94585

REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
E
Added device type 06 for vendor cages 54230 and 88379. Added
vendor cage 0EU86 for device types 01 through 06. Figure 1,
changed case outline M to reflect package is available in either a
single or dual cavity. -sld
99-05-14
K. A. Cottongim
F
Added case outline 9.
00-04-06
Raymond Monnin
G
Added device types 07, 08, and 09 for vendor cage 0EU86. Made
changes to table I to include the addition of device types 07, 08, and
09. Added a min limit to the table I for the ILI, and the ILO tests. Made
changes to Figures 2, 3, 4, 5, 6, and 8. -sld
02-01-31
Raymond Monnin
H
Added case outline Z. Updated paragraph 1.2.4, 1.3, figures 1, 2,
and 8. -sld
02-06-04
Raymond Monnin
J
Added case outline B. Added note to paragraph 1.2.4. -sld
03-10-06
Raymond Monnin
K
Updated drawing paragraphs. -sld
12-04-16
Charles F. Saffle
L
Paragraph 1.2.4 Case outline M: Correct case outline M package
style from “single/dual” to “dual”. Paragraph 1.2.4 footnote 1/: Delete
“(single cavity)” and “Case outline A can be used if longer leads are
necessary”. Figure 1 case outline M: Correct figure 1 to reflect dual
cavity quad flatpack only for case outline M. -gc
12-08-16
Charles F. Saffle
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PMIC N/A
PREPARED BY
Gary Zahn
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
CHECKED BY
Michael C. Jones
APPROVED BY
Kendall A. Cottongim
http://www.landandmaritime.dla.mil/
MICROCIRCUIT, HYBRID, MEMORY,
DIGITAL, 128K x 32-BIT, ELECTRICALLY
ERASABLE/PROGRAMMABLE READ ONLY
MEMORY
DRAWING APPROVAL DATE
94-08-02
REVISION LEVEL
L
SIZE
CAGE CODE
A
67268
SHEET
DSCC FORM 2233
APR 97
1 OF
5962-94585
36
5962-E441-12
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When
available, a choice of radiation hardness assurance levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962



Federal
stock class
designator
\



RHA
designator
(see 1.2.1)
94585
01



Device
type
(see 1.2.2)
/
H



Device
class
designator
(see 1.2.3)
M



Case
outline
(see 1.2.4)
X



Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
Generic number
01
02
03
04
05
06
07
08
09
Circuit function
128K32-300
128K32-250
128K32-200
128K32-150
128K32-140
128K32-120
128K32-250
128K32-200
128K32-150
EEPROM, 128K x 32-bit
EEPROM, 128K x 32-bit
EEPROM, 128K x 32-bit
EEPROM, 128K x 32-bit
EEPROM, 128K x 32-bit
EEPROM, 128K x 32-bit
EEPROM, 128K x 32-bit
EEPROM, 128K x 32-bit
EEPROM, 128K x 32-bit
Access time
300 ns
250 ns
200 ns
150 ns
140 ns
120 ns
250 ns
200 ns
150 ns
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level.
All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K,
and E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
Device performance documentation
K
Highest reliability class available. This level is intended for use in space
applications.
H
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
G
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C and D).
E
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
2
D
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
1.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
B
M 1/
N
T
U
X
Y
4
5
6
9 1/
Z
Descriptive designator
Terminals
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
68
68
68
66
66
66
66
66
66
66
68
68
Package style
Ceramic, single cavity, quad flatpack
Ceramic, dual cavity, quad flatpack
Ceramic, single cavity, quad flatpack
Hex-in-line, single cavity, with standoffs
Hex-in-line, single cavity, without standoffs
Hex-in-line, single cavity, with standoffs
Hex-in-line, single cavity, without standoffs
1.075", hex-in-line, single cavity, with standoffs
1.075", hex-in-line, single cavity, with standoffs
1.075", hex-in-line, single cavity, with standoffs
Ceramic, single cavity, quad flatpack
Ceramic, dual cavity, quad flatpack
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 2/
Supply voltage range (VCC) ........................................................
Input voltage range ....................................................................
Power dissipation (PD) ...............................................................
Storage temperature range ........................................................
Lead temperature (soldering, 10 seconds) ................................
Thermal resistance junction-to-case (θJC):
Case outlines T, X, U, and Y ..................................................
Case outline M and Z .............................................................
Case outline N ........................................................................
Case outlines 4, 5, and 6 ........................................................
Case outline B and 9 ..............................................................
Data retention ............................................................................
Endurance .................................................................................
-0.6 V to +6.25 V
-0.6 V to +6.25 V
1.4 W
-65°C to +150°C
+300°C
6.2°C/W
9.4°C/W
3.1°C/W
2.7°C/W
1.79°C/W
10 years minimum
10,000 cycles minimum 3/
1.4 Recommended operating conditions.
Supply voltage range (VCC) ........................................................
Input low voltage range (VIL) ......................................................
Input high voltage range (VIH):
Device types 01 through 06 ....................................................
Device types 07 through 09 ....................................................
Output voltage, High minimum (VOH) .........................................
Output voltage, low maximum (VOL) ...........................................
Case operating temperature range (TC) .....................................
1/
2/
3/
+4.5 V dc to +5.5 V dc
-0.5 V dc to +0.8 V dc
+2.0 V dc to VCC + 0.3 V dc
+2.2 V dc to VCC + 0.3 V dc
+2.4 V dc
+0.45 V dc
-55°C to +125°C
Due to the short leads of case outline M and case outline 9, caution should be taken if the system
application is to be used where extreme thermal transitions can occur.
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
Device types 7 through 9 for page mode writes only.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
3
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at https://assist.dla.mil/quicksearch/ or from the Standardization Document
Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The
manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as
defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not
affect the form, fit, or function of the device for the applicable device class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.
3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figures 4, 5, 6, and 7.
3.2.5 Block diagram. The block diagram shall be as specified on figure 8.
3.2.5 Typical output test circuit. The typical output test circuit shall be as specified on figure 9.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
4
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Programming procedure. The programming procedure shall be as specified by manufacturer and shall be available on
request.
