IDT ICS8538BG

ICS8538-31
LOW SKEW, 1-TO-8, CRYSTAL OSCILLATOR/
LVCMOS-TO-3.3V LVPECL FANOUT BUFFER
General Description
Features
The ICS8538-31 is a low skew, high performance
1-to-8 Crystal Oscillator/LVCMOS-to-3.3V LVPECL
HiPerClockS™
Fanout Buffer and a member of the HiPerClockS™
family of High Performance Clock Solutions from
IDT. The ICS8538-31 has selectable single ended
clock or crystal inputs. The single ended clock input accepts
LVCMOS or LVTTL input levels and translate them to 3.3V
LVPECL levels. The output enable is internally synchronized to
eliminate runt pulses on the outputs during asynchronous
assertion/deassertion of the clock enable pin.
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ICS
Guaranteed output and part-to-part skew characteristics make the
ICS8538-31 ideal for those applications demanding well defined
performance and repeatability.
Block Diagram
CLK_EN Pullup
CLK can accept the following input levels: LVCMOS, LVTTL
Maximum output frequency: 266MHz
Crystal frequency range: 14MHz - 40MHz
Output skew: 50ps (maximum)
Part-to-part skew: 250ps (maximum)
Propagation delay: 2.2ns (maximum)
3.3V operating supply mode
0°C to 70°C ambient operating temperature
Industrial temperature information available upon request
Available in both standard (RoHS 5) and lead-free (RoHS 6)
packages
CLK
CLK_SEL
CLK_EN
VEE
nQ7
Q7
VCCO
nQ6
Q6
nQ5
Q5
VEE
nQ4
Q4
D
LE
0
XTAL_IN
OSC
Selectable LVCMOS/LVTTL clock or crystal inputs
Pin Assignment
Q
CLK Pulldown
Eight differential 3.3V LVPECL outputs
1
Q0
nQ0
Q1
nQ1
XTAL_OUT
CLK_SEL Pulldown
Q2
nQ2
Q3
nQ3
Q4
nQ4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VCC
XTAL_IN
XTAL_OUT
VEE
Q0
nQ0
VCCO
Q1
nQ1
Q2
nQ2
VCCO
Q3
nQ3
28-Lead TSSOP, 173MIL
4.4mm x 9.7mm x 0.925mm package body
Q5
nQ5
G Package
Top View
Q6
nQ6
Q7
nQ7
IDT™ / ICS™ LVPECL FANOUT BUFFER
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ICS8538BG-31 REV. B FEBRUARY 5, 2008
ICS8538-31
LOW SKEW, 1-TO-8, CRYSTAL OSCILLATOR/LVCMOS-TO-3.3V LVPECL FANOUT BUFFER
Table 1. Pin Descriptions
Number
Name
Type
Description
1
CLK
Input
Pulldown Single-ended clock input. LVCMOS/LVTTL interface levels.
2
CLK_SEL
Input
Pulldown
3
CLK_EN
Input
Pullup
4, 12, 25
VEE
Power
Negative supply pins.
5, 6
nQ7, Q7
Output
Differential output pair. LVPECL interface levels.
7, 17, 22
VCCO
Power
Output supply pins.
8, 9
nQ6, Q6
Output
Differential output pair. LVPECL interface levels.
10, 11
nQ5, Q5
Output
Differential output pair. LVPECL interface levels.
13, 14
nQ4, Q4
Output
Differential output pair. LVPECL interface levels.
15, 16
nQ3, Q3
Output
Differential output pair. LVPECL interface levels.
18, 19
nQ2, Q2
Output
Differential output pair. LVPECL interface levels.
20, 21
nQ1, Q1
Output
Differential output pair. LVPECL interface levels.
23, 24
nQ0, Q0
Output
Differential output pair. LVPECL interface levels.
26,
27
XTAL_OUT
XTAL_IN
Input
Crystal oscillator interface. XTAL_IN is the input, XTAL_OUT is the output.
28
VCC
Power
Positive supply pin.
