STMICROELECTRONICS STR755FV2T6

STR750Fxx STR751Fxx
STR752Fxx STR755Fxx
ARM7TDMI-S™ 32-bit MCU with Flash, SMI, 3 std 16-bit timers,
PWM timer, fast 10-bit ADC, I2C, UART, SSP, USB and CAN
Features
■
Core
– ARM7TDMI-S 32-bit RISC CPU
– 54 DMIPS @ 60 MHz
■
Memories
– Up to 256 KB Flash program memory (10k
W/E cycles, retention 20 yrs @ 85°C)
– 16 KB Read-While-Write Flash for data
(100k W/E cycles, retention 20 yrs@ 85°C)
– Flash Data Readout and Write Protection
– 16KBytes embedded high speed SRAM
– Memory mapped interface (SMI) to ext.
Serial Flash (64 MB) w. boot capability
■
■
■
■
Clock, reset and supply management
– Single supply 3.3V ±10% or 5V ±10%
– Embedded 1.8V Voltage Regulators
– Int. RC for fast start-up and backup clock
– Up to 60 MHz operation using internal PLL
with 4 or 8 MHz crystal/ceramic osc.
– Smart Low Power Modes: SLOW, WFI,
STOP and STANDBY with backup registers
– Real-time Clock, driven by low power
internal RC or 32.768 kHz dedicated osc,
for clock-calendar and Auto Wake-up
Nested interrupt controller
– Fast interrupt handling with 32 vectors
– 16 IRQ priorities, 2 maskable FIQ sources
– 16 external interrupt / wake-up lines
DMA
– 4-channel DMA controller
– Circular buffer management
– Support for UART, SSP, Timers, ADC
LQFP64 10x10 mm
LFBGA64
8 x 8 x 1.7 mm
LFBGA100
10 x 10 x 1.7 mm
– 16-bit 6-ch. synchronizable PWM timer
– Dead time generation, edge/center-aligned
waveforms and emergency stop
– Ideal for induction/brushless DC motors
■
8 Communications interfaces
– 1 I2C interface
– 3 HiSpeed UARTs w. Modem/LIN capability
– 2 SSP interfaces (SPI or SSI) up to 16 Mb/s
– 1 CAN interface (2.0B Active)
– 1 USB full-speed 12 Mb/s interface with 8
configurable endpoint sizes
■
10-bit A/D converter
– 16/11 chan. with prog. Scan Mode & FIFO
– Programmable Analog Watchdog feature
– Conversion time: min. 3.75 µs
– Start conversion can be triggered by timers
■
Up to 72/38 I/O ports
– 72/38 GPIOs with High Sink capabilities
– Atomic bit SET and RES operations
Table 1.
Reference
6 Timers
– 16-bit watchdog timer (WDG)
– 16-bit timer for system timebase functions
– 3 synchronizable timers each with up to 2
input captures and 2 output
compare/PWMs.
October 2007
LQFP100 14 x 14 mm
Device summary
Root part number
STR750Fxx STR750FV0, STR750FV1, STR750FV2
STR751Fxx STR751FR0, STR751FR1, STR751FR2
STR752Fxx STR752FR0, STR752FR1, STR752FR2
STR755Fxx
Rev 4
STR755FR0, STR755FR1, STR755FR2
STR755FV0, STR755FV1, STR755FV2
1/84
www.st.com
1
Contents
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Contents
1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2
Device overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4
3.1
Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.0.1
4.1
5
Memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Electrical parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.1
5.2
5.3
2/84
Pin description table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.1.1
Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.1.2
Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.1.3
Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.1.4
Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.1.5
Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.1.6
Power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
5.1.7
I/O characteristics versus the various power schemes (3.3V or 5.0V) . 29
5.1.8
Current consumption measurements . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
5.2.1
Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
5.2.2
Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
5.2.3
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
5.3.1
General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
5.3.2
Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . 35
5.3.3
Embedded voltage regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
5.3.4
Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
5.3.5
Clock and timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
5.3.6
Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
5.3.7
EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
6
Contents
5.3.8
I/O port pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
5.3.9
TB and TIM timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
5.3.10
Communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . 62
5.3.11
USB characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
5.3.12
10-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
6.1
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
6.2
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
6.2.1
Reference document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
6.2.2
Selecting the product temperature range . . . . . . . . . . . . . . . . . . . . . . . . 80
7
Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
8
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
3/84
Description
1
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Description
The STR750 family of 32-bit microcontrollers combines the industry-standard ARM7TDMI®
32-bit RISC core, featuring high performance, very low power, and very dense code, with a
comprehensive set of peripherals and ST's latest 0.18µ embedded Flash technology. The
STR750 family comprises a range of devices integrating a common set of peripherals as
well as USB, CAN and some key innovations like clock failure detection and an advanced
motor control timer. It supports both 3.3V and 5V, and it is also available in an extended
temperature range (-40 to +105°C). This makes it a genuine general purpose
microcontroller family, suitable for a wide range of applications:
●
Appliances, brushless motor drives
●
USB peripherals, UPS, alarm systems
●
Programmable logic controllers, circuit breakers, inverters
●
Medical and portable equipment
2
Device overview
Table 2.
Device overview
Features
STR755FR0
STR755FR1
STR755FR2
STR751FR0/
STR751FR1/
STR751FR2
STR752FR0/
STR752FR1/
STR752FR2
STR755FV0
STR755FV1/
STR755FV2
Flash - Bank 0 (bytes)
64K/128K/256K
Flash - Bank 1 (bytes)
16K RWW
STR750FV0/
STR750FV1/
STR750FV2
RAM (bytes)
16K
Operating
Temperature.
Ambient temp.:-40 to +85°C / -40 to +105°C (see Table 49)
Junction temp. -40 to + 125 °C (see Table 10)
Common Peripherals
USB/CAN peripherals
Operating Voltage
Packages (x)
4/84
3 UARTs, 2 SSPs, 1 I2C, 3 timers 1 PWM timer,
38 I/Os 13 Wake-up lines, 11 A/D Channels
None
USB
3.3V or 5V
3.3V
CAN
T=LQFP64 10x10, H=LFBGA64
3 UARTs, 2 SSPs, 1 I2C,
3 timers 1 PWM timer, 72
I/Os 15 Wake-up lines, 16 A/D Channels
None
USB+CAN
3.3V or 5V
T=LQFP100 14x14, H=LFBGA100
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
3
Introduction
Introduction
This Datasheet contains the description of the STR750F family features, pinout, Electrical
Characteristics, Mechanical Data and Ordering information.
For complete information on the Microcontroller memory, registers and peripherals. Please
refer to the STR750F Reference Manual.
For information on the ARM7TDMI-S core please refer to the ARM7TDMI-S Technical
Reference Manual available from Arm Ltd.
For information on programming, erasing and protection of the internal Flash memory
please refer to the STR7 Flash Programming Reference Manual
For information on third-party development tools, please refer to the http://www.st.com/mcu
website.
3.1
Functional description
The STR750F family includes devices in 2 package sizes: 64-pin and 100-pin. Both types
have the following common features:
ARM7TDMI-STM core with embedded Flash & RAM
STR750F family has an embedded ARM core and is therefore compatible with all ARM tools
and software. It combines the high performance ARM7TDMI-STM CPU with an extensive
range of peripheral functions and enhanced I/O capabilities. All devices have on-chip highspeed single voltage FLASH memory and high-speed RAM.
Figure 1 shows the general block diagram of the device family.
Embedded Flash memory
Up to 256 KBytes of embedded Flash is available in Bank 0 for storing programs and data.
An additional Bank 1 provides 16 Kbytes of RWW (Read While Write) memory allowing it to
be erased/programmed on-the-fly. This partitioning feature is ideal for storing application
parameters.
●
When configured in burst mode, access to Flash memory is performed at CPU clock
speed with 0 wait states for sequential accesses and 1 wait state for random access
(maximum 60 MHz).
●
When not configured in burst mode, access to Flash memory is performed at CPU
clock speed with 0 wait states (maximum 32 MHz)
Embedded SRAM
16 Kbytes of embedded SRAM accessed (read/write) at CPU clock speed with 0 wait states.
Enhanced interrupt controller (EIC)
In addition to the standard ARM interrupt controller, the STR750F embeds a nested interrupt
controller able to handle up to 32 vectors and 16 priority levels. This additional hardware
block provides flexible interrupt management features with minimal interrupt latency.
5/84
Introduction
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Serial memory interface (SMI)
The Serial Memory interface is directly able to access up to 4 serial FLASH devices. It can
be used to access data, execute code directly or boot the application from external memory.
The memory is addressed as 4 banks of up to 16 Mbytes each.
Clocks and start-up
After RESET or when exiting from Low Power Mode, the CPU is clocked immediately by an
internal RC oscillator (FREEOSC) at a frequency centered around 5 MHz, so the application
code can start executing without delay. In parallel, the 4/8 MHz Oscillator is enabled and its
stabilization time is monitored using a dedicated counter.
An oscillator failure detection is implemented: when the clock disappears on the XT1 pin, the
circuit automatically switches to the FREEOSC oscillator and an interrupt is generated.
In Run mode, the AHB and APB clock speeds can be set at a large number of different
frequencies thanks to the PLL and various prescalers: up to 60 MHz for AHB and up to 32
MHz for APB when fetching from Flash (64 MHz and 32 MHz when fetching from SRAM).
In SLOW mode, the AHB clock can be significantly decreased to reduce power
consumption.
The built-in Clock Controller also provides the 48 MHz USB clock directly without any extra
oscillators or PLL. For instance, starting from the 4 MHz crystal source, it is possible to
obtain in parallel 60 MHz for the AHB clock, 48 MHz for the USB clock and 30 MHz for the
APB peripherals.
Boot modes
At start-up, boot pins are used to select one of five boot options:
●
Boot from internal flash
●
Boot from external serial Flash memory
●
Boot from internal boot loader
●
Boot from internal SRAM
Booting from SMI memory allows booting from a serial flash. This way, a specific boot
monitor can be implemented. Alternatively, the STR750F can boot from the internal boot
loader that implements a boot from UART.
Power supply schemes
You can connect the device in any of the following ways depending on your application.
6/84
●
Power Scheme 1: Single external 3.3V power source. In this configuration the
VCORE supply required for the internal logic is generated internally by the main voltage
regulator and the VBACKUP supply is generated internally by the low power voltage
regulator. This scheme has the advantage of requiring only one 3.3V power source.
●
Power Scheme 2: Dual external 3.3V and 1.8V power sources. In this configuration,
the internal voltage regulators are switched off by forcing the VREG_DIS pin to high
level. VCORE is provided externally through the V18 and V18REG power pins and
VBACKUP through the V18_BKP pin. This scheme is intended to save power consumption
for applications which already provide an 1.8V power supply.
●
Power Scheme 3: Single external 5.0V power source. In this configuration the
VCORE supply required for the internal logic is generated internally by the main voltage
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Introduction
regulator and the VBACKUP supply is generated internally by the low power voltage
regulator. This scheme has the advantage of requiring only one 5.0V power source.
●
Caution:
Power Scheme 4: Dual external 5.0V and 1.8V power sources. In this configuration,
the internal voltage regulators are switched off, by forcing the VREG_DIS pin to high
level. VCORE is provided externally through the V18 and V18REG power pins and
VBACKUP through the V18_BKP pin. This scheme is intended to provide 5V I/O capability.
When powered by 5.0V, the USB peripheral cannot operate.
Low power modes
The STR750F supports 5 low power modes, SLOW, PCG, WFI, STOP and STANDBY.
Caution:
●
SLOW MODE: the system clock speed is reduced. Alternatively, the PLL and the main
oscillator can be stopped and the device is driven by a low power clock (fRTC). The
clock is either an external 32.768 kHz oscillator or the internal low power RC oscillator.
●
PCG MODE (Peripheral Clock Gating MODE): When the peripherals are not used, their
APB clocks are gated to optimize the power consumption.
●
WFI MODE (Wait For Interrupts): only the CPU clock is stopped, all peripherals
continue to work and can wake-up the CPU when IRQs occur.
●
STOP MODE: all clocks/peripherals are disabled. It is also possible to disable the
oscillators and the Main Voltage Regulator (In this case the VCORE is entirely powered
by V18_BKP). This mode is intended to achieve the lowest power consumption with
SRAM and registers contents retained. The system can be woken up by any of the
external interrupts / wake-up lines or by the RTC timer which can optionally be kept
running. The RTC can be clocked either by the 32.768 kHz Crystal or the Low Power
RC Oscillator.
Alternatively, STOP mode gives flexibility to keep the either main oscillator, or the Flash
or the Main Voltage Regulator enabled when a fast start after wake-up is preferred (at
the cost of some extra power consumption).
●
STANDBY MODE: This mode (only available in single supply power schemes) is
intended to achieve the lowest power consumption even when the temperature is
increasing. The digital power supply (VCORE) is completely removed (no leakage even
at high ambient temperature). SRAM and all register contents are lost. Only the RTC
remains powered by V18_BKP. The STR750F can be switched back from STANDBY to
RUN mode by a trigger event on the WKP_STDBY pin or an alarm timeout on the RTC
counter.
It is important to bear in mind that it is forbidden to remove power from the VDD_IO power
supply in any of the Low Power Modes (even in STANDBY MODE).
DMA
The flexible 4-channel general-purpose DMA is able to manage memory to memory,
peripheral to memory and memory to peripheral transfers. The DMA controller supports
circular buffer management avoiding the generation of interrupts when the controller
reaches the end of the buffer.
The DMA can be used with the main peripherals: UART0, SSP0, Motor control PWM timer
(PWM), standard timer TIM0 and ADC.
RTC (real-time clock)
The real-time clock provides a set of continuously running counters which can be used with
suitable software to provide a clock calendar function, and provides an alarm interrupt and a
7/84
Introduction
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
periodic interrupt. It is clocked by an external 32.768 kHz oscillator or the internal low power
RC oscillator. The RC has a typical frequency of 300 kHz and can be calibrated.
WDG (watchdog timer)
The watchdog timer is based on a 16-bit downcounter and 8-bit prescaler. It can be used as
watchdog to reset the device when a problem occurs, or as free running timer for application
time out management.
Timebase timer (TB)
The timebase timer is based on a 16-bit auto-reload counter and not connected to the I/O
pins. It can be used for software triggering, or to implement the scheduler of a real-time
operating system.
Synchronizable standard timers (TIM2:0)
The three standard timers are based on a 16-bit auto-reload counter and feature up to 2
input captures and 2 output compares (for external triggering or time base / time out
management). They can work together with the PWM timer via the Timer Link feature for
synchronization or event chaining. In reset state, timer Alternate Function I/Os are
connected to the same
I/O ports in both 64-pin and 100-pin devices. To optimize timer functions in 64-pin devices,
timer Alternate Function I/Os can be connected, or “remapped”, to other I/O ports as
summarized in Table 3 and detailed in Table 6. This remapping is done by the application via
a control register.
Table 3. Standard timer alternate function I/Os
Number of alternate function I/Os
Standard timer functions
64-pin package
100-pin
package
Default mapping
Remapped
Input Capture
2
1
2
Output Compare/PWM
2
1
2
Input Capture
2
1
1
Output Compare/PWM
2
1
1
Input Capture
2
2
2
Output Compare/PWM
2
1
2
TIM 0
TIM 1
TIM 2
Any of the standard timers can be used to generate PWM outputs. One timer (TIM0) is
mapped to a DMA channel.
Motor control PWM timer (PWM)
The Motor Control PWM Timer (PWM) can be seen as a three-phase PWM multiplexed on 6
channels. The 16-bit PWM generator has full modulation capability (0...100%), edge or
centre-aligned patterns and supports dead-time insertion. It has many features in common
with the standard TIM timers which has the same architecture and it can work together with
the TIM timers via the Timer Link feature for synchronization or event chaining.The PWM
timer is mapped to a DMA channel.
8/84
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Introduction
I²C bus
The I²C bus interface can operate in multi-master and slave mode. It can support standard
and fast modes (up to 400KHz).
High speed universal asynch. receiver transmitter (UART)
The three UART interfaces are able to communicate at speeds of up to 2 Mbit/s. They
provide hardware management of the CTS and RTS signals and have LIN Master capability.
To optimize the data transfer between the processor and the peripheral, two FIFOs
(receive/transmit) of 16 bytes each have been implemented.
One UART can be served by the DMA controller (UART0).
Synchronous serial peripheral (SSP)
The two SSPs are able to communicate up to 8 Mbit/s (SSP1) or up to 16 Mbit/s (SSP0) in
standard full duplex 4-pin interface mode as a master device or up to 2.66 Mbit/s as a slave
device. To optimize the data transfer between the processor and the peripheral, two FIFOs
(receive/transmit) of 8 x 16 bit words have been implemented. The SSPs support the
Motorola SPI or TI SSI protocols.
One SSP can be served by the DMA controller (SSP0).
Controller area network (CAN)
The CAN is compliant with the specification 2.0 part B (active) with a bit rate up to 1Mbit/s. It
can receive and transmit standard frames with 11-bit identifiers as well as extended frames
with 29-bit identifiers. Up to 32 message objects are handled through an internal RAM
buffer. In LQFP64 devices, CAN and USB cannot be connected simultaneously.
Universal serial bus (USB)
The STR750F embeds a USB device peripheral compatible with the USB Full speed 12Mbs.
The USB interface implements a full speed (12 Mbit/s) function interface. It has software
configurable endpoint setting and suspend/resume support. The dedicated 48 MHz clock
source is generated from the internal main PLL. VDD must be in the range 3.3V±10% for
USB operation.
ADC (analog to digital converter)
The 10-bit Analog to Digital Converter, converts up to 16 external channels (11 channels in
64-pin devices) in single-shot or scan modes. In scan mode, continuous conversion is
performed on a selected group of analog inputs. The minimum conversion time is 3.75 µs
(including the sampling time).
The ADC can be served by the DMA controller.
An analog watchdog feature allows you to very precisely monitor the converted voltage of up
to four channels. An IRQ is generated when the converted voltage is outside the
programmed thresholds.
The events generated by TIM0, TIM2 and PWM timers can be internally connected to the
ADC start trigger, injection trigger, and DMA trigger respectively, to allow the application to
synchronize A/D conversion and timers.
9/84
Introduction
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
GPIOs (general purpose input/output)
Each of the 72 GPIO pins (38 GPIOs in 64-pin devices) can be configured by software as
output (push-pull or open-drain), as input (with or without pull-up or pull-down) or as
Peripheral Alternate Function. Port 1.15 is an exception, it can be used as general-purpose
input only or wake-up from STANDBY mode (WKP_STDBY). Most of the GPIO pins are
shared with digital or analog alternate functions.
10/84
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Block diagram
STR750 block diagram
BOOT1,
BOOT0
as AF
TEST
NJTRST
JTDI
JTCK
JTMS
JTDO
as AF
ARM7TDMI-S
CPU
60MHz
AHB
JTAG & ICE-RT
GP DMA
4 streams
AHB
Arbiter
SCLK, MOSI
MISO as AF
4 CS as AF
SERIAL MEMORY
INTERFACE
HRESETN
PRESETN
SRAM 16KB
AHB LITE (up to 60MHz)
Figure 1.
