ETC 5962-9471605H9A

REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
A
Added device type 05. Added case outlines M, N, 4, 5, 6, 7, and 8.
Added vendor cage code 88379.
96-08-30
K. A. Cottongim
B
Figure 1; For case outlines 5, 6, 7 and 8 changed dimension D3 min
and max from 1.030 and 1.040 inches to 1.020 and 1.060 inches.
Changed dimension A min from .156 inches to .135 inches. Changed
dimension L min from .145 inches to .132 inches. -sld
98-06-25
K.A. Cottongim
C
Added case outline 9. Figure 1; changed case outline M to be either a
single or dual cavity package. Figure 1; changed the dimension A2 max
limit from .015 inches to .025 inches for case outline M. Added thermal
resistance ratings for all case outlines to paragraph 1.3 . Added vendor
cage 88379 for case outline M, device types 01 through 05. Table I;
changed IOL from 12.0 mA to 8.0 mA for the VOL test. -sld
00-06-20
Raymond Monnin
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PMIC N/A
PREPARED BY
Steve L. Duncan
STANDARD
MICROCIRCUIT DRAWING
CHECKED BY
Michael C. Jones
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
APPROVED BY
Kendall A. Cottongim
AMSC N/A
DRAWING APPROVAL DATE
94-12-16
REVISION LEVEL
C
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
MICROCIRCUIT, HYBRID, DIGITAL, FLASH
ERASABLE/PROGRAMMABLE READ ONLY
MEMORY, 128K x 32-BIT
SIZE
CAGE CODE
A
67268
SHEET
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
1 OF
5962-94716
33
5962-E148-00
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes, class D (lowest reliability), class E, (exceptions), class G
(lowered high reliability), class H (high reliability), and class K, (highest reliability) and a choice of case outlines and lead finishes
which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness
assurance levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962



Federal
stock class
designator
\
94716



RHA
designator
(see 1.2.1)
01



Device
type
(see 1.2.2)
/
H



Device
class
designator
(see 1.2.3)
M



Case
outline
(see 1.2.4)
X



Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
05
Generic number
WF128K32-150HQ5, ACT-F128K32N-150
WF128K32-120HQ5, ACT-F128K32N-120
WF128K32-90HQ5, ACT-F128K32N-090
WF128K32-70HQ5, ACT-F128K32N-070
WF128K32-60HQ5, ACT-F128K32N-060
Circuit function
EPROM, FLASH, 128K x 32-bit
EPROM, FLASH, 128K x 32-bit
EPROM, FLASH, 128K x 32-bit
EPROM, FLASH, 128K x 32-bit
EPROM ,FLASH, 128K x 32-bit
Access time
150 ns
120 ns
90 ns
70 ns
60 ns
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level as
follows:
Device class
D, E, G, H, or K
Device performance documentation
Certification and qualification to MIL-PRF-38534
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94716
A
REVISION LEVEL
C
SHEET
2
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
M
N
S
T
U
V
W
X
Y
Z
4
5
6
7
8
9
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
Terminals
68
68
66
66
66
66
66
66
66
66
66
66
66
66
66
68
Package style
Co-fired ceramic, single/dual cavity, quad flatpack, lead formed
Co-fired ceramic, single cavity, quad flatpack, lead formed
Hex-in-line, single cavity, with standoffs
Hex-in-line, single cacvity, without standoffs
Hex-in-line, single cavity, with standoffs
Hex-in-line, single cavity, without standoffs
Hex-in-line, single cavity, with standoffs
Hex-in-line, single cavity, without standoffs
Hex-in-line, single cavity, with standoffs
Hex-in-line, single cavity, without standoffs
Ceramic, single cavity, quad flat pack
1.075", hex-in-line, single cavity, with standoffs
1.075", hex-in-line, single cavity, with standoffs
1.075", hex-in-line, single cavity, with standoffs
1.075", hex-in-line, single cavity, with standoffs
Co-fired ceramic, single cavity, ultra low profile, quad flatpack
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 1/
1/
2/
Supply voltage range (VCC) 2/ .......................................................
-2.0 V dc to +7.0 V dc
Signal voltage range (any pin except A9 ) 2/ ................................
Power dissipation (PD)....................................................................
-2.0 V dc to +7.0 V dc
1.1 W
Thermal resistance, junction-to-case (θJC):
Case outline M ............................................................................
Case outline N ............................................................................
Case outline 4 .............................................................................
Case outline 9 .............................................................................
Case outlines 5, 6, 7, and 8........................................................
Case outlines S, T, U, V, W, X, Y, and Z ...................................
Storage temperature range ............................................................
Lead temperature (soldering, 10 seconds)....................................
Data retention .................................................................................
Endurance (write/erase cycles) ......................................................
A9 voltage for sector protect (VID) 3/.............................................
11.3°C/W
9°C/W
4.07°C/W
4.57°C/W
13.13°C/W
10.63°C/W
-65°C to +150°C
+300°C
10 years minimum
10,000 cycles minimum
-2.0 V dc to +14.0 V dc
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
Minimum DC voltage on input or I/O pins is -0.5 V dc. During voltage transitions, input may overshoot V
to -2.0 V dc for
SS
periods of up to 20 ns. Maximum DC voltage on output and I/O pins is V
CC
may overshoot to V
CC
3/
+ 0.5 V dc. During voltage transitions, outputs
+ 2.0 V dc for periods of up to 20 ns.
Minimum DC input voltage on A9 pin is -0.5 V dc. During voltage transitions, A9 may overshoot V
SS
to -2.0 V dc for periods of
up to 20 ns. Maximum DC input voltage on A9 is +13.5 V dc which may overshoot to +14.0 V dc for periods of up to 20 ns.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94716
A
REVISION LEVEL
C
SHEET
3
1.4 Recommended operating conditions.
Supply voltage range (VCC) ............................................................
