ROHM ES6U41

2.5V Drive Nch+SBD MOSFET
ES6U41
Dimensions (Unit : mm)
Structure
Silicon N-channel MOSFET /
Schottky barrier diode
WEMT6
Features
1) Nch MOSFET and schottky barrier diodeare put in WEMT6 package.
2) High-speed switching, Low On-resistance.
3) Low voltage drive (2.5V drive).
4) Built-in Low VF schottky barrier diode.
(5)
(4)
(1)
(2)
(3)
Abbreviated symbol : U41
Applications
Switching
Package specifications
Inner circuit
Package
Type
(6)
Taping
Code
T2R
Basic ordering unit (pieces)
8000
(6)
(4)
(5)
ES6U41
∗2
∗1
(1)
Absolute maximum ratings (Ta=25C)
∗1 ESD protection diode
∗2 Body diode
<MOSFET>
Parameter
Drain-source voltage
Gate-source voltage
Symbol
VDSS
VGSS
ID
IDP ∗1
IS
ISP ∗1
Limits
30
±12
Channel temperature
Tch
150
°C
Power dissipation
PD
0.7
W / ELEMENT
Limits
25
20
0.5
Unit
V
V
A
Continuous
Pulsed
Continuous
Pulsed
Drain current
Source current
(Body diode)
∗2
(2)
(3)
(1)Gate
(2)Source
(3)Anode
(4)Cathode
(5)Drain
(6)Drain
Unit
V
V
A
A
A
A
±1.5
±6.0
0.75
6.0
∗1 Pw≤10μs, Duty cycle≤1%
∗2 Mounted on a ceramic board
<Di>
Parameter
Repetitive peak reverse voltage
Reverse voltage
Forward current
Symbol
VRM
VR
IF
IFSM
Forward current surge peak
Junction temperature
Power dissipation
Tj
PD
∗1
2.0
A
∗2
150
0.5
°C
W / ELEMENT
∗1 60Hz 1cycle
∗2 Mounted on ceramic board
<MOSFET and Di>
Parameter
Symbol
Power dissipation
Range of storage temperature
PD ∗
Tstg
Limits
Unit
0.8
−55 to +150
W / TOTAL
°C
∗ Mounted on a ceramic board
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c 2012 ROHM Co., Ltd. All rights reserved.
○
1/4
2012.02 - Rev.B
Data Sheet
ES6U41
Electrical characteristics
<MOSFET>
Parameter
Symbol
IGSS
Gate-source leakage
Drain-source breakdown voltage V(BR) DSS
Zero gate voltage drain current
IDSS
Gate threshold voltage
VGS (th)
Static drain-source on-state
resistance
Forward transfer admittance
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Total gate charge
Gate-source charge
Gate-drain charge
RDS (on)∗
Yfs
Ciss
Coss
Crss
td (on)
tr
td (off)
tf
Qg
Qgs
Qgd
∗
∗
∗
∗
∗
∗
∗
∗
Min.
−
30
−
0.5
−
−
−
1.5
−
−
−
−
−
−
−
−
−
−
Typ.
Max.
−
−
−
−
170
180
240
−
80
14
12
7
9
15
6
1.6
0.5
0.3
±10
−
1
1.5
240
250
340
−
−
−
−
−
−
−
−
2.2
−
−
Unit
μA
V
μA
V
mΩ
mΩ
mΩ
S
pF
pF
pF
ns
ns
ns
ns
nC
nC
nC
Conditions
VGS=±12V, VDS=0V
ID= 1mA, VGS=0V
VDS= 30V, VGS=0V
VDS= 10V, ID= 1mA
ID= 1.5A, VGS= 4.5V
ID= 1.5A, VGS= 4V
ID= 1.5A, VGS= 2.5V
VDS= 10V, ID= 1.5A
VDS= 10V
VGS=0V
f=1MHz
VDD 15V
ID= 0.75A
VGS= 4.5V
RL 20Ω
RG= 10Ω
VDD 15V, VGS= 4.5V
ID= 1.5A, RL 10Ω
RG= 10Ω
∗Pulsed
<Body diode characteristics (Source-drain)>
Parameter
Symbol Min.
Forward voltage
Typ.
Max.
VSD
−
−
1.2
Unit
V
Conditions
Symbol
Min.
Typ.
Max.
Unit
−
−
0.36
V
−
−
0.52
V
IF= 0.5A
−
−
100
μA
VR= 20V
IS= 0.75A, VGS=0V
<Di>
Parameter
Forward voltage
VF
Reverse current
IR
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c 2012 ROHM Co., Ltd. All rights reserved.