3.6 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked as listed in MIL-HDBK-103
and QML-38534.
3.7 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,
for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those
which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be
made available to the preparing activity (DLA Land and Maritime -VA) upon request.
3.8 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime -VA shall affirm that the
manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein.
3.9 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
3.10 Endurance. A reprogrammability test shall be completed as part of the vendor's reliability monitors. This
reprogrammability test shall be done for the initial characterization and after any design or process changes which may affect
the reprogrammability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of
program/erase endurance cycles listed in section 1.3 herein over the full specified operating temperature range. The vendor's
procedure shall be kept under document control and shall be made available upon request of the acquiring or preparing activity.
3.11 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test shall
be done for initial characterization and after any design or process change which may affect data retention. The methods and
procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the full military
temperature range. The vendor's procedure shall be kept under document control and shall be made available upon request of
the acquiring or preparing activity.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
5
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/ 2/
-55°C ≤ TC ≤ +125°C
+4.5 V dc ≤ VCC ≤ +5.5 V dc
unless otherwise specified
Group A
subgroups
Device
types
Limits
Min
Unit
Max
DC parameters
Supply current
ICC
Standby current
ISB
CS = VIL, OE = WE = VIH,
I/O 0 through I/O 31 = open.
Inputs = VCC = +5.5 V dc,
A0 through A16 change at
f = 5 MHz CMOS levels.
1,2,3
All
250
mA
CS = VCC, OE = VIH, I/O 0
through I/O 31 = open.
Inputs = VCC = +5.5 V dc,
A0 through A16 change at
f = 5 MHz CMOS levels.
1,2,3
All
5
mA
Input leakage current
ILI
VIN = VSS to VCC
1,2,3
All
-10
+10
µA
Input leakage ( RES pin)
IIL (RES)
VIN = VSS to VCC
1,2,3
7,8,9
-500
+500
µA
Output leakage current
ILO
CS = VIH, VOUT = VSS to VCC
1,2,3
All
+10
µA
Input low voltage
VIL
1,2,3
All
Input high voltage
VIH
1,2,3
1-6
2.0
7-9
2.2
1,2,3
7-9
VCC -.5 V
Input high voltage RES
signal
VH
Output low voltage
VOL
VCC = +4.5 V dc,
IOL = 2.1 mA
1,2,3
All
Output high voltage
VOH
VCC = +4.5 V dc,
IOL = -400 µA
1,2,3
All
-10
0.8
V
V
VCC +1V
V
0.45
V
2.4
V
Capacitance
A0 - A16 3/
CAD
COE
VIN = 0 V dc, f = 1.0 MHz,
TA = +25°C
4
All
50
pF
OE capacitance 3/
CS1 -4 capacitance 3/
CCS
VIN = 0 V dc, f = 1.0 MHz,
TA = +25°C
4
All
20
pF
WE1 -4 capacitance 3/
CWE1-4
VIN = 0 V dc, f = 1.0 MHz,
TA = +25°C
4
All
20
pF
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
6
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/ 2/
-55°C ≤ TC ≤ +125°C
+4.5 V dc ≤ VCC ≤+5.5 V dc
unless otherwise specified
Group A
subgroups
Device
types
Limits
Min
Unit
Max
Capacitance - Continued.
WE capacitance 3/
CWE
VIN = 0 V dc, f = 1.0 MHz,
TA = +25°C
Case outline N only.
4
All
50
pF
I/O0-I/O31 capacitance
3/
CI/O
VOUT = 0 V dc, f = 1.0 MHz,
TA = +25°C
4
All
20
pF
RES and RDY/ BUSY
capacitance
CRES
CRDY
RES = RDY/ BUSY = 0 V
4
7,8,9
50
pF
See 4.3.1c
7,8A,8B
All
Functional tests
Functional tests
Read cycle timing characteristics
Read cycle timing
tRC
See figure 4.
9,10,11
01
02,07
03,08
04,09
05
06
300
250
200
150
140
120
ns
Address access timing
tACC
See figure 4.
9,10,11
01
02,07
03,08
04,09
05
06
300
250
200
150
140
120
ns
Chip select access timing
tACS
See figure 4.
9,10,11
01
02,07
03,08
04,09
05
06
300
250
200
150
140
120
ns
Output hold from address
tOH
See figure 4.
9,10,11
All
0
ns
change OE or CS
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
7
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/ 2/
-55°C ≤ TC ≤ +125°C
+4.5 V dc ≤ VCC ≤ +5.5 V dc
unless otherwise specified
Group A
subgroups
Device
types
Limits
Unit
Min
Max
0
0
0
0
0
0
125
100
85
55
50
75
ns
ns
Read cycle timing characteristics - Continued.
Out enable to output
valid
tOE
See figure 4.
9,10,11
01
02,07
03,08
04,05
06
09
Chip select or output
enable to output high - Z
3/
tDF
See figure 4.
9,10,11
01-06
70
07-09
50
Byte write AC timing characteristics.
Address setup time
Write pulse width
tAS
tWP
See figure 5.
9,10,11
See figure 5.
9,10,11
01-06
10
07-09
0
01-06
150
07-09
250
Chip select setup time
tCS
See figure 5.
9,10,11
All
Address hold time
tAH
See figure 5.
9,10,11
Output enable setup time
tOES
See figure 5.
9,10,11
ns
ns
0
ns
01-06
100
ns
07-09
150
01-06
4
07-09
0
ns
Data hold time
tDH
See figure 5.
9,10,11
All
10
ns
Output enable hold time
tOEH
See figure 5.
9,10,11
01-06
10
ns
07-09
0
Data setup time
tDS
See figure 5.
9,10,11
All
100
ns
Chip select hold time
tCSH
See figure 5.
9,10,11
All
0
ns
Write pulse width high
tWPH
See figure 5.
9,10,11
01-06
50
ns
07-09
300
Write cycle time
tWC
See figure 5.
9,10,11
All
10
ms
See footnotes at end of table
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
8
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/ 2/
-55°C ≤ TC ≤ +125°C
+4.5 V dc ≤ VCC ≤ +5.5 V dc
unless otherwise specified
Group A
subgroups
Device
types
Limits
Min
Unit
Max
Page mode write AC timing characteristics.