+4.5 V dc to +5.5 V dc
Input low voltage range (VIL) ..........................................................
-0.5 V dc to +0.8 V dc
Input high voltage range (VIH) ........................................................
+2.0 V dc to VCC + 0.3 V dc
Case operating temperature range (TC).........................................
-55°C to +125°C
A9 voltage for sector protect (VID)..................................................
+11.5 V dc to +12.5 V dc
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of
this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue
of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard for Microcircuit Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's).
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbook are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class.
Therefore, the tests and inspections herein may not be performed for the applicable device class (see MIL-PRF-38534).
Furthermore, the manufacturer may take exceptions or use alternate methods to the tests and inspections herein and not perform
them. However, the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38534 and herein.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94716
A
REVISION LEVEL
C
SHEET
4
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.
3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figures 4, 5, and 6 .
3.2.5 Block diagram. The block diagram shall be as specified on figure 7.
3.2.6 Output load circuit. The output load circuit shall be as specified on figure 8.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as
specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Programming procedure. The programming procedure shall be as specified by the manufacturer and shall be available upon
request.
3.6 Marking of Device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
3.7 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for
each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if
any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made
available to the preparing activity (DSCC-VA) upon request.
3.8 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing.
The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets the
performance requirements of MIL-PRF-38534 and herein.
3.9 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
3.10 Endurance. A reprogrammability test shall be completed as part of the vendor's reliability monitors. This reprogrammability
test shall be done for the initial characterization and after any design process changes which may affect the reprogrammability of the
device. The methods and procedures may be vendor specific, but shall guarantee the number of program/erase cycles listed in
section 1.3 herein over the full military temperature range. The vendor's procedure shall be kept under document control and shall
be made available upon request of the acquiring or preparing activity.
3.11 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test shall be
done for initial characterization and after any design process change which may affect data retention. The methods and
procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the full military
temperature range. The vendor's procedure shall be kept under document control and shall be made available upon request of the
acquiring or preparing activity.
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified
in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or
function as described herein.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94716
A
REVISION LEVEL
C
SHEET
5
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/ 2/
Group A
subgroups
-55°C ≤ TA ≤+125°C
unless otherwise specified
Device
type
Limits
Min
Unit
Max
DC parameters
Input leakage current
ILI
VCC = 5.5 V dc, VIN = GND
1,2,3
All
10
µA
1,2,3
All
10
µA
1,2,3
All
140
mA
1,2,3
All
200
mA
1,2,3
All
6.5
mA
0.8
V
or VCC
Output leakage current
ILO
VCC = 5.5 V dc, VIN = GND
or VCC
VCC active current for read
ICC1
CS = VIL, OE = VIH,
f = 5 MHz, VCC = 5.5 V dc
VCC active current for
ICC2
program/erase 3/
VCC standby current
CS = VIL, OE = VIH,
f = 5 MHz, VCC = 5.5 V dc
ISB
CS = VIH, f = 5 MHz,
VCC = 5.5 V dc
Input low level 3/
VIL
1,2,3
All
Input high level 3/
VIH
1,2,3
All
Output low voltage
VOL
VCC = 4.5 V, IOL = 8.0 mA
1,2,3
All
Output high voltage
VOH1
VCC = 4.5 V, IOH = -2.5 mA
1,2,3
All
0.85 x
VCC
V
VOH2 3/
VCC = 4.5 V, IOH = -100 µA
1,2,3
All
VCC - 0.4
V
2.0
V
0.45
V
V dc
Dynamic characteristics
OE capacitance
COE
VIN = 0 V, f = 1.0 MHz,
4
All
50
pF
TA = +25° C
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94716
A
REVISION LEVEL
C
SHEET
6
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/ 2/
Group A
subgroups
-55°C ≤ TA ≤+125°C
unless otherwise specified
Device
type
Limits
Min
Unit
Max
Dynamic characterisitics - Continued
A0-16 capacitance 3/
CAD
VIN = 0 V, f = 1.0 MHz,
4
All
50
pF
4
All
20
pF
4
All
50
pF
TA = +25° C
CS capacitance 3/
CCS
VIN = 0 V, f = 1.0 MHz,
TA = +25° C
WE capacitance 3/
CWE
VIN = 0 V, f = 1.0 MHz,
TA = +25° C,
Case outline 4, only
20
Remaining case outlines
I/O0-I/O31 capacitance 3/
CI/O
VI/O = 0 V, f = 1.0 MHz,
4
All
See 4.3.1c
7, 8A,8B
All
20
pF
TA = +25° C
Functional testing
Functional tests
Read cycle AC timing characteristics
Read cycle time 3/
tRC
See figure 4
9,10,11
01
02
03
04
05
Address access time
tACC
See figure 4
9,10,11
01
02
03
04
05
150
120
90
70
60
ns
Chip select access time
tCE
See figure 4
9,10,11
01
02
03
04
05
150
120
90
70
60
ns
150
120
90
70
60
ns
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94716
A
REVISION LEVEL
C
SHEET
7
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/ 2/
Group A
subgroups
-55°C ≤ TA ≤+125°C
unless otherwise specified
Device
type
Limits
Min
Unit
Max
Read cycle AC timing characteristics - Continued
Output enable to output valid
tOE
See figure 4
9,10,11
01
02
03
04
05
55
50
40
35
30
ns
Chip select to output
high Z
tDF
See figure 4
9,10,11
01
02
03
04,05
35
30
25
20
ns
OE high to output high Z 3/
tDF
See figure 4
9,10,11
01
02
03
04,05
35
30
25
20
ns
Output hold from address,
CS or OE change, whichever
is first 3/
tOH
See figure 4
9,10,11
All
0
ns
3/
Write/Erase/Program AC timing characteristics WE controlled
Write cycle time 3/
tWC
See figure 5
9,10,11
01
02
03
04
05
150
120
90
70
60
ns
Chip select setup time
tCS
See figure 5
9,10,11
All
0
ns
Write enable pulse width
tWP
See figure 5
9,10,11
01,02
03
04
05
50
45
35
30
ns
Address setup time
tAS
See figure 5
9,10,11
All
0
ns
Data setup time
tDS
See figure 5
9,10,11
01,02
03
04,05
50
45
30
ns
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94716
A
REVISION LEVEL
C
SHEET
8
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/ 2/
Group A
subgroups
-55°C ≤ TA ≤+125°C
unless otherwise specified
Device
type
Limits
Min
Unit
Max
Write/Erase/Program AC timing characteristics WE controlled - Continued.
