KBP202G

Spec. No. : C757
Issued Date : 2009.05.12
Revised Date :2014.09.29
Page No. : 1/4
CYStech Electronics Corp.
Glass passivated Single-Phase Bridge Rectifiers
KBP2005G thru KBP210G
Reverse Voltage 50 to 1000 Volts Forward Current 2 Amps
Features
 Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
 Ideal for printed circuit boards
 Glass passivated chip junction
 High surge current capability
 High case dielectric strength
 Heat Resistance, Soldering iron : 300°C, 5 seconds
 UL recognized #E241476
KBP2XXG
□□
Mechanical Data
 Case: KBPM Molded plastic body
 Terminals: Silver plated leads, solderable per
J-STD-002B and JESD22-B102D
 Polarity : shown on front side of case, positive
lead by beveled corner.
Case Style : KBPM
Maximum Ratings and Electrical Characteristics
(Rating at 25C ambient temperature unless otherwise specified.)
Type
Symbol
Parameter
Repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum instantaneous forward voltage drop per leg,
IF=2A
Maximum average forward rectified output current at
TA=40 °C
Peak forward surge current @ 8.3ms single half sine
wave superimposed on rated load(JEDEC method)
Rating for fusing (t<8.3ms)
Maximum DC reverse current at rated DC blocking
voltage per leg
TA=25℃
TA=125℃
VRRM
VRMS
VDC
KBP
2005G
50
35
50
KBP
202G
200
140
200
KBP
204G
400
280
400
KBP
206G
600
420
600
KBP
208G
800
560
800
KBP Units
210G
1000
V
700
V
1000
V
VF
1.1
V
IF(AV)
2.0
A
IFSM
60
A
15
IR
RJA
RJL
Typical thermal resistance per leg
RJC
(Note 2)
Typical junction capacitance per element at 4V, 1MHz
CJ
Operating junction and storage temperature range
TJ;TSTG
Typical thermal resistance per leg
KBP
201G
100
70
100
(Note 1)
5
500
30
11
14
25
-55 ~ +150
Notes : 1.Device mounted on PCB with 0.47” × 0.47” (12 mm × 12 mm) copper pads.
2.Unit mounted on 75mm × 75mm × 1.6mm Cu plate heatsink.
KBP2005G-210G
CYStek Product Specification
μA
°C /W
pF
°C
CYStech Electronics Corp.
Spec. No. : C757
Issued Date : 2009.05.12
Revised Date :2014.09.29
Page No. : 2/4
Ordering Information
Device
KBP2XXXG-0-TA-S
Package
KBPM
(Pb-free lead plating package)
Shipping
600 pcs / tray, 4800 pcs/box
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, TA : 600 pcs / tray, 4800 pcs/box
Product rank, zero for no rank products
Product name
KBP2005G-210G
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C757
Issued Date : 2009.05.12
Revised Date :2014.09.29
Page No. : 3/4
Characteristic Curves
KBP2005G-210G
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C757
Issued Date : 2009.05.12
Revised Date :2014.09.29
Page No. : 4/4
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5 C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5C of actual peak
temperature(tp)
Ramp down rate
Time 25 C to peak temperature
Sn-Pb eutectic Assembly
Pb-free Assembly
3C/second max.
3C/second max.
100C
150C
60-120 seconds
150C
200C
60-180 seconds
183C
60-150 seconds
240 +0/-5 C
217C
60-150 seconds
260 +0/-5 C
10-30 seconds
20-40 seconds
6C/second max.
6 minutes max.
6C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
KBP2005G-210G
CYStek Product Specification