ICS ICS8535-21

ICS8535-21
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-2
LVCMOS/LVTTL-TO-3.3V LVPECL FANOUT BUFFER
GENERAL DESCRIPTION
FEATURES
The ICS8535-21 is a low skew, high performance
1-to-2 LVCMOS/LVTTL-to-3.3V LVPECL fanout
HiPerClockS™
buffer and a member of the HiPerClockS™ family of High Performance Clock Solutions from
ICS. The ICS8535-21 has two single-ended clock
inputs. The single-ended clock input accepts LVCMOS or
LVTTL input levels and translate them to 3.3V LVPECL levels. The clock enable is internally synchronized to eliminate
runt clock pulses on the output during asynchronous assertion/deassertion of the clock enable pin.
• 2 differential 3.3V LVPECL outputs
Guaranteed output and part-to-part skew characteristics
make the ICS8535-21 ideal for those applications demanding well defined performance and repeatability.
• Output skew: 20ps (maximum)
ICS
• Selectable CLK0 or CLK1 inputs for redundant
and multiple frequency fanout applications
• CLK0 or CLK1 can accept the following input levels:
LVCMOS or LVTTL
• Maximum output frequency: 266MHz
• Translates LVCMOS and LVTTL levels to
3.3V LVPECL levels
• Part-to-part skew: 300ps (maximum)
• Propagation delay: 1.6ns (maximum)
• Additive phase jitter, RMS: 0.03ps (typical)
• 3.3V operating supply
• 0°C to 70°C ambient operating temperature
• Industrial temperature information available upon request
BLOCK DIAGRAM
PIN ASSIGNMENT
D
CLK_EN
Q
VEE
CLK_EN
CLK_SEL
CLK0
VEE
CLK1
VCC
LE
CLK0
0
CLK1
1
Q0
nQ0
Q1
nQ1
1
2
3
4
5
6
7
14
13
12
11
10
9
8
VCC
Q0
nQ0
nc
Q1
nQ1
VCC
CLK_SEL
ICS8535-21
14-Lead TSSOP
4.4mm x 5.0mm x 0.92mm body package
G Package
Top View
8535AG-21
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1
REV. A OCTOBER 20, 2004
ICS8535-21
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-2
LVCMOS/LVTTL-TO-3.3V LVPECL FANOUT BUFFER
TABLE 1. PIN DESCRIPTIONS
Number
Name
Type
Description
1, 5
VEE
Power
2
CLK_EN
Input
3
CLK_SEL
Input
4
CLK0
Input
Negative supply pins.
Synchronizing clock enable. When HIGH, clock outputs follow clock input.
Pullup
When LOW, Q outputs are forced low, nQ outputs are forced high.
LVCMOS / LVTTL interface levels.
Clock select input. When HIGH, selects CLK1 input.
Pulldown
When LOW, selects CLK0 input. LVCMOS / LVTTL interface levels.
Pulldown LVCMOS / LVTTL clock input.
6
CLK1
Input
Pulldown LVCMOS / LVTTL clock input.
7, 8, 14
VCC
Power
Positive supply pins.
9, 10
nQ1, Q1
Output
Differential output pair. LVPECL interface levels.
11
nc
Unused
No connect.
12 , 13
nQ0, Q0
Output
Differential output pair. LVPECL interface levels.
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
TABLE 2. PIN CHARACTERISTICS
Symbol
Parameter
Test Conditions
Minimum
Typical
Maximum
Units
CIN
Input Capacitance
4
pF
RPULLUP
Input Pullup Resistor
51
KΩ
RPULLDOWN
Input Pulldown Resistor
51
KΩ
8535AG-21
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2
REV. A OCTOBER 20, 2004
ICS8535-21
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-2
LVCMOS/LVTTL-TO-3.3V LVPECL FANOUT BUFFER
TABLE 3A. CONTROL INPUT FUNCTION TABLE
Inputs
Outputs
CLK_EN
0
CLK_SEL
0
Selected Source
CLK0
Q0, Q1
Disabled; LOW
nQ0, nQ1
Disabled; HIGH
0
1
CLK1
Disabled; LOW
Disabled; HIGH
1
0
CLK0
Enabled
Enabled
1
1
CLK1
Enabled
Enabled
After CLK_EN switches, the clock outputs are disabled or enabled following a rising and falling input clock edge
as show in Figure 1.