BUS MATRIX
3.2
Introduction
FLASH 256KB
+16KB (RWW)
NESTED
INTERRUPT CTL
RESET &
POWER
VDD_IO
VCORE
VBACKUP
VDDA_PLL
VDDA_ADC
DC-DC
3.3V TO 1.8V
MAIN
LOW POWER
32xIRQ
2xFIQ
HCLK
OSC
32K
CLOCK
MANAGEMENT
15AF
P0[31:0]
P1[19:0]
P2[19:0]
16AF
VDDA_ADC
VSSA_ADC
PLL
OSC
4M
XT1
XT2
VDDA_PLL
VSSA_PLL
CK_USB
EXT.IT
WAKEUP
RTC_XT1
RTC_XT2
FREE
OSC
PCLK
APB
BRIDGE
VDD_IO
V18
V18BKP
VSS
LP
OSC
CK_RTC
CK_SYS
NRSTIN
NRSTOUT
USB Full Speed
GPIO PORT 0
USBDP
USBDM
CAN 2.0B
RX,TX
as AF
GPIO PORT 2
FIFO
2x(16x8bit) UART0
RX,TX,CTS,
RTS as AF
10-bit ADC
FIFO
2x(16x8bit) UART1
RX,TX,CTS,
RTS as AF
WATCHDOG
FIFO
2x(16x8bit) UART2
RX,TX,CTS,
RTS as AF
FIFO
2x(8x16bit) SSP0
MOSI,MISO,
SCK,NSS
as AF
FIFO
2x(8x16bit) SSP1
MOSI,MISO,
SCK,NSS
as AF
GPIO PORT 1
RTC
TB TIMER
2xICAP, 2xOCMP
as AF
2xICAP, 2xOCMP
as AF
TIM0 TIMER
2xICAP, 2xOCMP
as AF
TIM2 TIMER
PWM1, PWM1N
PWM2, PWM2N
PWM3, PWM3N
PWM_EMERGENCY
as AF
PWM TIMER
TIM1 TIMER
I2C
SCL,SDA
as AF
APB (up to 32 MHz)
AF: alternate function on I/O port pin
Note: I/Os shown for 100 pin devices. 64-pin devices have the I/O set shown in Figure 3.
11/84
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
P0.03 / TIM2_TI1 / ADC_IN1
VDD_IO
VSS_IO
VSS18
V18
P1.00 / TIM0_OC2
P1.01 / TIM0_TI2
P1.13 / ADC_IN14
P1.14/ ADC_IN15
P1.04 / PWM3N / ADC_IN9
P1.05 / PWM3
P1.06 / PWM2N/ ADC_IN10
P1.07 / PWM2
P1.08 / PWM1N/ ADC_IN11
P2.05 / PWM3N
P2.06 / PWM3
P2.07 / PWM2N
P2.08 / PWM2
P2.09 / PWM1N
P1.09 / PWM1
P1.10 / PWM_EMERGENCY
P0.04 / SMI_CS0 / SSP0_NSS
P0.05 / SSP0_SCLK / SMI_CK
P0.06 / SMI_DIN / SSP0_MISO
P0.07 / SMI_DOUT / SSP0_MOSI
4
Figure 2.
ADC_IN13 / P1.12
ADC_IN0 / TIM2_OC1/ P0.02
MCO / TIM0_TI1 / P0.01
BOOT0 / TIM0_OC1 / P0.00
TIM1_TI2 / P0.31
TIM1_OC2 / P0.30
ADC_IN8 / TIM1_TI1 / P0.29
TIM1_OC1 / P0.28
TEST
VSS_IO
ADC_IN6 / UART1_RTS / P0.23
TIM2_OC1/ P2.04
UART1_RTS / P2.03
P2.02
ADC_IN5 / UART1_CTS / P0.22
UART1_TX / P0.21
UART1_RX / P0.20
JTMS / P1.19
JTCK / P1.18
JTDO / P1.17
JTDI / P1.16
NJTRST
P2.01
P2.00
UART0_RTS / RTCK / P0.13
12/84
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
= 16 A/D input channels
= 15 External interrupts / Wake-up Lines
SMI_CS1 / ADC_IN2 / UART0_CTS / P0.12
SMI_CS2 / BOOT1 / UART0_TX / P0.11
SMI_CS3 / UART0_RX / P0.10
I2C_SDA / P0.09
I2C_SCL / P0.08
P2.19
P2.18
UART2_RTS / P2.17
ADC_IN12 / UART0_RTS P1.11
ADC_IN7 /UART2_RTS / P0.27
UART2_CTS / P0.26
UART2_TX / P0.25
UART2_RX / P0.24
ADC_IN4 / SSP1_NSS / USB_CK / P0.19
SSP1_MOSI / P0.18
ADC_IN3 / SSP1_MISO / P0.17
SSP1_SCLK / P0.16
P2.16
VDD_IO
VDDA_PLL
XT2
XT1
VSS_IO
VSSA_PLL
P2.15
Pin description
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Pin description
LQFP100 pinout
LQFP100
V18BKP I/Os
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
VREG_DIS
VSS_IO
VSSA_ADC
P2.10
P2.11
VDDA_ADC
VDD_IO
P1.02 / TIM2_OC2
P1.03 / TIM2_TI2
USB_DP
USB_DN
P0.14 / CAN_RX
P0.15 / CAN_TX
P2.12
P2.13
P1.15 / WKP_STDBY
NRSTIN
NRSTOUT
XRTC2
XRTC1
V18BKP
VSSBKP
VSS18
V18REG
P2.14
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
= 11 A/D input channels
= 13 External interrupts / Wake-up Lines
P1.09 / PWM1
P1.10 / PWM_EMERGENCY
P0.04 / SMI_CS0 /SSP0_NSS
P0.05 / SSP0_SCLK / SMI_CK
P0.06 / SMI_DIN / SSP0_MISO
P0.07 / SMI_DOUT / SSP0_MOSI
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
48
1
47
2
46
3
45
4
44
5
43
6
42
7
41
8
LQFP64
40
9
39
10
38
11
V18BKP I/Os
37
12
36
13
35
14
34
15
33
16
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
VREG_DIS
VSS_IO_2
VSSA_ADC
VDDA_ADC
VDD_IO_2
P1.03 / TIM2_TI2
P0.14 / CAN_RX or USB_DP
P0.15 / CAN_TX or USB_DN
NRSTIN
NRSTOUT
XRTC2
XRTC1
V18BKP
VSSBKP
VSS18
V18REG
SMI_CS1 / ADC_IN2 / UART0_CTS / UART2_RX /P0.12
SMI_CS2 / BOOT1 / UART0_TX / P0.11
SMI_CS3 / UART0_RX / P0.10
I2C_SDA/ P0.09
I2C_SCL / P0.08
ADC_IN12 / UART0_RTS / P1.11
ADC_IN4 / SSP1_NSS / USB_CK / P0.19
SSP1_MOSI / P0.18
ADC_IN3 / SSP1_MISO / P0.17
SSP1_SCLK / P0.16
VDD_IO_3
VDDA_PLL
XT2
XT1
VSS_IO_3
VSSA_PLL
ADC_IN13 / P1.12
ADC_IN0 / TIM2_OC1 / P0.02
MCO / TIM0_TI1 / P0.01
BOOT0 / TIM0_OC1 / P0.00
ADC_IN8 / TIM1_TI1 / P0.29
TIM1_OC1 / P0.28
TEST
VSS_IO_4
UART1_TX / P0.21
UART1_RX / P0.20
JTMS / P1.19
JTCK / P1.18
JTDO / P1.17
JTDI / P1.16
NJTRST
UART2_TX / UART0_RTS / RTCK / P0.13
P1.08 / PWM1N / ADC_IN11
LQFP64 pinout
P0.03 / TIM2_TI1 / ADC_IN1
VDD_IO_1
VSS_IO_1
VSS18
V18
P1.04 / PWM3N / ADC_IN9
P1.05 / PWM3
P1.06 / PWM2N / ADC_IN10
P1.07 / PWM2
Figure 3.
Pin description
13/84
Pin description
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Table 4.
LFBGA100 ball connections
1
3
4
5
6
7
8
9
10
A
P0.03
P1.13 P1.14
P1.04
P1.06 P1.08
P0.05
P0.06
P0.07
P1.02
B
P1.12
P0.02 P0.01
P1.05
P1.07 P1.09
P0.04
P2.13
P1.03
P2.10
C
P0.31
P0.00 VDD_IO
V18
P1.10 P2.09
VSS_IO
VSSA_ADC
P2.11
USB_DP
D
P0.29
P0.30 VSS_IO
VSS18
P1.01 P1.15
VDD_IO
VDDA_ADC
P2.12
USB_DN
E
P0.28
P0.23 P0.22
VSS_IO TEST P1.00 NRSTOUT VREG_DIS NRSTIN
P0.14
F
P2.03
P0.21 P0.20
P2.02
P2.04 P2.05
P2.06
VSS18
VSSBKP
P0.15
NJTRST P1.18 P1.19
P2.01
P2.00 P2.07
2.08
V18REG
V18BKP
XRTC2
G
H
P0.13
P1.16 P1.17
P2.19
P2.18 P2.17
P0.24
P2.14
P2.16
XRTC1
J
P0.11
P0.12 P1.11
P0.27
P0.19 P0.26
P0.25
P2.15
VDD_IO
VSS_IO
K
P0.10
P0.09 P0.08
P0.18
P0.17 P0.16
XT1
XT2
Table 5.
14/84
2
VDDA_PLL VSSA_PLL
LFBGA64 ball connections
1
2
3
4
5
6
7
8
A
P0.03
VSS_IO
P1.04
P1.06
P1.08
P0.05
P0.06
P0.07
B
P1.12
VDD_IO
P1.05
P1.07
P1.09
P0.04
P1.10
P1.03
C
P0.01
P0.02
P0.00
V18
VSS18
VDD_IO
VSS_IO
P0.14
D
P0.29
P0.28
TEST
VSS_IO
VREG_DIS VDDA_ADC VSSA_ADC
E
P1.18
P1.19
P0.20
P0.21
NRSTOUT
NRSTIN
V18BKP
XRTC2
F
P0.13
NJTRST
P1.16
P1.17
V18REG
VSS18
VSSBKP
XRTC1
G
P0.11
P0.12
P1.11
P0.19
VDD_IO
VSS_IO
H
P0.10
P0.09
P0.08
P0.17
P0.18
P0.16
P0.15
VDDA_PLL VSSA_PLL
XT2
XT1
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
4.0.1
Pin description
Pin description table
Legend / abbreviations for Table 6:
Type:
I = input, O = output, S = supply,
Input levels:
All Inputs are LVTTL at VDD_IO = 3.3V+/-0.3V or TTL
at VDD_IO = 5V± 0.5V. In both cases, TT means
VILmax =0.8V VIHmin=2.0V
Inputs:
All inputs can be configured as floating or with
internal weak pull-up or pull down (pu/pd)
Outputs:
All Outputs can be configured as Open Drain (OD) or
Push-Pull (PP) (see also note 6 below Table 6).
There are 3 different types of Output with different
drives and speed characteristics:
– O8: fmax = 40 MHz on CL=50pF and 8 mA static
drive capability for VOL=0.4V and up to 20 mA for
VOL=1.3V (seeOutput driving current on page 55)
– O4: fmax = 20 MHz on CL=50pF and 4 mA static
drive capability for VOL=0.4V (seeOutput driving
current on page 55)
– O2: fmax = 10 MHz on CL=50pF and 2 mA static
drive capability of for VOL=0.4V (seeOutput driving
current on page 55)
External interrupts/wake-up lines: EITx
15/84
Pin description
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Port reset state
The reset state of the I/O ports is GPIO input floating. Exceptions are P1[19:16] and P0.13
which are configured as JTAG alternate functions:
●
The JTAG inputs (JTDI, JTMS and JTDI) are configured as input floating and are ready
to accept JTAG sequences.
●
The JTAG output JTDO is configured as floating when idle (no JTAG operation) and is
configured in output push-pull only when serial JTAG data must be output.
●
The JTAG output RTCK is always configured as output push-pull. It outputs '0' level
during the reset phase and then outputs the JTCK input signal resynchronized 3 times
by the internal AHB clock.
●
The GPIO_PCx registers do not control JTAG AF selection, so the reset values of
GPIO_PCx for P1[19:16] and P0. 13 are the same as other ports. Refer to the GPIO
section of the STR750 Reference Manual for the register description and reset values.
●
P0.11 and P0.00 are sampled by the boot logic after reset, prior to fetching the first
word of user code at address 0000 0000h.
●
When booting from SMI (and only in this case), the reset state of the following GPIOs is
"SMI alternate function output enabled":
–
P0.07 (SMI_DOUT)
–
P0.05 (SMI_CLK)
–
P0.04 (SMI_CS0)
–
P0.06 (SMI_DIN)
Note that the other SMI pins: SMI_CS1,2,3 (P0.12, P0.11, P0.10) are not affected.
To avoid excess power consumption, unused I/O ports must be tied to ground.
STR750F pin description
Ext. int /Wake-up
Capability
X
X
Port 1.12
ADC: Analog
input 13
I/O
TT
X
X
EIT0
O8
X
X
Port 0.02
TIM2: Output
Compare 1(4)
I/O
TT
X
X
O8
X
X
Port 0.01
TIM0: Input
Main Clock
Capture / trigger
Output
/ external clock 1
I/O
TT
X
X
O8
X
X
Port 0.00 /
Boot mode
selection
input 0
TIM0: Output Compare 1
P0.31 / TIM1_TI2
I/O
TT
X
X
O2
X
X
Port 0.31
TIM1: Input Capture / trigger /
external clock 2
P0.30 /
TIM1_OC2
I/O
TT
X
X
O2
X
X
Port 0.30
TIM1: Output Compare 2
1
B1
2
B2
2
P0.02 /
C2 TIM2_OC1 /
ADC_IN0
3
B3
3
C1
4
C2
4
P0.00 /
C3 TIM0_OC1 /
BOOT0
5
C1
6
D2
P1.12 /
ADC_IN13
P0.01 / TIM0_TI1
/ MCO
Input Level
O8
B1
Pin name
Type
EIT12
LFBGA64(2)
X
LQFP64(2)
X
LFBGA100(1)
TT
LQFP100(1)
I/O
1
16/84
Output
pu/pd
Input
floating
Pin n°
Usable in Standby
Table 6.
OD
(3)
PP
Main
function
(after
reset)
Alternate function
ADC: Analog
input 0
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Input
Output
floating
pu/pd
5
D1
P0.29 / TIM1_TI1
/ ADC_IN8
I/O
TT
X
X
O2
X
X
Port 0.29
TIM1: Input
Capture 1
8
E1
6
D2
P0.28 /
TIM1_OC1
I/O
TT
X
X
O2
X
X
Port 0.28
TIM1: Output Compare 1
9
E5
7
D3 TEST
I
Reserved, must be tied to ground
10
E4
8
D4 VSS_IO
S
Ground Voltage for digital I/Os
Capability
LFBGA64(2)
D1
Input Level
LQFP64(2)
7
Pin name
Type
LFBGA100(1)
Main
function
(after
reset)
LQFP100(1)
Pin n°
Usable in Standby
STR750F pin description (continued)
Ext. int /Wake-up
Table 6.
Pin description
OD
(3)
PP
Alternate function
I/O
TT
X
X
O2
X
X
Port 0.23
UART1: Ready
To Send
output(4)
ADC: Analog
input 8
11
E2
P0.23 /
UART1_RTS /
ADC_IN6
12
F5
P2.04 /
TIM2_OC1
I/O
TT
X
X
O2
X
X
Port 2.04
TIM2: Output
Compare 1(4)
13
F1
P2.03 /
UART1_RTS
I/O
TT
X
X
O2
X
X
Port 2.03
UART1: Ready
To Send
output(4)
14
F4
P2.02
I/O
TT
X
X
O2
X
X
Port 2.02
15
E3
P0.22 /
UART1_CTS /
ADC_IN5
I/O
TT
X
X
O2
X
X
Port 0.22
UART1: Clear To
Send input
16
F2
9
E4
P0.21 /
UART1_TX
I/O
TT
X
X
O2
X
X
Port 0.21
UART1: Transmit data output
(remappable to P0.15)(4)
17
F3
10
E3
P0.20 /
UART1_RX
I/O
TT
X
X
O2
X
X
Port 0.20
UART1: Receive data input
(remappable to P0.14)(4)
18
G3
11
E2
P1.19 / JTMS
I/O
TT
X
X
O2
X
X
JTAG mode
selection
input(6)
Port 1.19
19
G2
12
E1 P1.18 / JTCK
I/O
TT
X
X
O2
X
X
JTAG clock
input(6)
Port 1.18
20
H3
13
F4 P1.17 / JTDO
I/O
TT
X
X
O8
X
X
JTAG data
output(6)
Port 1.17
21
H2
14
F3 P1.16 / JTDI
I/O
TT
X
X
O2
X
X
JTAG data
input(6)
Port 1.16
22
G1
15
F2 NJTRST
I
TT
23
G4
P2.01
I/O
TT
X
X
O2
X
X
Port 2.01
24
G5
P2.00
I/O
TT
X
X
O2
X
X
Port 2.00
X
JTAG
return
clock
output(6)
ADC analog input
6
ADC: Analog
input 5
JTAG reset input(5)
Port 0.13
25
H1
16
P0.13 / RTCK /
F1 UART0_RTS
UART2_TX
I/O
TT
X
X
O8
X
UART2: Transmit
UART0: Ready
To Send
output(4)
Data output
(when
remapped)(8)
17/84
Pin description
26
J2
P0.12 /
UART2_RX /
17 G2 UART0_CTS /
ADC_IN2 /
SMI_CS1
I/O
TT
X
X
Capability
Output
Ext. int /Wake-up
pu/pd
Input Level
Pin name
Type
Input
LFBGA64(2)
LQFP64(2)
LFBGA100(1)
LQFP100(1)
Pin n°
O4
OD
(3)
X
PP
X
Usable in Standby
STR750F pin description (continued)
floating
Table 6.