Data hold time
tDH
See figure 5
9,10,11
All
0
ns
Address hold time
tAH
See figure 5
9,10,11
01,02
03,04,
05
50
45
ns
Write enable pulse high 3/
tWPH
See figure 5
9,10,11
All
20
ns
Read recovery before 3/
write
tGHWL
See figure 5
9,10,11
All
0
ns
Write/Erase/Program AC timing characteristics CS controlled.
Write cycle time 3/
tWC
See figure 6
9,10,11
01
02
03
04
05
150
120
90
70
60
ns
Write enable setup time
tWS
See figure 6
9,10,11
All
0
ns
Chip select pulse width
tCP
See figure 6
9,10,11
01,02
03
04
05
50
45
35
30
ns
Address setup time
tAS
See figure 6
9,10,11
All
0
ns
Data hold time
tDH
See figure 6
9,10,11
All
0
ns
Data setup time
tDS
See figure 6
9,10,11
01,02
03
04,05
50
45
30
ns
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94716
A
REVISION LEVEL
C
SHEET
9
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/ 2/
Group A
subgroups
-55°C ≤ TA ≤+125°C
unless otherwise specified
Device
type
Limits
Min
Unit
Max
Write/Erase/Program AC characteristics CS controlled - Continued.
Address hold time
tAH
See figure 6
9,10,11
01,02
03,04,
05
50
45
ns
Chip select pulse width
high 3/
tCPH
See figure 6
9,10,11
All
20
ns
Read recovery before 3/
write
tGHEL
9,10,11
All
0
ns
1/ Unless otherwise specified, 4.5 V dc ≤ V
CC
≤ 5.5 V dc and V
SS
= 0 V.
2/ Unless otherwise specified, the DC test conditions are as follows:
Input pulse levels: V = V - 0.3 V and V = 0.3V.
IH
CC
IL
Unless otherwise specified, the AC test conditions are as follows:
Input pulse levels: V = 0 V and V = 3.0 V.
IL
IH
Input rise and fall times: 5 nanoseconds.
Input and output timing reference levels: 1.5 V.
Output load circuit as specified in figure 8.
3/ Guaranteed by design, but not tested.
STANDARD
MICROCIRCUIT DRAWING
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REVISION LEVEL
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Case outline M.
FIGURE 1. Case outlines.
STANDARD
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Case outline M - Continued.
Symbol
Millimeters
Inches
Min
Max
Min
Max
A
3.12
5.10
.123
.200
A1
2.30
4.72
.118
.186
A2
0.24
0.64
.005
.025
b
0.33
0.43
.013
.017
B
c
0.25 REF
0.23
D/E
.010 REF
0.30
.009
20.3 BSC
.012
.800 BSC
D1/E1
22.10
22.65
.870
.890
D2/E2
24.89
25.35
.980
1.000
D3/E3
23.75
24.28
.936
.956
e
1.27 BSC
.050 BSC
R
0.25 BSC
.010 BSC
L1
0.89
1.14
.035
.045
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. Pin numbers are for reference only.
3. Case outline M may be either a single cavity or dual cavity package. Dimension A2 is measured between the lowest
horizontal plane of the package and the seating plane of the lead(s).
FIGURE 1. Case outlines - Continued.
STANDARD
MICROCIRCUIT DRAWING
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REVISION LEVEL
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Case outline N.
FIGURE 1. Case outlines - Continued.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94716
A
REVISION LEVEL
C
SHEET
13
Case outline N - Continued.
Symbol
Millimeters
Inches
Min
Max
Min
Max
A
3.12
4.06
.123
.160
A2
0.13
0.64
.005
.025
b
0.33
0.43
.013
.017
c
0.23
0.30
.009
.012
D/E
20.3 BSC
.800 BSC
D1/E1
22.10
22.65
.870
.890
D2/E2
24.89
25.35
.980
1.000
D3/E3
23.75
24.28
.936
.956
e
1.27 BSC
.050 BSC
R
0.25 BSC
.010 BSC
L1
0.89
1.14
.035
.045
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. Pin numbers are for reference only.
3. Case outline N is a single cavity package.
FIGURE 1. Case outlines - Continued.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94716
A
REVISION LEVEL
C
SHEET
14
Case outlines S, U, W, Y, 5, 6, 7, and 8.
FIGURE 1. Case outlines- Continued.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94716
A
REVISION LEVEL
C
SHEET
15
Case outlines S, U, W, and Y only.