In the active mode, the state of the outputs are a function of the CLK0 and CLK1 inputs as described in Table 3B.
Enabled
Disabled
CLK0, CLK1
CLK_EN
nQ0, nQ1
Q0, Q1
FIGURE 1. CLK_EN TIMING DIAGRAM
TABLE 3B. CLOCK INPUT FUNCTION TABLE
Inputs
CLK0 or CLK1
0
1
8535AG-21
Outputs
Q0, Q1
LOW
HIGH
nQ0, nQ1
HIGH
LOW
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3
REV. A OCTOBER 20, 2004
ICS8535-21
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-2
LVCMOS/LVTTL-TO-3.3V LVPECL FANOUT BUFFER
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, VCC
4.6V
Inputs, VI
-0.5V to VCC + 0.5V
Outputs, IO
Continuous Current
Surge Current
50mA
100mA
Package Thermal Impedance, θJA
93.2°C/W (0 lfpm)
Storage Temperature, TSTG
-65°C to 150°C
NOTE: Stresses beyond those listed under Absolute
Maximum Ratings may cause permanent damage to the
device. These ratings are stress specifications only. Functional
operation of product at these conditions or any conditions
beyond those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect product reliability.
TABLE 4A. POWER SUPPLY DC CHARACTERISTICS, VCC = 3.3V±5%, TA = 0°C TO 70°C
Symbol
Parameter
Test Conditions
VCC
Positive Supply Voltage
IEE
Power Supply Current
Minimum
Typical
Maximum
Units
3.135
3.3
3.465
V
50
mA
Maximum
Units
2
VCC + 0.3
V
TABLE 4B. LVCMOS / LVTTL DC CHARACTERISTICS, VCC = 3.3V±5%, TA = 0°C TO 70°C
Symbol
Parameter
VIH
Input High Voltage
VIL
Input Low Voltage
IIH
Input High Current
IIL
Input Low Current
Test Conditions
Minimum
CLK0, CLK1
Typical
2
VCC + 0.3
V
CLK0, CLK1
-0.3
1.3
V
CLK_EN, CLK_SEL
-0.3
0.8
V
CLK_EN, CLK_SEL
CLK0, CLK1, CLK_SEL
VIN = VCC = 3.465V
150
µA
CLK_EN
VIN = VCC = 3.465V
5
µA
CLK0, CLK1, CLK_SEL
VIN = 0V, VCC = 3.465V
-5
µA
CLK_EN
VIN = 0V, VCC = 3.465V
-150
µA
TABLE 4C. LVPECL DC CHARACTERISTICS, VCC = 3.3V±5%, TA = 0°C TO 70°C
Symbol
Parameter
Test Conditions
Minimum
Typical
Maximum
Units
VOH
Output High Voltage; NOTE 1
VCC - 1.4
VCC - 0.9
V
VOL
Output Low Voltage; NOTE 1
VCC - 2.0
VCC - 1.7
V
VSWING
Peak-to-Peak Output Voltage Swing
0.6
1.0
V
NOTE 1: Outputs terminated with 50Ω to VCC - 2V.
8535AG-21
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4
REV. A OCTOBER 20, 2004
ICS8535-21
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-2
LVCMOS/LVTTL-TO-3.3V LVPECL FANOUT BUFFER
TABLE 5. AC CHARACTERISTICS, VCC = 3.3V±5%, TA = 0°C TO 70°C
Symbol
Parameter
fMAX
Output Frequency
Test Conditions
Minimum
Maximum
Units
266
MHz
tPD
Propagation Delay; NOTE 1
1.6
ns
t sk(o)
Output Skew; NOTE 2, 5
20
ps
t sk(pp)
Par t-to-Par t Skew; NOTE 3, 5
Buffer Additive Phase Jitter, RMS;
refer to Additive Phase Jitter
Section, NOTE 4
Output Rise/Fall Time
300
ps
t jit
tR/tF
IJ 266MHz
Typical
1.0
156.25MHz @ Integration
Range: 12KHz - 20MHz
20% to 80% @ 50MHz
0.03
300
odc
Output Duty Cycle
IJ 200MHz
45
All parameters measured at IJ 266MHz unless noted otherwise.