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Main
function
(after
reset)
Port 0.12
Alternate function
UART0: Clear To
Send input
ADC: Analog
input 2
Serial Memory
Interface: chip
select output 1
UART2: Receive
Data input (when
remapped)(8)
O4
X
X
Port
0.11/Boot
mode
selection
input 1
O2
X
X
Port 0.10
UART0: Receive
Data input
O4
X
X
Port 0.09
I2C: Serial Data
O4
X
X
Port 0.08
I2C: Serial clock
X
O2
X
X
Port 2.19
X
X
O2
X
X
Port 2.18
TT
X
X
O2
X
X
Port 2.17
UART2: Ready To Send output(4)
I/O
TT
X
X
O8
X
X
Port 1.11
UART0: Ready
To Send
output(4)
ADC: Analog
input 12
P0.27 /
UART2_RTS /
ADC_IN7
I/O
TT
X
X
O2
X
X
Port 0.27
UART2: Ready
To Send
output(8)
ADC: Analog
input 7
J6
P0.26 /
UART2_CTS
I/O
TT
X
X
O2
X
X
Port 0.26
UART2: Clear To Send input
37
J7
P0.25 /
UART2_TX
I/O
TT
X
X
O2
X
X
Port 0.25
UART2: Transmit data output
(remappable to P0.13)(8)
38
H7
P0.24 /
UART2_RX
I/O
TT
X
X
O2
X
X
Port 0.24
UART2: Receive data input
(remappable to P0.12)(8)
27
J1
P0.11 /
UART0_TX /
18 G1
BOOT1 /
SMI_CS2
28
K1
P0.10 /
19 H1 UART0_RX /
SMI_CS3
I/O
TT
X
X
29
K2
20 H2 P0.09 / I2C_SDA
I/O
TT
X
X
30
K3
21 H3 P0.08 / I2C_SCL
I/O
TT
X
X
31
H4
P2.19
I/O
TT
X
32
H5
P2.18
I/O
TT
33
H6
P2.17 /
UART2_RTS
I/O
34
J3
P1.11
22 G3 /UART0_RTS
ADC_IN12
35
J4
36
39
J5
P0.19 / USB_CK /
23 G4 SSP1_NSS /
ADC_IN4
P0.18 /
SSP1_MOSI
40
K4
24 H5
41
K5
P0.17 /
25 H4 SSP1_MISO /
ADC_IN3
42
K6
26 H6
18/84
P0.16 /
SSP1_SCLK
I/O
TT
X
X
I/O
TT
X
X
EIT4
EIT3
EIT11
EIT6
O2
X
X
Port 0.19
UART0: Transmit
data output
Serial Memory
Interface: chip
select output 2
Serial Memory
Interface: chip
select output 3
SSP1: Slave
select input
(remappable to
P0.11)(8)
ADC: Analog
input 4
USB:
48 MHz Clock
input
I/O
TT
X
X
O2
X
X
Port 0.18
SSP1: Master out/slave in data
(remappable to P0.10)(8)
I/O
TT
X
X
O2
X
X
Port 0.17
SSP1: Master
in/slave out data
(remappable to
P0.09)(8)
I/O
TT
X
X
O2
X
X
Port 0.16
SSP1: serial clock (remappable to
P0.08)(8)
ADC: Analog
input 3
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Input
Output
Supply voltage for digital I/Os
45
K9
28 G7 VDDA_PLL
S
Supply voltage for PLL
46
K8
29 H7 XT2
47
K7
30 H8 XT1
48
J10
31 G6 VSS_IO
S
Ground voltage for digital I/Os
49
K10
32 G8 VSSA_PLL
S
Ground voltage for PLL
X
X
Capability
S
TT
pu/pd
27 G5 VDD_IO
I/O
floating
J9
P2.16
Input Level
44
Pin name
Type
H9
LFBGA64(2)
43
LQFP64(2)
LFBGA100(1)
Main
function
(after
reset)
LQFP100(1)
Pin n°
Usable in Standby
STR750F pin description (continued)
Ext. int /Wake-up
Table 6.
Pin description
O2
OD
(3)
PP
X
X
Alternate function
Port 2.16
4 MHz main oscillator
50
J8
P2.15
I/O
TT
X
X
O2
X
X
Port 2.15
51
H8
P2.14
I/O
TT
X
X
O2
X
X
Port 2.14
52
G8
33
F5 V18REG
Stabilization for main voltage regulator. Requires
external capacitors of at least 10µF between
V18REG and VSS18. See Figure 4.
S
To be connected to the 1.8V external power supply
when embedded regulators are not used,
53
F8
34
F6 VSS18
S
Ground Voltage for the main voltage regulator
54
F9
35
F7 VSSBKP
S
Stabilization for low power voltage regulator.
S
Ground Voltage for the low power voltage regulator.
Requires external capacitors of at least 1µF
between V18BKP and VSSBKP. See Figure 4.
To be connected to the 1.8V external power supply
when embedded regulators are not used,
55
G9
36
E7 V18BKP
56
H10
37
F8 XRTC1
X
57
G10 38
E8 XRTC2
X
32 kHz oscillator for Realtime Clock
58
E7
39
E5 NRSTOUT
O
59
E9
40
E6 NRSTIN
I
TT
60
D6
I
TT
X
P1.15 /
WKP_STDBY
EIT15
X
Reset output
X
Reset input
X
Port 1.15
Wake-up from STANDBY input pin
61
B8
P2.13
I/O
TT
X
X
O2
X
X
Port 2.13
62
D9
P2.12
I/O
TT
X
X
O2
X
X
Port 2.12
63
F10
P0.15 / CAN_TX
I/O
TT
X
X
O2
X
X
Port 0.15
CAN: Transmit data output
64
E10
P0.14 / CAN_RX
I/O
TT
X
X
O2
X
X
Port 0.14
CAN: Receive data input
65
D10
USB_DN
I/O
USB: bidirectional data (data -)
66
C10
USB_DP
I/O
USB: bidirectional data (data +)
67
B9
41 D8
(7)
(7)
42 C8
(7)
(7)
41 D8
(7)
(7)
42 C8
(7)
(7)
43
B8 P1.03 / TIM2_TI2
I/O
TT
X
X
EIT5
O2
X
X
Port 1.03
TIM2: Input Capture / trigger /
external clock 2 (remappable to
P0.07)(8)
19/84
Pin description
Input
Output
Supply Voltage for digital I/Os
70
D8
45 D6 VDDA_ADC
S
Supply Voltage for A/D converter
X
X
Capability
S
TT
pu/pd
44 C6 VDD_IO
I/O
floating
D7
P1.02 /
TIM2_OC2
Input Level
69
Pin name
Type
A10
LFBGA64(2)
68
LQFP64(2)
LFBGA100(1)
Main
function
(after
reset)
LQFP100(1)
Pin n°
Usable in Standby
STR750F pin description (continued)
Ext. int /Wake-up
Table 6.
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
O2
OD
(3)
PP
X
X
Port 1.02
Alternate function
TIM2: Output compare 2
(remappable to P0.06)(8)
71
C9
P2.11
I/O
TT
X
X
O2
X
X
Port 2.11
72
B10
P2.10
I/O
TT
X
X
O2
X
X
Port 2.10
73
C8
46 D7 VSSA_ADC
S
Ground Voltage for A/D converter
74
C7
47 C7 VSS_IO
S
Ground Voltage for digital I/Os
75
E8
48 D5 VREG_DIS
I
TT
I/O
TT
X
X
I/O
TT
X
X
I/O
TT
X
X
I/O
TT
X
X
Voltage Regulator Disable input
76
A9
49
P0.07 /
A8 SMI_DOUT /
SSP0_MOSI
77
A8
50
A7
78
A7
51
P0.05 /
A6 SSP0_SCLK /
SMI_CK
79
B7
52
B6
80
C5
53
P1.10
B7 PWM_EMERGE
NCY
I/O
TT
X
X
81
B6
54
B5 P1.09 / PWM1
I/O
TT
X
X
82
C6
P2.09 / PWM1N
I/O
TT
X
83
G7
P2.08 / PWM2
I/O
TT
84
G6
P2.07 / PWM2N
I/O
85
F7
P2.06 / PWM3
86
F6
87
A6
55
A5
88
B5
56
B4 P1.07 / PWM2
89
A5
57
A4
90
B4
58
B3 P1.05 / PWM3
20/84
O4
X
X
Port 0.07
Serial Memory
Interface: data
output
SSP0: Master out
Slave in data
O4
X
X
Port 0.06
Serial Memory
Interface: data
input
SSP0: Master in
Slave out data
O4
X
X
Port 0.05
SSP0: Serial
clock
Serial Memory
Interface: Serial
clock output
O4
X
X
Port 0.04
Serial Memory
Interface: chip
select output 0
SSP0: Slave
select input
EIT10
O2
X
X
Port 1.10
PWM: Emergency input
EIT9
O4
X
X
Port 1.09
PWM: PWM1 output
X
O2
X
X
Port 2.09
PWM: PWM1 complementary
output(4)
X
X
O2
X
X
Port 2.08
PWM: PWM2 output(4)
TT
X
X
O2
X
X
Port 2.07
PWM: PWM2 complementary
output(4)
I/O
TT
X
X
O2
X
X
Port 2.06
PWM: PWM3 output(4)
P2.05 / PWM3N
I/O
TT
X
X
O2
X
X
Port 2.05
PWM: PWM3 complementary
output(4)
P1.08 / PWM1N /
ADC_IN11
I/O
TT
X
X
O4
X
X
Port 1.08
PWM: PWM1
complementary
output(8)
I/O
TT
X
X
O4
X
X
Port 1.07
PWM: PWM2 output(4)
I/O
TT
X
X
O4
X
X
Port 1.06
PWM: PWM2
complementary
output(4)
I/O
TT
X
X
O4
X
X
Port 1.05
PWM: PWM3 output(4)
P0.06 / SMI_DIN
/ SSP0_MISO
P0.04 / SMI_CS0
/ SSP0_NSS
P1.06 / PWM2N /
ADC_IN10
EIT2
EIT1
EIT8
EIT7
ADC: analog
input 11
ADC: analog
input 10
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
92
Capability
A3
Main
function
(after
reset)
pu/pd
59
Output
floating
LFBGA64(2)
A4
Input Level
LQFP64(2)
91
Type
LFBGA100(1)
Input
LQFP100(1)
Pin n°
Usable in Standby
STR750F pin description (continued)
Ext. int /Wake-up
Table 6.
Pin description
P1.04 / PWM3N /
ADC_IN9
I/O
TT
X
X
O4
X
X
Port 1.04
PWM: PWM3
complementary
output(4)
A3
P1.14 /
ADC_IN15
I/O
TT
X
X
O8
X
X
Port 1.14
ADC: analog input 15
93
A2
P1.13 /
ADC_IN14
I/O
TT
X
X
O8
X
X
Port 1.13
ADC: analog input 14
94
D5
P1.01 / TIM0_TI2
I/O
TT
X
X
O2
X
X
Port 1.01
TIM0: Input Capture / trigger /
external clock 2 (remappable to
P0.05)(8)
95
E6
P1.00 /
TIM0_OC2
I/O
TT
X
X
O2
X
X
Port 1.00
TIM0: Output compare 2
(remappable to P0.04)(8)
Pin name
EIT13
OD
(3)
PP
Alternate function
ADC: analog
input 9
96
C4
60 C4 V18
S
Stabilization for main voltage regulator. Requires
external capacitors 33nF between V18 and VSS18.
See Figure 4.
To be connected to the 1.8V external power supply
when embedded regulators are not used.
97
D4
61 C5 VSS18
S
Ground Voltage for the main voltage regulator.
98
D3
62
A2 VSS_IO
S
Ground Voltage for digital I/Os
99
C3
63
B2 VDD_IO
S
Supply Voltage for digital I/Os
100
A1
64
A1
P0.03 / TIM2_TI1
/ ADC_IN1
I/O
TT
X
X
O2
X
X
Port 0.03
TIM2: Input
Capture / trigger
/ external clock 1
ADC: analog
input 1
1. For STR755FVx part numbers, the USB pins must be left unconnected.
2. The non available pins on LQPFP64 and LFBGA64 packages are internally tied to low level.
3. None of the I/Os are True Open Drain: when configured as Open Drain, there is always a protection diode between the I/O
pin and VDD_IO.
4. In the 100-pin package, this Alternate Function is duplicated on two ports. You can configure one port to use this AF, the
other port is then free for general purpose I/O (GPIO), external interrupt/wake-up lines, or analog input (ADC_IN) where
these functions are listed in the table.
5. It is mandatory that the NJTRST pin is reset to ground during the power-up phase. It is recommended to connect this pin to
NRSTOUT pin (if available) or NRSTIN.
6. After reset, these pins are enabled as JTAG alternate function see (Port reset state on page 16). To use these ports as
general purpose I/O (GPIO), the DBGOFF control bit in the GPIO_REMAP0R register must be set by software (in this case,
debugging these I/Os via JTAG is not possible).
7. There are two different TQFP and BGA 64-pin packages: in the first one, pins 41 and 42 are mapped to USB DN/DP while
for the second one, they are mapped to P0.15/CAN_TX and P0.14/CAN_RX.
8. For details on remapping these alternate functions, refer to the GPIO_REMAP0R register description.
21/84
Pin description
Figure 4.
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Required external capacitors when regulators are used
33 nF
33 nF
96
VSS18 V18
97
V18BKP 55
VSSBKP 54
LQFP100
VSS18
1µF
V18BKP 36
VSSBKP 35
1µF
LQFP64
53
V18REG 52
61 60
VSS18 V18
VSS18
10 µF
34
V18REG 33
10 µF
VDD_IO
27
VDD_IO
44
1 µF
1 µF
33 nF
33 nF
D4 C4
VSS18 V18
VSSBKP F9
LFBGA100
1µF
V18BKP E7
VSSBKP F7
1µF
LFBGA64
VSS18
VSS18
F8
V18REG G8
VDD_IO
J9
1 µF
22/84
C5 C4
VSS18 V18
V18BKP G9
10 µF
F6
V18REG F5
VDD_IO
G5
1 µF
10 µF
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
4.1
Pin description
Memory map
Figure 5.
Memory map
Addressable Memory Space
4 Gbytes
0xFFFF FFFF
0xFFFF 8000
APB TO ARM7
BRIDGE
Peripheral Memory Space
32 Kbytes
0xFFFF FFFF
32K
0xFFFF FC00
0xFFFF FBFF
0xFFFF F800
0xFFFF F7FF
7
Reserved
1K
EIC
1K
EXTIT
1K
RTC
1K
DMA
1K
Reserved
1K
GPIO I/O Ports
1K
Reserved
1K
UART2
1K
UART1
1K
UART0
1K
Reserved
1K
0xFFFF F400
0xFFFF F3FF
FLASH Memory Space
128/256 Kbytes
0xE000 0000
0xDFFF FFFF
0xFFFF F000
0xFFFF EFFF
0xFFFF EC00
0xFFFF EBFF
6
0x2010 DFFF
0x2010 C000
SystemMemory 8K
0x2010 0017
0x2010 0000
Flash registers
24B
0xFFFF E800
0xFFFF E7FF
0xFFFF E400
0xFFFF E3FF
0xFFFF E000
0xFFFF DFFF
0xC000 0000
0xBFFF FFFF
0xFFFF DC00
0xFFFF DBFF
0xFFFF D800
0xFFFF D7FF
5
0x200C
0x200C
0x200C
0x200C
0x200C
0xA000 0000
0x9FFF FFFF
4
0x9000 0013
0x9000 0000
0x83FF FFFF
0x8000 0000
0x7FFF FFFF
SMI Registers
4000
3FFF
2000
1FFF
0000
0xFFFF D400
0xFFFF D3FF
B1F1
8K
B1F0
8K
0xFFFF D000
0xFFFF CFFF
0xFFFF CC00
0xFFFF CBFF
0xFFFF C800
0xFFFF C7FF
20B
0xFFFF C400
0xFFFF C3FF
SMI Ext. Memory
4 x 16M
0xFFFF C000
0xFFFF BFFF
0xFFFF BC00
0xFFFF BBFF
0xFFFF B800
0xFFFF B7FF
3
0x6000 0047
0x6000 0000
0x5FFF FFFF
0xFFFF B400
0xFFFF B3FF
CONF + MRCC
1K
0x2003 FFFF
0xFFFF B000
0xFFFF AFFF
B0F7(2)
2
0x4000 3FFF
0x4000 0000
0x3FFF FFFF
64K
0xFFFF A800
0xFFFF A7FF
0x2003 0000
0x2002 FFFF
Internal SRAM
B0F6(2)
16K
64K
0x2002 0000
0x2001 FFFF
1
0x2010 0017
0x2000 0000
0x1FFF FFFF
0xFFFF
0xFFFF
0xFFFF
0xFFFF
0xFFFF
B0F5
128K/256K+16K+32B
64K
0x2001 0000
0x2000 FFFF
0
Boot Memory(1)
128K/256K
0x2000
0x2000
0x2000
0x2000
0x2000
0x2000
0x2000
0x2000
0x2000
8000
7FFF
6000
5FFF
4000
3FFF
2000
1FFF
0000
1K
CAN
1K
Reserved
1K
SSP1
1K
SSP0
1K
Reserved
1K
WDG
1K
Reserved
1K
USB Registers
1K
Reserved
1K
A400
A3FF
A200 USB RAM 256 x16-bit
A000
9FFF
0xFFFF 9000
0xFFFF 8FFF
32K
1K
PWM
1K
TIM2
1K
TIM1
1K
TIM0
1K
TB Timer
1K
ADC
1K
Reserved
1K
0xFFFF 8C00
0xFFFF 8BFF
B0F1
8K
8K
8K
0xFFFF 8400
0xFFFF 83FF
B0F0
8K
0xFFFF 8000
B0F3
B0F2
0xFFFF 8800
0xFFFF 87FF
1K
Reserved
0xFFFF 9800
0xFFFF 97FF
0xFFFF 9400
0xFFFF 93FF
Internal Flash
1K
0xFFFF 9C00
0xFFFF 9BFF
B0F4
0x0000 0000
0xFFFF AC00
0xFFFF ABFF
I2C
Reserved
(1) In internal Flash Boot Mode, internal FLASH is aliased at 0x0000 0000h
(2) Only available in STR750Fx2
Reserved
23/84
Electrical parameters
5
Electrical parameters
5.1
Parameter conditions
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Unless otherwise specified, all voltages are referred to VSS.
5.1.1
Minimum and maximum values
Unless otherwise specified the minimum and maximum values are guaranteed in the worst
conditions of ambient temperature, supply voltage and frequencies by tests in production on
100% of the devices with an ambient temperature at TAmax (given by the selected
temperature range).
Data based on product characterisation, design simulation and/or technology characteristics
are indicated in the table footnotes and are not tested in production. Based on
characterization, the minimum and maximum values refer to sample tests and represent the
mean value plus or minus three times the standard deviation (mean±3Σ).
5.1.2
Typical values
Unless otherwise specified, typical data are based on TA=25° C, VDD_IO=3.3 V (for the
3.0 V≤VDD_IO≤3.6 V voltage range) and V18=1.8 V. They are given only as design guidelines
and are not tested.
Typical ADC accuracy values are determined by characterization of a batch of samples from
a standard diffusion lot over the full temperature range, where 95% of the devices have an
error less than or equal to the value indicated (mean±2Σ).
5.1.3
Typical curves
Unless otherwise specified, all typical curves are given only as design guidelines and are
not tested.
24/84
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
5.1.4
Electrical parameters
Loading capacitor
The loading conditions used for pin parameter measurement are shown in Figure 6.
Figure 6.
Pin loading conditions
STR7 PIN
CL=50pF
5.1.5
Pin input voltage
The input voltage measurement on a pin of the device is described in Figure 7.
