Standard Products
QCOTSTM UT8Q512 512K x 8 SRAM
Data Sheet
November, 2004
FEATURES
20ns (3.3 volt supply) maximum address access time
Asynchronous operation for compatibility with industrystandard 512K x 8 SRAMs
TTL compatible inputs and output levels, three-state
bidirectional data bus
Typical radiation performance
- Total dose: 50krads
- >100krads(Si), for any orbit, using Aeroflex UTMC
patented shielded package
- SEL Immune >80 MeV-cm2/mg
- LETTH(0.25) = >10 MeV-cm2/mg
- Saturated Cross Section cm2 per bit, 5.0E-9
- <1E-8 errors/bit-day, Adams 90% geosynchronous
heavy ion
Packaging options:
- 36-lead ceramic flatpack (3.42 grams)
- 36-lead flatpack shielded (10.77 grams)
Standard Microcircuit Drawing 5962-99607
- QML T and Q compliant
Clk. Gen.
Writing to the device is accomplished by taking Chip Enable
one (E) input LOW and Write Enable (W) inputs LOW. Data on
the eight I/O pins (DQ0 through DQ7) is then written into the
location specified on the address pins (A0 through A18). Reading
from the device is accomplished by taking Chip Enable one (E)
and Output Enable (G) LOW while forcing Write Enable (W)
HIGH. Under these conditions, the contents of the memory
location specified by the address pins will appear on the I/O pins.
The eight input/output pins (DQ0 through DQ7) are placed in a
high impedance state when the device is deselected (E, HIGH),
the outputs are disabled (G HIGH), or during a write operation
(E LOWand W LOW).
Row Select
Memory Array
1024 Rows
512x8 Columns
I/O Circuit
Column Select
A9
CLK
Gen.
A12
A13
A14
A15
A16
A17
A18
Data
Control
A10
A11
DQ 0 - DQ 7
The QCOTSTM UT8Q512 Quantified Commercial Off-theShelf product is a high-performance CMOS static RAM
organized as 524,288 words by 8 bits. Easy memory expansion
is provided by an active LOW Chip Enable (E), an active LOW
Output Enable (G), and three-state drivers. This device has a
power-down feature that reduces power consumption by more
than 90% when deselected.
Pre-Charge Circuit
A0
A1
A2
A3
A4
A5
A6
A7
A8
INTRODUCTION
E
W
G
Figure 1. UT8Q512
1 SRAM Block Diagram
DEVICE OPERATION
A0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
A1
A2
A3
A4
E
DQ0
DQ1
VDD
VSS
DQ2
DQ3
W
A5
A6
A7
A8
A9
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
The UT8Q512 has three control inputs called Enable 1 (E), Write
Enable (W), and Output Enable (G); 19 address inputs, A(18:0);
and eight bidirectional data lines, DQ(7:0). E Device Enable
controls device selection, active, and standby modes. Asserting
E enables the device, causes IDD to rise to its active value, and
decodes the 19 address inputs to select one of 524,288 words in
the memory. W controls read and write operations. During a read
cycle, G must be asserted to enable the outputs.
NC
A18
A17
A16
A15
G
DQ7
DQ6
VSS
VDD
DQ5
DQ4
A14
A13
A12
A11
A10
NC
Table 1. Device Operation Truth Table
Figure 2. 25ns SRAM Pinout (36)
PIN NAMES
G
W
E
I/O Mode
Mode
X1
X
1
3-state
Standby
X
0
0
Data in
Write
1
1
0
3-state
Read2
0
1
0
Data out
Read
A(18:0)
Address
Notes:
1. “X” is defined as a “don’t care” condition.
2. Device active; outputs disabled.
DQ(7:0)
Data Input/Output
READ CYCLE
E
Enable
W
Write Enable
G
Output Enable
A combination of W greater than VIH (min) and E less than VIL
(max) defines a read cycle. Read access time is measured from
the latter of Device Enable, Output Enable, or valid address to
valid data output.