○
Conditions
IF= 0.1A
2/4
2012.02 - Rev.B
Data Sheet
ES6U41
Electrical characteristics curves
<MOSFET>
2
1.5
1
VGS= 1.7V
VGS= 1.6V
0.5
1.5
VGS= 1.7V
1
VGS= 1.6V
0.5
0
0.2
0.4
0.6
0.8
1
0
2
DRAIN-SOURCE VOLTAGE : VDS[V]
100
VGS= 2.5V
VGS= 4.0V
VGS= 4.5V
10
1
8
10
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
10
0.01
0.1
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
10
10
DRAIN-CURRENT : ID[A]
Fig.7 Static Drain-Source On-State
Resistance vs. Drain Current(Ⅳ)
FORWARD TRANSFER ADMITTANCE : |Yfs| [S]
100
10
100
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
10
0.01
10
0.1
1
10
DRAIN-CURRENT : ID[A]
Fig.6 Static Drain-Source On-State
Resistance vs. Drain Current(Ⅲ)
10
VDS= 10V
Pulsed
1
Ta= -25°C
Ta=25°C
Ta=75°C
Ta=125°C
0.1
0.01
2.0
VGS= 4.0V
Pulsed
DRAIN-CURRENT : ID[A]
VGS= 2.5V
Pulsed
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1
1.5
GATE-SOURCE VOLTAGE : VGS[V]
Fig.5 Static Drain-Source On-State
Resistance vs. Drain Current(Ⅱ)
1000
c 2012 ROHM Co., Ltd. All rights reserved.
○
1.0
Fig.3 Typical Transfer Characteristics
1000
100
DRAIN-CURRENT : ID[A]
1
0.01
0.001
0.5
10
VGS= 4.5V
Pulsed
Fig.4 Static Drain-Source On-State
Resistance vs. Drain Current(Ⅰ)
0.1
0.1
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(ON)[mΩ]
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(ON)[mΩ]
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(ON)[mΩ]
6
1000
0.1
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= - 25°C
Fig.2 Typical Output Characteristics(Ⅱ)
Ta=25°C
Pulsed
0.01
1
DRAIN-SOURCE VOLTAGE : VDS[V]
Fig.1 Typical Output Characteristics(Ⅰ)
0.01
4
REVERSE DRAIN CURRENT : Is [A]
0
VDS= 10V
Pulsed
VGS= 1.5V
0
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(ON)[mΩ]
VGS= 1.8V
Ta=25°C
Pulsed
1000
10
Ta=25°C
Pulsed
VGS= 10V
VGS= 2.5V
VGS= 2.2V
DRAIN CURRENT : ID[A]
VGS= 10V
VGS= 4.5V
VGS= 4.0V
VGS= 2.5V
VGS= 2.2V
VGS= 1.8V
DRAIN CURRENT : ID[A]
DRAIN CURRENT : ID[A]
2
0.1
1
10
DRAIN-CURRENT : ID[A]
Fig.8 Forward Transfer Admittance
vs. Drain Current
3/4
VGS=0V
Pulsed
1
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
0.1
0.01
0.2
0.4
0.6
0.8
1.0
1.2
SOURCE-DRAIN VOLTAGE : VSD [V]
Fig.9 Reverse Drain Current
vs. Sourse-Drain Voltage
2012.02 - Rev.B
Data Sheet
ES6U41
1000
800
ID= 1.50A
600
ID= 0.75A
400
200
5
td(off)
100
tf
10
tr
td(on)
0
Ta=25°C
VDD= 15V
VGS= 4.5V
RG=10Ω
Pulsed
GATE-SOURCE VOLTAGE : VGS [V]
Ta=25°C
Pulsed
SWITCHING TIME : t [ns]
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(ON)[mΩ]
1000
1
0
2
4
6
8
10
0.01
0.1
GATE-SOURCE VOLTAGE : VGS[V]
Fig.10 Static Drain-Source On-State
Resistance vs. Gate Source Voltage
1
10
4
3
2
Ta=25°C
VDD= 15V
ID= 1.5A
RG=10Ω
Pulsed
1
0
0
0.5
1
1.5
2
DRAIN-CURRENT : ID[A]
TOTAL GATE CHARGE : Qg [nC]
Fig.11 Switching Characteristics
Fig.12 Dynamic Input Characteristics
CAPACITANCE : C [pF]
1000
Ciss
100
Crss
10
Coss
Ta=25°C
f=1MHz
VGS=0V
1
0.01
0.1
1
10
100
DRAIN-SOURCE VOLTAGE : VDS[V]
Fig.13 Typical Capacitance
vs. Drain-Source Voltage
<Di>
1
pulsed
pulsed
10000
Ta = 75℃
1000
Ta = 25℃
100
10
Ta= - 25℃
1
0.1
0.01
FORWARD CURRENT : IF (A)
(A)
REVERSE CURRENT ::IIRF (A)
100000
0.1
Ta = 75℃
Ta = 25℃
Ta= - 25℃
0.01
0.001
0
5
10
15
20
25
0
REVERSE VOLTAGE : VR[V]
Fig.1 Reverse Current vs. Reverse Voltage
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c 2012 ROHM Co., Ltd. All rights reserved.
○
0.1
0.2
0.3
0.4
0.5
0.6
FORWARD VOLTAGE : VF[V]
Fig.2 Forward Current vs. Forward Voltage
4/4
2012.02 - Rev.B
Notice
Notes
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R1120A