Data setup time
tDS
See figure 6.
9,10,11
All
100
ns
Data hold time
tDH
See figure 6.
9,10,11
All
10
ns
Write pulse width
tWP
See figure 6.
9,10,11
01-06
150
ns
07-09
250
Byte load cycle time
Write pulse width high
Write cycle time
tBLC
tWPH
tWC
See figure 6.
9,10,11
See figure 6.
9,10,11
01-06
150
07-09
30
01-06
50
07-09
300
See figure 6.
9,10,11
All
µs
ns
10
ms
Data polling AC timing characteristics. 3/
Data hold time
tDH
See figure 7.
9,10,11
All
10
ns
Output enable hold time
tOEH
See figure 7.
9,10,11
All
10
ns
Output enable to output
delay
tOE
See figure 7.
9,10,11
All
Write recovery time
tWR
See figure 7.
9,10,11
All
0
RES low to output float
tDFR
See figure 4.
9,10,11
07-09
0
350
ns
RES to output delay
tRR
See figure 4.
9,10,11
07-09
0
450
ns
Reset protect time
tRP
See figures 5 and 6.
9,10,11
07-09
100
Reset high time
tRES
See figures 5 and 6.
9,10,11
07-09
Time to device busy
tDB
See figures 5 and 6.
9,10,11
07-09
1/
Unless otherwise specified, the AC test conditions are as follows:
Input pulse levels: VIL = 0 V and VIH = 3.0 V.
Input rise and fall times: 5 nanoseconds.
Input and output timing reference level: 1.5 V.
2/
RES and RDY/ BUSY functions are applicable for device types 07 through 09 only.
3/
Guaranteed by design, but not tested.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
100
ns
ns
µs
µs
1.0
120
ns
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
9
Case outline M.
FIGURE 1. Case outline(s).
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
10
Case outline M - Continued.
Symbol
Millimeters
Inches
Min
Max
Min
Max
A
3.12
5.08
.123
.200
A1
2.30
4.72
.118
.186
A2
0.00
0.51
.000
.020
b
0.33
0.43
.013
.017
B
0.25 REF
.010 REF
D/E
20.32 BSC
.800 BSC
D1/E1
22.10
22.61
.870
.890
D2/E2
24.89
25.40
.980
1.000
D3/E3
23.77
24.28
.936
.956
e
1.27 BSC
R
0.13
L1
0.89
.050 BSC
.005
1.14
.035
.045
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. Pin numbers are for reference only.
3. Case outline M is a dual cavity package.
FIGURE 1. Case outline(s) - Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
11
Case outline N.
Symbol
A
A1
A2
b
c
D/E
D1/E1
D2/E2
e
e1
j
k
L
S1
Millimeters
Min
Max
4.45
5.08
1.52 BSC
1.14
1.39
0.31
0.46
0.23
0.31
63.63
66.42
39.24
40.01
73.28
84.20
1.27 BSC
20.32 BSC
4.83
5.33
37.72
38.48
12.19
13.21
9.65 BSC
Inches
Min
Max
.175
.200
.060 BSC
.045
.055
.012
.018
.009
.012
2.505
2.615
1.545
1.575
2.885
3.315
.050 BSC
.800 BSC
.190
.210
1.485
1.515
.480
.520
.380 BSC
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. Pin numbers are for reference only.
FIGURE 1. Case outline(s) - Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
12
Case outlines T, X, 4, 5, and 6.
FIGURE 1. Case outline(s) - Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
13
Case outlines T and X - Continued.
Symbol
A
A1
A2
øb
øb1
øb2
D/E
D1/E1
D2
D3
e
L
Millimeters
Min
Max
5.33
6.22
0.64
0.89
3.42
3.68
0.41
0.51
1.14
1.40
1.65
1.91
29.72
30.48
25.40 BSC
15.24 BSC
28.96
29.21
2.54 BSC
3.68
3.94
Inches
Min
Max
.210
.245
.025
.035
.135
.145
.016
.020
.045
.055
.065
.075
1.170
1.200
1.000 BSC
.600 BSC
1.140
1.150
.100 BSC
.145
.155
Case outlines 4, 5, and 6 - Continued.
Symbol
A
A1
øb
øb1
øb2
D/E
D1/E1
D2
D3
e
L
Millimeters
Min
Max
3.43
4.60
0.64
0.89
0.41
0.51
1.14
1.40
1.65
1.91
27.05
27.56
25.40 BSC
15.24 BSC
25.90
26.92
2.54 BSC
3.35
3.94
Inches
Min
Max
.135
.181
.025
.035
.016
.020
.045
.055
.065
.075
1.065
1.085
1.000 BSC
.600 BSC
1.020
1.060
.100 BSC
.132
.155
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. Pin 1 is identified by .070 inch (1.78 mm) square pad.
3. Pin numbers are for reference only.
FIGURE 1. Case outline(s) - Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
14
Case outlines U and Y.
Symbol
A
A1
A2
øb
øb1
øb2
D/E
D1/E1
D2
D3
e
L
Millimeters
Min
Max
4.70
5.84
0.13
0.51
3.42
3.68
0.41
0.51
0.76
1.52
1.65
1.91
29.72
30.48
25.40 BSC
15.24 BSC
28.96
29.21
2.54 BSC
4.19
4.70
Inches
Min
Max
.185
.230
.005
.020
.135
.145
.016
.020
.030
.060
.065
.075
1.170
1.200
1.000 BSC
.600 BSC
1.140
1.150
.100 BSC
.165
.185
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. Pin 1 is identified by .070 inch (1.78 mm) square pad.
3. Pin numbers are for reference only.
FIGURE 1. Case outline(s) - Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
15
Case outlines B and 9.
FIGURE 1. Case outline(s) - Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
16
Case outline B - Continued.