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
Table 2. Pin Characteristics
Symbol
Parameter
CIN
Input Capacitance
4
pF
RPULLUP
Input Pullup Resistor
51
kΩ
RPULLDOWN
Input Pulldown Resistor
51
kΩ
IDT™ / ICS™ LVPECL FANOUT BUFFER
Test Conditions
2
Minimum
Typical
Maximum
Units
ICS8538BG-31 REV. B FEBRUARY 5, 2008
ICS8538-31
LOW SKEW, 1-TO-8, CRYSTAL OSCILLATOR/LVCMOS-TO-3.3V LVPECL FANOUT BUFFER
Function Tables
Table 3A. Control Input Function Table
Inputs
Outputs
CLK_EN
CLK_SEL
Selected Source
Q0:Q7
nQ0:nQ7
0
0
CLK
Disabled; Low
Disabled; High
0
1
XTAL_IN, XTAL_OUT
Disabled; Low
Disabled; High
1
0
CLK
Enabled
Enabled
1
1
XTAL_IN, XTAL_OUT
Enabled
Enabled
After CLK_EN switches, the clock outputs are disabled or enabled following a rising and falling input clock or crystal oscillator edge as
shown in Figure 1. In the active mode, the state of the outputs are a function of the CLK input as described in Table 3B.
Enabled
Disabled
CLK
CLK_EN
nQ0:nQ7
Q0:Q7
Figure 1. CLK_EN Timing Diagram
Table 3B. Clock Input Function Table
Inputs
Outputs
CLK
Q0:Q7
nQ0:nQ7
0
LOW
HIGH
1
HIGH
LOW
IDT™ / ICS™ LVPECL FANOUT BUFFER
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ICS8538BG-31 REV. B FEBRUARY 5, 2008
ICS8538-31
LOW SKEW, 1-TO-8, CRYSTAL OSCILLATOR/LVCMOS-TO-3.3V LVPECL FANOUT BUFFER
Absolute Maximum Ratings
NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.
These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond
those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect product reliability.
Item
Rating
Supply Voltage, VCC
4.6V
Inputs, VI
-0.5V to VCC+ 0.5V
Outputs, IO
Continuous Current
Surge Current
50mA
100mA
Package Thermal Impedance, θJA
49.8°C/W (0 lfpm)
Storage Temperature, TSTG
-65°C to 150°C
DC Electrical Characteristics
Table 4A. Power Supply DC Characteristics, VCC = VCCO = 3.3V±5%, VEE = 0V, TA = 0°C to 70°C
Symbol
Parameter
VCC
Test Conditions
Minimum
Typical
Maximum
Units
Positive Supply Voltage
3.135
3.3
3.465
V
VCCO
Output Supply Voltage
3.135
3.3
3.465
V
IEE
Power Supply Current
110
mA
ICCO
Output Supply Current
50
mA
Maximum
Units
Table 4B. LVCMOS/LVTTL DC Characteristics, VCC = VCCO = 3.3V±5%, VEE = 0V, TA = 0°C to 70°C
Symbol
Parameter
Test Conditions
Minimum
Typical
VIH
Input High Voltage
2
VCC + 0.3
V
VIL
Input Low Voltage
-0.3
0.8
V
Input
High Current
CLK, CLK_SEL
VCC = VIN = 3.465V
150
µA
IIH
CLK_EN
VCC = VIN = 3.465V
5
µA
Input
Low Current
CLK, CLK_SEL
VCC = 3.465V, VIN = 0V
-5
µA
IIL
CLK_EN
VCC = 3.465V, VIN = 0V
-150
µA
Table 4C. LVPECL DC Characteristics, VCC = VCCO = 3.3V±5%, VEE = 0V, TA = 0°C to 70°C
Symbol
Parameter
VOH
Output High Current; NOTE 1
VOL
Output Low Current; NOTE 1
VSWING
Peak-to-Peak Output Voltage Swing
Test Conditions
Minimum
Typical
Maximum
Units
VCCO – 1.4
VCCO – 0.9
µA
VCCO– 2.0
VCCO – 1.7
µA
0.6
1.0
V
NOTE 1: Outputs terminated with 50Ω to VCCO – 2V.