VDD
Power
VSS
Ground
SRAM Read Cycle 1, the Address Access in figure 3a, is
initiated by a change in address inputs while the chip is enabled
with G asserted and W deasserted. Valid data appears on data
outputs DQ(7:0) after the specified tAVQV is satisfied. Outputs
remain active throughout the entire cycle. As long as Device
Enable and Output Enable are active, the address inputs may
change at a rate equal to the minimum read cycle time (tAVAV).
SRAM read Cycle 2, the Chip Enable - Controlled Access in
figure 3b, is initiated by E going active while G remains asserted,
W remains deasserted, and the addresses remain stable for the
entire cycle. After the specified tETQV is satisfied, the eight-bit
word addressed by A(18:0) is accessed and appears at the data
outputs DQ(7:0).
SRAM read Cycle 3, the Output Enable - Controlled Access in
figure 3c, is initiated by G going active while E is asserted, W
is deasserted, and the addresses are stable. Read access time is
tGLQV unless tAVQV or tETQV have not been satisfied.
2
WRITE CYCLE
by G, the user must wait tWLQZ before applying data to the eight
bidirectional pins DQ(7:0) to avoid bus contention.
A combination of W less than VIL(max) and E less than
VIL(max) defines a write cycle. The state of G is a “don’t care”
for a write cycle. The outputs are placed in the high-impedance
state when either G is greater than VIH(min), or when W is less
than VIL(max).
TYPICAL RADIATION HARDNESS
Table 2. Typical Radiation Hardness
Design Specifications1
Write Cycle 1, the Write Enable - Controlled Access in figure
4a, is defined by a write terminated by W going high, with E
still active. The write pulse width is defined by tWLWH when the
write is initiated by W, and by tETWH when the write is initiated
by E. Unless the outputs have been previously placed in the highimpedance state by G, the user must wait tWLQZ before applying
data to the nine bidirectional pins DQ(7:0) to avoid bus
contention.
Total Dose
50
krad(Si) nominal
Heavy Ion
Error Rate2
<1E-8
Errors/Bit-Day
Notes:
1. The SRAM will not latchup during radiation exposure under recommended
operating conditions.
2. 90% worst case particle environment, Geosynchronous orbit, 100 mils of
Aluminum.
Write Cycle 2, the Chip Enable - Controlled Access in figure
4b, is defined by a write terminated by the latter of E going
inactive. The write pulse width is defined by tWLEF when the
write is initiated by W, and by tETEF when the write is initiated
by the E going active. For the W initiated write, unless the
outputs have been previously placed in the high-impedance state
3
ABSOLUTE MAXIMUM RATINGS1
(Referenced to VSS)
SYMBOL
PARAMETER
LIMITS
VDD
DC supply voltage
-0.5 to 4.6V
VI/O
Voltage on any pin
-0.5 to 4.6V
TSTG
Storage temperature
-65 to +150°C
PD
Maximum power dissipation
TJ
Maximum junction temperature2
+150°C
Thermal resistance, junction-to-case3
10°C/W
DC input current
±10 mA
ΘJC
II
1.0W
Notes:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, and functional operation of the device
at these or any other conditions beyond limits indicated in the operational sections of this specification is not recommended. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability and performance.