Symbol
Millimeters
Min
A
Inches
Max
Min
Max
4.06
A1
.160
2.79
.110
A2
1.12
1.42
.044
.056
b
0.33
0.43
.013
.017
C
0.15
0.25
.006
.010
D/E
20.32 BSC
.800 BSC
D1/E1
23.65
24.10
.931
.949
D2/E2
24.89
25.40
.980
1.000
e
L1
1.27 BSC
0.51
1.14
.050 BSC
.020
.045
Case outline 9 - Continued.
Symbol
Millimeters
Min
Inches
Max
Min
Max
A
3.56
.140
A1
2.79
.110
A2
0.46
0.76
.018
.030
b
0.33
0.43
.013
.017
C
0.15
0.25
.006
.010
D/E
20.32 BSC
.800 BSC
D1/E1
23.65
24.10
.931
.949
D2/E2
24.89
25.40
.980
1.000
e
L1
1.27 BSC
0.51
1.14
.050 BSC
.020
.045
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall
rule.
2. Pin numbers are for reference only.
FIGURE 1. Case outline(s) - Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
17
Case outline Z.
FIGURE 1. Case outline(s) -Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
18
Case Z - Continued.
Symbol
A
A1
A2
b
c
D/E
D1/E1
D2/E2
e
e1
j
k
L
R
S1
Millimeters
Min
Max
3.12
5.08
3.00
4.72
0.00
0.51
0.33
0.43
0.23
0.31
27.58
28.30
22.10
22.61
48.77
50.80
1.27 BSC
20.32 BSC
4.95
5.21
22.73
22.99
8.00
8.26
0.13
1.02 BSC
Inches
Min
Max
.123
.200
.118
.186
.000
.020
.013
.017
.009
.012
1.086
1.114
.870
.890
1.920
2.000
.050 BSC
.800 BSC
.195
.205
.895
.905
.315
.325
.005
.040 BSC
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. Pin numbers are for reference only.
FIGURE 1. Case outline(s) - Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
19
Device
types
1-6
Device
types
1-6
Device
types
1-6
Device
types
1-6
Case
outlines
B, M, 9
Case
outlines
B, M, 9
Case
outlines
B, M, 9
Case
outlines
B, M, 9
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
1
GND
18
GND
35
OE
52
GND
2
CS3
19
I/O8
36
CS2
53
I/O23
3
A5
20
I/O9
37
NC
54
I/O22
4
A4
21
I/O10
38
WE 2
55
I/O21
5
A3
22
I/O11
39
WE 3
56
I/O20
6
A2
23
I/O12
40
WE 4
57
I/O19
7
A1
24
I/O13
41
NC
58
I/O18
8
A0
25
I/O14
42
NC
59
I/O17
9
NC
26
I/O15
43
NC
60
I/O16
10
I/O0
27
VCC
44
I/O31
61
VCC
11
I/O1
28
A11
45
I/O30
62
A10
12
I/O2
29
A12
46
I/O29
63
A9
13
I/O3
30
A13
47
I/O28
64
A8
14
I/O4
31
A14
48
I/O27
65
A7
15
I/O5
32
A15
49
I/O26
66
A6
16
I/O6
33
A16
50
I/O25
67
WE1
17
I/O7
34
CS1
51
I/O24
68
CS4
NOTES:
1. NC is no connection.
2. For case outline M, device types 07 through 09, pin 9 is RES , pin 31 is A15, pin 32 is A14, and pin 43 is
RDY/ BUSY .
FIGURE 2. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
20
Device
types
1-6
Device
types
1-6
Device
types
1-6
Device
types
1-6
Case
outline
N
Case
outline
N
Case
outline
N
Case
outline
N
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
1
GND
18
GND
35
OE
52
GND
2
CS1
19
I/O8
36
CS4
53
I/O23
3
A5
20
I/O9
37
NC
54
I/O22
4
A4
21
I/O10
38
NC
55
I/O21
5
A3
22
I/O11
39
NC
56
I/O20
6
A2
23
I/O12
40
NC
57
I/O19
7
A1
24
I/O13
41
NC
58
I/O18
8
A0
25
I/O14
42
NC
59
I/O17
9
NC
26
I/O15
43
NC
60
I/O16
10
I/O0
27
VCC
44
I/O31
61
VCC
11
I/O1
28
A11
45
I/O30
62
A10
12
I/O2
29
A12
46
I/O29
63
A9
13
I/O3
3
A13
47
I/O28
64
A8
14
I/O4
31
A14
48
I/O27
65
A7
15
I/O5
32
A15
49
I/O26
66
A6
16
I/O6
33
A16
50
I/O25
67
WE
17
I/O7
34
CS2
51
I/O24
68
CS3
NOTE: NC is no connection.
FIGURE 2. Terminal connections - Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
21
Device
types
1-6
Device
types
1-6
Device
types
1-6
Device
types
1-6
Case
outlines
T,U,X,Y,
4,5
Case
outlines
T,U,X,Y,
4,5
Case
outlines
T,U,X,Y,
4,5
Case
outlines
T,U,X,Y,
4,5
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
1
I/O8
18
A12
35
I/O25
52
WE 3
2
I/O9
19
VCC
36
I/O26
53
CS3
3
I/O10
20
CS1
37
A6
54
GND
4
A13
21
NC
38
A7
55
I/O19
5
A14
22
I/03
39
NC
56
I/O31
6
A15
23
I/015
40
A8
57
I/O30
7
A16
24
I/O14
41
A9
58
I/O29
8
NC
25
I/O13
42
I/O16
59
I/O28
9
I/O0
26
I/O12
43
I/O17
60
A0
10
I/O1
27
OE
44
I/O18
61
A1
11
I/O2
28
NC
45
VCC
62
A2
12
WE 2
29
WE1
46
CS4
63
I/O23
13
CS2
30
I/O7
47
WE 4
64
I/O22
14
GND
31
I/O6
48
I/O27
65
I/O21
15
I/O11
32
I/O5
49
A3
66
I/O20
16
A10
33
I/O4
50
A4
17
A11
34
I/O24
51
A5
NOTE: Case outlines T, U, and 4, pins 8, 21, 28, and 39 are no connects (NC) and for case outlines X, Y, and 5, pins 8, 21,
28, and 39 are ground.