Symbol
Millimeters
Inches
Min
Max
Min
Max
A
5.08
6.22
.200
.245
A1
0.64
0.89
.025
.035
φb
0.41
0.51
.016
.020
φb1
1.14
1.40
.045
.055
φb2
1.65
1.91
.065
.075
D/E
29.72
30.48
1.170
1.200
D1/E1
25.40 BSC
1.000 BSC
D2
15.24 BSC
.600 BSC
D3
28.96
e
L
29.21
1.020
2.54 BSC
3.68
1.150
.100 BSC
3.94
.132
.155
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. Pin 1 is identified by a 0.070 square pad.
3. Pin numbers are for reference only.
FIGURE 1. Case outlines - Continued.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94716
A
REVISION LEVEL
C
SHEET
16
Case outlines 5, 6, 7, and 8 only.
Symbol
Millimeters
Inches
Min
Max
Min
Max
A
3.43
4.34
.135
.181
A1
0.64
0.89
.025
.035
φb
0.41
0.51
.016
.020
φb1
1.14
1.40
.045
.055
φb2
1.65
1.91
.065
.075
D/E
27.05
27.56
1.065
1.085
D1/E1
25.40 BSC
1.000 BSC
D2
15.24 BSC
.600 BSC
D3
25.90
e
L
26.92
1.020
2.54 BSC
3.35
1.060
.100 BSC
3.94
.132
.155
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. Pin 1 is identified by a 0.070 square pad.
3. Pin numbers are for reference only.
FIGURE 1. Case outlines - Continued.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94716
A
REVISION LEVEL
C
SHEET
17
Case outlines T, V, X, and Z.
FIGURE 1. Case outlines - Continued.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94716
A
REVISION LEVEL
C
SHEET
18
Case outlines T, V, X, and Z - Continued.
Symbol
Millimeters
Inches
Min
Max
Min
Max
A
3.30
5.84
.130
.230
φb
0.41
0.51
.016
.020
φb1
0.76 REF
.030 REF
φb2
1.65
1.91
.065
.075
D/E
26.92
30.48
1.060
1.200
D1/E1
25.40 BSC
1.000 BSC
D2
15.24 BSC
.600 BSC
D3
26.16
e
L
29.21
1.030
2.54 BSC
4.19
1.150
.100 BSC
4.69
.165
.185
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. Pin 1 is identified by a 0.070 square pad.
3. Pin numbers are for reference only.
FIGURE 1. Case outlines - Continued.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94716
A
REVISION LEVEL
C
SHEET
19
Case outline 4.
FIGURE 1. Case outlines - Continued.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94716
A
REVISION LEVEL
C
SHEET
20
Case outline 4 - Continued.
Symbol
Millimeters
Inches
Min
Max
Min
Max
A
4.46
5.10
.175
.200
A1
1.40
1.65
.055
.065
A2
1.14
1.40
.045
.055
b
0.30
0.46
.012
.018
c
0.23
0.31
.009
.012
D/E
63.63
66.42
2.505
2.615
D1/E1
39.24
40.01
1.545
1.575
D2/E2
73.28
84.20
2.885
3.315
e
1.14
1.40
.045
.055
e1
20.19
20.45
.795
.805
j
4.83
5.33
.190
.210
k
37.72
38.48
1.485
1.515
L
12.19
13.21
.480
.520
S1
9.45
9.86
.372
.388
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. Pin numbers are for reference only.
FIGURE 1. Case outlines - Continued.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94716
A
REVISION LEVEL
C
SHEET
21
Case outline 9.
FIGURE 1. Case outlines - Continued.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94716
A
REVISION LEVEL
C
SHEET
22
Case outline 9 - Continued.
Symbol
Millimeters
Min
Inches
Max
Min
Max
A
3.56
.140
A1
2.79
.110
A2
0.46
0.76
.018
.030
b
0.33
0.43
.013
.017
C
0.15
0.25
.006
.010
D/E
20.32 TYP
.800 TYP
D1/E1
23.65
24.10
.931
.949
D2/E2
25.15
25.40
.990
1.000
e
L1
1.27 TYP
0.51
.050 TYP
1.14
.020
.045
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. Pin numbers are for reference only.
FIGURE 1. Case outlines - Continued.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94716
A
REVISION LEVEL
C
SHEET
23
Device
types
All
Device
types
All
Device
types
All
Device
types
All
Case
outlines
M, N, 9
Case
outlines
M, N, 9
Case
outlines
M, N, 9
Case
outlines
M, N, 9
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
1
GND
18
GND
35
OE
52
GND
2
CS3
19
I/O8
36
CS2
53
I/O23
3
A5
20
I/O9
37
NC
54
I/O22
4
A4
21
I/O10
38
WE2
55
I/O21
5
A3
22
I/O11
39
WE3
56
I/O20
6
A2
23
I/O12
40
WE4
57
I/O19
7
A1
24
I/O13
41
NC
58
I/O18
8
A0
25
I/O14
42
NC
59
I/O17
9
NC
26
I/O15
43
NC
60
I/O16
10
I/O0
27
VCC
44
I/O31
61
VCC
11
I/O1
28
A11
45
I/O30
62
A10
12
I/O2
29
A12
46
I/O29
63
A9
13
I/O3
30
A13
47
I/O28
64
A8
14
I/O4
31
A14
48
I/O27
65
A7
15
I/O5
32
A15
49
I/O26
66
A6
16
I/O6
33
A16
50
I/O25
67
WE1
17
I/O7
34
CS1
51
I/O24
68
CS4
FIGURE 2. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94716
A
REVISION LEVEL
C
SHEET
24
Device
type
All
Device
type
All
Device
type
All
Device
type
All
Case
outlines
U,V,Y,Z,
6,8
Case
outlines
U,V,Y,Z,
6,8
Case
outlines
U,V,Y,Z,
6,8
Case
outlines
U,V,Y,Z,
6,8
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
1
I/O8
18
A15
35
I/O25
52
WE3
2
I/O9
19
VCC
36
I/O26
53
CS3
3
I/O10
20
CS1
37
A7
54
GND
4
A14
21
NC
38
A12
55
I/O19
5
A16
22
I/03
39
NC
56
I/O31
6
A11
23
I/015
40
A13
57
I/O30
7
A0
24
I/O14
41
A8
58
I/O29
8
NC
25
I/O13
42
I/O16
59
I/O28
9
I/O0
26
I/O12
43
I/O17
60
A1
10
I/O1
27
OE
44
I/O18
61
A2
11
I/O2
28
NC
45
VCC
62
A3
12
WE2
29
WE1
46
CS4
63
I/O23
13
CS2
30
I/O7
47
WE4
64
I/O22
14
GND
31
I/O6
48
I/O27
65
I/O21
15
I/O11
32
I/O5
49
A4
66
I/O20
16
A10
33
I/O4
50
A5
17
A9
34
I/O24
51
A6
NOTE: Case outlines Y, Z, and 8, pins 8, 21, 28, and 39 are no connects (NC) and for case outlines U, V, and 6, pins 8, 21,
28, and 39 are ground.
