ROHM RXH125N03

Data Sheet
4V Drive Nch MOSFET
RXH125N03
 Structure
Silicon N-channel MOSFET
 Dimensions (Unit : mm)
SOP8
Features
1) Low on-resistance.
2) Built-in G-S Protection Diode.
3) Small Surface Mount Package (SOP8).
(8)
(5)
(1)
(4)
 Application
Switching
 Packaging specifications
 Inner circuit
Package
Type
Code
Basic ordering unit (pieces)
RXH125N03
Taping
TB
2500

(8)
 Absolute maximum ratings (Ta = 25C)
Parameter
Symbol
Limits
Unit
Drain-source voltage
VDSS
30
V
Gate-source voltage
VGSS
20
V
Continuous
ID
12.5
A
Pulsed
Continuous
IDP
IS
*1
36
1.6
A
A
Pulsed
ISP
*1
36
A
PD
*2
2.0
W
Tch
Tstg
150
55 to 150
C
C
Symbol
Limits
Unit
62.5
C / W
Drain current
Source current
(Body Diode)
Power dissipation
Channel temperature
Range of storage temperature
(1) Source
(2) Source
(3) Source
(4) Gate
(5) Drain
(6) Drain
(7) Drain
(8) Drain
(7)
(6)
(5)
(3)
(4)
∗2
∗1
(1)
(2)
∗1 ESD PROTECTION DIODE
∗2 BODY DIODE
*1 Pw10s, Duty cycle1%
*2 Mounted on a ceramic board.
 Thermal resistance
Parameter
Channel to Ambient
Rth
(ch-a)*
*Mounted on a ceramic board.
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1/6
2011.03 - Rev.A
Data Sheet
RXH125N03
 Electrical characteristics (Ta = 25C)
Parameter
Gate-source leakage
Symbol
IGSS
Drain-source breakdown voltage V(BR)DSS
Min.
Typ.
Max.
Unit
Conditions
-
-
10
A
VGS=20V, VDS=0V
30
-
-
V
ID=1mA, VGS=0V
IDSS
-
-
1
A
VDS=30V, VGS=0V
Gate threshold voltage
VGS (th)
1.0
-
2.5
V
VDS=10V, ID=1mA
Static drain-source on-state
resistance
*
RDS (on)
-
7.5
12.0
ID=12.5A, VGS=10V
-
9.5
13.3
m ID=12.5A, VGS=4.5V
-
10.0
14.0
ID=12.5A, VGS=4.0V
Forward transfer admittance
l Yfs l*
9.0
-
-
S
ID=12.5A, VDS=10V
Input capacitance
Ciss
-
1000
-
pF
VDS=10V
Output capacitance
Coss
-
340
-
pF
VGS=0V
Zero gate voltage drain current
Reverse transfer capacitance
Crss
-
170
-
pF
f=1MHz
Turn-on delay time
td(on) *
-
12
-
ns
ID=6.3A, VDD 15V
Rise time
tr *
td(off) *
-
20
-
ns
VGS=10V
-
55
-
ns
RL=2.38
tf *
-
18
-
ns
RG=10
Total gate charge
Qg *
-
12.7
-
nC
ID=12.5A, VDD 15V
Gate-source charge
Gate-drain charge
Qgs *
Qgd *
-
2.6
6.0
-
nC
nC
VGS=5V
Turn-off delay time
Fall time
*Pulsed
Body diode characteristics (Source-Drain) (Ta = 25C)
Parameter
Forward Voltage
Symbol
VSD *
Min.
Typ.
Max.