Figure 7.
Pin input voltage
STR7 PIN
VIN
25/84
Electrical parameters
5.1.6
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Power supply schemes
When mentioned, some electrical parameters can refer to a dedicated power scheme
among the four possibilities. The four different power schemes are described below.
Power supply scheme 1: Single external 3.3 V power source
Figure 8.
Power supply scheme 1
IN STANDBY MODE THIS BLOCK IS KEPT POWERED ON
V18_BKP
1µF
VSS_BKP
NORMAL
MODE
VREG_DIS
LOW POWER V
LPVREG ~1.4V
VOLTAGE
REGULATOR
V18
33nF
BACKUP
CIRCUITRY
OSC32K, RTC
WAKEUP LOGIC,
BACKUP REGISTERS)
POWER
SWITCH
VSS18
V18REG
10µF
VBACKUP
V18
VSS18
VDD_IO
3.3V
1µF
MAIN
VMVREG = 1.8V
VOLTAGE
REGULATOR
+/-0.3V
VSS_IO
VIO=3.3V
OUT
I/O LOGIC
GP I/Os
IN
VDD_PLL
3.3V
PLL
VSS_PLL
VDD_ADC
VSS_ADC
ADCIN
26/84
3.3V
ADC
VCORE
KERNEL LOGIC
(CPU &
DIGITAL &
MEMORIES)
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Electrical parameters
Power supply scheme 2: Dual external 1.8V and 3.3V supply
Figure 9.
Power supply scheme 2
V18_BKP
VSS_BKP
VDD_IO
VBACKUP
OFF
LOW POWER
VOLTAGE
REGULATOR
VREG_DIS
V18
VLPVREG
BACKUP
CIRCUITRY
(OSC32K, RTC
WAKEUP LOGIC,
BACKUP REGISTERS)
V18REG
POWER
SWITCH
1.8V
VSS18
OFF
VDD_IO
MAIN
VOLTAGE
REGULATOR
3.3V
+/-0.3V
VCORE
VMVREG
VSS_IO
KERNEL
(CORE &
DIGITAL &
MEMORIES)
VIO=3.3V
OUT
GP I/Os
I/O LOGIC
IN
VDD_PLL
3.3V
VSS_PLL
VDD_ADC
VSS_ADC
PLL
3.3V
ADC
ADCIN
NOTE : THE EXTERNAL 3.3 V POWER SUPPLY MUST ALWAYS BE KEPT ON
27/84
Electrical parameters
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Power supply scheme 3: Single external 5 V power source
Figure 10. Power supply scheme 3
IN STANDBY MODE THIS BLOCK IS KEPT POWERED ON
V18_BKP
1µF
VSS_BKP
NORMAL
MODE
VREG_DIS
LOW POWER V
LPVREG ~1.4V
VOLTAGE
REGULATOR
V18
33nF
BACKUP
CIRCUITRY
OSC32K, RTC
WAKEUP LOGIC,
BACKUP REGISTERS)
POWER
SWITCH
VSS18
V18REG
10µF
VBACKUP
V18
VSS18
VDD_IO
5.0V
1µF
MAIN
VMVREG = 1.8V
VOLTAGE
REGULATOR
+/-0.5V
VSS_IO
VIO=5.0V
OUT
I/O LOGIC
GP I/Os
IN
VDD_PLL
5.0V
PLL
VSS_PLL
VDD_ADC
VSS_ADC
ADCIN
28/84
5.0V
ADC
VCORE
KERNEL LOGIC
(CPU &
DIGITAL &
MEMORIES)
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Electrical parameters
Power supply scheme 4: Dual external 1.8 V and 5.0 V supply
Figure 11. Power supply scheme 4
V18_BKP
VSS_BKP
VDD_IO
VBACKUP
OFF
LOW POWER
VOLTAGE
REGULATOR
VREG_DIS
V18
VLPVREG
BACKUP
CIRCUITRY
(OSC32K, RTC
WAKEUP LOGIC,
BACKUP REGISTERS)
V18REG
POWER
SWITCH
1.8V
VSS18
OFF
VDD_IO
MAIN
VOLTAGE
REGULATOR
5.0V
+/-0.5V
VCORE
VMVREG
VSS_IO
KERNEL
(CORE &
DIGITAL &
MEMORIES)
VIO=5.0V
OUT
GP I/Os
I/O LOGIC
IN
VDD_PLL
5.0V
PLL
VSS_PLL
VDD_ADC
VSS_ADC
5.0V
ADC
ADCIN
NOTE : THE EXTERNAL 5.0V POWER SUPPLY MUST ALWAYS BE KEPT ON
5.1.7
I/O characteristics versus the various power schemes (3.3V or 5.0V)
Unless otherwise mentioned, all the I/O characteristics are valid for both
●
VDD_IO=3.0 V to 3.6 V with bit EN33=1
●
VDD_IO=4.5 V to 5.5 V with bit EN33=0
When VDD_IO=3.0 V to 3.6 V, I/Os are not 5V tolerant.
5.1.8
Current consumption measurements
All the current consumption measurements mentioned below refer to Power scheme 1 and 2
as described in Figure 12 and Figure 13
29/84
Electrical parameters
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Figure 12. Power consumption measurements in power scheme 1 (regulators
enabled)
VDDA_ADC pins
VDDA_PLL pins
IDDA_PLL
IDDA_ADC
ADC
load
PLL
load
VDD_IO pins
IDD
ballast
regulator I33
transistor
3.3V
Supply
3.3V
internal
load
V18 pins (including V18BKP)
I18
1.8V
internal
load
IDD is measured, which corresponds to the total current consumption :
IDD = IDDA_PLL + IDDA_ADC + I33 + I18
Figure 13. Power consumption measurements in power scheme 2 (regulators
disabled)
VDDA_ADC pins
VDDA_PLL pins
IDDA_PLL
IDD_v33
3.3V
Supply
30/84
PLL
load
I33
3.3V
internal
load
I18
1.8V
internal
load
IDD_v18
IDD_v33 and IDD_v18 are measured which correspond to:
IDD_v33 = IDDA_PLL + IDDA_ADC + I33
IDD_v18 = I18
ADC
load
VDD_IO pins
V18 pins (including V18BKP)
1.8V
Supply
IDDA_ADC
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Electrical parameters
Figure 14. Power consumption measurements in power scheme 3 (regulators
enabled)
VDDA_ADC pins
VDDA_PLL pins
IDDA_PLL
IDDA_ADC
ADC
load
PLL
load
VDD_IO pins
IDD
ballast
regulator I50
transistor
5.0V
Supply
5.0V
internal
load
V18 pins (including V18BKP)
I18
1.8V
internal
load
IDD is measured, which corresponds to the total current consumption :
IDD = IDDA_PLL + IDDA_ADC + I50 + I18
Figure 15. Power consumption measurements in power scheme 4 (regulators
disabled)
VDDA_ADC pins
VDDA_PLL pins
IDDA_PLL
IDD_v50
5.0V
Supply
PLL
load
I50
5.0V
internal
load
I18
1.8V
internal
load
IDD_v18
IDD_v50 and IDD_v18 are measured which correspond to:
IDD_v50= IDDA_PLL + IDDA_ADC + I50
IDD_v18 = I18
ADC
load
VDD_IO pins
V18 pins (including V18BKP)
1.8V
Supply
IDDA_ADC
31/84
Electrical parameters
5.2
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
5.2.1
Voltage characteristics
Table 7.
Voltage characteristics
Symbol
Ratings
VDD_x - VSS_X(1) Including VDDA_ADC and VDDA_PLL
V18 - VSS18
VIN
Digital 1.8 V Supply voltage on all V18
power pins (when 1.8 V is provided
externally)
Input voltage on any pin (2)
Min
Max
Unit
-0.3
6.5
V
-0.3
2.0
VSS-0.3 to
VDD_IO+0.3
VSS-0.3 to
VDD_IO+0.3
|∆VDDx|
Variations between different 3.3 V or
5.0 V power pins
50
|∆V18x|
Variations between different 1.8 V power
pins(3)
25
Variations between all the different
ground pins
50
|VSSX - VSS|
VESD(HBM)
Electro-static discharge voltage (Human
Body Model)
VESD(MM)
Electro-static discharge voltage (Machine
Model)
see : Absolute
maximum
ratings
(electrical
sensitivity) on
page 52
mV
see : Absolute
maximum
ratings
(electrical
sensitivity) on
page 52
1. All 3.3 V or 5.0 V power (VDD_IO, VDDA_ADC, VDDA_PLL) and ground (VSS_IO, VSSA_ADC, VDDA_ADC) pins
must always be connected to the external 3.3V or 5.0V supply. When powered by 3.3V, I/Os are not 5V
tolerant.
2. IINJ(PIN) must never be exceeded. This is implicitly insured if VIN maximum is respected. If VIN maximum
cannot be respected, the injection current must be limited externally to the IINJ(PIN) value. A positive
injection is induced by VIN>VDD while a negative injection is induced by VIN<VSS. For true open-drain pads,
there is no positive injection current, and the corresponding VIN maximum must always be respected
3. Only when using external 1.8 V power supply. All the power (V18, V18REG, V18BKP) and ground (VSS18,
VSSBKP) pins must always be connected to the external 1.8 V supply.
32/84
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
5.2.2
Electrical parameters
Current characteristics
Table 8.
Current characteristics
Symbol
Maximum
value
Ratings
IVDD_IO(1)
IVSS_IO(1)
IIO
Total current into VDD_IO power lines (source) (2)
Total current out of VSS ground lines (sink)
Unit
150
(2)
150
Output current sunk by any I/O and control pin
25
Output current source by any I/Os and control pin
- 25
Injected current on NRSTIN pin
±5
Injected current on XT1 and XT2 pins
±5
mA
IINJ(PIN) (3) & (4)
Injected current on any other
ΣIINJ(PIN)(3)
pin (5)
Total injected current (sum of all I/O and control
±5
pins) (5)
± 25
1. The user can use GPIOs to source or sink high current (up to 20 mA for O8 type High Sink I/Os). In this
case, the user must ensure that these absolute max. values are not exceeded (taking into account the
RUN power consumption) and must follow the rules described in Section 5.3.8: I/O port pin characteristics
on page 54.
2. All 3.3 V or 5.0 V power (VDD_IO, VDDA_ADC, VDDA_PLL) and ground (VSS_IO, VSSA_ADC, VDDA_ADC) pins
must always be connected to the external 3.3V or 5.0V supply.
3. IINJ(PIN) must never be exceeded. This is implicitly insured if VIN maximum is respected. If VIN maximum
cannot be respected, the injection current must be limited externally to the IINJ(PIN) value. A positive
injection is induced by VIN>VDD while a negative injection is induced by VIN<VSS.
4. Negative injection disturbs the analog performance of the device. See note in Section 5.3.12: 10-bit ADC
characteristics on page 72.
5. When several inputs are submitted to a current injection, the maximum ΣIINJ(PIN) is the absolute sum of the
positive and negative injected currents (instantaneous values). These results are based on
characterization with ΣIINJ(PIN) maximum current injection on four I/O port pins of the device.
5.2.3
Thermal characteristics
Table 9.
Thermal characteristics
Symbol
Ratings
Value
Unit
TSTG
Storage temperature range
-65 to +150
°C
TJ
Maximum junction temperature
150
°C
33/84
Electrical parameters
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
5.3
Operating conditions
5.3.1
General operating conditions
Subject to general operating conditions for VDD_IO, and TA unless otherwise specified.
Table 10.
Symbol
fHCLK
General operating conditions
Parameter
Internal AHB Clock frequency
Conditions
Min
Max
Accessing SRAM with 0 wait
states
0
64
Accessing Flash in burst
mode, TA≤85° C
0
60
Accessing Flash in burst
mode
TA>85° C
56
Accessing Flash with 0 wait
states
0
32
Accessing Flash in RWW
mode
0
16
0
32
Standard Operating Voltage
Power Scheme 1 & 2
3.0
3.6
Standard Operating Voltage
Power Scheme 3 & 4
4.5
5.5
V18
Standard Operating Voltage
Power Scheme 2 & 4
1.65
1.95
PD
Power dissipation at TA= 85° C
for suffix 6 or TA= 105° C for
suffix 7(1)
fPCLK
VDD_IO
TA
TJ
Internal APB Clock frequency
LQFP100
434
LQFP64
444
LFBGA100
487
LFBGA64
344
Unit
MHz
MHz
V
mW
Ambient temperature for 6 suffix Maximum power dissipation
version
Low power dissipation(2)
-40
85
°C
-40
105
°C
Ambient temperature for 7 suffix Maximum power dissipation
version
Low power dissipation (2)
-40
105
°C
-40
125
°C
6 Suffix Version
-40
105
°C
7 Suffix Version
-40
125
°C
Junction temperature range
1. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Section 6.2:
Thermal characteristics on page 79).
2. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see
Section 6.2: Thermal characteristics on page 79).
34/84
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
5.3.2
Electrical parameters
Operating conditions at power-up / power-down
Subject to general operating conditions for TA.
Table 11.
Operating conditions at power-up / power-down
Symbol
Parameter
Conditions
Min(1)
Typ
Max(1)
µs/V
20
tVDD_IO
VDD_IO rise time rate
tV18
V18 rise time rate (1)
20
When 1.8 V power is supplied
externally
Unit
ms/V
µs/V
20
20
ms/V
1. Data guaranteed by characterization, not tested in production.
5.3.3
Embedded voltage regulators
Subject to general operating conditions for VDD_IO, and TA
Table 12.
Embedded voltage regulators
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VMVREG
MVREG power supply(1)
load <150 mA
1.65
1.80
1.95
V
VLPVREG
LPVREG power supply(2)
load <10 mA
1.30
1.40
1.50
V
tVREG_PWRUP(1)
Voltage Regulators start-up
time (to reach 90% of final V18
value) at VDD_IO power-up(3)
VDD_IO rise
slope = 20 µs/V
80
µs
VDD_IO rise
slope = 20 ms/V
35
ms
1. VMVREG is observed on the V18, V18REG and V18BKP pins except in the following case:
- In STOP mode with MVREG OFF (LP_PARAM13 bit). See note 2.
- In STANDBY mode. See note 2.
2. In STANDBY mode, VLPVREG is observed on the V18BKP pin
In STOP mode, VLPVREG is observed on the V18, V18REG and V18BKP pins.
3. Once VDD_IO has reached 3.0 V, the RSM (Regulator Startup Monitor) generates an internal RESET
during this start-up time.
35/84
Electrical parameters
5.3.4
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Supply current characteristics
The current consumption is measured as described in Figure 12 on page 30 and Figure 13
on page 30.
Subject to general operating conditions for VDD_IO, and TA
Maximum power consumption
For the measurements in Table 13 and Table 14, the MCU is placed under the following
conditions:
●
All I/O pins are configured in output push-pull 0
●
All peripherals are disabled except if explicitly mentioned.
●
Embedded Regulators are used to provide 1.8 V (except if explicitly mentioned).
Table 13.
Symbol
IDD
Maximum power consumption in RUN and WFI modes
Parameter
Conditions (1)
Typ(2) Max (3) Unit
External Clock with PLL
multiplication, code running from
RAM, all peripherals enabled in the 3.3V
Supply current in
MRCC_PLCKEN register: fHCLK=60 and 5V
RUN mode
MHz, fPCLK=30 MHz
range
Single supply scheme see Figure 12
/ Figure 14
80
90
mA
External Clock, code running from
RAM: fHCLK=60 MHz, fPCLK=30 MHz
3.3V
Supply current in Single supply scheme see
and 5V
WFI mode
Figure 12./ Figure 14
range
Parameter setting BURST=1,
WFI_FLASHEN=1
62
67
mA
1. The conditions for these consumption measurements are described at the beginning of Section 5.3.4.
2. Typical data are based on TA=25°C, VDD_IO=3.3V or 5.0V and V18=1.8V unless otherwise specified.
3. Data based on product characterisation, tested in production at VDD_IO max and V18 max (1.95V in dual
supply mode or regulator output value in single supply mode) and TA max.
36/84
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Table 14.
Electrical parameters
Maximum power consumption in STOP and STANDBY modes
Max(3)
Symbol
Conditions (1)
Parameter
Supply
current in
STOP mode
IDD
Supply
current in
STANDBY
mode
Typ(2)
TA
25°C
TA
85°C
TA
105°C
Unit
LP_PARAM bits: ALL OFF(4)
Single supply scheme see Figure 12.
3.3V
range
12
16
117
250
µA
LP_PARAM bits: ALL OFF
Dual supply scheme see Figure 13.
IDD_V18
IDD_V33
5
<1
8
3
60
20
110
26
µA
LP_PARAM bits: ALL OFF(4)
Single supply scheme see Figure 10
5V
range
15
22
160
310
µA
LP_PARAM bits: ALL OFF
Dual supply scheme see Figure 11
IDD_V18
IDD_V50
5
3
8
6
60
50
110
65
3.3 V
range
10
20
25
28
5V
range
15
25
30
33
µA
RTC OFF
1. The conditions for these consumption measurements are described at the beginning of Section 5.3.4.
2. Typical data are based on TA=25°C, VDD_IO=3.3V or 5.0V and V18=1.8V unless otherwise specified.
3. Data based on product characterisation, tested in production at VDD_IO max and V18 max (1.95V in dual supply mode or
regulator output value in single supply mode).
4. In this mode, the whole digital circuitry is powered internally by the LPVREG at approximately 1.4V, which significantly
reduces the leakage currents.
37/84
Electrical parameters
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Figure 16. Power consumption in STOP mode Figure 17. Power consumption in STOP mode
in Single supply scheme (3.3 V
Single supply scheme (5 V range)
range)
350
300
300
TYP (3.3V)
MAX (3.6V)
200
IStop (uA)
IStop (uA)
250
150
100
250
TYP (5.0V)
200
MAX (5.5V)
150
100
50
50
0
0
-40
25
45
55
75
95
105
-40
25
Temp (°C)
75
95
35
TYP (3.3V)
30
MAX (3.6V)
25
IStandby (uA)
25
20
15
10
5
TYP (5.0V)
MAX (5.5V)
20
15
10
5
0
0
-40
25
Temp (°C)
105
Figure 19. Power consumption in STANDBY
mode (5 V range)
30
IStandby (uA)
55
Temp (°C)
Figure 18. Power consumption in STANDBY
mode (3.3 V range)
38/84
45
105
-40
25
Temp (°C)
105
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Electrical parameters
Typical power consumption
The following measurement conditions apply to Table 15, Table 16 and Table 17.
In RUN mode:
●
Program is executed from Flash (except if especially mentioned). The program consists
of an infinite loop. When fHCLK > 32 MHz, burst mode is activated.
●
A standard 4 MHz crystal source is used.
●
In all cases the PLL is used to multiply the frequency.
●
All measurements are done in the single supply scheme with internal regulators used
(see Figure 12)
In WFI Mode:
●
In WFI Mode the measurement conditions are similar to RUN mode (OSC4M and PLL
enabled). In addition, the Flash can be disabled depending on burst mode activation:
–
For AHB frequencies greater than 32 MHz, burst mode is activated and the Flash
is kept enabled by setting the WFI_FLASH_EN bit (this bit cannot be reset when
burst mode is activated).
