DIP2450-01D3 - STMicroelectronics

DIP2450-01D3
2 G / 5 G WLAN diplexer
Datasheet - production data
Features
• Low insertion loss in pass band
• High attenuation levels
• High rejection of out-of-band frequencies
• Small footprint: < 1.4 mm2
Benefits
• Very low profile (<600 µm after reflow)
Flip Chip package 4 bumps
• High Q, low loss
• High RF performance
• Tight tolerance
• Bill of materials and area reduction
Figure 1. Pin configuration (bump view)
1
2
5G
2G
ANT
GND
Applications
• WLAN
• Bluetooth
A
• Mobile phone application
• Wireless networking
B
Description
This diplexer targets the use of dual band 2.4
GHz and 5 GHz. The DIP2450-01D3 is a diplexer
dedicated to the WLAN/BT application.
It is designed using STMicroelectronics IPD
(integrated passive device) technology on non
conductive glass substrate to optimize RF
performance.
May 2014
This is information on a product in full production.
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Characteristics
1
DIP2450-01D3
Characteristics
Table 1. Absolute rating (limiting values)
Value
Symbol
Parameter
Unit
Min.
PAV
VESD
antenna
and 2G
ports
TOP
Typ.
Average power
Max.
27
ESD ratings:
MIL STD883C (HBM:C = 100 pF, R = 1.5 kΩ, air discharge)
Charged device model (CDM)
Machine model (MM: C = 200 pF, R = 25 Ω, L = 500 nH)
400
500
100
Operating temperature range
-40
dBm
V
+85
ºC
Table 2. Electrical characteristics and RF performance (Tamb = 25 °C)
Value
Symbol
Parameter
Test condition
Unit
Min.
Typ.
Max.
Pass band
2 G band pass
2400
2483.5
MHz
5 G band pass
4900
5850
MHz
f
Z
Nominal impedance
Return loss
Ω
50
All ports
-17
dB
S21
2 G to antenna insertion loss
2400 to 2483.5 MHz
0.6
0.7
dB
S31
5 G to antenna insertion loss
4900 to 5850 MHz
0.6
0.7
dB
Attenuation
S21
2 G to antenna attenuation
4900 to 5850 MHz
20
dB
S31
5 G to antenna attenuation
2400 to 2483.5 MHz
18
dB
Out of band attenuation
S21
S31
2/10
2 G to antenna attenuation
5 G to antenna attenuation
5850 to 7000 MHz
15
7000 to 9500 MHz
9
9800 to 10500 MHz
16
9800 to 11650 MHz
11
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dB
dB
DIP2450-01D3
1.1
Characteristics
Measured performance
Figure 2. 2 G and 5 G forward transmission
(Tamb = 25 °C)
0
S21 and S31 (dB)
Figure 3. 2 G, 5 G and antenna reflection
coefficient (Tamb = 25 °C)
S11, S22 and S33 (dB)
0
-5
-10
-10
-20
-15
-30
S21 (2 G ≥ ANT)
S31 (5 G ≥ ANT)
-40
S11 (ANT)
S22 (2 G)
S33 (5 G)
-20
-25
-50
-30
F (GHz)
-60
F (GHz)
-35
0
2
4
6
10
8
12
0
Figure 4. 2 G insertion loss (Tamb = 25 °C)
-0.40
-20
-0.50
-30
-0.55
-40
-0.60
-50
-0.65
-60
F (GHz)
2.42
2.44
2.46
2.48
10
8
12
F (GHz)
-70
4.9
2.50
Figure 6. 2 G attenuation in high frequency
band (Tamb = 25 °C)
-0
6
S21(dB)
-10
-0.45
2.40
4
Figure 5. 2 G attenuation in 5 G band
(Tamb = 25 °C)
S21(dB)
-0.70
2
S21(dB)
5.1
5.3
5.5
5.7
5.9
Figure 7. 2 G return loss (Tamb = 25 °C)
S22(dB)
-10
-10
-15
-20
-30
-20
-40
-25
-50
F (GHz)
-60
5
6
7
8
9
10
11
F (GHz)
-30
12
2.40
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2.42
2.44
2.46
2.48
2.50
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Characteristics
