ROHM RSF010P05

Data Sheet
4V Drive Pch MOSFET
RSF010P05
 Structure
Silicon P-channel MOSFET
 Dimensions (Unit : mm)
0.2Max.
TUMT3
Features
1) Low On-resistance.
2) Small high power package.
3) Low voltage drive.(4V)
Abbreviated symbol : SU
 Application
Switching
 Packaging specifications
Type
 Inner circuit
Package
Code
Taping
TL
Basic ordering unit (pieces)
RSF010P05
(3)
3000

∗1
∗2
 Absolute maximum ratings (Ta = 25C)
Parameter
Drain-source voltage
Source current
(Body Diode)
Limits
Unit
VDSS
45
V
VGSS
20
V
Continuous
ID
1
A
Pulsed
Continuous
IDP
IS
*1
4
0.6
A
A
Pulsed
ISP
*1
4
A
PD
*2
0.8
W
Tch
Tstg
150
55 to 150
C
C
Symbol
Limits
Unit
Rth (ch-a)*
156
C / W
Gate-source voltage
Drain current
Symbol
Power dissipation
Channel temperature
Range of storage temperature
(1) Gate
(2) Source
(3) Drain
(1)
(2)
∗1 ESD PROTECTION DIODE
∗2 BODY DIODE
*1 Pw10s, Duty cycle1%
*2 Mounted on a ceramic board.
 Thermal resistance
Parameter
Channel to Ambient
*Mounted on a ceramic board.
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1/6
2011.03 - Rev.A
Data Sheet
RSF010P05
 Electrical characteristics (Ta = 25C)
Parameter
Gate-source leakage
Symbol
IGSS
Drain-source breakdown voltage V(BR)DSS
Min.
Typ.
Max.
Unit
Conditions
-
-
10
A
VGS=20V, VDS=0V
45
-
-
V
ID=1mA, VGS=0V
IDSS
-
-
1
A
VDS=45V, VGS=0V
Gate threshold voltage
VGS (th)
1.0
-
2.5
V
VDS=10V, ID=1mA
Static drain-source on-state
resistance
-
330
460
*
RDS (on)
Forward transfer admittance
Zero gate voltage drain current
-
450
630
-
490
690
ID=1A, VGS=10V
m ID=0.5A, VGS=4.5V
ID=0.5A, VGS=4V
l Yfs l*
1
-
-
S
ID=1A, VDS=10V
Input capacitance
Ciss
-
160
-
pF
VDS=10V
Output capacitance
Coss
-
40
-
pF
VGS=0V
Reverse transfer capacitance
Crss
-
17
-
pF
f=1MHz
Turn-on delay time
td(on) *
-
6
-
ns
ID=0.5A, VDD 25V
Rise time
tr *
td(off) *
-
4
-
ns
VGS=10V
-
18
-
ns
RL=50
tf *
-
6
-
ns
RG=10
Total gate charge
Qg *
-
2.3
-
nC
ID=1A
Gate-source charge
Gate-drain charge
Qgs *
Qgd *
-
0.9
0.6
-
nC
nC
VDD 25V
VGS=5V
Turn-off delay time
Fall time
*Pulsed
Body diode characteristics (Source-Drain) (Ta = 25C)
Parameter
Forward Voltage
Symbol
VSD *
Min.
Typ.
Max.
Unit
Conditions
-
-
1.2
V
Is=1A, VGS=0V
*Pulsed
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2/6
2011.03 - Rev.A
Data Sheet
RSF010P05
Electrical characteristic curves (Ta=25C)
Fig.1 Typical Output Characteristics (Ⅰ)
Fig.2 Typical Output Characteristics (Ⅱ)
1
1
Ta=25°C
Pulsed
0.8
Ta=25°C
Pulsed
VGS=-10.0V
VGS=-4.5V
0.8
VGS=-10.0V
VGS=-3.0V
VGS=-4.0V
VGS=-4.0V
Drain Current : -ID [A]
Drain Current : -ID [A]
VGS=-4.5V
VGS=-3.0V
0.6
0.4
VGS=-2.8V
0.2
0.6
VGS=-2.8V
0.4
0.2
VGS=-2.5V
VGS=-2.5V
0
0
0
0.2
0.4
0.6
0.8
1
0
2
Drain-Source Voltage : -VDS [V]
8
10
Fig.4 Static Drain-Source On-State Resistance vs. Drain Current
10000
10000
Ta=25°C
Pulsed
VGS=-10V
pulsed
VGS=-4.0V
VGS=-4.5V
VGS=-10V
Static Drain-Source On-State Resistance
RDS(on) [mΩ]
Static Drain-Source On-State Resistance
RDS(on) [mΩ]
6
Drain-Source Voltage : -VDS [V]
Fig.3 Static Drain-Source On-State Resistance vs. Drain Current
1000
100
10
0.01
0.1
1
1000
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
100
10
0.01
10
Drain Current :-ID [A]
0.1
1
10
Drain Current :- ID [A]