2. Maximum junction temperature may be increased to +175°C during burn-in and steady-static life.
3. Test per MIL-STD-883, Method 1012.
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
LIMITS
VDD
Positive supply voltage
3.0 to 3.6V
TC
Case temperature range
(C) screening: -55° to +125°C
(E) screening: -40° to +125°C
VIN
DC input voltage
0V to VDD
4
DC ELECTRICAL CHARACTERISTICS (Pre/Post-Radiation)*
(-55°C to +125°C for (C) screening and -40oC to +125oC for (W) screening) (VDD = 3.3V + 0.3)
SYMBOL
PARAMETER
CONDITION
MIN
MAX
VIH
High-level input voltage
(TTL)
VIL
Low-level input voltage
(TTL)
0.8
V
VOL1
Low-level output voltage
IOL = 8mA, VDD =3.0V (TTL)
0.4
V
VOL2
Low-level output voltage
IOL = 200µA,VDD =3.0V (CMOS)
0.08
V
VOH1
High-level output voltage
IOH = -4mA,VDD =3.0V (TTL)
VOH2
High-level output voltage
IOH = -200µA,VDD =3.0V (CMOS)
CIN1
Input capacitance
ƒ = 1MHz @ 0V
10
pF
CIO1
Bidirectional I/O capacitance
ƒ = 1MHz @ 0V
12
pF
IIN
Input leakage current
VSS < VIN < VDD, VDD = VDD (max)
-2
2
µA
IOZ
Three-state output leakage current
0V < VO < VDD
VDD = VDD (max)
G = VDD (max)
-2
2
µA
Short-circuit output current
0V < VO < VDD
-90
90
mA
IDD(OP)
Supply current operating
@ 1MHz
Inputs: VIL = 0.8V,
VIH = 2.0V
IOUT = 0mA
VDD = VDD (max)
125
mA
IDD1(OP)
Supply current operating
@40MHz
Inputs: VIL = 0.8V,
VIH = 2.0V
IOUT = 0mA
VDD = VDD (max)
180
mA
IDD2(SB)
Nominal standby supply current
@0MHz
Inputs: VIL = VSS
IOUT = 0mA
E = VDD - 0.5
VDD = VDD (max)
VIH = VDD - 0.5V
-55°C and 25°C
-40oC and 25oC
6
6
mA
mA
+125°C
40
mA
IOS2, 3
2.0
UNIT
Notes:
* Post-radiation performance guaranteed at 25°C per MIL-STD-883 Method 1019.
1. Measured only for initial qualification and after process or design changes that could affect input/output capacitance.
2. Supplied as a design limit but not guaranteed or tested.
3. Not more than one output may be shorted at a time for maximum duration of one second.
5
V
2.4
V
VDD-0.10
V
AC CHARACTERISTICS READ CYCLE (Pre/Post-Radiation)*
(-55°C to +125°C for (C) screening and -40oC to +125oC for
(W) screening) (VDD = 3.3V + 0.3)
SYMBOL
PARAMETER
MIN
MAX
tAVAV1
Read cycle time
tAVQV
Read access time
tAXQX
Output hold time
3
ns
tGLQX
G-controlled Output Enable time
0
ns
tGLQV
G-controlled Output Enable time (Read Cycle 3)
10
ns
tGHQZ2
G-controlled output three-state time
10
ns
tETQX3
E-controlled Output Enable time
tETQV3
E-controlled access time
25
ns
E-controlled output three-state time
10
ns
tEFQZ1,2,4
20
UNIT
ns
25
3
ns
Notes: * Post-radiation performance guaranteed at 25°C per MIL-STD-883 Method 1019.