–
For AHB frequencies less than or equal to 32 MHz, burst mode is deactivated,
WFI_FLASH_EN is reset and the LP_PARAM14 bit is set (Flash is disabled in WFI
mode).
In SLOW mode:
●
The same program as in RUN mode is executed from Flash. The CPU is clocked by the
FREEOSC, OSC4M, LPOSC or OSC32K. Only EXTIT peripheral is enabled in the
MRCC_PCLKEN register.
In SLOW-WFI mode:
●
In SLOW-WFI, the measurement conditions are similar to SLOW mode (CPU clocked
by a low frequency clock). In addition, the LP_PARAM14 bit is set (FLASH is OFF). The
WFI routine itself is executed from SRAM (it is not allowed to execute a WFI from the
internal FLASH)
In STOP mode:
●
Several measurements are given: in the single supply scheme with internal regulators
used (see Figure 12): and in the dual supply scheme (see Figure 13).
In STANDBY mode:
●
●
Three measurements are given:
–
The RTC is disabled, only the consumption of the LPVREG and RSM remain
(almost no leakage currents)
–
The RTC is running, clocked by a standard 32.768 kHz crystal.
–
The RTC is running, clocked by the internal Low Power RC oscillator (LPOSC)
STANDBY mode is only supported in the single supply scheme (see Figure 12)
39/84
Electrical parameters
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Subject to general operating conditions for VDD_IO, and TA
Table 15.
Symbol
Single supply typical power consumption in Run, WFI, Slow and Slow-WFI modes
Para meter
Conditions
Clocked by OSC4M with PLL multiplication, all peripherals
enabled in the MRCC_PLCKEN register:
fHCLK=60 MHz, fPCLK=30 MHz
fHCLK=56 MHz, fPCLK=28 MHz
fHCLK=48 MHz, fPCLK=24 MHz
fHCLK=32 MHz, fPCLK=32 MHz
fHCLK=16 MHz, fPCLK=16 MHz
Supply current in fHCLK=8 MHz, fPCLK=8 MHz
RUN mode(4)
Clocked by OSC4M with PLL multiplication, only EXTIT
IDD (3)
3.3V
5V
typ(1) typ(2)
80
75
65
59
34
20
82
77
67
61
37
22
65
60
54
42
22
16
67
62
55
44
24
18
62
59
53
22
13
10
63
60
54
23
15
11
Clocked by FREEOSC: fHCLK=fPCLK=~5 MHz,
Supply current in Clocked by OSC4M: fHCLK=fPCLK=4 MHz
Clocked by LPOSC: fHCLK=fPCLK=~300 kHz
SLOW mode(4)
Clocked by OSC32K: fHCLK=fPCLK=32.768 kHz
9
8
3.65
3.5
10
9
3.9
4.2
mA
Clocked by FREEOSC: fHCLK=fPCLK=~5 MHz
Supply current in
Clocked by OSC4M: fHCLK=fPCLK=4 MHz
SLOW-WFI
Clocked by LPOSC: fHCLK=fPCLK=~300 kHz
(4)(7)
mode
Clocked by OSC32K: fHCLK=fPCLK=32.768 kHz
3.5
3.1
1.15
0.98
4.0
3.75
1.65
1.5
mA
peripheral enabled in the MRCC_PLCKEN register:
fHCLK=60 MHz, fPCLK=30 MHz
fHCLK=56 MHz, fPCLK=28 MHz
fHCLK=48 MHz, fPCLK=24 MHz
fHCLK=32 MHz, fPCLK=32 MHz
fHCLK=16 MHz, fPCLK=16 MHz
fHCLK=8 MHz, fPCLK=8 MHz
Clocked by OSC4M with PLL multiplication, only EXTIT
peripheral enabled in the MRCC_PLCKEN register:
fHCLK=60 MHz, fPCLK=30 MHz(5)
Supply current in fHCLK=56 MHz, fPCLK=28 MHz(5)
fHCLK=48 MHz, fPCLK=24 MHz(5)
WFI mode(4)
fHCLK=32 MHz, fPCLK=32 MHz(6)
fHCLK=16 MHz, fPCLK= 16 MHz (6)
fHCLK= 8 MHz, fPCLK= 8 MHz(6)
1. Typical data based on TA=25° C and VDD_IO=3.3V.
2. Typical data based on TA=25° C and VDD_IO=5.0V.
3. The conditions for these consumption measurements are described at the beginning of Section 5.3.4 on page 36.
4. Single supply scheme see Figure 14.
5. Parameter setting BURST=1, WFI_FLASHEN=1
6. Parameter setting BURST=0, WFI_FLASHEN=0
7. Parameter setting WFI_FLASHEN=0, OSC4MOFF=1
40/84
Unit
mA
mA
mA
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Table 16.
Electrical parameters
Dual supply supply typical power consumption in Run, WFI, Slow and
Slow-WFI modes
To calculate the power consumption in Dual supply mode, refer to the values given in Table 15. and
consider that this consumption is split as follows:
IDD(single supply)~IDD(dual supply)= IDD_V18 + IDD(VDD_IO)
For 3.3V range: IDD(VDD_IO) ~ 1 to 2 mA
For 5V range: IDD(VDD_IO) ~ 2 to 3 mA
Therefore most of the consumption is sunk on the V18 power supply
This formula does not apply in STOP and STANDBY modes, refer to Table 17.
Subject to general operating conditions for VDD_IO, and TA
Table 17.
Symbol
Typical power consumption in STOP and STANDBY modes
3.3V
Typ(1)
5V
Typ(2)
LP_PARAM bits: ALL OFF(5)
12
15
LP_PARAM bits : MVREG ON, OSC4M OFF, FLASH
OFF(6)
130
135
LP_PARAM bits: MVREG ON, OSC4M ON , FLASH
OFF(6)
1950
1930
630
635
2435
2425
Parameter
Supply current
in STOP
mode(4)
Conditions
LP_PARAM bits: MVREG ON, OSC4M OFF, FLASH ON (6)
LP_PARAM bits: MVREG ON, OSC4M ON, FLASH ON
IDD(3)
Supply current
in STOP
mode(7)
Supply current
in STANDBY
mode(4)
(6)
LPPARAM bits: ALL OFF, with V18=1.8 V
IDD_V18
IDD_V33
5
<1
5
<1
LP_PARAM bits: OSC4M ON, FLASH OFF
IDD_V18
IDD_V33
410
1475
410
1435
LP_PARAM bits: OSC4M OFF, FLASH ON
IDD_V18
IDD_V33
550
<1
550
1
LP_PARAM bits: OSC4M ON, FLASH ON
IDD_V18
IDD_V33
910
1475
910
1445
RTC OFF
11
14
RTC ON clocked by OSC32K
14
18
Unit
µA
µA
µA
1. Typical data are based on TA=25°C, VDD_IO=3.3 V and V18=1.8 V unless otherwise indicated in the table.
2. Typical data are based on TA=25°C, VDD_IO=5.0 V and V18=1.8 V unless otherwise indicated in the table.
3. The conditions for these consumption measurements are described at the beginning of Section 5.3.4 on page 36.
4. Single supply scheme see Figure 12.
5. In this mode, the whole digital circuitry is powered internally by the LPVREG at approximately 1.4 V, which significantly
reduces the leakage currents.
6. In this mode, the whole digital circuitry is powered internally by the MVREG at 1.8 V.
7. Dual supply scheme see Figure 13.
41/84
Electrical parameters
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Supply and clock manager power consumption
Table 18.
Supply and clock manager power consumption
Conditions(1)
3.3V
Typ
5V
Typ
External components specified in:
4/8 MHz crystal / ceramic resonator
oscillator (XT1/XT2) on page 46
1815
1795
FLASH static current consumption in
STOP or WFI mode (LP_PARAM bit
FLASH ON)
515
515
Main Voltage Regulator static current
IDD(MVREG) consumption in STOP mode
(LP_PARAM bit: MVREG ON)
130
135
STOP mode includes leakage
where V18 is internally set to 1.4 V
12
15
STANDBY mode where
V18BKP and V18 are internally set to
1.4 V and 0 V respectively
11
14
Symbol
Parameter
Supply current of resonator oscillator
IDD(OSC4M) in STOP or WFI mode (LP_PARAM
bit: OSC4M ON)
IDD(FLASH)
Low Power Voltage Regulator + RSM
IDD(LPVREG)
current static current consumption
1. Measurements performed in 3.3V single supply mode see Figure 12
42/84
Unit
µA
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Electrical parameters
On-Chip peripheral power consumption
Conditions:
–
VDD_IO=VDDA_ADC=VDDA_PLL=3.3 V or 5 V ±10% unless otherwise specified.
–
TA= 25° C
–
Clocked by OSC4M with PLL multiplication, fCK_SYS=64 MHz, fHCLK=32 MHz,
fPCLK=32 MHz
.
Table 19.
On-Chip peripherals
Symbol
IDD(TIM)
Parameter
TIM Timer supply current (1)
PWM Timer supply
current(2)
IDD(SSP)
SSP supply current
(3)
IDD(UART)
UART supply current (4)
IDD(PWM)
Typ
(3.3V and 5.0V)
Unit
0.7
1
1.3
1.6
IDD(I2C)
I2C supply current
(5)
0.3
IDD(ADC)
ADC supply current when converting (6)
1.2
mA
(7)
IDD(USB)
USB supply current
Note: VDD_IO must be 3.3 V ±10%
0.90
IDD(CAN)
CAN supply current (8)
2.8
1. Data based on a differential IDD measurement between reset configuration and timer counter running at 32
MHz. No IC/OC programmed (no I/O pads toggling)
2. Data based on a differential IDD measurement between reset configuration and PWM running at 32 MHz.
This measurement does not include PWM pads toggling consumption.
3. Data based on a differential IDD measurement between reset configuration and permanent SPI master
communication at maximum speed 16 MHz. The data sent is 55h. This measurement does not include the
pad toggling consumption.
4. Data based on a differential IDD measurement between reset configuration and a permanent UART data
transmit sequence at 1Mbauds. This measurement does not include the pad toggling consumption.
5. Data based on a differential IDD measurement between reset configuration (I2C disabled) and a permanent
I2C master communication at 100kHz (data sent equal to 55h). This measurement includes the pad
toggling consumption but not the external 10kOhm external pull-up on clock and data lines.
6. Data based on a differential IDD measurement between reset configuration and continuous A/D
conversions at 8 MHz in scan mode on 16 inputs configured as AIN.
7. Data based on a differential IDD measurement between reset configuration and a running generic HID
application.
8. Data based on a differential IDD measurement between reset configuration (CAN disabled) and a
permanent CAN data transmit sequence in loopback mode at 1MHz. This measurement does not include
the pad toggling consumption.
43/84
Electrical parameters
5.3.5
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Clock and timing characteristics
XT1 external clock source
Subject to general operating conditions for VDD_IO, and TA.
Table 20.
Symbol
fXT1
XT1 external clock source
Parameter
Conditions(1) (2)
Min
External clock source
frequency
VXT1H
XT1 input pin high level
voltage
VXT1L
XT1 input pin low level
voltage
tw(XT1H)
tw(XT1L)
XT1 high or low time (3)
Typ
Max
Unit
4
60
MHz
VDD_IO
0.7xVDD_IO
V
tr(XT1)
tf(XT1)
see Figure 20
VSS
0.3xVDD_IO
6
ns
XT1 rise or fall
time (3)
IL
XTx Input leakage current
CIN(XT1)
XT1 input capacitance(3)
DuCy(XT1) Duty cycle
20
VSS ≤ VIN ≤
VDD_IO
±1
5
45
pF
55
1. Data based on typical application software.
2. Time measured between interrupt event and interrupt vector fetch. ∆tc(INST) is the number of tCPU cycles
needed to finish the current instruction execution.
3. Data based on design simulation and/or technology characteristics, not tested in production.
44/84
µA
%
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Electrical parameters
XRTC1 external clock source
Subject to general operating conditions for VDD_IO, and TA.
Table 21.
XRTC1 external clock source
Symbol
Conditions(1)
Parameter
fXRTC1
External clock source
frequency
VXRTC1H
XRTC1 input pin high
level voltage
VXRTC1L
XRTC1 input pin low
level voltage
Min
Typ
Max
Unit
32.768
500
kHz
VDD_IO
0.7xVDD_IO
V
see Figure 20
tw(XRTC1H) XRTC1 high or low
tw(XRTC1L) time(2)
tr(XRTC1)
tf(XRTC1)
IL
CIN(RTC1)
XRTC1 rise or fall
VSS
0.3xVDD_IO
900
ns
time(2)
XRTCx Input leakage
current
50
VSS≤VIN≤VDD_I
±1
O
XRTC1 input
capacitance(2)
5
DuCy(RTC1) Duty cycle
30
µA
pF
70
%
1. Data based on typical application software.
2. Data based on design simulation and/or technology characteristics, not tested in production.
Figure 20. Typical application with an external clock source
90%
VXT1H
10%
VXT1L
tr(XT1)
TXT1
tf(XT1)
tw(XT1H)
tw(XT1L)
XT2
EXTERNAL
CLOCK SOURCE
fOSC4M
hi-Z
XT1
IL
STR750
45/84
Electrical parameters
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
4/8 MHz crystal / ceramic resonator oscillator (XT1/XT2)
The STR750 system clock or the input of the PLL can be supplied by a OSC4M which is a 4
MHz clock generated from a 4 MHz or 8 MHz crystal or ceramic resonator. If using an 8 MHz
oscillator, software set the XTDIV bit to enable a divider by 2 and generate a 4 MHz OSC4M
clock. All the information given in this paragraph are based on product characterisation with
specified typical external components. In the application, the resonator and the load
capacitors have to be placed as close as possible to the oscillator pins in order to minimize
output distortion and start-up stabilization time. Refer to the crystal/ceramic resonator
manufacturer for more details (frequency, package, accuracy...).
Table 22.
Symbol
4/8 MHz crystal / ceramic resonator oscillator (XT1/XT2)(1)
Parameter
Conditions
Min
4 MHz Crystal/Resonator Oscillator
connected on XT1/XT2 XTDIV=0
or
8 MHz Crystal/Resonator Oscillator
connected on XT1/XT2 XTDIV=1
fOSC4M
Oscillator frequency
RF
Feedback resistor
CL1(2)
CL2
Recommended load
capacitance versus equivalent
RS=200Ω
serial resistance of the crystal or
(3)
ceramic resonator (RS)
i2
XT2 driving current
Typ
Max
4
200
VDD_IO=3.3 V or 5.0 V
tSU(OSC4M)(4) Startup time at VDD_IO power-up
Unit
MHz
240
270
kΩ
60
pF
425
µA
1
ms
1. Resonator characteristics given by the crystal/ceramic resonator manufacturer.
2. For CL1 and CL2 it is recommended to use high-quality ceramic capacitors in the 5-pF to 25-pF range (typ.) designed for
high-frequency applications and selected to match the requirements of the crystal or resonator. CL1 and CL2, are usually the
same size. The crystal manufacturer typically specifies a load capacitance which is the series combination of CL1 and CL2.
PCB and MCU pin capacitance must be included when sizing CL1 and CL2 (10 pF can be used as a rough estimate of the
combined pin and board capacitance).
3. The relatively low value of the RF resistor offers a good protection against issues resulting from use in a humid
environment, due to the induced leakage and the bias condition change. However, it is recommended to take this point into
account if the MCU is used in tough humidity conditions.
4. tSU(OSC4M) is the typical start-up time measured from the moment VDD_IO is powered (with a quick VDD_IO ramp-up from 0
to 3.3V (<50µs) to a stabilized 4MHz oscillation is reached. This value is measured for a standard crystal resonator and it
can vary significantly with the crystal/ceramic resonator manufacturer.
Figure 21. Typical application with a 4 or 8 MHz crystal or ceramic resonator
XTDIV
WHEN RESONATOR WITH
INTEGRATED CAPACITORS
CL1
XT1
LINEAR
AMPLIFIER
RESONATOR
RF
CL2
fOSC4M
/2
VDD/2
Ref
FEEDBACK
LOOP
i2
XT2
STR75X
46/84
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Electrical parameters
OSC32K crystal / ceramic resonator oscillator
The STR7 RTC clock can be supplied with a 32.768 kHz Crystal/Ceramic resonator
oscillator. All the information given in this paragraph are based on product characterisation
with specified typical external components. In the application, the resonator and the load
capacitors have to be placed as close as possible to the oscillator pins in order to minimize
output distortion and start-up stabilization time. Refer to the crystal/ceramic resonator
manufacturer for more details (frequency, package, accuracy...).
Table 23.
OSC32K crystal / ceramic resonator oscillator
Symbol
Parameter
Conditions
fOSC32K
Oscillator Frequency
RF
Feedback resistor
CL1
CL2
Recommended load capacitance
RS=40KΩ
versus equivalent serial resistance of
the crystal or ceramic resonator (RS)(1)
i2
XT2 driving current
Min
Typ
Max
Unit
32.768
VDD_IO=3.3 V or 5.0 V
VDD_IO=3.3 V or 5.0 V
VIN=VSS
tSU(OSC32K)(2) Startup time
270
kHz
310
370
kΩ
12.5
15
pF
5
µA
1
VDD_IO is stabilized
2.5
s
1. The oscillator selection can be optimized in terms of supply current using an high quality resonator with small RS value.
Refer to crystal/ceramic resonator manufacturer for more details
2. tSU(OSC32K) is the start-up time measured from the moment it is enabled (by software) to a stabilized 32 kHz oscillation is
reached. This value is measured for a standard crystal resonator and it can vary significantly with the crystal/ceramic
resonator manufacturer
Figure 22. Typical application with a 32.768 kHz crystal or ceramic resonator
WHEN RESONATOR WITH
INTEGRATED CAPACITORS
i2
CL1
CL2
fOSC32K
XRTC1
32 kHz
RESONATOR
FEEDBACK
LOOP
RF
XRTC2
STR750
PLL characteristics
PLL Jitter Terminology
●
Self-referred single period jitter (period jitter)
Period Jitter is defined as the difference of the maximum period (Tmax) and minimum
period (Tmin) at the output of the PLL where Tmax is the maximum time difference
between 2 consecutive clock rising edges and Tmin is the minimum time difference
between 2 consecutive clock rising edges.
See Figure 23
●
Self-referred long term jitter (N period jitter)
Self-referred long term Jitter is defined as the difference of the maximum period (Tmax)
and minimum period (Tmin) at the output of the PLL where Tmax is the maximum time
47/84
Electrical parameters
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
difference between N+1 consecutive clock rising edges and Tmin is the minimum time
difference between N+1 consecutive clock rising edges.
N should be kept sufficiently large to have a long term jitter (ex: thousands).
For N=1, this becomes the single period jitter.