IDT™ / ICS™ LVPECL FANOUT BUFFER
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ICS8538BG-31 REV. B FEBRUARY 5, 2008
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LOW SKEW, 1-TO-8, CRYSTAL OSCILLATOR/LVCMOS-TO-3.3V LVPECL FANOUT BUFFER
Table 5. Crystal Characteristics
Parameter
Test Conditions
Minimum
Maximum
Units
40
MHz
Equivalent Series Resistance (ESR)
50
Ω
Shunt Capacitance
7
pF
Drive Level
1
mW
Mode of Oscillation
Typical
Fundamental
Frequency
14
AC Electrical Characteristics
Table 6. AC Characteristics, VCC = VCCO = 3.3V±5%, VEE = 0V, TA = 0°C to 70°C
Parameter Symbol
Maximum
Units
fMAX
Output Frequency
266
MHz
tPD
Propagation Delay; NOTE 1
2.2
ns
tsk(o)
Output Skew; NOTE 2, 4
50
ps
tsk(pp)
Part-to-Part Skew; NOTE 3, 4
tR / tF
Output Rise/Fall Time
odc
Output Duty Cycle
Test Conditions
20% to 80%
Minimum
Typical
250
ps
200
700
ps
45
55
%
All parameters measured at fMAX unless noted otherwise.
NOTE 1: Measured from VCC/2 input crossing point to the differential output crossing point.
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at the output differential
cross points.
NOTE 3: Defined as skew between outputs on different devices operating at the same supply voltages and with equal load conditions.
Using the same type of inputs on each device, the outputs are measured at the differential cross points.
NOTE 4: This parameter is defined in accordance with JEDEC Standard 65.
IDT™ / ICS™ LVPECL FANOUT BUFFER
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ICS8538BG-31 REV. B FEBRUARY 5, 2008
ICS8538-31
LOW SKEW, 1-TO-8, CRYSTAL OSCILLATOR/LVCMOS-TO-3.3V LVPECL FANOUT BUFFER
Parameter Measurement Information
2V
Par t 1
VCC,
VCCO
Qx
nQx
SCOPE
Qx
nQy
Par t 2
LVPECL
nQx
Qy
VEE
tsk(pp)
-1.3V±0.165V
3.3/3.3V LVPECL Output Load AC Test Circuit
Part-to-Part Skew
nQx
Qx
CLK
nQy
nQ0:nQ7
Qy
Q0:Q7
tPD
tsk(o)
Propagation Delay
Output Skew
nQ0:nQ7
Q0:Q7
80%
80%
t PW
VSW I N G
Clock
Outputs
t
20%
20%
tR
tF
odc =
PERIOD
t PW
x 100%
t PERIOD
Output Rise/Fall Time
IDT™ / ICS™ LVPECL FANOUT BUFFER
Output Duty Cycle/Pulse Width/Period
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ICS8538BG-31 REV. B FEBRUARY 5, 2008
ICS8538-31
LOW SKEW, 1-TO-8, CRYSTAL OSCILLATOR/LVCMOS-TO-3.3V LVPECL FANOUT BUFFER
Application Information
Crystal Input Interface
The ICS8538-31 has been characterized with 18pF parallel
resonant crystals. The capacitor values, C1 and C2, shown in
Figure 2 below were determined using an 18pF parallel resonant
crystal and were chosen to minimize the ppm error. These same
capacitor values will tune any 18pF parallel resonant crystal over
the frequency range and other parameters specified in this data
sheet. The optimum C1 and C2 values can be slightly adjusted for
different board layouts.
XTAL_IN
C1
18p
X1
18pF Parallel Crystal
XTAL_OUT
C2
22p
Figure 2. Crystal Input Interface
LVCMOS to XTAL Interface
The XTAL_IN input can accept a single-ended LVCMOS signal
through an AC coupling capacitor. A general interface diagram is
shown in Figure 3. The XTAL_OUT pin can be left floating. The
input edge rate can be as slow as 10ns. For LVCMOS inputs, it is
recommended that the amplitude be reduced from full swing to half
swing in order to prevent signal interference with the power rail and
to reduce noise. This configuration requires that the output
VCC
impedance of the driver (Ro) plus the series resistance (Rs) equals
the transmission line impedance. In addition, matched termination
at the crystal input will attenuate the signal in half. This can be
done in one of two ways. First, R1 and R2 in parallel should equal
the transmission line impedance. For most 50Ω applications, R1
and R2 can be 100Ω. This can also be accomplished by removing
R1 and making R2 50Ω.
VCC
R1
Ro
Rs
0.1µf
50Ω
XTAL_IN
Zo = Ro + Rs
R2
XTAL_OUT
Figure 3. General Diagram for LVCMOS Driver to XTAL Input Interface
IDT™ / ICS™ LVPECL FANOUT BUFFER
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LOW SKEW, 1-TO-8, CRYSTAL OSCILLATOR/LVCMOS-TO-3.3V LVPECL FANOUT BUFFER
Recommendations for Unused Input and Output Pins
Inputs:
Outputs:
Crystal Inputs
LVPECL Outputs
For applications not requiring the use of the crystal oscillator input,
both XTAL_IN and XTAL_OUT can be left floating. Though not
required, but for additional protection, a 1kΩ resistor can be tied
from XTAL_IN to ground.