Fig.6 Static Drain-Source On-State Resistance vs. Drain Current
Fig.5 Static Drain-Source On-State Resistance vs. Drain Current
10000
10000
VGS=-4V
pulsed
Static Drain-Source On-State Resistance
RDS(on) [mΩ]
VGS=-4.5V
pulsed
Static Drain-Source On-State Resistance
RDS(on) [mΩ]
4
1000
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
100
10
0.01
0.1
1
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
100
10
0.01
10
0.1
1
10
Drain Current :- ID [A]
Drain Current :- ID [A]
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1000
3/6
2011.03 - Rev.A
Data Sheet
RSF010P05
Fig.8 Typical Transfer Characteristics
Fig.7 Forward Transfer Admittance vs. Drain Current
10
10
VDS=-10V
pulsed
VDS=-10V
pulsed
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
1
Drain Currnt : -ID [A]
Forward Transfer Admittance
Yfs [S]
1
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
0.1
0.1
0.01
0.01
0.001
0.001
0.01
0.1
1
10
1.0
1.5
Drain Current : -ID [A]
3.0
3.5
4.0
Fig.10 Static Drain-Source On-State Resistance vs. Gate-Source Voltage
1500
10
VGS=0V
pulsed
Ta=25°C
Pulsed
Static Drain-Source On-State Resistance
RDS(on) [mΩ]
Source Current : -Is [A]
2.5
Gate-Source Voltage : -VGS [V]
Fig.9 Source Current vs. Source-Drain Voltage
1
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
0.1
ID=-0.5A
ID=-1.0A
1000
500
0
0.01
0.0
0.5
1.0
1.5
0
2.0
2
4
6
8
10
Gate-Source Voltage : -VGS [V]
Source-Drain Voltage : - VSD [V]
Fig.11 Switching Characteristics
Fig.12 Dynamic Input Characteristics
1000
10
VDD≒-25V
VGS=-10V
RG=10Ω
Ta=25°C
Pulsed
100
td(off)
td(on)
10
Ta=25°C
VDD=-25V
ID=-1.0A
Pulsed
8
Gate-Source Voltage : -VGS [V]
tf
Switching Time : t [ns]
2.0
6
4
2
tr
1
0
0.01
0.1
1
10
0
1
1.5
2
2.5
3
3.5
4
4.5
5
Total Gate Charge : Qg [nC]
Drain Current :- ID [A]
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0.5
4/6
2011.03 - Rev.A
Data Sheet
RSF010P05
Fig.14 Maximum Safe Operating Area
Fig.13 Typical Capacitance vs. Drain-Source Voltage
1000
10
Operation in this area is limited by RDS(on)
(VGS = -10V)
Ta=25°C
f=1MHz
VGS=0V
Drain Current : - ID [ A ]
Capacitance : C [pF]
PW = 100μs
100
Ciss
Coss
10
Crss
1
PW = 1ms
PW = 10ms
0.1
Ta=25°C
Single Pulse
Mounted on a ceramic board.
(30mm × 30mm × 0.8mm)
1
DC Operation
0.01
0.01
0.1
1
10
100
0.1
Drain-Source Voltage : -VDS [V]
1
10
100
Drain-Source Voltage : -VDS [ V ]
Fig.15 Normalized Transient Thermal Resistance v.s. Pulse Width
Normalized Transient Thermal Resistance : r（t）
10
Ta=25°C
Single Pulse
1
0.1
0.01
Mounted on a ceramic board.
(30mm × 30mm × 0.8mm)
Rth(ch-a)=156°C/W
Rth(ch-a)(t)=r(t)×Rth(ch-a)
0.001
0.0001
0.00001 0.0001
0.001
0.01
0.1
1
10
100
1000
Pulse width : Pw (s)
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5/6
2011.03 - Rev.A
Data Sheet
RSF010P05
 Measurement circuits
Pulse Width
VGS
ID
VDS
VGS
10%
50%
90%
RL
50%
10%
D.U.T.
10%
RG
VDD
VDS
90%
td(on)
tr
ton
90%
td(off)
tf
toff
Fig.1-2　Switching Waveforms
Fig.1-1 Switching Time Measurement Circuit
VG
ID
VDS
VGS
RL
IG(Const.)
D.U.T.
Qg
VGS
Qgs
Qgd
VDD
Charge
Fig.2-1 Gate Charge Measurement Circuit
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Fig.2-2 Gate Charge Waveform
6/6
2011.03 - Rev.A
Notice
Notes
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R1120A