See Figure 23
●
Cycle-to-cycle jitter (N period jitter)
This corresponds to the time variation between adjacent cycles over a random sample
of adjacent clock cycles pairs. Jitter(cycle-to-cycle) = Max(Tcycle n- Tcycle n-1) for n=1
to N.
See Figure 24
Figure 23. Self-referred jitter (single and long term)
n
---
n+1
n+N
IDEAL
CK_PLL
T
ACTUAL
CK_PLL
single period
jitter
trigger point
long term
jitter
Figure 24. Cycle-to-cycle jitter
n
n+1
n+2
---
n+N
IDEAL
CK_PLL
T
ACTUAL
CK_PLL
Tcycle 1
48/84
Tcycle 2
Tcycle N-1
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Electrical parameters
PLL characteristics
Subject to general operating conditions for VDD_IO, and TA.
Table 24.
PLL characteristics
Value
Symbol
Parameter
Test Conditions
Min
PLL input clock
fPLL_IN
Max(1)
4.0
PLL input clock duty cycle
40
PLL multiplier output clock
fPLL_INx 24
fVCO
VCO frequency range
When PLL
operates (locked)
tLOCK
PLL lock time
fPLL_OUT
Typ
336
Unit
MHz
60
%
165
MHz
960
MHz
300
µs
∆tJITTER1(2)(3)
Single period jitter (+/-3Σ peak
to peak)
fPLL_IN = 4 MHz(4)
VDD_IO is stable
+/-250
ps
∆tJITTER2(2)(3)
Long term jitter (+/-3Σ peak to
peak)
fPLL_IN = 4 MHz(4)
VDD_IO is stable
+/-2.5
ns
∆tJITTER3(2)(3)
Cycle to cycle jitter (+/-3Σ peak fPLL_IN = 4 MHz(4)
VDD_IO is stable
to peak)
+/-500
ps
1. Data based on product characterisation, not tested in production.
2. Refer to jitter terminology in : PLL characteristics on page 47 for details on how jitter is specified.
3. The jitter specification holds true only up to 50mV (peak-to-peak) noise on VDDA_PLL and V18 supplies.
Jitter will increase if the noise is more than 50mV. In addition, it assumes that the input clock has no jitter.
4. The PLL parameters (MX1, MX0, PRESC1, PRESC2) must respect the constraints described in: PLL
characteristics on page 47.
Internal RC oscillators (FREEOSC & LPOSC)
Subject to general operating conditions for VDD_IO, and TA.
Table 25.
Internal RC oscillators (FREEOSC & LPOSC)
Symbol
Parameter
fCK_FREEOSC
FREEOSC Oscillator Frequency
fCK_LPOSC
LPOSC Oscillator Frequency
Conditions
Min
Typ
Max
Unit
3
5
8
MHz
150
300
500
kHz
49/84
Electrical parameters
5.3.6
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Memory characteristics
Flash memory
Subject to general operating conditions for VDD_IO and V18, TA = -40 to 105 °C unless
otherwise specified.
Table 26.
Flash memory characteristics
Value
Symbol
Parameter
Test Conditions
Typ
Max(1)
Unit
tPW
Word Program
35
µs
tPDW
Double Word Program
60
µs
tPB0
Bank 0 Program (256K)
Single Word programming of
a checker-board pattern
2
4.9(2)
s
tPB1
Bank 1 Program (16K)
Single Word programming of
a checker-board pattern
125
224(2)
ms
tES
Sector Erase (64K)
Not preprogrammed (all 1)
Preprogrammed (all 0)
1.54
1.176
2.94(2)
2.38(2)
s
tES
Sector Erase (8K)
Not preprogrammed (all 1)
Preprogrammed (all 0)
392
343
560(2)
532(2)
ms
tES
Bank 0 Erase (256K)
Not preprogrammed (all 1)
Preprogrammed (all 0)
8.0
6.6
13.7
11.2
s
tES
Bank 1 Erase (16K)
Not preprogrammed (all 1)
Preprogrammed (all 0)
0.9
0.8
1.5
1.3
s
tRPD
Recovery when disabled
20
µs
tPSL
Program Suspend Latency
10
µs
tESL
Erase Suspend Latency
300
µs
1. Data based on characterisation not tested in production
2. 10K program/erase cycles.
Table 27.
Flash memory endurance and data retention
Value
Symbol
Parameter
Conditions
Unit
Typ
Max
NEND_B0 Endurance (Bank 0 sectors)
10
kcycles
NEND_B1 Endurance (Bank 1 sectors)
100
kcycles
YRET
Data Retention
TA=85° C
20
Years
tESR
Erase Suspend Rate
Min time from Erase
Resume to next Erase
Suspend
20
ms
1. Data based on characterisation not tested in production.
50/84
Min(1)
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
5.3.7
Electrical parameters
EMC characteristics
Susceptibility tests are performed on a sample basis during product characterization.
Functional EMS (electro magnetic susceptibility)
Based on a simple running application on the product (toggling 2 LEDs through I/O ports),
the product is stressed by two electro magnetic events until a failure occurs (indicated by the
LEDs).
●
ESD: Electro-Static Discharge (positive and negative) is applied on all pins of the
device until a functional disturbance occurs. This test conforms with the IEC 1000-4-2
standard.
●
FTB: A Burst of Fast Transient voltage (positive and negative) is applied to VDD and
VSS through a 100pF capacitor, until a functional disturbance occurs. This test
conforms with the IEC 1000-4-4 standard.
A device reset allows normal operations to be resumed. The test results are given in the
table below based on the EMS levels and classes defined in application note AN1709.
Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical
application environment and simplified MCU software. It should be noted that good EMC
performance is highly dependent on the user application and the software in particular.
Therefore it is recommended that the user applies EMC software optimization and
prequalification tests in relation with the EMC level requested for his application.
Software recommendations:
The software flowchart must include the management of runaway conditions such as:
●
Corrupted program counter
●
Unexpected reset
●
Critical Data corruption (control registers...)
Prequalification trials:
Most of the common failures (unexpected reset and program counter corruption) can be
reproduced by manually forcing a low state on the RESET pin or the Oscillator pins for 1
second.
To complete these trials, ESD stress can be applied directly on the device, over the range of
specification values. When unexpected behaviour is detected, the software can be
hardened to prevent unrecoverable errors occurring (see application note AN1015).
Table 28.
Symbol
EMC characteristics
Parameter
Conditions
Level/
Class
VFESD
Voltage limits to be applied on any I/O pin to
induce a functional disturbance
VDD_IO=3.3 V or 5 V,
TA=+25° C, fCK_SYS=32 MHz
conforms to IEC 1000-4-2
Class A
VEFTB
Fast transient voltage burst limits to be applied VDD_IO=3.3 V or 5 V,
through 100pF on VDD and VSS pins to induce TA=+25° C, fCK_SYS=32 MHz
a functional disturbance
conforms to IEC 1000-4-4
Class A
51/84
Electrical parameters
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Electro magnetic interference (EMI)
Based on a simple application running on the product (toggling 2 LEDs through the I/O
ports), the product is monitored in terms of emission. This emission test is in line with the
norm SAE J 1752/3 which specifies the board and the loading of each pin.
Table 29.
EMI characteristics
Symbo
Parameter
l
SEMI
Peak level
Monitored
Frequency Band
Conditions
Flash devices:
VDD_IO=3.3 V or 5 V,
TA=+25° C,
LQFP64 package
conforming to SAE J
1752/3
Max vs. [fOSC4M/fHCLK]
Unit
4/32MHz
4/60MHz
0.1 MHz to 30 MHz
22
26
30 MHz to 130 MHz
31
26
130 MHz to 1 GHz
19
23
SAE EMI Level
>4
>4
dBµV
-
Absolute maximum ratings (electrical sensitivity)
Based on three different tests (ESD, LU and DLU) using specific measurement methods, the
product is stressed in order to determine its performance in terms of electrical sensitivity.
For more details, refer to the application note AN1181.
Electro-Static discharge (ESD)
Electro-Static Discharges (a positive then a negative pulse separated by 1 second) are
applied to the pins of each sample according to each pin combination. The sample size
depends on the number of supply pins in the device (3 parts*(n+1) supply pin). Two models
can be simulated: Human Body Model and Machine Model. This test conforms to the
JESD22-A114A/A115A standard.
Table 30.
Symbol
Absolute maximum ratings
Ratings
VESD(HBM)
Electro-static discharge voltage
(Human Body Model)
VESD(MM)
Electro-static discharge voltage
(Machine Model)
VESD(CDM)
Electro-static discharge voltage
(Charge Device Model)
Conditions
Unit
2000
TA=+25° C
1. Data based on product characterisation, not tested in production.
52/84
Maximum
value(1)
200
750
V
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Electrical parameters
Static and dynamic latch-up
●
LU: 3 complementary static tests are required on 10 parts to assess the latch-up
performance. A supply overvoltage (applied to each power supply pin) and a current
injection (applied to each input, output and configurable I/O pin) are performed on each
sample. This test conforms to the EIA/JESD 78 IC latch-up standard. For more details,
refer to the application note AN1181.
●
DLU: Electro-Static Discharges (one positive then one negative test) are applied to
each pin of 3 samples when the micro is running to assess the latch-up performance in
dynamic mode. Power supplies are set to the typical values, the oscillator is connected
as near as possible to the pins of the micro and the component is put in reset mode.
This test conforms to the IEC1000-4-2 and SAEJ1752/3 standards. For more details,
refer to the application note AN1181.
Table 31.
Symbol
LU
DLU
Electrical sensitivities
Parameter
Conditions
Class(1)
Static latch-up class
TA=+25° C
TA=+85° C
TA=+105° C
Class A
Dynamic latch-up class
VDD= 5.5 V, fOSC4M=4 MHz,
fCK_SYS=32 MHz, TA=+25° C
Class A
1. Class description: A Class is an STMicroelectronics internal specification. All its limits are higher than the
JEDEC specifications, that means when a device belongs to Class A it exceeds the JEDEC standard. B
Class strictly covers all the JEDEC criteria (international standard).
53/84
Electrical parameters
5.3.8
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
I/O port pin characteristics
General characteristics
Subject to general operating conditions for VDD_IO and TA unless otherwise specified.
Table 32.
General characteristics
I/O static characteristics
Symbol
Parameter
VIL
Input low level voltage
VIH
Input high level voltage
Vhys
Schmitt trigger voltage
hysteresis(1)
Conditions
Min
Typ
Max Unit
0.8
V
2
TTL ports
400
mV
IINJ(PIN)
Injected Current on any I/O pin
±4
ΣIINJ(PIN
Total injected current (sum of all
I/O and control pins)
± 25
(2)
mA
Input leakage current on robust
pins
See Section 5.3.12 on page 72
Input leakage current(3)
VSS≤VIN≤VDD_IO
Static current consumption(4)
Floating input mode
RPU
Weak pull-up equivalent
resistor(5)
VIN=VSS
RPD
Weak pull-down equivalent
resistor(5)
VIN=VDD_IO
CIO
I/O pin capacitance
Ilkg
IS
tw(IT)in
±1
µA
200
VDD_IO=3.3 V
50
95
200
kΩ
VDD_IO=5 V
20
58
150
kΩ
VDD_IO=3.3 V
25
80
180
kΩ
VDD_IO=5 V
20
50
120
kΩ
External interrupt/wake-up lines
pulse time(6)
5
2
pF
TAP
1. Hysteresis voltage between Schmitt trigger switching levels.
2. When the current limitation is not possible, the VIN absolute maximum rating must be respected, otherwise
refer to IINJ(PIN) specification. A positive injection is induced by VIN>VDD_IO while a negative injection is
induced by VIN<VSS. Refer to Section 5.2 on page 32 for more details.
3. Leakage could be higher than max. if negative current is injected on adjacent pins.
4. Configuration not recommended, all unused pins must be kept at a fixed voltage: using the output mode of
the I/O for example or an external pull-up or pull-down resistor (see Figure 25). Data based on design
simulation and/or technology characteristics, not tested in production.
5. The RPU pull-up and RPD pull-down equivalent resistor are based on a resistive transistor.
6. To generate an external interrupt, a minimum pulse width has to be applied on an I/O port pin configured
as an external interrupt source.
54/84
B
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Electrical parameters
Figure 25. Connecting unused I/O pins
VDD
STR7XXX
10kΩ
10kΩ
UNUSED I/O PORT
UNUSED I/O PORT
STR7XXX
Output driving current
The GP I/Os have different drive capabilities:
●
O2 outputs can sink or source up to +/-2 mA.
●
O4 outputs can sink or source up to +/-4 mA.
●
outputs can sink or source up to +/-8 mA or can sink +20 mA (with a relaxed VOL).
In the application, the user must limit the number of I/O pins which can drive current to
respect the absolute maximum rating specified in Section 5.2.2 :
●
The sum of the current sourced by all the I/Os on VDD_IO, plus the maximum RUN
consumption of the MCU sourced on VDD_IO, can not exceed the absolute maximum
rating IVDD_IO.
●
The sum of the current sunk by all the I/Os on VSS_IO plus the maximum RUN
consumption of the MCU sunk on VSS_IO can not exceed the absolute maximum rating
IVSS_IO.
Subject to general operating conditions for VDD_IO and TA unless otherwise specified.
55/84
Electrical parameters
Table 33.
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Output driving current
I/O Output drive characteristics for
VDD_IO = 3.0 to 3.6 V and EN33 bit =1
or VDD_IO = 4.5 to 5.5 V and EN33 bit =0
I/O
Symbol
Type
Parameter
Conditions
VOL(1)
Output low level voltage for a standard
I/O pin when 8 pins are sunk at same IIO=+2 mA
time
VOH(2)
Output high level voltage for an I/O pin
I =-2 mA
when 4 pins are sourced at same time IO
VOL(1)
Output low level voltage for a standard
I/O pin when 8 pins are sunk at same IIO=+4 mA
time
VOH(2)
Output high level voltage for an I/O pin
I =-4 mA
when 4 pins are sourced at same time IO
O2
O4
Min
O8
VOH(2)
VDD_IO-0.8
0.4
VDD_IO-0.8
V
0.4
IIO=+20 mA,
Output low level voltage for a high sink T ≤85°C
A
I/O pin when 4 pins are sunk at same T ≥85°C
A
time
IIO=+8 mA
Output high level voltage for an I/O pin
I =-8 mA
when 4 pins are sourced at same time IO
Unit
0.4
Output low level voltage for a standard
I/O pin when 8 pins are sunk at same IIO=+8 mA
time
VOL(1)
Max
1.3
1.5
0.4
VDD_IO-0.8
1. The IIO current sunk must always respect the absolute maximum rating specified in Section 5.2.2 and the
sum of IIO (I/O ports and control pins) must not exceed IVSS_IO.
2. The IIO current sourced must always respect the absolute maximum rating specified in Section 5.2.2 and
the sum of IIO (I/O ports and control pins) must not exceed IVDD_IO.
56/84
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Electrical parameters
Output speed
Subject to general operating conditions for VDD_IO and TA unless otherwise specified.
Table 34.
Output speed
I/O dynamic characteristics for
VDD_IO = 3.0 to 3.6V and EN33 bit =1
or VDD_IO = 4.5 to 5.5V and EN33 bit =0
I/O
Type
Symbol
Parameter
Conditions
fmax(IO)out Maximum Frequency(1)
O2
CL=50 pF
tf(IO)out
Output high to low level fall
time(2)
tr(IO)out
Output low to high level rise
time(2)
fmax(IO)out Maximum Frequency(1)
O4
tf(IO)out
Output high to low level fall
time(2)
tr(IO)out
Output low to high level rise
time(2)
Output high to low level fall
time(2)
tr(IO)out
Output low to high level rise
time(2)
MHz
30
ns
33
25
MHz
12
CL=50 pF
Between 10% and 90%
ns
14
CL=50pF
tf(IO)out
10
CL=50 pF
Between 10% and 90%
CL=50 pF
fmax(IO)out Maximum Frequency(1)
O8
Min Typ Max Unit
40
MHz
6
CL=50 pF
Between 10% and 90%
ns
6
1. The maximum frequency is defined as described in Figure 26.
2. Data based on product characterisation, not tested in production.
Figure 26. I/O output speed definition
10%
90%
50%
50%
90%
10%
EXTERNAL
OUTPUT
ON 50pF
tr(IO)out
tr(IO)out
T
Maximum frequency is achieved if (tr + tf) ≤ (2/3)T and if the duty cycle is (45-55%)
when loaded by 50pF
57/84
Electrical parameters
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
NRSTIN and NRSTOUT pins
NRSTIN Pin Input Driver is TTL/LVTTL as for all GP I/Os. A permanent pull-up is present
which is the same as RPU (see : General characteristics on page 54)
NRSTOUT Pin Output Driver is equivalent to the O2 type driver except that it works only as
an open-drain (the P-MOS is de-activated). A permanent pull-up is present which is the
same as RPU (see : General characteristics on page 54)
Subject to general operating conditions for VDD_IO and TA unless otherwise specified.
Table 35. NRSTIN and NRSTOUT pins
Symbol
Parameter
Conditions
VIL(NRSTIN)
NRSTIN Input low level
voltage(1)
VIH(NRSTIN)
NRSTIN Input high level
voltage(1)
Vhys(NRSTIN)
NRSTIN Schmitt trigger
voltage hysteresis(2)
VOL(NRSTIN)
NRSTOUT Output low level
voltage(3)
IIO=+2 mA
RPU(NRSTIN)
NRSTIN Weak pull-up
equivalent resistor(4)
VIN=VSS
tw(RSTL)out
Generated reset pulse
duration (visible at NRSTOUT
pin)(5)
th(RSTL)in
External reset pulse hold time
at NRSTIN pin(6)
tg(RSTL)in
maximum negative spike
duration filtered at NRSTIN
pin(7)
Min Typ 1) Max Unit
0.8
V
2
400
mV
0.4
V
VDD_IO=3.3 V
25
50
100
kΩ
VDD_IO=5 V
20
31
100
kΩ
Internal reset source
15
20
At VDD_IO power-up(5)
20
µs
When VDD_IO is
established(5)
1
µs
The time between two
spikes must be higher
than 1/2 of the spike
duration.
µs
150
ns
1. Data based on product characterisation, not tested in production.
2. Hysteresis voltage between Schmitt trigger switching levels.
3. The IIO current sunk must always respect the absolute maximum rating specified in Section 5.2.2 and the
sum of IIO (I/O ports and control pins) must not exceed IVSS.
4. The RPU pull-up equivalent resistor are based on a resistive transistor
5. To guarantee the reset of the device, a minimum pulse of 15 µs has to be applied to the internal reset. At
VDD_IO power-up, the built-in reset stretcher may not generate the 15 µs pulse duration while once VDD_IO
is established, an external reset pulse will be internally stretched up to 15 µs thanks to the reset pulse
stretcher.
6. The reset network (the resistor and two capacitors) protects the device against parasitic resets, especially
in noisy environments.
7. In fact the filter is made to ignore all incoming pulses with short duration:
- all negative spikes with a duration less than 150 ns are filtered
- all trains of negative spikes with a ratio of 1/2 are filtered. This means that all spikes with a maximum
duration of 150 ns with minimum interval between spikes of 75 ns are filtered.