FIGURE 2. Terminal connections - Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
22
Device
types
1-6
Device
types
1-6
Device
types
1-6
Device
types
1-6
Case
outline
6
Case
outline
6
Case
outline
6
Case
outline
6
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
1
I/O8
18
A15
35
I/O25
52
WE 3
2
I/O9
19
VCC
36
I/O26
53
CS3
3
I/O10
20
CS1
37
A7
54
GND
4
A14
21
NC
38
A12
55
I/O19
5
A16
22
I/03
39
NC
56
I/O31
6
A11
23
I/015
40
A13
57
I/O30
7
A0
24
I/O14
41
A8
58
I/O29
8
NC
25
I/O13
42
I/O16
59
I/O28
9
I/O0
26
I/O12
43
I/O17
60
A1
10
I/O1
27
OE
44
I/O18
61
A2
11
I/O2
28
NC
45
VCC
62
A3
12
WE 2
29
WE1
46
CS4
63
I/O23
13
CS2
30
I/O7
47
WE 4
64
I/O22
14
GND
31
I/O6
48
I/O27
65
I/O21
15
I/O11
32
I/O5
49
A4
66
I/O20
16
A10
33
I/O4
50
A5
17
A9
34
I/O24
51
A6
NOTE: NC is no connection.
FIGURE 2. Terminal connections - Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
23
Device
types
7-9
Device
types
7-9
Device
types
7-9
Device
types
7-9
Case
outline
M, Z
Case
outline
M, Z
Case
outline
M, Z
Case
outline
M, Z
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
1
GND
18
GND
35
OE
52
GND
2
CS3
19
I/O8
36
CS2
53
I/O23
3
A5
20
I/O9
37
NC
54
I/O22
4
A4
21
I/O10
38
WE 2
55
I/O21
5
A3
22
I/O11
39
WE 3
56
I/O20
6
A2
23
I/O12
40
WE 4
57
I/O19
7
A1
24
I/O13
41
NC
58
I/O18
8
A0
25
I/O14
42
NC
59
I/O17
9
RES
26
I/O15
43
RDY/ BUSY
60
I/O16
10
I/O0
27
VCC
44
I/O31
61
VCC
11
I/O1
28
A11
45
I/O30
62
A10
12
I/O2
29
A12
46
I/O29
63
A9
13
I/O3
30
A13
47
I/O28
64
A8
14
I/O4
31
A15
48
I/O27
65
A7
15
I/O5
32
A14
49
I/O26
66
A6
16
I/O6
33
A16
50
I/O25
67
WE1
17
I/O7
34
CS1
51
I/O24
68
CS4
NOTES:
1. NC is no connection.
2. For case outline M, device types 01 through 06, pin 9 is a no connect, pin 31 is A14, pin 32 is A15, and pin 43
is a no connect.
FIGURE 2. Terminal connections - Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
24
Device types 01 through 06.
CS
OE
WE
A0-A16
Mode
Data I/O
Device
Current
H
X
X
X
Standby
High Z
Standby
L
L
H
Stable
Read
Data Out
Active
L
H
L
Stable
Write
Data In
Active
X
H
X
X
Out Disable
High Z
Active
X
X
H
X
Write Inhibit
Active
X
L
X
NOTES:
1. H = VIH = High logic level
2. L = VIL = Low logic level
3. X = Do not care (either high or low)
4. High Z = High impedance state
X
Write Inhibit
Active
Device types 07 trough 09.
Mode
CS
OE
WE
RES
RDY/ BUSY
I/O
Read
VIL
VIL
VIH
VH
High Z
Dout
Standby
VIH
X
X
X
High Z
High Z
Write
VIL
VIH
VIL
VH
High Z to VOL
DIN
Deselect
VIL
VIH
VIH
VH
High Z
High Z
Write inhibit
X
X
VIH
X
---
---
Write inhibit
X
VIL
X
X
---
---
Data polling
VIL
VIL
VIH
VH
VOL
DOUT (I/O7)
Program reset
X
X
X
VIL
High Z
High Z
NOTES:
1. VIH = High logic "1" state.
2. VIL = Low logic "0" state.
3. X = "do not care" state.
4. High Z = High impedance state.
5. DIN = Data in, DOUT = Data out, and VH = VCC - 0.5 V to VCC +1.0 V.
FIGURE 3. Truth table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
25
NOTE: RES waveform is applicable for device types 07 through 09 only.
FIGURE 4. Read cycle timing diagram.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
26
NOTE: RDY/ BUSY , RES and VCC waveforms are applicable for device types 07 through 09 only.
FIGURE 5. Write cycle timing diagram WE controlled.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
27
NOTE: RDY/ BUSY , RES and VCC waveforms are applicable for device types 07 through 09 only.
FIGURE 5. Write cycle timing diagram CS controlled - Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
28
NOTES:
1. AO through A6 are used to address specific bytes within a page.
2. A7 through A16 must specify the same page address during each high to low transition of write enable or chip select.
3. RDY/ BUSY , RES and VCC waveforms are applicable for device types 07 through 09 only.
FIGURE 6. Page mode write timing diagram.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
29
FIGURE 7. Data polling AC timing diagram.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
30
Case outlines B, M, T, U, X, Y, 4, 5, 6, and 9.
Case outline N.
FIGURE 8. Block diagram(s).
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
31
Case outlines M and Z, device types 07, 08, and 09 only.
FIGURE 8. Block diagram - Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
32
NOTES:
1. VZ is programmed from -2.0 V to +7.0 V. IOH and IOL are programmable from 0 to 16 mA.
2. Tester impedance ZO = 75 ohms
3. VZ is typically the midpoint of VOH and VOL.
4. CL includes tester includes jig capacitance.
FIGURE 9. Typical output test circuit.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
33
TABLE II. Electrical test requirements.
MIL-PRF-38534 test requirements
Subgroups
(in accordance with
MIL-PRF-38534, group
A test table)
Interim electrical parameters
1,4,7,9
Final electrical parameters
1*,2,3,4,7,8A,8B,9,10,11
Group A test requirements
1,2,3,4,7,8A,8B,9,10,11
Group C end-point electrical
parameters
1,2,3,4,7,8A,8B,9,10,11
End-point electrical parameters for
radiation hardness assurance
(RHA) devices
Not applicable
* PDA applies to subgroup 1.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form,
fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply:
a.
b.