DIP2450-01D3
Figure 8. Antenna return loss in 2 G band
(Tamb = 25 °C)
Figure 9. Antenna return loss in 5 G band
(Tamb = 25 °C)
S11(dB)
-10
-10
-15
-15
-20
-20
-25
-25
F (GHz)
-30
2.40
2.42
2.44
2.46
2.48
4.9
2.50
S31(dB)
-0.45
-20
-0.50
-30
-0.55
-40
-0.60
-50
-0.65
-60
F (GHz)
4.9
5.1
5.3
5.5
5.7
5.3
5.5
5.7
5.9
S31(dB)
5.9
S31(dB)
F (GHz)
-70
2.40
Figure 12. 5 G attenuation in high frequency
band (Tamb = 25 °C)
-0
5.1
Figure 11. 5 G attenuation in 2 G band
(Tamb = 25 °C)
-10
-0.70
F (GHz)
-30
Figure 10. 5 G insertion loss (Tamb = 25 °C)
-0.40
S11(dB)
2.42
2.44
2.46
2.48
2.50
Figure 13. 5 G return loss (Tamb = 25 °C)
-10
S33(dB)
-10
-15
-20
-30
-20
-40
-25
-50
F (GHz)
-60
5
4/10
6
7
8
9
10
11
F (GHz)
-30
12
4.9
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5.1
5.3
5.5
5.7
5.9
DIP2450-01D3
Characteristics
Figure 14. 2 G to 5 G isolation (Tamb = 25 °C)
0
S23 (dB)
Figure 15. 2 G to 5 G isolation in 2 G band (Tamb
= 25 °C)
-15
S23(dB)
-5
-20
-10
-15
-20
-25
-25
-30
-30
-35
-40
-25
-45
F (GHz)
-50
F (GHz)
-40
0
2
4
6
8
10
12
2.40
2.42
2.44
2.46
2.48
2.50
Figure 16. 2 G to 5 G isolation in 5 G band (Tamb = 25 °C)
S23(dB)
-15
-20
-25
-30
-25
F (GHz)
-40
4.9
5.1
5.3
5.5
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5.9
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Application information
2
DIP2450-01D3
Application information
Figure 17. Application schematic
5GHz Tx
WLAN
Diplexer
2GHz Tx
5GHz Rx
2GHz Rx
BT
Balun
BT TX
BT RX
Figure 18. PCB recommendation
2G
5G
ANT
Pad diameter: 220 µm, distance from ground: 100 µm
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DIP2450-01D3
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 19. Package dimensions
725 µm
187.5 µm
Ø255 µm ±40 µm
5G
GND
ANT
437.5 µm
625 µm
2G
630 µm ±60 µm
187.5 µm
187.5 µm
1.25 mm ±50 µm
3
Package information
1.1 mm ±50 µm
Figure 20. Footprint
Copper pad diameter:
220 µm recommended
260 µm maximum
200 µm
Figure 21. Marking
Dot, ST logo
ECOPACK status
xx = marking
z = manufacturing
location
yww = datecode
(y = year
ww = week)
Solder mask opening:
300 µm minimum
Solder stencil opening:
220 µm recommended
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x x z
y ww
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Package information
DIP2450-01D3
Figure 22. Flip Chip tape and reel specifications
Ø 1.50 ± 0.10
4.0 ± 0.1
1.75 ± 0.1
2.0 ± 0.05
0.71 ± 0.05
All dimensions in mm
8/10
3.5 ±- 0.05
1.35± 0.05
8.0 +0.3 -0.10
0.20 ± 0.02
1.20 ± 0.05
4.0 ± 0.1
User direction of unreeling
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DIP2450-01D3
4
Ordering information
Ordering information
Table 3. Ordering information
5
Order code
Marking
Package
Weight
Base qty
Delivery mode
DIP2450-01D3
SA
Flip Chip
1.88 mg
5000
Tape and reel (7”)
Revision history
.
Table 4. Document revision history
Date
Revision
Changes
27-June-2012
1
Initial release
07-May-2014
2
Updated Figure 19: Package dimensions.
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DIP2450-01D3
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