Data guaranteed by design, not tested in production.
58/84
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Electrical parameters
Figure 27. Recommended NRSTIN pin protection
VDD_IO
RPU
Filter
NRSTOUT
TO RESET
OTHER CHIPS
PULSE
GENERATOR
INTERNAL RESET
WATCHDOG RESET
SOFTWARE RESET
RSM RESET
VDD_IO
STR7X
RPU
NRSTIN
EXTERNAL
RESET
CIRCUIT
Filter
0.01µF
1. The user must ensure that the level on the NRSTIN pin can go below the VIL(NRSTIN) max. level specified in
NRSTIN and NRSTOUT pins on page 58. Otherwise the reset will not be taken into account internally.
59/84
Electrical parameters
5.3.9
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
TB and TIM timer characteristics
Subject to general operating conditions for VDD_IO, fCK_SYS, and TA unless otherwise
specified.
Refer to Section 5.3.8: I/O port pin characteristics on page 54 for more details on the
input/output alternate function characteristics (output compare, input capture, external clock,
PWM output...).
Table 36. TB and TIM timers
Symbol
tw(ICAP)in
Parameter
Conditions
Input capture
TIM0,1,2
pulse time
fCK_TIM(MAX) = fCK_SYS
TB
tres(TIM)
Timer
resolution
time(1)
fCK_TIM = fCK_SYS =
60 MHz
fCK_TIM(MAX) = fCK_SYS
TIM0,1,2 f
CK_TIM = fCK_SYS =
60MHz
fEXT
ResTIM
Timer
fCK_TIM(MAX) = fCK_SYS
external clock
TIM0,1,2 f
CK_TIM = fCK_SYS =
frequency on
60 MHz
TI1 or TI2
Min
fCK_TIM = fCK_SYS =
60 MHz
fCK_TIM = fCK_SYS =
60 MHz
Max
Unit
2
tCK_TIM
1
tCK_TIM
16.6(1)
ns
1
tCK_TIM
16.6(1)
ns
0
fCK_TIM/4
MHz
0
15
MHz
16
bit
1
65536
tCK_TIM
0.0166
1092
µs
1
65536
tCK_TIM
0.0166
1092
µs
Timer
resolution
16-bit
Counter clock TB
period when
tCOUNTER internal clock
is selected
(16-bit
TIM0,1,2
Prescaler)
Typ
65536x65536 tCK_TIM
TB
Maximum
tMAX_COUNT Possible
Count
fCK_TIM = fCK_SYS =
60 MHz
71.58
s
65536x65536 tCK_TIM
TIM0,1,2 f
CK_TIM = fCK_SYS =
60 MHz
71.58
s
1. Take into account the frequency limitation due to the I/O speed capability when outputting the PWM to I/O
pin, described in : Output speed on page 57.
60/84
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Electrical parameters
Table 37. PWM Timer (PWM)
Symbol
Parameter
Conditions
fCK_TIM(MAX) = fCK_SYS
tres(PWM)
PWM resolution time
ResPWM
PWM resolution
VOS(1)
PWM/DAC output step
voltage
tCOUNTER
Timer clock period
when internal clock is
selected
Maximum Possible
tMAX_COUNT
Count
fCK_TIM = fCK_SYS =
60 MHz
Min
Typ
Max
Unit
1
tCK_TIM
16.6(1)
ns
16
bit
VDD_IO=3.3 V, Res=16-bits
50(1)
µV
VDD_IO=5.0 V, Res=16-bits
(1)
µV
fCK_TIM=60 MHz
76
1
65536
tCK_TIM
0.0166
1087
µs
65536x
t
65536 CK_TIM
fCK_TIM = fCK_SYS =
60 MHz
71.58
s
1. Take into account the frequency limitation due to the I/O speed capability when outputting the PWM to an
I/O pin, as described in : Output speed on page 57.
61/84
Electrical parameters
5.3.10
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Communication interface characteristics
SSP synchronous serial peripheral in master mode (SPI or TI mode)
General operating conditions: V33, 3.0V to 3.3V, V18 =1.8V, CL ≈ 45 pF.
Table 38.
Symbol
fSCK
SSP master mode characteristics(1)
Parameter
Conditions
SPI clock frequency(2)
tr(SCK)
SPI clock rise time
tf(SCK)
SPI clock fall time
tw(SCKH)
tw(SCKL)
SCK high and low time
tNSSLQV
NSS low to Data Output
MOSI valid time
Min
SSP0
16
SSP1
8
SSP0
14
SSP1
33
SSP0
11
SSP1
30
SSP0
19
SSP1
30
SSP0
0.5tSCK+15ns
SSP1
0.5tSCK+30ns
SSP0
0.5tSCK+15ns
SSP1
0.5tSCK+30ns
SSP0
tSCK+15ns
SSP1
tSCK+30ns
SCK last edge to NSS high
CPHA = 1
SCK trigger edge to data
output MOSI valid time
SSP0
15
tSCKQV
SSP1
30
SCK trigger edge to data
output MOSI invalid time
SSP0
0
tSCKQX
SSP1
0
Data input (MISO) setup
time w.r.t SCK sampling
edge
SSP0
25
tsu
SSP1
25
Data input (MISO) hold time
w.r.t SCK sampling edge
SSP0
0
th
SSP1
0
1. Data based on characterisation results, not tested in production.
2. Max frequency for the 2 SSPs is fPCLK/2; fPCLK max = 32 MHz. This takes into account the frequency
limitation due to I/O speed capability. SSP0 uses IO4 type while SSP1 uses IO2 type I/Os.
62/84
Unit
MHz
CPHA = 0
tSCKNSSH
Max
ns
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Electrical parameters
Figure 28. SPI configuration - master mode, single transfer
NSS OUTPUT
tc(SCK)
tSCKNSSH (CPHA=0)
sample
edge
SCK OUTPUT
CPHA=0
CPOL=0
sample
edge
trigger
edge
trigger
edge
CPHA=0
CPOL=1
CPHA=1
CPOL=0
trigger
edge
tSCKNSSH (CPHA=1)
trigger
edge
sample
edge
sample
edge
CPHA=1
CPOL=1
tw(SCKH)
tw(SCKL)
tsu(MISO)
MISO INPUT
DONT CARE
tr(SCK)
tf(SCK)
th(MISO)
MSB IN
BIT IN
DONT
CARE
LSB IN
tNSSLQV
tSCKQX
tSCKQV
MOSI OUTPUT
tSCKQX
MSB OUT
1 OR 0
LSB OUT
BIT OUT
1 OR 0
Figure 29. SPI configuration - master mode, continuous transfer, CPHA=0
tc(SCK)
1.5*tc(SCK)
NSS OUTPUT
SCK OUTPUT
sample
trigger sample
trigger sample
trigger
sample
trigger sample
trigger
sample
trigger sample
CPOL=0
CPOL=1
MOSI OUTPUT
MISO INPUT
tNSSLQV
1 OR 0
DONT CARE
tNSSLQV
MSB OUT
LSB OUT
MSB IN
LSB IN
MSB OUT
DONT CARE
FRAME 1
MSB IN
FRAME 2
Figure 30. SPI configuration - master mode, continuous transfer, CPHA=1
tc(SCK)
NSS OUTPUT
SCK OUTPUT
trigger
sample trigger
sample trigger
sample trigger
samlpe trigger
sample trigger
sample trigger
sample trigger
sample trigger
CPOL=0
CPOL=1
MOSI OUTPUT
1 OR 0
MISO INPUT DONT CARE
MSB OUT
LSB OUT MSB OUT
MSB IN
LSB IN
FRAME 1
MSB IN
FRAME 2
63/84
Electrical parameters
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Figure 31. TI configuration - master mode, single transfer
NSS
OUTPUT
tc(SCK)
trigger
edge
SCK
OUTPUT
sample
edge
tw(SCKH)
trigger
edge
sample
edge
trigger
edge
sample
edge
tw(SCKL)
tf(SCK)
tsu(MISO)
tr(SCK)
th(MISO)
MISO
INPUT
MSB IN
DONT CARE
tSCKQV
MOSI
OUTPUT
1 OR 0
DONT CARE
LSB IN
tSCKQX
MSB OUT
LSB OUT
Figure 32. TI configuration - master mode, continuous transfer
tc(SCK)
tc(SCK)
NSS OUTPUT
trigger sample
trigger sample
trigger sample
trigger sample
trigger sample
trigger sample
trigger sample
trigger sample
SCK OUTPUT
MOSI OUTPUT
1 OR 0
MISO INPUT DONT CARE
MSB OUT
LSB OUT
MSB OUT
LSB OUT
MSB IN
LSB IN
MSB IN
LSB IN
FRAME 1
64/84
FRAME 2
DONT CARE
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Electrical parameters
SSP synchronous serial peripheral in slave mode (SPI or TI mode)
Subject to general operating conditions with CL ≈ 45 pF
Table 39.
SSP slave mode characteristics(1)
Symbol
Parameter
Conditions
Min
SSP0
fSCK
SPI clock frequency
SSP1
Max
Unit
2.66 MHz
(fPLCK/12)
MHz
NSS input setup time w.r.t
SCK first edge
SSP0
0
tsu(NSS)
SSP1
0
NSS input hold time w.r.t
SCK last edge
SSP0
th(NSS)
tPCLK+15ns
SSP1
tPCLK+15ns
NSS low to Data Output
MISO valid time
SSP0
tNSSLQV
2tPCLK
3tPCLK+30 ns
SSP1
2tPCLK
3tPCLK+30 ns
NSS low to Data Output
MISO invalid time
SSP0
tNSSLQZ
2tPCLK
3tPCLK+15 ns
SSP1
2tPCLK
3tPCLK+15 ns
SSP0
15
tSCKQV
SCK trigger edge to data
output MISO valid time
SSP1
30
SCK trigger edge to data
output MISO invalid time
SSP0
tSCKQX
2tPCLK
SSP1
2tPCLK
MOSI setup time w.r.t SCK
sampling edge
SSP0
0
tsu(MOSI)
SSP1
0
MOSI hold time w.r.t SCK
sampling edge
SSP0
th(MOSI)
3tPCLK+15 ns
SSP1
3tPCLK+15 ns
ns
1. Data based on characterisation results, not tested in production.
Figure 33. SPI configuration, slave mode with CPHA=0, single transfer
NSS INPUT
SCK INPUT
tsu(NSS)
th(NSS)
sample
edge
CPHA=0
CPOL=0
CPHA=0
CPOL=1
MSB OUT
tNSSHQZ
tSCKQX(MISO)
tSCKQV(MISO)
z
DONT CARE
tr(SCK)
tf(SCK)
tw(SCKH)
tw(SCKL)
tsu(SI)
MOSI INPUT
trigger
edge
tc(SCK)
tNSSLQV
MISO OUTPUT
sample
edge
trigger
edge
BIT OUT
LSB OUT
z
th(SI)
MSB IN
BIT1 IN
LSB IN
DONT CARE
65/84
Electrical parameters
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Figure 34. SPI configuration - slave mode with CPHA=0, continuous transfer
1.5*tc(SCK)
tc(SCK)
1.5*tc(SCK)
NSS INPUT
SCK INPUT
sample
trigger sample
trigger sample
trigger
sample
trigger sample
trigger
sample
trigger sample
CPOL=0
CPOL=1
tNSHQZ
tNSSLQV
tNSSLQV
z
MISO OUTPUT
MOSI INPUT
DONT CARE
MSB OUT
LSB OUT
MSB IN
LSB IN
z
DONT CARE
MSB OUT
MSB IN
FRAME 1
FRAME 2
Figure 35. SPI configuration, slave mode with CPHA=1, single transfer
NSS INPUT
tsu(NSS)
CPHA=1
CPOL=0
SCK INPUT
th(NSS)
trigger
edge
trigger
edge
sample
edge
CPHA=1
CPOL=1
tc(SCK)
tr(SCK)
tf(SCK)
tw(SCKH)
tw(SCKL)
tSCKQV(MISO)
tNSSLQV
MISO OUTPUT
tNSSHQX
tNSSHQZ
tSCKQX(MISO)
z
MSB OUT
tsu(SI)
MOSI INPUT
sample
edge
DONT CARE
BIT OUT
z
LSB OUT
th(SI)
MSB IN
DONT
CARE
LSB IN
BIT1 IN
Figure 36. SPI configuration - slave mode with CPHA=1, continuous transfer
tc(SCK)
NSS OUTPUT
SCK OUTPUT
trigger
sample trigger
sample trigger
sample trigger
sample trigger
sample trigger
CPOL=1
MOSI OUTPUT
1 OR 0
MISO INPUT DONT CARE
MSB OUT
LSB OUT MSB OUT
MSB IN
LSB IN
FRAME 1
66/84
samlpe trigger
CPOL=0
MSB IN
FRAME 2
sample trigger
sample trigger
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Electrical parameters
Figure 37. TI configuration - slave mode, single transfer
tsu(NSS)
NSS
INPUT
tc(SCK)
tc(SCK)/2
trigger
edge
SCK
sample
edge
tc(SCK)/2
trigger
edge
sample
edge
trigger
edge
sample
edge
INPUT
tw(SCKH)
tw(SCKL)
tf(SCK)
tsu(MOSI)
tr(SCK)
th(MOSI)
MOSI
INPUT
DONT CARE
MSB IN
tSCKQZ
tSCKQV
MISO
OUTPUT
z
1 OR 0
DONT CARE
LSB IN
tSCKQX
MSB OUT
z
LSB OUT
Figure 38. TI configuration - slave mode, continuous transfer
tc(SCK)
tsu(NSS)
th(NSS)
tc(SCK)
NSS OUTPUT
trigger sample
trigger sample
trigger sample
trigger sample
trigger sample
trigger sample
trigger sample
trigger sample
SCK OUTPUT
MOSI INPUT DONT CARE
MSB IN
LSB IN
MSB IN
LSB IN
MISO OUTPUT
MSB OUT
LSB OUT
MSB OUT
LSB OUT
1 OR 0
FRAME 1
DONT CARE
FRAME 2
67/84
Electrical parameters
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
SMI - serial memory interface
Subject to general operating conditions with CL ≈ 30 pF.
Table 40.
SMI characteristics(1)
Symbol
Parameter
Min
Max
Unit
32(2)(3)
fSMI_CK
SMI clock frequency
48(4)
tr(SMI_CK)
SMI clock rise time
10
tf(SMI_CK)
SMI clock fall time
8
MHz
ns
tv(SMI_DOUT) Data output valid time
10
th(SMI_DOUT) Data output hold time
0
tv(SMI_CSSx) CSS output valid time
10
th(SMI_CSSx) CSS output hold time
0
tsu(SMI_DIN)
Data input setup time
0
th(SMI_DIN)
Data input hold time
5
1. Data based on characterisation results, not tested in production.
2. Max. frequency = fPCLK/2 = 64/2 = 32 MHz.
3. Valid for all temperature ranges: -40 to 105 °C, with 30 pF load capacitance.
4. Valid up to 60 °C, with 10 pF load capacitance.
Figure 39. SMI timing diagram
tc(SMI_CK)
SMI_CK OUTPUT
tw(SMI_CKH)
tw(SMI_CKL)
tsu(SMI_DIN)
th(SMI_DIN)
tv(SMI_DOUT)
th(SMI_DOUT)
SMI_DIN INPUT
MSB IN
MSB OUT
SMI_DOUT OUTPUT
tv(SMI_CSS)
BIT6 IN
BIT6 OUT
tr(SMI_CK)
tf(SMI_CK)
LSB IN
LSB OUT
th(SMI_CSS)
SMI_CSSX OUTPUT
I2C - Inter IC control interface
Subject to general operating conditions for VDD_IO, fPCLK, and TA unless otherwise specified.
The I2C interface meets the requirements of the Standard I2C communication protocol
described in the following table with the restriction mentioned below:
Restriction: The I/O pins which SDA and SCL are mapped to are not “True” OpenDrain: when configured as open-drain, the PMOS connected between the I/O pin and
VDD_IO is disabled, but it is still present. Also, there is a protection diode between the
I/O pin and VDD_IO. Consequently, when using this I2C in a multi-master network, it is
68/84
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Electrical parameters
not possible to power off the STR7x while some another I2C master node remains
powered on: otherwise, the STR7x will be powered by the protection diode.
Refer to I/O port characteristics for more details on the input/output alternate function
characteristics (SDA and SCL).
Table 41.
SDA and SCL characteristics
Symbol
Standard mode
I2C
Parameter
Min(2)
Fast mode I2C(1)
Unit
(2)
(2)
Max
(2)
Min
Max
tw(SCLL)
SCL clock low time
4.7
1.3
tw(SCLH)
SCL clock high time
4.0
0.6
tsu(SDA)
SDA setup time
250
100
th(SDA)
SDA data hold time
0(3)
0(4)
900(3)
tr(SDA)
tr(SCL)
SDA and SCL rise time
1000
20+0.1Cb
300
tf(SDA)
tf(SCL)
SDA and SCL fall time
300
20+0.1Cb
300
th(STA)
START condition hold time
4.0
0.6
tsu(STA)
Repeated START condition setup time
4.7
0.6
tsu(STO)
STOP condition setup time
4.0
0.6
µs
4.7
1.3
µs
tw(STO:STA) STOP to START condition time (bus free)
Capacitive load for each bus line
Cb
1. fPCLK, must be at least 8 MHz to achieve max fast
µs
µs
400
I2C
ns
400
pF
speed (400 kHz).
2. Data based on standard I2C protocol requirement, not tested in production.
3. The maximum hold time of the START condition has only to be met if the interface does not stretch the low
period of SCL signal.
4. The device must internally provide a hold time of at least 300 ns for the SDA signal in order to bridge the
undefined region of the falling edge of SCL.
Figure 40. Typical application with I2C bus and timing diagram
VDD
4.7kΩ
VDD
4.7kΩ
I2C BUS
100Ω
SDA
100Ω
SCL
STRT75X
REPEATED START
START
tsu(STA)
tw(STO:STA)
START
SDA
tr(SDA)
tf(SDA)
tsu(SDA)
STOP
th(SDA)
SCL
th(STA)
tw(SCKH)
tw(SCKL)
tr(SCK)
tf(SCK)
tsu(STO)
1. Measurement points are done at CMOS levels: 0.3xVDD and 0.7xVDD.
69/84
Electrical parameters
5.3.11
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
USB characteristics
The USB interface is USB-IF certified (Full Speed).
Table 42.
USB startup time
Symbol
Parameter
tSTARTUP
USB transceiver startup time
Table 43.