All unused LVPECL outputs can be left floating. We recommend
that there is no trace attached. Both sides of the differential output
pair should either be left floating or terminated.
CLK Input
For applications not requiring the use of a clock input, it can be left
floating. Though not required, but for additional protection, a 1kΩ
resistor can be tied from the CLK input to ground.
LVCMOS Control Pins
All control pins have internal pull-ups or pull-downs; additional
resistance is not required but can be added for additional
protection. A 1kΩ resistor can be used.
Termination for 3.3V LVPECL Outputs
The clock layout topology shown below is a typical termination for
LVPECL outputs. The two different layouts mentioned are
recommended only as guidelines.
transmission lines. Matched impedance techniques should be
used to maximize operating frequency and minimize signal
distortion. Figures 4A and 4B show two different layouts which are
recommended only as guidelines. Other suitable clock layouts may
exist and it would be recommended that the board designers
simulate to guarantee compatibility across all printed circuit and
clock component process variations.
FOUT and nFOUT are low impedance follower outputs that
generate ECL/LVPECL compatible outputs. Therefore, terminating
resistors (DC current path to ground) or current sources must be
used for functionality. These outputs are designed to drive 50Ω
3.3V
Zo = 50Ω
125Ω
FOUT
FIN
Zo = 50Ω
Zo = 50Ω
FOUT
50Ω
RTT =
125Ω
1
Z
((VOH + VOL) / (VCC – 2)) – 2 o
Zo = 50Ω
VCC - 2V
RTT
84Ω
Figure 4A. 3.3V LVPECL Output Termination
IDT™ / ICS™ LVPECL FANOUT BUFFER
FIN
50Ω
84Ω
Figure 4B. 3.3V LVPECL Output Termination
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ICS8538BG-31 REV. B FEBRUARY 5, 2008
ICS8538-31
LOW SKEW, 1-TO-8, CRYSTAL OSCILLATOR/LVCMOS-TO-3.3V LVPECL FANOUT BUFFER
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS8538-31.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS8538-31 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
•
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 110mA = 381.15mW
•
Power (outputs)MAX = 30mW/Loaded Output pair
If all outputs are loaded, the total power is 8 * 30mW = 240mW
Total Power_MAX (3.3V, with all outputs switching) = 381.15mW + 240mW = 621.15mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device.
The maximum recommended junction temperature for HiPerClockS devices is 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = Junction Temperature
θJA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming no air flow
and a multi-layer board, the appropriate value is 49.8°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.621W * 49.8°C/W = 100.9°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type
of board (single layer or multi-layer).
Table 7. Thermal Resistance θJA for 28 Lead TSSOP, Forced Convection
θJA by Velocity
Linear Feet per Minute
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
82.9°C/W
68.7°C/W
60.5°C/W
Multi-Layer PCB, JEDEC Standard Test Boards
49.8°C/W
43.9°C/W
41.2°C/W
NOTE: Most modern PCB design use multi-layered boards. The data in the second row pertains to most designs.
IDT™ / ICS™ LVPECL FANOUT BUFFER
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ICS8538BG-31 REV. B FEBRUARY 5, 2008
ICS8538-31
LOW SKEW, 1-TO-8, CRYSTAL OSCILLATOR/LVCMOS-TO-3.3V LVPECL FANOUT BUFFER
3. Calculations and Equations.
The purpose of this section is to derive the power dissipated into the load.
LVPECL output driver circuit and termination are shown in Figure 5.
VCCO
Q1
VOUT
RL
50Ω
VCCO - 2V
Figure 5. LVPECL Driver Circuit and Termination
To calculate worst case power dissipation into the load, use the following equations which assume a 50Ω load, and a termination voltage
of VCCO – 2V.
•
For logic high, VOUT = VOH_MAX = VCCO_MAX – 0.9V
(VCCO_MAX – VOH_MAX) = 0.9V
•
For logic low, VOUT = VOL_MAX = VCO_MAX – 1.7V
(VCCO_MAX – VOL_MAX) = 1.7V
Pd_H is power dissipation when the output drives high.