FIGURE 2. Terminal connections (industrial pin-outs) - Continued.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94716
A
REVISION LEVEL
C
SHEET
25
Device
type
All
Device
type
All
Device
type
All
Device
type
All
Case
outlines
S,T,W,X,
5,7
Case
outlines
S,T,W,X,
5,7
Case
outlines
S,T,W,X,
5,7
Case
outlines
S,T,W,X,
5,7
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
1
I/O8
18
A12
35
I/O25
52
WE3
2
I/O9
19
VCC
36
I/O26
53
CS3
3
I/O10
20
CS1
37
A6
54
GND
4
A13
21
NC
38
A7
55
I/O19
5
A14
22
I/03
39
NC
56
I/O31
6
A15
23
I/015
40
A8
57
I/O30
7
A16
24
I/O14
41
A9
58
I/O29
8
NC
25
I/O13
42
I/O16
59
I/O28
9
I/O0
26
I/O12
43
I/O17
60
A0
10
I/O1
27
OE
44
I/O18
61
A1
11
I/O2
28
NC
45
VCC
62
A2
12
WE2
29
WE1
46
CS4
63
I/O23
13
CS2
30
I/O7
47
WE4
64
I/O22
14
GND
31
I/O6
48
I/O27
65
I/O21
15
I/O11
32
I/O5
49
A3
66
I/O20
16
A10
33
I/O4
50
A4
17
A11
34
I/O24
51
A5
NOTE: Case outlines W, X, and 7, pins 8, 21, 28, and 39 are no connects (NC) and for case outlines S, T, and 5, pins 8,
21, 28, and 39 are ground.
FIGURE 2. Terminal connections (alternative pin-outs) - Continued.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94716
A
REVISION LEVEL
C
SHEET
26
Device
types
All
Device
types
All
Device
types
All
Device
types
All
Case
outline
4
Case
outline
4
Case
outline
4
Case
outline
4
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
1
GND
18
GND
35
OE
52
GND
2
CS1
19
I/O8
36
CS4
53
I/O23
3
A5
20
I/O9
37
NC
54
I/O22
4
A4
21
I/O10
38
NC
55
I/O21
5
A3
22
I/O11
39
NC
56
I/O20
6
A2
23
I/O12
40
NC
57
I/O19
7
A1
24
I/O13
41
NC
58
I/O18
8
A0
25
I/O14
42
NC
59
I/O17
9
NC
26
I/O15
43
NC
60
I/O16
10
I/O0
27
VCC
44
I/O31
61
VCC
11
I/O1
28
A11
45
I/O30
62
A10
12
I/O2
29
A12
46
I/O29
63
A9
13
I/O3
30
A13
47
I/O28
64
A8
14
I/O4
31
A14
48
I/O27
65
A7
15
I/O5
32
A15
49
I/O26
66
A6
16
I/O6
33
A16
50
I/O25
67
WE
17
I/O7
34
CS2
51
I/O24
68
CS3
FIGURE 2. Terminal connections - Continued.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94716
A
REVISION LEVEL
C
SHEET
27
CS
OE
WE
Data I/O
MODE
Device current
H
X
X
High Z
Standby
Standby
L
L
H
Data out
Read
Active
L
H
L
Data in
Write
Active
NOTES:
1.
H=V
2.
L = V = Low Logic Level
3.
4.
X = Do not care (either high or low)
High Z = High Impedance State
IH
= High Logic Level
IL
FIGURE 3. Truth table.
FIGURE 4. Read cycle timing diagram.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94716
A
REVISION LEVEL
C
SHEET
28
FIGURE 5. Write/Erase/Program operations, WE controlled.
NOTES:
1. PA represents the address of the memory location to be programmed.
2. PD represents the data to be programmed at byte address.
3. D7 is the output of the complement of the data written to the device.
4. DOUT is the output of the data written to the device.
5. Figures indicate last two bus cycles of a four bus cycle sequence.
FIGURE 6. Write/Erase/Program operations, CS controlled.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94716
A
REVISION LEVEL
C
SHEET
29
Case outlines M, N, S, T, U, V, W, X, Y, Z, 5, 6, 7, 8, and 9
Case outline 4.
FIGURE 7. Block diagrams .
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94716
A
REVISION LEVEL
C
SHEET
30
NOTES:
1. V is programmable from -2 V to +7 V.
Z
2. I
OL
and I
OH
are programmable from 0 to 16 mA.
3. Tester impedance is Z = 75 ohms.
0
4. V is typically the midpoint of V
Z
5. I
OL
OL
and I
OH
and V
.
OH
are adjusted to simulate a typical resistive load circuit.
