ROHM RTF016N05

Data Sheet
2.5V Drive Nch MOSFET
RTF016N05
 Structure
Silicon N-channel MOSFET
 Dimensions (Unit : mm)
0.2Max.
TUMT3
Features
1) Low on-resistance.
2) Built-in G-S Protection Diode.
3) Small Surface Mount Package (TUMT3).
Abbreviated symbol : PU
 Application
Switching
 Packaging specifications
 Inner circuit
Package
Type
Code
Basic ordering unit (pieces)
RTF016N05
Taping
TL
3000

(3)
∗2
∗1
 Absolute maximum ratings (Ta = 25C)
Parameter
Symbol
Limits
Drain-source voltage
VDSS
45
V
Gate-source voltage
VGSS
12
V
Drain current
Source current
(Body Diode)
Unit
Continuous
ID
1.6
A
Pulsed
Continuous
IDP
IS
*1
6.4
0.6
A
A
Pulsed
ISP
*1
6.4
A
PD
*2
0.8
W
Tch
Tstg
150
55 to 150
C
C
Symbol
Limits
Unit
156
C / W
Power dissipation
Channel temperature
Range of storage temperature
(1) Gate
(2) Source
(3) Drain
(1)
(2)
∗1 ESD PROTECTION DIODE
∗2 BODY DIODE
*1 Pw10s, Duty cycle1%
*2 Mounted on a ceramic board.
 Thermal resistance
Parameter
Channel to Ambient
Rth
(ch-a)*
*Mounted on a ceramic board.
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1/6
2011.05 - Rev.A
Data Sheet
RTF016N05
 Electrical characteristics (Ta = 25C)
Parameter
Gate-source leakage
Symbol
Min.
Typ.
Max.
Unit
IGSS
-
-
10
A
VGS=12V, VDS=0V
45
-
-
V
ID=1mA, VGS=0V
Drain-source breakdown voltage V(BR)DSS
Conditions
IDSS
-
-
1
A
VDS=45V, VGS=0V
Gate threshold voltage
VGS (th)
0.5
-
1.5
V
VDS=10V, ID=1mA
Static drain-source on-state
resistance
RDS (on)*
-
140
190
ID=1.6A, VGS=4.5V
-
150
210
m ID=1.6A, VGS=4.0V
-
200
280
ID=1.6A, VGS=2.5V
Forward transfer admittance
l Yfs l*
1.5
-
-
S
ID=1.6A, VDS=10V
Input capacitance
Ciss
-
150
-
pF
VDS=10V
Zero gate voltage drain current
Output capacitance
Coss
-
40
-
pF
VGS=0V
Reverse transfer capacitance
Crss
-
15
-
pF
f=1MHz
Turn-on delay time
td(on) *
-
8
-
ns
ID=0.8A, VDD 25V
Rise time
tr *
td(off) *
-
14
-
ns
VGS=4.5V
-
16
-
ns
RL=31.3
Turn-off delay time
Fall time
tf *
-
10
-
ns
RG=10
Total gate charge
Qg *
-
2.3
-
nC
ID=1.6A, VDD 25V
Gate-source charge
Gate-drain charge
Qgs *
Qgd *
-
0.8
0.5
-
nC
nC
VGS=4.5V
*Pulsed
Body diode characteristics (Source-Drain) (Ta = 25C)
Parameter
Forward Voltage
Symbol
VSD *
Min.
Typ.
Max.
-
-
1.2
Unit
Conditions
V
Is=1.6A, VGS=0V
*Pulsed
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2/6
2011.05 - Rev.A
Data Sheet
RTF016N05
Electrical characteristic curves (Ta=25C)
Fig.2 Typical Output Characteristics(Ⅱ)
Fig.1 Typical Output Characteristics(Ⅰ)
1.6
1.6
VGS= 10V
VGS= 4.5V
VGS= 4.0V
VGS= 2.5V
DRAIN CURRENT : ID[A]
1.2
Ta=25°C
Pulsed
1.4
1
VGS= 1.8V
0.8
VGS= 2.0V
0.6
VGS= 1.8V
1.2
DRAIN CURRENT : ID[A]
1.4
0.4
0.2
VGS= 2.0V
0.8
0.6
0.4
0.2
0
Ta=25°C
Pulsed
0
0
0.2
0.4
0.6
0.8
1
0
2
6
8
10
Fig.4 Static Drain-Source On-State
Resistance vs. Drain Current(Ⅰ)
Fig.3 Typical Transfer Characteristics
10
1000
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[mΩ]
VDS= 10V
Pulsed
1
DRAIN CURRENT : ID[A]
4
DRAIN-SOURCE VOLTAGE : VDS[V]
DRAIN-SOURCE VOLTAGE : VDS[V]
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= - 25°C
0.1
0.01
Ta=25°C
Pulsed
100
.