Pd_L is the power dissipation when the output drives low.
Pd_H = [(VOH_MAX – (VCCO_MAX – 2V))/RL] * (VCCO_MAX – VOH_MAX) = [(2V – (VCCO_MAX – VOH_MAX))/RL] * (VCCO_MAX – VOH_MAX) =
[(2V – 0.9V)/50Ω] * 0.9V = 19.8mW
Pd_L = [(VOL_MAX – (VCCO_MAX – 2V))/RL] * (VCCO_MAX – VOL_MAX) = [(2V – (VCCO_MAX – VOL_MAX))/RL] * (VCCO_MAX – VOL_MAX) =
[(2V – 1.7V)/50Ω] * 1.7V = 10.2mW
Total Power Dissipation per output pair = Pd_H + Pd_L = 30mW
IDT™ / ICS™ LVPECL FANOUT BUFFER
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ICS8538BG-31 REV. B FEBRUARY 5, 2008
ICS8538-31
LOW SKEW, 1-TO-8, CRYSTAL OSCILLATOR/LVCMOS-TO-3.3V LVPECL FANOUT BUFFER
Reliability Information
Table 8. θJA vs. Air Flow Table for a 282 Lead TSSOP
θJA by Velocity
Linear Feet per Minute
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
82.9°C/W
68.7°C/W
60.5°C/W
Multi-Layer PCB, JEDEC Standard Test Boards
49.8°C/W
43.9°C/W
41.2°C/W
NOTE: Most modern PCB design use multi-layered boards. The data in the second row pertains to most designs.
Transistor Count
The transistor count for ICS8430-62 is: 4258
Package Outline and Package Dimension
Package Outline - G Suffix for 28 Lead TSSOP
Table 9. Package Dimensions
All Dimensions in Millimeters
Symbol
Minimum
Maximum
N
28
A
1.20
A1
0.5
0.15
A2
0.80
1.05
b
0.19
0.30
c
0.09
0.20
D
9.60
9.80
E
6.40 Basic
E1
4.30
4.50
e
0.65 Basic
L
0.45
0.75
α
0°
8°
aaa
0.10
Reference Document: JEDEC Publication 95, MO-153
IDT™ / ICS™ LVPECL FANOUT BUFFER
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ICS8538BG-31 REV. B FEBRUARY 5, 2008
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LOW SKEW, 1-TO-8, CRYSTAL OSCILLATOR/LVCMOS-TO-3.3V LVPECL FANOUT BUFFER
Ordering Information
Table 10. Ordering Information
Part/Order Number
ICS8538BG-31
ICS8538BG-31T
ICS8538BG-31LF
ICS8538BG-31LFT
Marking
ICS8538BG-31
ICS8538BG-31
ICS8538BG-31LF
ICS8538BG-31LF
Package
28 Lead TSSOP
28 Lead TSSOP
“Lead-Free” 28 Lead TSSOP
“Lead-Free” 28 Lead TSSOP
Shipping Packaging
Tube
1000 Tape & Reel
Tube
1000 Tape & Reel
Temperature
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
NOTE: Parts that are ordered with an "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for
the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use
in normal commercial applications. Any other applications, such as those requiring extended temperature ranges, high reliability or other extraordinary environmental requirements
are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any
IDT product for use in life support devices or critical medical instruments.
IDT™ / ICS™ LVPECL FANOUT BUFFER
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ICS8538BG-31 REV. B FEBRUARY 5, 2008
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LOW SKEW, 1-TO-8, CRYSTAL OSCILLATOR/LVCMOS-TO-3.3V LVPECL FANOUT BUFFER
Revision History Sheet
Rev
Table
Page
A
T10
13
Ordering Information table - added Lead-Free marking.
5
AC Characteristics Table - changed Output Rise/Fall parameters from 500ps min. to
200ps min., and 850ps max. to 700ps max.
Power Considerations - updated Junction Temperature equation with worst case
thermal resistance of 0 lfpm at 49.8°C/W.
B
T6
9
Description of Change
IDT™ / ICS™ LVPECL FANOUT BUFFER
Date
13
1/18/08
2/5/08
ICS8538BG-31 REV. B FEBRUARY 5, 2008
ICS8538-31
LOW SKEW, 1-TO-8, CRYSTAL OSCILLATOR/LVCMOS-TO-3.3V LVPECL FANOUT BUFFER
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