Burn-in test, method 1015 of MIL-STD-883.
(1)
Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control and
shall be made available to either DLA Land and Maritime -VA or the acquiring activity upon request. Also, the test
circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent
specified in test method 1015 of MIL-STD-883.
(2)
TA as specified in accordance with table I of method 1015 of MIL-STD-883.
Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance
with MIL-PRF-38534 and as specified herein.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
34
4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows:
a.
Tests shall be as specified in table II herein.
b.
Subgroups 5 and 6 shall be omitted.
c.
Subgroups 7, 8A, and 8B shall include verification of the truth table.
d.
The following data patterns shall be verified during subgroups 7, 8A, and 8B:
(1)
0's to all memory cell locations.
(2)
1's to all memory cell locations.
(3)
Checkerboard pattern to entire memory array.
(4)
Checkerboard compliment to entire memory array.
4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534.
4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows:
a.
End-point electrical parameters shall be as specified in table II herein.
b.
All devices requiring end-point electrical testing shall be programmed with a checkerboard pattern of alternate rows of
AA hex and 55 hex.
c.
Steady-state life test, method 1005 of MIL-STD-883.
(1)
Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control and
shall be made available to either DLA Land and Maritime -VA or the acquiring activity upon request. Also, the test
circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent
specified in test method 1005 of MIL-STD-883.
(2)
TA as specified in accordance with table I of method 1005 of MIL-STD-883.
(3)
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
(4)
The checkerboard data pattern shall be verified after burn-in as part of end-point electrical testing.
4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534.
4.3.5 Radiation hardness assurance (RHA) insepction. RHA inspection is currently not applicable to this drawing.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
35
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated as specified in MIL-PRF38534.
6.4 Record of users. Military and industrial users shall inform DLA Land and Maritime when a system application requires
configuration control and the applicable SMD to that system. DLA Land and Maritime will maintain a record of users and this list
will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices
(FSC 5962) should contact DLA Land and Maritime-VA, telephone (614) 692-0547.
6.5 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990,
or telephone (614) 692-1081.
6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK-103
and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DLA Land and Maritime-VA and have agreed to
this drawing.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-94585
A
REVISION LEVEL
L
SHEET
36
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 12-08-16
Approved sources of supply for SMD 5962-94585 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will
be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and
a certificate of compliance has been submitted to and accepted by DLA Land and Maritime -VA. This information
bulletin is superseded by the next dated revisions of MIL-HDBK-103 and QML-38534. DLA Land and Maritime
maintains an online database of all current sources of supply at
http://www.landandmaritime.dla.mil/Programs/Smcr/.
Standard
microcircuit drawing
PIN 1/
5962-9458501HMA
5962-9458501HMC
5962-9458501HMA
5962-9458501HMC
5962-9458501HMA
5962-9458501HMC
5962-9458501HNC
5962-9458501HTA
5962-9458501HTC
5962-9458501HUA
5962-9458501HUC
5962-9458501HXA
5962-9458501HXC
5962-9458501HYA
5962-9458501HYC
5962-9458501H4A
5962-9458501H4C
5962-9458501H4A
5962-9458501H4C
5962-9458501H4A
5962-9458501H4C
5962-9458501H5A
5962-9458501H5C
5962-9458501H5A
5962-9458501H5C
5962-9458501H5A
5962-9458501H5C
5962-9458501H6A
5962-9458501H6C
5962-9458501H9A
5962-9458501H9C
5962-9458501HBA
5962-9458501HBC
Vendor
CAGE
number
Vendor
similar
PIN 2/
0EU86
0EU86
54230
54230
3/
3/
54230
54230
54230
54230
54230
54230
54230
54230
54230
0EU86
0EU86
54230
54230
3/
3/
0EU86
0EU86
54230
54230
3/
3/
54230
54230
54230
54230
54230
54230
AS8E128K32Q-300/883C
AS8E128K32Q-300/883C
WE128K32-300G2Q
WE128K32-300G2Q
ACT-E128K32N-300F2Q
ACT-E128K32N-300F2Q
WE128K32-300G4Q
WE128K32N-300HQ
WE128K32N-300HQ
WE128K32N-300HQ
WE128K32N-300HQ
WE128K32-300HQ
WE128K32-300HQ
WE128K32-300HQ
WE128K32-300HQ
AS8E128K32PN-300/883C
AS8E128K32PN-300/883C
WE128K32N-300H1Q
WE128K32N-300H1Q
ACT-E128K32N-300P7Q
ACT-E128K32N-300P7Q
AS8E128K32P-300/883C
AS8E128K32P-300/883C
WE128K32-300H1Q
WE128K32-300H1Q
ACT-E128K32C-300P7Q
ACT-E128K32C-300P7Q
WE128K32NP-300H1Q
WE128K32NP-300H1Q
WE128K32-300G1UQ
WE128K32-300G1UQ
WE128K32-300G1TQ
WE128K32-300G1TQ
See footnotes at end of table.
1 of 7
STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued.