6. ATE tester includes jig capacitance.
FIGURE 8. Output load circuit.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94716
A
REVISION LEVEL
C
SHEET
31
TABLE II. Electrical test requirements.
MIL-PRF-38534 test requirements
Subgroups
(in accordance with
MIL-PRF-38534, group A test
table)
Interim electrical parameters
1,4,7,9
Final electrical parameters
1*,2,3,4,7,8A,8B,9,10,11
Group A test requirements
1,2,3,4,7,8A,8B,9,10,11
Group C end-point electrical
parameters
1,2,3,4,7,8A,8B,9,10,11
End-point electrical parameters
for Radiation Hardness Assurance
(RHA) devices
Not applicable
* PDA applies to subgroup 1.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply:
a. Burn-in test, method 1015 of MIL-STD-883.
(1)
Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control and
shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method
1015 of MIL-STD-883.
(2)
TA as specified in accordance with table I of method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests
prior to burn-in are optional at the discretion of the manufacturer.
4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance
with MIL-PRF-38534 and as specified herein.
4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows:
a. Tests shall be as specified in table II herein.
b. Subgroups 5 and 6 shall be omitted.
c. Subgroups 7, 8A, and 8B shall include verification of the truth table on figure 3.
d. The following data patterns shall be verified during subgroups 7, 8A, and 8B.
(1)
0's to all memory cell locations.
(2)
Checkerboard pattern to entire memory.
(3)
Checkerboard compliment to entire memory array.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94716
A
REVISION LEVEL
C
SHEET
32
4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534.
4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows:
a. End-point electrical parameters shall be as specified in table II herein.
b. Steady-state life test, method 1005 of MIL-STD-883.
(1)
Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control and
shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method
1005 of MIL-STD-883.
(2)
TA as specified in accordance with table I of method 1005 of MIL-STD-883.
(3)
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
(4)
The checkerboard data pattern shall be verified after burn-in as part of end-point electrical testing.
4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534.
4.3.5 Radiation Hardness Assurance (RHA) inspection. RHA inspection is not currently applicable to this drawing.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original
equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared
specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated as specified in MIL-PRF-38534.
6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus when a system application
requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for
coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should
contact DSCC-VA, telephone (614) 692-0544.
6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43216-5000, or telephone (614)
692-0512.
6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK-103
and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DSCC-VA and have agreed to this drawing.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-94716
A
REVISION LEVEL
C
SHEET
33
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 00-06-20
Approved sources of supply for SMD 5962-94716 are listed below for immediate acquisition information only and shall be added to
MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be revised to include the addition
or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to
and accepted by DSCC-VA. This bulletin is superseded by the next dated revisions of MIL-HDBK-103 and QML-38534.
Standard
microcircuit drawing
PIN 1/
5962-9471601HMA
5962-9471601HMA
5962-9471601HMC
5962-9471601HMC
5962-9471601HNA
5962-9471601HNA
5962-9471601HNC
5962-9471601HNC
5962-9471601HSA
5962-9471601HSC
5962-9471601HTA
5962-9471601HTC
5962-9471601HUA
5962-9471601HUC
5962-9471601HVA
5962-9471601HVC
5962-9471601HWA
5962-9471601HWC
5962-9471601HXA
5962-9471601HXC
5962-9471601HYA
5962-9471601HYC
5962-9471601HZA
5962-9471601HZA
5962-9471601HZC
5962-9471601HZC
5962-9471601H4C
5962-9471601H5A
5962-9471601H5C
5962-9471601H6A
5962-9471601H6C
5962-9471601H7A
5962-9471601H7C
5962-9471601H8A
5962-9471601H8A
5962-9471601H8C
5962-9471601H8C
5962-9471601H9A
5962-9471601H9C
Vendor
CAGE
number
54230
88379
54230
88379
54230
88379
54230
88379
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
88379
54230
88379
54230
54230
54230
54230
54230
54230
54230
54230
88379
54230
88379
54230
54230
1 of 6
Vendor
similar
PIN 2/
WF128K32-150G2Q5
ACT-F128K32N-150F5Q
WF128K32-150G2Q5
ACT-F128K32N-150F5Q
WF128K32-150G2UQ5
ACT-F128K32N-150F5Q
WF128K32-150G2UQ5
ACT-F128K32N-150F5Q
WF128K32A-150HQ5
WF128K32A-150HQ5
WF128K32A-150HSQ5
WF128K32A-150HSQ5
WF128K32-150HQ5
WF128K32-150HQ5
WF128K32-150HSQ5
WF128K32-150HSQ5
WF128K32NA-150HQ5
WF128K32NA-150HQ5
WF128K32NA-150HSQ5
WF128K32NA-150HSQ5
WF128K32N-150HQ5
WF128K32N-150HQ5
WF128K32N-150HSQ5
ACT-F128K32N-150P3Q
WF128K32N-150HSQ5
ACT-F128K32N-150P3Q
WF128K32-150G4Q5
WF128K32A-150H1Q5
WF128K32A-150H1Q5
WF128K32-150H1Q5
WF128K32-150H1Q5
WF128K32NA-150H1Q5
WF128K32NA-150H1Q5
WF128K32N-150H1Q5
ACT-F128K32N-150P7Q
WF128K32N-150H1Q5
ACT-F128K32N-150P7Q
WF128K32-150G1UQ5
WF128K32-150G1UQ5
STANDARD MICROCIRCUIT DRAWING SOURCE APPROVAL BULLETIN - Continued.