1. Functional test.
2. Three-state is defined as a 300mV change from steady-state output voltage (see Figure 3).
3. The ET (enable true) notation refers to the falling edge of E. SEU immunity does not affect the read parameters.
4. The EF (enable false) notation refers to the rising edge of E. SEU immunity does not affect the read parameters.
High Z to Active Levels
Active to High Z Levels
VH - 300mV
VLOAD + 300mV
}
VLOAD
{
{
}
VLOAD - 300mV
VL + 300mV
Figure 3. 3-Volt SRAM Loading
6
ns
tAVAV
A(18:0)
DQ(7:0)
Previous Valid Data
Valid Data
tAVQV
tAXQX
Assumptions:
1. E and G < VIL (max) and W > VIH (min)
Figure 4a. SRAM Read Cycle 1: Address Access
A(18:0)
E
tETQV
DQ(7:0)
tEFQZ
tETQX
DATA VALID
Assumptions:
1. G < VIL (max) and W > VIH (min)
Figure 4b. SRAM Read Cycle 2: Chip Enable-Controlled Access
tAVQV
A(18:0)
G
tGHQZ
tGLQX
DATA VALID
DQ(7:0)
Assumptions:
1. E< VIL (max) and W > VIH (min)
tGLQV
Figure 4c. SRAM Read Cycle 3: Output Enable-Controlled Access
7
AC CHARACTERISTICS WRITE CYCLE (Pre/Post-Radiation)*
(-55°C to +125°C for (C) screening and -40oC to +125oC for (E) screening) (VDD = 3.3V + 0.3)
SYMBOL
PARAMETER
MIN
MAX
UNIT
tAVAV1
Write cycle time
20
ns
tETWH
Device Enable to end of write
20
ns
tAVET
Address setup time for write (E - controlled)
0
ns
tAVWL
Address setup time for write (W - controlled)
0
ns
tWLWH
Write pulse width
20
ns
tWHAX
Address hold time for write (W - controlled)
2
ns
tEFAX
Address hold time for Device Enable (E - controlled)
2
ns
tWLQZ2
W - controlled three-state time
tWHQX
W - controlled Output Enable time
5
ns
tETEF
Device Enable pulse width (E - controlled)
20
ns
tDVWH
Data setup time
15
ns
tWHDX2
Data hold time
2
ns
tWLEF
Device Enable controlled write pulse width
20
ns
tDVEF2
Data setup time
15
ns
tEFDX
Data hold time
2
ns
tAVWH
Address valid to end of write
20
ns
Write disable time
5
ns
tWHWL1
10
Notes:
* Post-radiation performance guaranteed at 25°C per MIL-STD-883 Method 1019.
1. Functional test performed with outputs disabled (G high).
2. Three-state is defined as 300mV change from steady-state output voltage (see Figure 3).
8
ns
A(18:0)
tAVAV2
E
tAVWH
tETWH
tWHWL
W
tAVWL
tWLWH
tWHAX
Q(7:0)
tWLQZ
D(7:0)
tWHQX
APPLIED DATA
Assumptions:
1. G < VIL (max). If G > VIH (min) then Q(8:0) will be
in three-state for the entire cycle.
2. G high for tAVAV cycle.
tDVWH
tWHDX
Figure 5a. SRAM Write Cycle 1: Write Enable - Controlled Access
9
tAVAV3
A(18:0)
tETEF
tAVET
tEFAX
E
or
tAVET
E
tETEF
tEFAX
tWLEF
W
D(7:0)
APPLIED DATA
tWLQZ
tDVEF
Q(7:0)
tEFDX
Assumptions & Notes:
1. G < VIL (max). If G > VIH (min) then Q(7:0) will be in three-state for the entire cycle.
2. Either E scenario above can occur.
3. G high for tAVAV cycle.
Figure 5b. SRAM Write Cycle 2: Chip Enable - Controlled Access
CMOS
90%
VDD-0.05V
300 ohms
10%
VLOAD = 1.55V
10%
0.5V
< 5ns
50pF
< 5ns
Input Pulses
Notes:
1. 50pF including scope probe and test socket capacitance.
2. Measurement of data output occurs at the low to high or high to low transition mid-point
(i.e., CMOS input = VDD/2).
Figure 6. AC Test Loads and Input Waveforms
10
DATA RETENTION CHARACTERISTICS (Pre/Post-Irradiation)
(1 Second Data Retention Test)
SYMBOL
PARAMETER
MINIMUM
MAXIMUM
UNIT
VDR
VDD for data retention
2.0
--
V
IDDR 1,2
Data retention current
--
2.0
mA
tEFR1,3
Chip select to data retention time
0
ns
tAVAV
ns
Operation recovery time
tR1,3
Notes:
1. E = VDD - .2V, all other inputs = VDR or VSS.
2. Data retention current (IDDR) Tc = 25oC.
3. Not guaranteed or tested.
DATA RETENTION CHARACTERISTICS (Pre/Post-Irradiation)
(10 Second Data Retention Test, Tc= -55oC to +125oC for (C) screening
SYMBOL
PARAMETER
VDD for data retention
VDD1
tEFR2, 3
Chip select to data retention time
Operation recovery time
tR2, 3
MINIMUM
MAXIMUM
UNIT
3.0
3.6
V
0
ns
tAVAV
ns
Notes:
1. Performed at VDD (min) and VDD (max).
2. E = VSS, all other inputs = VDR or VSS.
3. Not guaranteed or tested.
DATA RETENTION MODE
VDD
50%
VDR > 2.0V
50%
tR
tEFR
E
Figure 7. Low VDD Data Retention Waveform
11
PACKAGING
1. All exposed metalized areas are gold plated over electroplated nickel per MIL-PRF-38535.
2. The lid is electrically connected to VSS.
3. Lead finishes are in accordance to MIL-PRF-38535.
4. Lead position and coplanarity are not measured.
5. ID mark is vendor option.
6. Total weight is approx. 3.42 grams
Figure 8. 36-pin Ceramic FLATPACK
12
1. All package finishes are per MIL-PRF-38535.
2. Letter designations are for cross-reference to MIL-STD-1835.
3. All leads increase max. limit by 0.003 measured at the center of the flat, when lead finish A (solder) is applied.
4. Total weight is approx. 10.77 g.
5. X-rays are an ineffective test for shielded packages.
Figure 9. 36-lead flatpack shielded package
13
ORDERING INFORMATION
512K x 8 SRAM:
UT8Q512 - * *
*
*
Lead Finish:
(A) = Hot solder dipped
(C) = Gold
(X) = Factory option (gold or solder)
Screening:
(C) = Military Temperature Range flow
(P) = Prototype flow
(W) = Extended Industrial Temperature Range Flow (-40oC to +125oC)
Package Type:
(I) = 36-lead flatpack shielded package (bottom brazed)
(U) = 36-lead flatpack package (bottom brazed)
= 25ns access time, 3.3V operation
20 = 20ns access time, 3.3V operation
-Aeroflex UTMC Core Part Number
Notes:
1. Lead finish (A,C, or X) must be specified.
2. If an “X” is specified when ordering, then the part marking will match the lead finish and will be either “A” (solder) or “C” (gold).
3. Prototype flow per UTMC Manufacturing Flows Document. Tested at 25°C only. Lead finish is GOLD ONLY. Radiation neither
tested nor guaranteed.
4. Military Temperature Range flow per UTMC Manufacturing Flows Document. Devices are tested at -55°C, room temp, and +125°C.
Radiation neither tested nor guaranteed.
5. 36LBBFP Shielded Package for reduced high rel orders only.
6. Extended Industrial Temperature Range flow per UTMC Manufacturing Flows Document. Devices are tested at -40°C to +125°C.
Radiation neither tested nor guaranteed.
14
512K x 8 SRAM: SMD
5962 - 99607
** * * *
Lead Finish:
(A) = Hot solder dipped
(C) = Gold
(X) = Factory Option (gold or solder)
Case Outline:
(X) = 36-lead flatpack shielded package (bottom-brazed)
(U) = 36-lead ceramic flatpack (bottom-brazed)
Class Designator:
(T) = QML Class T
(Q) = QML Class Q
Device Type
01 = 25ns access time, 3.3V operation, Mil-Temp
02 = 25ns access time, 3.3V operation, Extended Industrial Temp (-40oC to +125oC)
03 = 20ns access time, 3.3V operation, Mil-Temp
04 = 20ns access time, 3.3V operation, Extended Industrial Temp (-40oC to +125oC)
Drawing Number: 99607
Total Dose:
(D) = 1E4 (10krad)(Si))
(P) = 3E4 (30krad)(Si)) (contact factory)
(L) = 5E4 (50krad(Si)) (contact factory)
Federal Stock Class Designator: No options
Notes:
1.Lead finish (A,C, or X) must be specified.
2.If an “X” is specified when ordering, part marking will match the lead finish and will be either “A” (solder) or “C” (gold).
3.Total dose radiation must be specified when ordering.
15
Aeroflex Colorado Springs - Datasheet Definition
Advanced Datasheet - Product In Development
Preliminary Datasheet - Shipping Prototype
Datasheet - Shipping QML & Reduced Hi-Rel
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