Conditions
Max
Unit
1
µs
USB characteristics
USB DC Electrical Characteristics
Symbol
Parameter
Min.(1)(2) Max.(1)(2) Unit
Conditions
Input Levels
VDI
Differential Input Sensitivity
I(DP, DM)
0.2
VCM
Differential Common Mode
Range
Includes VDI range
0.8
2.5
VSE
Single Ended Receiver
Threshold
1.3
2.0
V
Output Levels
VOL
Static Output Level Low
RL of 1.5 kΩ to 3.6V(3)
VOH
Static Output Level High
RL of 15 kΩ to VSS(3)
0.3
V
2.8
3.6
1. All the voltages are measured from the local ground potential.
2. It is important to be aware that the DP/DM pins are not 5 V tolerant. As a consequence, in case of a a
shortcut with Vbus (typ: 5.0V), the protection diodes of the DP/DM pins will be direct biased . This will not
damage the device if not more than 50 mA is sunk for longer than 24 hours but the reliability may be
affected.
3. RL is the load connected on the USB drivers
Figure 41. USB: data signal rise and fall time
Differential
Data Lines
Crossover
points
VCRS
VSS
tr
tf
Table 44.
Symbol
USB: Full speed electrical characteristics
Parameter
Conditions
Min
Max
Unit
Driver characteristics:
70/84
tr
Rise time(1)
CL=50 pF
4
20
ns
tf
Time1)
CL=50 pF
4
20
ns
Fall
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Table 44.
Electrical parameters
USB: Full speed electrical characteristics
Symbol
Parameter
Conditions
Min
Max
Unit
trfm
Rise/ Fall Time matching
tr/tf
90
110
%
VCRS
Output signal Crossover Voltage
1.3
2.0
V
1. Measured from 10% to 90% of the data signal. For more detailed informations, please refer to USB
Specification - Chapter 7 (version 2.0).
71/84
Electrical parameters
5.3.12
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
10-bit ADC characteristics
Subject to general operating conditions for VDDA_ADC, fPCLK, and TA unless otherwise
specified.
Table 45.
Symbol
10-bit ADC characteristics
Parameter
Conditions
Min
Typ(1)
Max
Unit
0.4
8
MHz
VSSA_ADC
VDDA_ADC
V
fADC
ADC clock frequency
VAIN
Conversion voltage range(2)
RAIN
External input impedance(3)(4)
10
kΩ
CAIN
External capacitor on analog
input(3)(4)
6.8
pF
+400 µA injected
on any pin
1
µA
-400 µA injected
on any pin
except specific
adjacent pins in
Table 46
1
µA
Ilkg
Induced input leakage current
-400µA injected
on specific
adjacent pins in
Table 46
CADC
Internal sample and hold
capacitor
tCAL
Calibration Time
tCONV
IADC
Total Conversion time
(including sampling time)
fCK_ADC=8 MHz
fCK_ADC=8 MHz
Sunk on
VDDA_ADC
40
µA
3.5
pF
725.25
µs
5802
1/fADC
3.75
µs
30 (11 for sampling + 19 for
Successive Approximation)
1/fADC
3.7
mA
1. Unless otherwise specified, typical data are based on TA=25°C. They are given only as design guidelines
and are not tested.
2. Calibration is needed once after each power-up.
3. CPARASITIC represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus
the pad capacitance (3 pF). A high CPARASITIC value will downgrade conversion accuracy. To remedy this,
fADC should be reduced.
4. Depending on the input signal variation (fAIN), CAIN can be increased for stabilization time and reduced to
allow the use of a larger serial resistor (RAIN). It is valid for all fADC frequencies ≤ 8 MHz.
72/84
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Electrical parameters
ADC accuracy vs. negative injection current
Injecting negative current on specific pins listed in Table 46 (generally adjacent to the analog
input pin being converted) should be avoided as this significantly reduces the accuracy of
the conversion being performed. It is recommended to add a Schottky diode (pin to ground)
to pins which may potentially inject negative current.
Table 46.
List of adjacent pins
Analog input
Related adjacent pins
a
None
AIN1/P0.03
None
AIN2/P0.12
P0.11
AIN3/P0.17
P0.18 and P0.16
AIN4/P0.19
P0.24
AIN5/P0.22
None
AIN6/P0.23
P2.04
AIN7/P0.27
P1.11 and P0.26
AIN8/P0.29
P0.30 and P0.28
AIN9/P1.04
None
AIN10/P1.06
P1.05
AIN11/P1.08
P1.04 and P1.13
AIN12/P1.11
P2.17 and P0.27
AIN13/P1.12
None
AIN14/P1.13
P1.14 and P1.01
AIN15/P1.14
None
Figure 42. Typical application with ADC
VDD
STR75XX
VT
0.6V
RAIN
2kΩ(max)
AINx
VAIN
CAIN
VT
0.6V
IL
±1µA
10-Bit A/D
Conversion
CADC
3.2pF
Analog power supply and reference pins
The VDDA_ADC and VSSA_ADC pins are the analog power supply of the A/D converter cell.
Separation of the digital and analog power pins allow board designers to improve A/D
performance. Conversion accuracy can be impacted by voltage drops and noise in the event
of heavily loaded or badly decoupled power supply lines (see : General PCB design
guidelines on page 74).
73/84
Electrical parameters
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
General PCB design guidelines
To obtain best results, some general design and layout rules should be followed when
designing the application PCB to shield the noise-sensitive, analog physical interface from
noise-generating CMOS logic signals.
●
Use separate digital and analog planes. The analog ground plane should be connected
to the digital ground plane via a single point on the PCB.
●
Filter power to the analog power planes. It is recommended to connect capacitors, with
good high frequency characteristics, between the power and ground lines, placing
0.1 µF and optionally, if needed 10 pF capacitors as close as possible to the STR7
power supply pins and a 1 to 10 µF capacitor close to the power source (see
Figure 43).
●
The analog and digital power supplies should be connected in a star network. Do not
use a resistor, as VDDA_ADC is used as a reference voltage by the A/D converter and
any resistance would cause a voltage drop and a loss of accuracy.
●
Properly place components and route the signal traces on the PCB to shield the analog
inputs. Analog signals paths should run over the analog ground plane and be as short
as possible. Isolate analog signals from digital signals that may switch while the analog
inputs are being sampled by the A/D converter. Do not toggle digital outputs near the
A/D input being converted.
Software filtering of spurious conversion results
For EMC performance reasons, it is recommended to filter A/D conversion outliers using
software filtering techniques.
Figure 43. Power supply filtering
STR75XX
1 to 10µF
0.1µF
STR7
DIGITAL NOISE
FILTERING
VSS
VDD_IO
VDD
POWER
SUPPLY
SOURCE
(3.3V or 5.0V)
0.1µF
EXTERNAL
NOISE
FILTERING
74/84
VDDA_ADC
VSSA_ADC
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Table 47.
Electrical parameters
ADC accuracy
ADC accuracy with fCK_SYS = 20 MHz, fADC=8 MHz, RAIN < 10 kΩ
This assumes that the ADC is calibrated(1)
Symbol
Parameter
Conditions
|ET|
Total unadjusted error (2) (3)
|EO|
Offset error(2) (3)
EG
Gain Error (2) (3)
|ED|
Differential linearity error(2) (3)
|EL|
Integral linearity error (2) (3)
VDDA_ADC=3.3 V
VDDA_ADC=5.0 V
VDDA_ADC=3.3 V
VDDA_ADC=5.0 V
VDDA_ADC=3.3 V
VDDA_ADC=5.0 V
VDDA_ADC=3.3 V
VDDA_ADC=5.0 V
VDDA_ADC=3.3 V
VDDA_ADC=5.0 V
Typ
Max
1
1.2
1
1.2
0.15
0.5
0.15
0.5
-0.8
-0.2
-0.8
-0.2
0.7
0.9
0.7
0.9
0.6
0.8
0.6
0.8
Unit
LSB
1. Calibration is needed once after each power-up.
2. Refer to ADC accuracy vs. negative injection current on page 73
3. ADC Accuracy vs. MCO (Main Clock Output): the ADC accuracy can be significantly degraded when
activating the MCO on pin P0.01 while converting an analog channel (especially those which are close to
the MCO pin). To avoid this, when an ADC conversion is launched, it is strongly recommended to disable
the MCO.
Figure 44. ADC accuracy characteristics
Digital Result ADCDR
EG
1023
1022
1021
1LSB
IDEAL
V
–V
DDA
SSA
= -----------------------------------------
1024
(2)
ET
(3)
7
(1)
6
5
4
(1) Example of an actual transfer curve
(2) The ideal transfer curve
(3) End point correlation line
EO
EL
3
ED
2
ET=Total Unadjusted Error: maximum deviation
between the actual and the ideal transfer curves.
EO=Offset Error: deviation between the first actual
transition and the first ideal one.
EG=Gain Error: deviation between the last ideal
transition and the last actual one.
ED=Differential Linearity Error: maximum deviation
between actual steps and the ideal one.
EL=Integral Linearity Error: maximum deviation
between any actual transition and the end point
correlation line.
1 LSBIDEAL
1
0
1
VSSA
2
3
4
5
6
7
Vin
1021 1022 1023 1024
VDDA
75/84
Package characteristics
6
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Package characteristics
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK® specifications are available at www.st.com.
6.1
Package mechanical data
Figure 45. 64-pin low profile quad flat package (10x10)
0.10mm
.004
seating plane
D
D1
D3
A
A2
A1
Dim.
Min
Typ
A
B
e
E3E1 E
c
Max
Min
Typ
Max
1.60
0.0630
0.15 0.0020
0.0059
A1
0.05
A2
1.35
1.40
1.45 0.0531 0.0551 0.0571
b
0.17
0.22
0.27 0.0067 0.0087 0.0106
C
0.09
0.20 0.0035
0.0079
D
12.00
0.4724
D1
10.00
0.3937
E
12.00
0.4724
E1
10.00
0.3937
e
0.50
K
0°
3.5°
L
0.45
0.60
L1
M x 45°
inches(1)
mm
0.0197
7°
0°
3.5°
1.00
0.0394
Number of pins
PIN 1
IDENTIFICATION
N
1.
L1
L
K
76/84
7°
0.75 0.0177 0.0236 0.0295
64
Values in inches are converted from mm
and rounded to 4 decimal digits.
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Package characteristics
Figure 46. 100-pin low profile flat package (14x14)
inches(1)
mm
Dim.
Min
Typ
Max
Min
Typ
Max
A
D
D1
A
A1
A2
b
C
D
D1
E
E1
e
θ
L
L1
A2
A1
b
e
E1
E
c
L1
L
θ
N
1.60
0.05
0.15 0.0020
1.35 1.40 1.45 0.0531 0.0551
0.17 0.22 0.27 0.0067 0.0087
0.09
0.20 0.0035
16.00
0.6299
14.00
0.5512
16.00
0.6299
14.00
0.5512
0.50
0.0197
0°
3.5°
7°
0°
3.5°
0.45 0.60 0.75 0.0177 0.0236
1.00
0.0394
Number of Pins
100
0.0630
0.0059
0.0571
0.0106
0.0079
7°
0.0295
1. Values in inches are converted from mm and
rounded to 4 decimal digits.
Figure 47. 64-ball low profile fine pitch ball grid array package
inches(1)
mm
Dim.
Min
A
A1
A2
b
D
D1
E
E1
e
f
ddd
Typ Max
1.210
0.270
0.450
7.750
7.750
0.720
1.050
Min
Typ
1.700 0.0476
0.0106
1.120
0.500
8.000
5.600
8.000
5.600
0.800
1.200
N
0.550 0.0177
8.150 0.3051
8.150 0.3051
Max
0.0669
0.0441
0.0197
0.3150
0.2205
0.3150
0.2205
0.0315
0.0472
0.880 0.0283
1.350 0.0413
0.120
Number of Pins
64
0.0217
0.3209
0.3209
0.0346
0.0531
0.0047
1. Values in inches are converted from mm and rounded
to 4 decimal digits.
77/84
Package characteristics
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Figure 48. 100-ball low profile fine pitch ball grid array package
inches(1)
mm
Dim.
Min
A
A1
A2
A3
A4
b
D
D1
E
E1
e
F
ddd
eee
fff
Typ
Max
Min
Typ
1.700
0.270
9.85
N
0.0669
0.0106
1.085
0.30
0.45
9.85
Max
0.50
10.00
7.20
10.00
7.20
0.80
1.40
0.0427
0.0118
0.80
0.55
10.15
0.0315
0.0177 0.0197 0.0217
0.3878 0.3937 0.3996
0.2835
10.15 0.3878 0.3937 0.3996
0.2835
0.0315
0.055
0.12
0.005
0.15
0.006
0.08
0.003
Number of Balls
100
1. Values in inches are converted from mm and rounded to 4 decimal
digits.
Figure 49. Recommended PCB design rules (0.80/0.75mm pitch BGA)
Dpad
0.37 mm
0.52 mm typ. (depends on solder
Dsm
mask registration tolerance
Solder paste 0.37 mm aperture diameter
– Non solder mask defined pads are recommended
– 4 to 6 mils screen print
Dpad
Dsm
78/84
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
6.2
Package characteristics
Thermal characteristics
The maximum chip junction temperature (TJmax) must never exceed the values given in
Table 10: General operating conditions on page 34.
The maximum chip-junction temperature, TJmax, in degrees Celsius, may be calculated
using the following equation:
TJmax = TAmax + (PDmax x ΘJA)
Where:
–
TAmax is the maximum Ambient Temperature in °C,
–
ΘJA is the Package Junction-to-Ambient Thermal Resistance, in ° C/W,
–
PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax),
–
PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum
chip internal power.
–
PI/Omax represents the maximum Power Dissipation on Output Pins.
Where:
PI/Omax = Σ (VOL*IOL) + Σ((VDD-VOH)*IOH),
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high
level in the application.
Table 48.
Thermal characteristics(1)
Symbol
Parameter
Value
Unit
ΘJA
Thermal Resistance Junction-Ambient
LQFP 100 - 14 x 14 mm / 0.5 mm pitch
46
°C/W
ΘJA
Thermal Resistance Junction-Ambient
LQFP 64 - 10 x 10 mm / 0.5 mm pitch
45
°C/W
ΘJA
Thermal Resistance Junction-Ambient
LFBGA 64 - 8 x 8 x 1.7mm
58
°C/W
ΘJA
Thermal Resistance Junction-Ambient
LFBGA 100 - 10 x 10 x 1.7mm
41
°C/W
1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection
environment.
6.2.1
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
79/84
Package characteristics
6.2.2
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Selecting the product temperature range
When ordering the microcontroller, the temperature range is specified in the order code
Table 49: Order codes on page 81.
The following example shows how to calculate the temperature range needed for a given
application.
Assuming the following application conditions:
Maximum ambient temperature TAmax= 82 °C (measured according to JESD51-2),
IDDmax=8 mA, VDD = 5 V, maximum 20 I/Os used at the same time in output at low level
with IOL = 8 mA, VOL= 0.4 V
PINTmax = 8 mA x 5 V= 400 mW
PIOmax = 20 x 8 mA x 0.4V = 64 mW
This gives: PINTmax= 400 mW and PIOmax 64 mW:
PDmax = 400 mW + 64 mW
Thus: PDmax = 464 mW
Using the values obtained in Table 48 TJmax is calculated as follows:
–
For LQFP100, 46°C/W
TJmax = 82° C + (46° C/W x 464 mW) = 82°C + 21°C = 103° C
This is within the range of the suffix 6 version parts (-40 < TJ < 105° C).
In this case, parts must be ordered at least with the temperature range suffix 6
(see Table 49: Order codes on page 81).
–
For BGA64, 58°C/W
TJmax = 82° C + (58° C/W x 464 mW) = 82°C + 27°C = 109° C
This is within the range of the suffix 7 version parts (-40 < TJ < 125° C).
In this case, parts must be ordered at least with the temperature range suffix 7
(see Table 49: Order codes on page 81).
Figure 50. LQFP100 PDmax vs TA
700
P D (mW)
600
500
Suffix 6
400
Suffix 7
300
200
100
TA (° C)
80/84
12
5
11
5
10
5
95
85
75
0
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
7
Order codes
Order codes
Table 49.
Order codes
Flash Prog.
Memory
Partnumber
(Bank 0)
Package
USB
Periph
Periph
Yes
Yes
-40 to +85°C
-
Yes
-40 to +85°C
Yes
-
-40 to +85°C
Yes
-
-40 to +105°C
-
-
-40 to +85°C
Kbytes
STR750FV0T6
64
STR750FV1T6
128
STR750FV2T6
256
STR750FV0H6
64
STR750FV1H6
128
STR750FV2H6
256
STR751FR0T6
64
STR751FR1T6
128
STR751FR2T6
256
STR751FR0H6
64
STR751FR1H6
128
STR751FR2H6
256
STR752FR0T6
64
STR752FR1T6
128
STR752FR2T6
256
STR752FR0H6
64
STR752FR1H6
128
STR752FR2H6
256
STR752FR0T7
64
STR752FR1T7
128
STR752FR2T7
256
STR752FR0H7
64
STR752FR1H7
128
STR752FR2H7
256
STR755FR0T6
64
STR755FR1T6
128
STR755FR2T6
256
STR755FR0H6
64
STR755FR1H6
128
STR755FR2H6
256
Nominal
CAN
Temp. Range
(TA)
LQFP100 14x14
LFBGA100 10x10
LQFP64 10x10
LFBGA64 8x8
LQFP64 10x10
LFBGA64 8x8
LQFP64 10x10
LFBGA64 8x8
LQFP64 10x10
LFBGA64 8x8
81/84
Order codes
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Table 49.
Order codes (continued)
Flash Prog.
Memory
Partnumber
(Bank 0)
Package
CAN
USB
Periph
Periph
-
-
Kbytes
82/84
STR755FV0T6
64
STR755FV1T6
128
STR755FV2T6
256
STR755FV0H6
64
STR755FV1H6
128
STR755FV2H6
256
Nominal
Temp. Range
(TA)
LQFP100 14x14
LFBGA100 10x10
-40 to +85°C
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
8
Revision history
Revision history
Table 50.
Document revision history
Date
Revision
25-Sep-2006
1
Initial release
30-Oct-2006
2
Added power consumption data for 5V operation in Section 5
3
Changed datasheet title from STR750F to STR750FXX STR751Fxx
STR752Fxx STR755xx.
Added Table 1: Device summary on page 1
Added note 1 to Table 6
Added STOP mode IDD max. values in Table 14
Updated XT2 driving current in Table 23.
Updated RPD in Table 32
Updated Table 21: XRTC1 external clock source on page 45
Updated Table 34: Output speed on page 57
Added characteristics for SSP synchronous serial peripheral in master
mode (SPI or TI mode) on page 62 and SSP synchronous serial
peripheral in slave mode (SPI or TI mode) on page 65
Added characteristics for SMI - serial memory interface on page 68
Added Table 42: USB startup time on page 70
4
Updated Section 5.2.3: Thermal characteristics on page 33
Updated PD, TJ and TA in Section 5.3: Operating conditions on page 34
Updated Table 20: XT1 external clock source on page 44
Updated Table 21: XRTC1 external clock source on page 45
Updated Section 6: Package characteristics on page 76 (inches rounded
to 4 decimal digits instead of 3)
Updated Ordering information Section 7: Order codes on page 81
04-Jul-2007
23-Oct-2007
Description of Changes
83/84
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
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84/84