-
-
1.2
Unit
V
Conditions
Is=12.5A, VGS=0V
*Pulsed
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2/6
2011.03 - Rev.A
Data Sheet
RXH125N03
Electrical characteristic curves (Ta=25C)
Fig.1 Typical Output Characteristics (Ⅰ)
Fig.2 Typical Output Characteristics (Ⅱ)
12.5
12.5
VGS=10.0V
Ta=25°C
Pulsed
10
VGS=4.5V
VGS=4.0V
10
VGS=10.0V
VGS=4.0V
VGS=3.0V
7.5
VGS=2.5V
VGS=3.0V
Drain Current : ID [A]
Drain Current : ID [A]
VGS=4.5V
5
7.5
5
VGS=2.5V
2.5
2.5
Ta=25°C
Pulsed
0
0
0
0.2
0.4
0.6
0.8
1
0
2
Drain-Source Voltage : VDS [V]
8
10
Fig.4 Static Drain-Source On-State Resistance vs. Drain Current
100
100
VGS=10V
pulsed
Static Drain-Source On-State Resistance
RDS(on) [mΩ]
Ta=25°C
Pulsed
Static Drain-Source On-State Resistance
RDS(on) [mΩ]
6
Drain-Source Voltage : VDS [V]
Fig.3 Static Drain-Source On-State Resistance vs. Drain Current
VGS=4.0V
VGS=4.5V
VGS=10V
10
1
0.01
0.1
1
10
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
10
1
0.01
100
0.1
1
10
100
Drain Current : ID [A]
Drain Current : ID [A]
Fig.5 Static Drain-Source On-State Resistance vs. Drain Current
Fig.6 Static Drain-Source On-State Resistance vs. Drain Current
100
100
Static Drain-Source On-State Resistance
RDS(on) [mΩ]
VGS=4.5V
pulsed
Static Drain-Source On-State Resistance
RDS(on) [mΩ]
4
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
10
1
0.01
0.1
1
10
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
10
1
0.01
100
0.1
1
10
100
Drain Current : ID [A]
Drain Current : ID [A]
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VGS=4V
pulsed
3/6
2011.03 - Rev.A
Data Sheet
RXH125N03
Fig.7 Forward Transfer Admittance vs. Drain Current
Fig.8 Typical Transfer Characteristics
100
100
VDS=10V
pulsed
VDS=10V
pulsed
10
Drain Currnt : ID [A]
Forward Transfer Admittance
Yfs [S]
10
1
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
0.1
0.01
0.001
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
1
0.1
0.01
0.001
0.01
0.1
1
10
100
0.0
0.5
1.0
2.5
3.0
3.5
50
100
VGS=0V
pulsed
Static Drain-Source On-State Resistance
RDS(on) [mΩ]
Ta=25°C
pulsed
10
Source Current : Is [A]
2.0
Fig.10 Static Drain-Source On-State Resistance vs. Gate-Source Voltage
Fig.9 Source Current vs. Source-Drain Voltage
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
1
0.1
40
ID=6.3A
ID=12.5A
30
20
10
0
0.01
0.0
0.5
1.0
1.5
0
2.0
2
4
6
8
10
Gate-Source Voltage : VGS [V]
Source-Drain Voltage : VSD [V]
Fig.11 Switching Characteristics
Fig.12 Dynamic Input Characteristics
10000
10
VDD≒15V
VGS=10V
RG=10Ω
Ta=25°C
Pulsed
Ta=25°C
VDD=15V
ID=12.5A
Pulsed
8
Gate-Source Voltage : VGS [V]
1000
Switching Time : t [ns]
1.5
Gate-Source Voltage : VGS [V]
Drain Current : ID [A]
tf
td(off)
100
10
tr
6
4
2
td(on)
1
0
0.01
0.1
1
10
100
0
10
15
20
25
Total Gate Charge : Qg [nC]
Drain Current : ID [A]
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4/6
2011.03 - Rev.A
Data Sheet
RXH125N03
Fig.14 Maximum Safe Operating Area
Fig.13 Typical Capacitance vs. Drain-Source Voltage
100
10000
Operation in this area is limited by RDS(on)
(VGS = 10V)
PW = 100μs
1000
Drain Current : ID [ A ]
Capacitance : C [pF]
10
Ciss
Coss
100
PW = 1ms
1
PW = 10ms
0.1
Crss
Ta=25°C
Single Pulse
Mounted on a ceramic board.
(30mm × 30mm × 0.8mm)
Ta=25°C
f=1MHz
VGS=0V
DC Operation
0.01
10
0.01
0.1
1
10
0.1
100
1
10
100
Drain-Source Voltage : VDS [ V ]
Drain-Source Voltage : VDS [V]
Fig.15 Normalized Transient Thermal Resistance v.s. Pulse Width
Normalized Transient Thermal Resistance : r (t)
10
Ta=25°C
Single Pulse
1
0.1
0.01
Mounted on a ceramic board.
(30mm × 30mm × 0.8mm)
Rth(ch-a)=62.5°C/W
Rth(ch-a)(t)=r(t)×Rth(ch-a)
0.001
0.0001
0.0001
0.001
0.01
0.1
1
10
100
1000
Pulse width : Pw (s)
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5/6
2011.03 - Rev.A
Data Sheet
RXH125N03
 Measurement circuits
Pulse width
VGS
ID
VDS
90%
50%
10%
VGS
VDS
RL
50%
10%
D.U.T.
VDD
RG
10%
90%
td(on)
ton
Fig.1-1 Switching Time Measurement Circuit
90%
td(off)
tr
tf
toff
Fig.1-2 Switching Waveforms
VG
VGS
ID
VDS
Qg
RL
IG(Const.)
VGS
D.U.T.
Qgs
Qgd
VDD
Charge
Fig.2-1 Gate Charge Measurement Circuit
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Fig.2-2 Gate Charge Waveform
6/6
2011.03 - Rev.A
Notice
Notes
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R1120A