DATE: 12-08-16
Standard
microcircuit drawing
PIN 1/
5962-9458502HMA
5962-9458502HMC
5962-9458502HMA
5962-9458502HMC
5962-9458502HMA
5962-9458502HMC
5962-9458502HNC
5962-9458502HTA
5962-9458502HTC
5962-9458502HUA
5962-9458502HUC
5962-9458502HXA
5962-9458502HXC
5962-9458502HYA
5962-9458502HYC
5962-9458502H4A
5962-9458502H4C
5962-9458502H4A
5962-9458502H4C
5962-9458502H4A
5962-9458502H4C
5962-9458502H5A
5962-9458502H5C
5962-9458502H5A
5962-9458502H5C
5962-9458502H5A
5962-9458502H5C
5962-9458502H6A
5962-9458502H6C
5962-9458502H9A
5962-9458502H9C
5962-9458502HBA
5962-9458502HBC
Vendor
CAGE
number
Vendor
similar
PIN 2/
0EU86
0EU86
54230
54230
3/
3/
54230
54230
54230
54230
54230
54230
54230
54230
54230
0EU86
0EU86
54230
54230
3/
3/
0EU86
0EU86
54230
54230
3/
3/
54230
54230
54230
54230
54230
54230
AS8E128K32Q-250/883C
AS8E128K32Q-250/883C
WE128K32-250G2Q
WE128K32-250G2Q
ACT-E128K32N-250F2Q
ACT-E128K32N-250F2Q
WE128K32-300G4Q
WE128K32N-250HQ
WE128K32N-250HQ
WE128K32N-250HQ
WE128K32N-250HQ
WE128K32-250HQ
WE128K32-250HQ
WE128K32-250HQ
WE128K32-250HQ
AS8E128K32PN-250/883C
AS8E128K32PN-250/883C
WE128K32N-250H1Q
WE128K32N-250H1Q
ACT-E128K32N-250P7Q
ACT-E128K32N-250P7Q
AS8E128K32P-250/883C
AS8E128K32P-250/883C
WE128K32-250H1Q
WE128K32-250H1Q
ACT-E128K32C-250P7Q
ACT-E128K32C-250P7Q
WE128K32NP-250H1Q
WE128K32NP-250H1Q
WE128K32-250G1UQ
WE128K32-250G1UQ
WE128K32-250G1TQ
WE128K32-250G1TQ
See footnotes at end of table.
2 of 7
STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued.
DATE: 12-08-16
Standard
microcircuit drawing
PIN 1/
5962-9458503HMA
5962-9458503HMC
5962-9458503HMA
5962-9458503HMC
5962-9458503HMA
5962-9458503HMC
5962-9458503HNC
5962-9458503HTA
5962-9458503HTC
5962-9458503HUA
5962-9458503HUC
5962-9458503HXA
5962-9458503HXC
5962-9458503HYA
5962-9458503HYC
5962-9458503H4A
5962-9458503H4C
5962-9458503H4A
5962-9458503H4C
5962-9458503H4A
5962-9458503H4C
5962-9458503H5A
5962-9458503H5C
5962-9458503H5A
5962-9458503H5C
5962-9458503H5A
5962-9458503H5C
5962-9458503H6A
5962-9458503H6C
5962-9458503H9A
5962-9458503H9C
5962-9458503HBA
5962-9458503HBC
Vendor
CAGE
number
Vendor
similar
PIN 2/
0EU86
0EU86
54230
54230
3/
3/
54230
54230
54230
54230
54230
54230
54230
54230
54230
0EU86
0EU86
54230
54230
3/
3/
0EU86
0EU86
54230
54230
3/
3/
54230
54230
54230
54230
54230
54230
AS8E128K32Q-200/883C
AS8E128K32Q-200/883C
WE128K32-200G2Q
WE128K32-200G2Q
ACT-E128K32N-200F2Q
ACT-E128K32N-200F2Q
WE128K32-300G4Q
WE128K32N-200HQ
WE128K32N-200HQ
WE128K32N-200HQ
WE128K32N-200HQ
WE128K32-200HQ
WE128K32-200HQ
WE128K32-200HQ
WE128K32-200HQ
AS8E128K32PN-200/883C
AS8E128K32PN-200/883C
WE128K32N-200H1Q
WE128K32N-200H1Q
ACT-E128K32N-200P7Q
ACT-E128K32N-200P7Q
AS8E128K32P-200/883C
AS8E128K32P-200/883C
WE128K32-200H1Q
WE128K32-200H1Q
ACT-E128K32C-200P7Q
ACT-E128K32C-200P7Q
WE128K32NP-200H1Q
WE128K32NP-200H1Q
WE128K32-200G1UQ
WE128K32-200G1UQ
WE128K32-200G1TQ
WE128K32-200G1TQ
See footnotes at end of table.
3 of 7
STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued.
DATE: 12-08-16
Standard
microcircuit drawing
PIN 1/
5962-9458504HMA
5962-9458504HMC
5962-9458504HMA
5962-9458504HMC
5962-9458504HMA
5962-9458504HMC
5962-9458504HNC
5962-9458504HTA
5962-9458504HTC
5962-9458504HUA
5962-9458504HUC
5962-9458504HXA
5962-9458504HXC
5962-9458504HYA
5962-9458504HYC
5962-9458504H4A
5962-9458504H4C
5962-9458504H4A
5962-9458504H4C
5962-9458504H4A
5962-9458504H4C
5962-9458504H5A
5962-9458504H5C
5962-9458504H5A
5962-9458504H5C
5962-9458504H5A
5962-9458504H5C
5962-9458504H6A
5962-9458504H6C
5962-9458504H9A
5962-9458504H9C
5962-9458504HBA
5962-9458504HBC
Vendor
CAGE
number
Vendor
similar
PIN 2/
0EU86
0EU86
54230
54230
3/
3/
54230
54230
54230
54230
54230
54230
54230
54230
54230
0EU86
0EU86
54230
54230
3/
3/
0EU86
0EU86
54230
54230
3/
3/
54230
54230
54230
54230
54230
54230
AS8E128K32Q-150/883C
AS8E128K32Q-150/883C
WE128K32-150G2Q
WE128K32-150G2Q
ACT-E128K32N-150F2Q
ACT-E128K32N-150F2Q
WE128K32-150G4Q
WE128K32N-150HQ
WE128K32N-150HQ
WE128K32N-150HQ
WE128K32N-150HQ
WE128K32-150HQ
WE128K32-150HQ
WE128K32-150HQ
WE128K32-150HQ
AS8E128K32PN-150/883C
AS8E128K32PN-150/883C
WE128K32N-150H1Q
WE128K32N-150H1Q
ACT-E128K32N-150P7Q
ACT-E128K32N-150P7Q
AS8E128K32P-150/883C
AS8E128K32P-150/883C
WE128K32-150H1Q
WE128K32-150H1Q
ACT-E128K32C-150P7Q
ACT-E128K32C-150P7Q
WE128K32NP-150H1Q
WE128K32NP-150H1Q
WE128K32-150G1UQ
WE128K32-150G1UQ
WE128K32-150G1TQ
WE128K32-150G1TQ
See footnotes at end of table.