VGS= 2.5V
VGS= 4.0V
VGS= 4.5V
10
0.001
0
1
2
0.1
3
1
10
GATE-SOURCE VOLTAGE : VGS[V]
DRAIN-CURRENT : ID[A]
Fig.5 Static Drain-Source On-State
Resistance vs. Drain Current(Ⅱ)
Fig.6 Static Drain-Source On-State
Resistance vs. Drain Current(Ⅲ)
1000
1000
VGS= 4.5V
Pulsed
VGS= 4.0V
Pulsed
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[mΩ]
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[mΩ]
VGS= 10V
VGS= 4.5V
VGS= 4.0V
VGS= 2.5V
1
100
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= - 25°C
10
100
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= - 25°C
10
0.1
1
10
0.1
DRAIN-CURRENT : ID[A]
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1
10
DRAIN-CURRENT : ID[A]
3/6
2011.05 - Rev.A
Data Sheet
RTF016N05
Fig.7 Static Drain-Source On-State
Resistance vs. Drain Current(Ⅳ)
Fig.8 Forward Transfer Admittance
vs. Drain Current
10
FORWARD TRANSFER ADMITTANCE : |Yfs| [S]
1000
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[mΩ]
VGS= 2.5V
Pulsed
100
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= - 25°C
1
1
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= - 25°C
0.1
0.01
10
0.1
VDS= 10V
Pulsed
10
0.1
DRAIN-CURRENT : ID[A]
Fig.9 Reverse Drain Current
vs. Sourse-Drain Voltage
350
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(ON)[mΩ]
VGS=0V
Pulsed
SOURCE CURRENT : Is [A]
10
Fig.10 Static Drain-Source On-State
Resistance vs. Gate Source Voltage
10
1
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= - 25°C
0.1
0.01
ID= 1.6A
300
250
ID= 0.8A
200
150
100
50
0
0
0.5
1
1.5
0
2
4
6
8
10
GATE-SOURCE VOLTAGE : VGS[V]
SOURCE-DRAIN VOLTAGE : VSD [V]
Fig.12 Dynamic Input Characteristics
Fig.11 Switching Characteristics
10
1000
tf
GATE-SOURCE VOLTAGE : VGS [V]
Ta=25°C
VDD=25V
VGS=4.5V
RG=10W
Pulsed
td(off)
SWITCHING TIME : t [ns]
1
DRAIN-CURRENT : ID[A]
100
10
tr
td(on)
1
8
6
4
Ta=25°C
VDD= 25V
ID= 1.6A
RG=10W
Pulsed
2
0
0.01
0.1
1
10
0
DRAIN-CURRENT : ID[A]
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1
2
3
4
5
TOTAL GATE CHARGE : Qg [nC]
4/6
2011.05 - Rev.A
Data Sheet
RTF016N05
Fig.13 Typical Capacitance
vs. Drain-Source Voltage
Fig.14 Maximum Safe Operating Area
1000
100
Operation in this area is limited by RDS(ON)
(VGS=4.5V)
DRAIN CURRENT : ID (A)
CAPACITANCE : C [pF]
Ciss
100
Crss
10
10
PW =100us
1
DC operation
PW =1ms
PW =10ms
0.1
Coss
Ta=25°C
Single Pulse
Mounted on a ceramic board.
(30mm × 30mm × 0.8mm)
Ta=25°C
f=1MHz
VGS=0V
1
0.01
0.01
0.1
1
10
100
0.1
1
10
100
DRAIN-SOURCE VOLTAGE : VDS[V]
DRAIN-SOURCE VOLTAGE : VDS[V]
Fig.15 Normalized Transient Thermal Resistance vs. Pulse Width
10
NORMARIZED TRANSIENT THERMAL
RESISTANCE : r (t)
Ta = 25°C
Single Pulse
1
0.1
Mounted on a ceramic board.
(30mm × 30mm × 0.8mm)
Rth(ch-a)=156°C/W
Rth(ch-a)(t)=r(t)×Rth(ch-a)
0.01
0.001
0.0001
0.001
0.01
0.1
1
10
100
1000
PULSE WIDTH : Pw(s)
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5/6
2011.05 - Rev.A
Data Sheet
RTF016N05
 Measurement circuits
Pulse width
VGS
ID
VDS
90%
50%
10%
VGS
VDS
RL
50%
10%
D.U.T.
VDD
RG
10%
90%
td(on)
ton
Fig.1-1 Switching Time Measurement Circuit
90%
td(off)
tr
tf
toff
Fig.1-2 Switching Waveforms
VG
VGS
ID
VDS
Qg
RL
IG(Const.)
VGS
D.U.T.
Qgs
Qgd
VDD
Charge
Fig.2-1 Gate Charge Measurement Circuit
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Fig.2-2 Gate Charge Waveform
6/6
2011.05 - Rev.A
Notice
Notes
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R1120A