DATE: 00-06-20
Standard
microcircuit drawing
PIN 1/
5962-9471602HMA
5962-9471602HMA
5962-9471602HMC
5962-9471602HMC
5962-9471602HNA
5962-9471602HNA
5962-9471602HNC
5962-9471602HNC
5962-9471602HSA
5962-9471602HSC
5962-9471602HTA
5962-9471602HTC
5962-9471602HUA
5962-9471602HUC
5962-9471602HVA
5962-9471602HVC
5962-9471602HWA
5962-9471602HWC
5962-9471602HXA
5962-9471602HXC
5962-9471602HYA
5962-9471602HYC
5962-9471602HZA
5962-9471602HZA
5962-9471602HZC
5962-9471602HZC
5962-9471602H4C
5962-9471602H5A
5962-9471602H5C
5962-9471602H6A
5962-9471602H6C
5962-9471602H7A
5962-9471602H7C
5962-9471602H8A
5962-9471602H8A
5962-9471602H8C
5962-9471602H8C
5962-9471602H9A
5962-9471602H9C
Vendor
CAGE
number
54230
88379
54230
88379
54230
88379
54230
88379
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
88379
54230
88379
54230
54230
54230
54230
54230
54230
54230
54230
88379
54230
88379
54230
54230
2 of 6
Vendor
similar
PIN 2/
WF128K32-120G2Q5
ACT-F128K32N-120F5Q
WF128K32-120G2Q5
ACT-F128K32N-120F5Q
WF128K32-120G2UQ5
ACT-F128K32N-120F5Q
WF128K32-120G2UQ5
ACT-F128K32N-120F5Q
WF128K32A-120HQ5
WF128K32A-120HQ5
WF128K32A-120HSQ5
WF128K32A-120HSQ5
WF128K32-120HQ5
WF128K32-120HQ5
WF128K32-120HSQ5
WF128K32-120HSQ5
WF128K32NA-120HQ5
WF128K32NA-120HQ5
WF128K32NA-120HSQ5
WF128K32NA-120HSQ5
WF128K32N-120HQ5
WF128K32N-120HQ5
WF128K32N-120HSQ5
ACT-F128K32N-120P3Q
WF128K32N-120HSQ5
ACT-F128K32N-120P3Q
WF128K32-120G4Q5
WF128K32A-120H1Q5
WF128K32A-120H1Q5
WF128K32-120H1Q5
WF128K32-120H1Q5
WF128K32NA-120H1Q5
WF128K32NA-120H1Q5
WF128K32N-120H1Q5
ACT-F128K32N-120P7Q
WF128K32N-120H1Q5
ACT-F128K32N-120P7Q
WF128K32-120G1UQ5
WF128K32-120G1UQ5
STANDARD MICROCIRCUIT DRAWING SOURCE APPROVAL BULLETIN - Continued.
DATE: 00-06-20
Standard
microcircuit drawing
PIN 1/
5962-9471603HMA
5962-9471603HMA
5962-9471603HMC
5962-9471603HMC
5962-9471603HNA
5962-9471603HNA
5962-9471603HNC
5962-9471603HNC
5962-9471603HSA
5962-9471603HSC
5962-9471603HTA
5962-9471603HTC
5962-9471603HUA
5962-9471603HUC
5962-9471603HVA
5962-9471603HVC
5962-9471603HWA
5962-9471603HWC
5962-9471603HXA
5962-9471603HXC
5962-9471603HYA
5962-9471603HYC
5962-9471603HZA
5962-9471603HZA
5962-9471603HZC
5962-9471603HZC
5962-9471603H4C
5962-9471603H5A
5962-9471603H5C
5962-9471603H6A
5962-9471603H6C
5962-9471603H7A
5962-9471603H7C
5962-9471603H8A
5962-9471603H8A
5962-9471603H8C
5962-9471603H8C
5962-9471603H9A
5962-9471603H9C
Vendor
CAGE
number
54230
88379
54230
88379
54230
88379
54230
88379
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
88379
54230
88379
54230
54230
54230
54230
54230
54230
54230
54230
88379
54230
88379
54230
54230
3 of 6
Vendor
similar
PIN 2/
WF128K32-90G2Q5
ACT-F128K32N-090F5Q
WF128K32-90G2Q5
ACT-F128K32N-090F5Q
WF128K32-90G2UQ5
ACT-F128K32N-090F5Q
WF128K32-90G2UQ5
ACT-F128K32N-090F5Q
WF128K32A-90HQ5
WF128K32A-90HQ5
WF128K32A-90HSQ5
WF128K32A-90HSQ5
WF128K32-90HQ5
WF128K32-90HQ5
WF128K32-90HSQ5
WF128K32-90HSQ5
WF128K32NA-90HQ5
WF128K32NA-90HQ5
WF128K32NA-90HSQ5
WF128K32NA-90HSQ5
WF128K32N-90HQ5
WF128K32N-90HQ5
WF128K32N-90HSQ5
ACT-F128K32N-090P3Q
WF128K32N-90HSQ5
ACT-F128K32N-090P3Q
WF128K32-90G4Q5
WF128K32A-90H1Q5
WF128K32A-90H1Q5
WF128K32-90H1Q5
WF128K32-90H1Q5
WF128K32NA-90H1Q5
WF128K32NA-90H1Q5
WF128K32N-90H1Q5
ACT-F128K32N-090P7Q
WF128K32N-90H1Q5
ACT-F128K32N-090P7Q
WF128K32-90G1UQ5
WF128K32-90G1UQ5
STANDARD MICROCIRCUIT DRAWING SOURCE APPROVAL BULLETIN - Continued.
