ROHM BU21018MWV

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Structure
Silicon Monolithic IC
Product Name
Capacitive Sensor Controller for Cellular Phone
Product No
BU21018MWV
Features
1) High- resistive sensor material
2) High Speed Sensing
3) 3.0 V singe power supply
4) 36ch sensors
5) 2ch reference (1ch only use is possible)
6) Automatic program download function for internal CPU
●Absolute maximum ratings
PARAMETER
SYMBOL
RATING
UNIT
Digital applied voltage
DVDD
-0.5 ~ 2.5
V
Analog applied voltage
AVDD
-0.5 ~ 4.5
V
Digital input voltage
Vdi
-0.5 ~ DVDD
V
Analog input voltage
Vai
-0.5 ~ AVDD
V
Storage temperature range
Tstg
-55 ~ 125
℃
Power dissipation
Pd
928*1
mW
(*1) This is the power dissipation per IC unit. Reduce to 9.28 mW /℃ when Ta = 25℃ or above.
●Operating conditions
PARAMETER
SYMBOL
RATING
UNIT
Digital power supply
DVDD
1.60 ~ 2.00
V
Analog power supply
AVDD
2.70 ~ 3.60
V
Operating temperature rage
Topr
-20 ~ 85
℃
This chip is not designed to protect itself against radioactive rays.
REV. C
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●Electrical characteristics
PARAMETER
RATING
SYMBOL
Digital Low level input
MIN
TYP
MAX
UNIT
CONDITION
VIL1
-0.4
-
0.25*DVDD
V
VIH1
0.7*DVDD
-
DVDD+0.5
V
VOL1
-
-
VSS+0.4
V
IOL=2.0[mA]
VOL2
-
-
VSS+0.45
V
IOL=1.0[mA]
VOH2
LDO-0.4
-
LDO+0.5
V
IOH=-0.5[mA]
OSC Frequency
Freq
21.0
24.0
27.0
MHz
Digital standby current
Ist1
0
-
10
uA
Analog standby current
Ist2
0
-
10
uA
Digital operating current
Idd1
-
3
5.5
mA
Analog operation current
Idd2
-
1
1.5
mA
voltage
Digital High level input
voltage
Digital Low level output
voltage
Analog Low level output
voltage
Analog High level output
voltage
*Ta = 25℃ as long as it doesn't specify it.
●Block diagram
SIN00
11
SIN01
12
Noise Filter
CPU Core
SIN02
13
SIN03
20
Data
Memory
2kB
Program
Memory
16kB
CV
Transfer
Controller
Register
Calibration
Controller
7
EEPROM
I2C
SIN33
50
OSC
SIN34
SIN35
I2C
51
52
RESET
(POR)
Clock
Controller
8
EDA
ECL
4
SDA
5
SCL
6
ADR_SEL
10
RESET
1
EXT_CLK
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●External measure and View
●Pin description
BU21018
NAME
DISCRIPTION
PIN
1
2
3
4
5
6
EXTCLK
INT
NC
SDA
SCL
ADR_SEL
7
EDA
8
ECL
9
IFSEL
10
DVDD
11
12
13
14
15
16
17
SIN00
SIN01
SIN02
LDO
VSS
AVDD
RESET
18
19
20
21
22~50
51
52
53
54
55
56
SREF0
SREF1
SIN03
SIN04
SIN05~SIN33
SIN34
SIN35
TEST0
TEST1
TEST2
TEST3
External clock input
Interrupt
I2C:SDA
I2C:SCL
I2C: Address select
“L” (1011100)2
“H” (1011101)2
Automatic program download of
EEPROM
(SDA)
Automatic program download of
EEPROM
(SCL)
Interface select
(Low fix)
Digital power
Connect to LDO pin.
Sensor
Sensor
Sensor
LDO output*1
Ground
Analog power
Reset
“L” Reset
“H” Release
Reference sensor
Reference sensor
Sensor
Sensor
Sensor
Sensor
Sensor
Test (Low fix)
Test (Low fix)
Test (Low fix)
Test (Low fix)
Lot No.
Package:UQFN056V7070
*1 Please do not connect devices other than BU21018MWV.
REV. C
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●Cautions on use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break
down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode
exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including
the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The electrical
characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due
to the reverse connection, such as mounting an external diode between the power supply and the IC's power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for
the digital block power supply and the analog block power supply, even though these power supplies has the same level of
potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the
diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the
GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the
same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be
used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the
terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB
to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After
the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for
protection against static electricity, establish a ground for the assembly process and pay thorough attention to the
transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a
voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the
input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply
to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical
characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern
from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to
the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND.
Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Rush current
The IC with some power supplies has a capable of rush current due to procedure and delay at power-on. Pay attention to the
capacitance of the coupling condensers and the wiring pattern width and routing of the power supply and the GND lines.
(13) Others
In case of use this LSI, please peruse some other detail documents, we called, Technical note, Functional description,
Application note.
REV. C
Notice
Notes
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The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
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use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
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R1120A