain current
Gate threshold voltage
Rise time
Turn-off delay time
Fall time
m
VDS=10V, ID=1mA
ID=32.5A, VGS=10V
ID=32.5A, VGS=4V
*Pulsed
Body diode characteristics (Source-Drain)
Parameter
Forward Voltage
Symbol
VSD *
Unit
Conditions
V
Is=65A, VGS=0V
*Pulsed
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© 2011 ROHM Co., Ltd. All rights reserved.
2/6
2011.06 - Rev.A
Data Sheet
RSJ650N10
Electrical characteristic curves (Ta=25C)
Fig.2 Typical Output Characteristics (Ⅱ)
Fig.1 Typical Output Characteristics (Ⅰ)
50
50
VGS=10.0V
VGS=3.0V
VGS=4.5V
VGS=10.0V
VGS=4.0V
40
VGS=4.5V
40
VGS=2.5V
30
VGS=4.0V
VGS=3.0V
Drain Current : ID [A]
Drain Current : ID [A]
VGS=2.8V
20
10
VGS=2.8V
VGS=2.5V
30
20
10
Ta=25°C
pulsed
Ta=25°C
pulsed
0
0
0
0.2
0.4
0.6
0.8
1
0
2
8
10
Fig.4 Static Drain-Source On-State Resistance vs. Drain Current
Fig.3 Static Drain-Source On-State Resistance vs. Drain Current
100
100
VGS=10V
pulsed
Static Drain-Source On-State Resistance
RDS(on) [mW]
Ta=25°C
pulsed
VGS=4.0V
VGS=10V
10
1
0.01
0.1
1
10
10
1
0.01
100
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
0.1
1
10
100
Drain Current : ID [A]
Drain Current : ID [A]
Fig.5 Static Drain-Source On-State Resistance vs. Drain Current
Fig.6 Forward Transfer Admittance vs. Drain Current
1000
100
VGS=4V
pulsed
VDS=10V
pulsed
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
100
Forward Transfer Admittance
Yfs [S]
Static Drain-Source On-State Resistance
RDS(on) [mW]
6
Drain-Source Voltage : VDS [V]
Drain-Source Voltage : VDS [V]
Static Drain-Source On-State Resistance
RDS(on) [mW]
4
10
10
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
1
0.1
1
0.01
0.1
1
10
0.01
0.01
100
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© 2011 ROHM Co., Ltd. All rights reserved.
0.1
1
10
100
Drain Current : ID [A]
Drain Current : ID [A]
3/6
2011.06 - Rev.A
Data Sheet
RSJ650N10
Fig.7 Typical Transfer Characteristics
Fig.8 Source Current vs. Source-Drain Voltage
100
100
VGS=0V
pulsed
VDS=10V
pulsed
10
Source Current : Is [A]
Drain Currnt : ID [A]
10
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
1
0.1
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
1
0.1
0.01
0.001
0.01
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0.0
0.5
1.0
1.5
Gate-Source Voltage : VGS [V]
Source-Drain Voltage : VSD [V]
Fig.9 Static Drain-Source On-State Resistance vs. Gate-Source Voltage
Fig.10 Switching Characteristics
20
100000
VDD≒50V
VGS=10V
RG=10W
Ta=25°C
Pulsed
tf
10000
15
ID=50A
Switching Time : t [ns]
Static Drain-Source On-State Resistance
RDS(on) [mW]
Ta=25°C
pulsed
ID=32.5A
10
td(off)
1000
100
5
td(on)
10
tr
1
0
0
2
4
6
8
0.01
10
0.1
1
10
100
Drain Current : ID [A]
Gate-Source Voltage : VGS [V]
Fig.12 Typical Capacitance vs. Drain-Source Voltage
Fig.11 Dynamic Input Characteristics
100000
10
Ta=25°C
VDD=50V
ID=32.5A
Pulsed
Ciss
10000
Capacitance : C [pF]
8
Gate-Source Voltage : VGS [V]
2.0
6
4
1000
Coss
Crss
100
2
Ta=25°C
f=1MHz
VGS=0V
10
0
0
50
100
150
200
250
0.01
300
1
10
100
1000
Drain-Source Voltage : VDS [V]
Total Gate Charge : Qg [nC]
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© 2011 ROHM Co., Ltd. All rights reserved.
0.1
4/6
2011.06 - Rev.A
Data Sheet
RSJ650N10
Fig.14 Maximum Safe Operating Area
Fig.13 Normalized Transient Thermal Resistance v.s. Pulse Width
1000
Ta=25°C
Single Pulse
Operation in this area is limited by RDS(on)
(VGS = 10V)
1
100
Drain Current : ID [ A ]
Normalized Transient Thermal Resistance : r (t)
10
0.1
0.01
0.001
Mounted on epoxy board.
(25mm × 27mm × 0.8mm)
Rth(ch-a)=70.2°C/W
Rth(ch-a)(t)=r(t)×Rth(ch-a)
0.0001
0.00001
0.0001
10
PW = 300us
PW = 1ms
1
PW = 10ms
PW = 1s
Ta=25°C
Single Pulse
Mounted on epoxy board.
(25mm × 27mm × 0.8mm)
0.1
0.01
0.001
0.01
0.1
1
10
100
1000
0.1
Pulse width : Pw (s)
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© 2011 ROHM Co., Ltd. All rights reserved.
1
10
100
1000
Drain-Source Voltage : VDS [ V ]
5/6
2011.06 - Rev.A
Data Sheet
RSJ650N10
 Measurement circuits
Pulse width
VGS
ID
VDS
90%
50%
10%
VGS
VDS
RL
50%
10%
D.U.T.
VDD
RG
10%
90%
td(on)
ton
Fig.1-1 Switching Time Measurement Circuit
90%
td(off)
tr
tf
toff
Fig.1-2 Switching Waveforms
VG
VGS
ID
VDS
Qg
RL
IG(Const.)
VGS
D.U.T.
Qgs
Qgd
VDD
Charge
Fig.2-1 Gate Charge Measurement Circuit
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© 2011 ROHM Co., Ltd. All rights reserved.
Fig.2-2 Gate Charge Waveform
6/6
2011.06 - Rev.A
Notice
Notes
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R1120A