DATE: 00-06-20
Standard
microcircuit drawing
PIN 1/
5962-9471604HMA
5962-9471604HMA
5962-9471604HMC
5962-9471604HMC
5962-9471604HNA
5962-9471604HNA
5962-9471604HNC
5962-9471604HNC
5962-9471604HSA
5962-9471604HSC
5962-9471604HTA
5962-9471604HTC
5962-9471604HUA
5962-9471604HUC
5962-9471604HVA
5962-9471604HVC
5962-9471604HWA
5962-9471604HWC
5962-9471604HXA
5962-9471604HXC
5962-9471604HYA
5962-9471604HYC
5962-9471604HZA
5962-9471604HZA
5962-9471604HZC
5962-9471604HZC
5962-9471604H4C
5962-9471604H5A
5962-9471604H5C
5962-9471604H6A
5962-9471604H6C
5962-9471604H7A
5962-9471604H7C
5962-9471604H8A
5962-9471604H8A
5962-9471604H8C
5962-9471604H8C
5962-9471604H9A
5962-9471604H9C
Vendor
CAGE
number
54230
88379
54230
88379
54230
88379
54230
88379
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
88379
54230
88379
54230
54230
54230
54230
54230
54230
54230
54230
88379
54230
88379
54230
54230
4 of 6
Vendor
similar
PIN 2/
WF128K32-70G2Q5
ACT-F128K32N-070F5Q
WF128K32-70G2Q5
ACT-F128K32N-070F5Q
WF128K32-70G2UQ5
ACT-F128K32N-070F5Q
WF128K32-70G2UQ5
ACT-F128K32N-070F5Q
WF128K32A-70HQ5
WF128K32A-70HQ5
WF128K32A-70HSQ5
WF128K32A-70HSQ5
WF128K32-70HQ5
WF128K32-70HQ5
WF128K32-70HSQ5
WF128K32-70HSQ5
WF128K32NA-70HQ5
WF128K32NA-70HQ5
WF128K32NA-70HSQ5
WF128K32NA-70HSQ5
WF128K32N-70HQ5
WF128K32N-70HQ5
WF128K32N-70HSQ5
ACT-F128K32N-070P3Q
WF128K32N-70HSQ5
ACT-F128K32N-070P3Q
WF128K32-70G4Q5
WF128K32A-70H1Q5
WF128K32A-70H1Q5
WF128K32-70H1Q5
WF128K32-70H1Q5
WF128K32NA-70H1Q5
WF128K32NA-70H1Q5
WF128K32N-70H1Q5
ACT-F128K32N-070P7Q
WF128K32N-70H1Q5
ACT-F128K32N-070P7Q
WF128K32-70G1UQ5
WF128K32-70G1UQ5
STANDARD MICROCIRCUIT DRAWING SOURCE APPROVAL BULLETIN - Continued.
DATE: 00-06-20
Standard
microcircuit drawing
PIN 1/
5962-9471605HMA
5962-9471605HMA
5962-9471605HMC
5962-9471605HMC
5962-9471605HNA
5962-9471605HNA
5962-9471605HNC
5962-9471605HNC
5962-9471605HSA
5962-9471605HSC
5962-9471605HTA
5962-9471605HTC
5962-9471605HUA
5962-9471605HUC
5962-9471605HVA
5962-9471605HVC
5962-9471605HWA
5962-9471605HWC
5962-9471605HXA
5962-9471605HXC
5962-9471605HYA
5962-9471605HYC
5962-9471605HZA
5962-9471605HZA
5962-9471605HZC
5962-9471605HZC
5962-9471605H4C
5962-9471605H5A
5962-9471605H5C
5962-9471605H6A
5962-9471605H6C
5962-9471605H7A
5962-9471605H7C
5962-9471605H8A
5962-9471605H8A
5962-9471605H8C
5962-9471605H8C
5962-9471605H9A
5962-9471605H9C
Vendor
CAGE
number
54230
88379
54230
88379
54230
88379
54230
88379
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
54230
88379
54230
88379
54230
54230
54230
54230
54230
54230
54230
54230
88379
54230
88379
54230
54230
Vendor
similar
PIN 2/
WF128K32-60G2Q5
ACT-F128K32N-060F5Q
WF128K32-60G2Q5
ACT-F128K32N-060F5Q
WF128K32-60G2UQ5
ACT-F128K32N-060F5Q
WF128K32-60G2UQ5
ACT-F128K32N-060F5Q
WF128K32A-60HQ5
WF128K32A-60HQ5
WF128K32A-60HSQ5
WF128K32A-60HSQ5
WF128K32-60HQ5
WF128K32-60HQ5
WF128K32-60HSQ5
WF128K32-60HSQ5
WF128K32NA-60HQ5
WF128K32NA-60HQ5
WF128K32NA-60HSQ5
WF128K32NA-60HSQ5
WF128K32N-60HQ5
WF128K32N-60HQ5
WF128K32N-60HSQ5
ACT-F128K32N-060P3Q
WF128K32N-60HSQ5
ACT-F128K32N-060P3Q
WF128K32-60G4Q5
WF128K32A-60H1Q5
WF128K32A-60H1Q5
WF128K32-60H1Q5
WF128K32-60H1Q5
WF128K32NA-60H1Q5
WF128K32NA-60H1Q5
WF128K32N-60H1Q5
ACT-F128K32N-060P7Q
WF128K32N-60H1Q5
ACT-F128K32N-060P7Q
WF128K32-60G1UQ5
WF128K32-60G1UQ5
1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer
listed for that part. If the desired lead finish is not listed contact the vendor for its availability.
2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance
requirements of this drawing.
5 of 6
STANDARD MICROCIRCUIT DRAWING SOURCE APPROVAL BULLETIN - Continued.
DATE: 00-06-20
Vendor CAGE
number
Vendor name
and address
54230
White Electronic Designs Corporation
3601 East University Drive
Phoenix, AZ 85034-7217
88379
Aeroflex Circuit Technology
35 South Service Road
Plainview NY, 11803-4193
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
6 of 6