4 of 7
STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued.
DATE: 12-08-16
Standard
microcircuit drawing
PIN 1/
5962-9458505HMA
5962-9458505HMC
5962-9458505HMA
5962-9458505HMC
5962-9458505HMA
5962-9458505HMC
5962-9458505HNC
5962-9458505HTA
5962-9458505HTC
5962-9458505HUA
5962-9458505HUC
5962-9458505HXA
5962-9458505HXC
5962-9458505HYA
5962-9458505HYC
5962-9458505H4A
5962-9458505H4C
5962-9458505H4A
5962-9458505H4C
5962-9458505H4A
5962-9458505H4C
5962-9458505H5A
5962-9458505H5C
5962-9458505H5A
5962-9458505H5C
5962-9458505H5A
5962-9458505H5C
5962-9458505H6A
5962-9458505H6C
5962-9458505H9A
5962-9458505H9C
5962-9458505HBA
5962-9458505HBC
Vendor
CAGE
number
Vendor
similar
PIN 2/
0EU86
0EU86
54230
54230
3/
3/
54230
54230
54230
54230
54230
54230
54230
54230
54230
0EU86
0EU86
54230
54230
3/
3/
0EU86
0EU86
54230
54230
3/
3/
54230
54230
54230
54230
54230
54230
AS8E128K32Q-140/883C
AS8E128K32Q-140/883C
WE128K32-140G2Q
WE128K32-140G2Q
ACT-E128K32N-140F2Q
ACT-E128K32N-140F2Q
WE128K32-140G4Q
WE128K32N-140HQ
WE128K32N-140HQ
WE128K32N-140HQ
WE128K32N-140HQ
WE128K32-140HQ
WE128K32-140HQ
WE128K32-140HQ
WE128K32-140HQ
AS8E128K32PN-140/883C
AS8E128K32PN-140/883C
WE128K32N-140H1Q
WE128K32N-140H1Q
ACT-E128K32N-140P7Q
ACT-E128K32N-140P7Q
AS8E128K32P-140/883C
AS8E128K32P-140/883C
WE128K32-140H1Q
WE128K32-140H1Q
ACT-E128K32C-140P7Q
ACT-E128K32C-140P7Q
WE128K32NP-140H1Q
WE128K32NP-140H1Q
WE128K32-140G1UQ
WE128K32-140G1UQ
WE128K32-140G1TQ
WE128K32-140G1TQ
See footnotes at end of table.
5 of 7
STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued.
DATE: 12-08-16
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-9458506HMA
5962-9458506HMC
5962-9458506HMA
5962-9458506HMC
5962-9458506HMA
5962-9458506HMC
5962-9458506HNC
5962-9458506HTA
5962-9458506HTC
5962-9458506HUA
5962-9458506HUC
5962-9458506HXA
5962-9458506HXC
5962-9458506HYA
5962-9458506HYC
5962-9458506H4A
5962-9458506H4C
5962-9458506H4A
5962-9458506H4C
5962-9458506H4A
5962-9458506H4C
5962-9458506H5A
5962-9458506H5C
5962-9458506H5A
5962-9458506H5C
5962-9458506H5A
5962-9458506H5C
5962-9458506H6A
5962-9458506H6C
5962-9458506H9A
5962-9458506H9C
5962-9458506HBA
5962-9458506HBC
0EU86
0EU86
54230
54230
3/
3/
54230
54230
54230
54230
54230
54230
54230
54230
54230
0EU86
0EU86
54230
54230
3/
3/
0EU86
0EU86
54230
54230
3/
3/
54230
54230
54230
54230
54230
54230
AS8E128K32Q-120/883C
AS8E128K32Q-120/883C
WE128K32-120G2Q
WE128K32-120G2Q
ACT-E128K32N-120F2Q
ACT-E128K32N-120F2Q
WE128K32-120G4Q
WE128K32N-120HQ
WE128K32N-120HQ
WE128K32N-120HQ
WE128K32N-120HQ
WE128K32-120HQ
WE128K32-120HQ
WE128K32-120HQ
WE128K32-120HQ
AS8E128K32PN-120/883C
AS8E128K32PN-120/883C
WE128K32N-120H1Q
WE128K32N-120H1Q
ACT-E128K32N-120P7Q
ACT-E128K32N-120P7Q
AS8E128K32P-120/883C
AS8E128K32P-120/883C
WE128K32-120H1Q
WE128K32-120H1Q
ACT-E128K32C-120P7Q
ACT-E128K32C-120P7Q
WE128K32NP-120H1Q
WE128K32NP-120H1Q
WE128K32-120G1UQ
WE128K32-120G1UQ
WE128K32-120G1TQ
WE128K32-120G1TQ
5962-9458507HMA
5962-9458507HMC
5962-9458507HZC
5962-9458508HMA
5962-9458508HMC
5962-9458508HZC
5962-9458509HMA
5962-9458509HMC
5962-9458509HZC
0EU86
0EU86
0EU86
0EU86
0EU86
0EU86
0EU86
0EU86
0EU86
AS8ER128K32Q-250/883C
AS8ER128K32Q-250/883C
AS8ER128K32QB-250/883C
AS8ER128K32Q-200/883C
AS8ER128K32Q-200/883C
AS8ER128K32QB-200/883C
AS8ER128K32Q-150/883C
AS8ER128K32Q-150/883C
AS8ER128K32QB-150/883C
See footnotes at top of next page.
6 of 7
STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued.
DATE: 12-08-16
1/
2/
3/
The lead finish shown for each PIN representing a hermetic package is the most readily available from the
manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine its
availability.
Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the
performance requirements of this drawing.
No longer available from an approved source of supply.
Vendor CAGE
number
Vendor name
and address
0EU86
Austin Semiconductor, Incorporated
DBA Micross Components
8701 Cross Park Drive
Austin, TX 78754
54230
White Electronic Designs Corporation
3601 East University Drive
Phoenix, AZ 85034
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
7 of 7