The cycle-to-cycle jitter on the input will equal the jitter on the output. The par t does not add jitter.
NOTE 1: Measured from the VCC/2 of the input to the differential output crossing point.
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions.
Measured at the output differential cross points.
NOTE 3: Defined as skew between outputs on different devices operating at the same supply voltages
and with equal load conditions. Using the same type of inputs on each device, the outputs are measured
at the differential cross points.
NOTE 4: Driving only one input clock.
NOTE 5: This parameter is defined in accordance with JEDEC Standard 65.
8535AG-21
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5
ps
600
ps
55
%
REV. A OCTOBER 20, 2004
Integrated
Circuit
Systems, Inc.
ICS8535-21
LOW SKEW, 1-TO-2
LVCMOS/LVTTL-TO-3.3V LVPECL FANOUT BUFFER
ADDITIVE PHASE JITTER
in the 1Hz band to the power in the fundamental. When the
required offset is specified, the phase noise is called a dBc
value, which simply means dBm at a specified offset from the
fundamental. By investigating jitter in the frequency domain,
we get a better understanding of its effects on the desired application over the entire time record of the signal. It is mathematically possible to calculate an expected bit error rate given
a phase noise plot.
The spectral purity in a band at a specific offset from the fundamental compared to the power of the fundamental is called
the dBc Phase Noise. This value is normally expressed using
a Phase noise plot and is most often the specified plot in many
applications. Phase noise is defined as the ratio of the noise
power present in a 1Hz band at a specified offset from the
fundamental frequency to the power value of the fundamental.
This ratio is expressed in decibels (dBm) or a ratio of the power
0
-10
Input/Output Additive Phase Jitter,
-20
Integration Range: 12KHz - 20MHz at
156.25MHz = 0.03ps (typical)
-30
-40
SSB PHASE NOISE dBc/HZ
-50
-60
-70
-80
-90
-100
-110
-120
-130
-140
-150
-160
-170
-180
-190
1k
10k
100k
1M
10M
100M
OFFSET FROM CARRIER FREQUENCY (HZ)
device meets the noise floor of what is shown, but can actually
be lower. The phase noise is dependant on the input source
and measurement equipment.
As with most timing specifications, phase noise measurements
have issues. The primary issue relates to the limitations of the
equipment. Often the noise floor of the equipment is higher
than the noise floor of the device. This is illustrated above. The
8535AG-21
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6
REV. A OCTOBER 20, 2004
ICS8535-21
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-2
LVCMOS/LVTTL-TO-3.3V LVPECL FANOUT BUFFER
PARAMETER MEASUREMENT INFORMATION
2V
VCC
Qx
SCOPE
PART 1
nQx
Qx
LVPECL
PART 2
nQy
nQx
VEE
Qy
t sk(pp)
-1.3V ± 0.165V
3.3V OUTPUT LOAD AC TEST CIRCUIT
PART-TO-PART SKEW
nQx
80%
80%
Qx
VSW I N G
Clock
Outputs
nQy
20%
20%
tF
tR
Qy
t sk(o)
OUTPUT RISE/FALL TIME
OUTPUT SKEW
nQ0, nQ1
CLK0,
CLK1
Q0, Q1
Pulse Width
t
nQ0, nQ1
Q0, Q1
odc =
tPD
PERIOD
t PW
t PERIOD
OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD
PROPAGATION DELAY
8535AG-21
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7
REV. A OCTOBER 20, 2004
ICS8535-21
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-2
LVCMOS/LVTTL-TO-3.3V LVPECL FANOUT BUFFER
APPLICATION INFORMATION
TERMINATION FOR LVPECL OUTPUTS
drive 50Ω transmission lines. Matched impedance techniques
should be used to maximize operating frequency and minimize
signal distortion. Figures 2A and 2B show two different layouts
which are recommended only as guidelines. Other suitable
clock layouts may exist and it would be recommended that the
board designers simulate to guarantee compatibility across all
printed circuit and clock component process variations.
The clock layout topology shown below is a typical termination for LVPECL outputs. The two different layouts mentioned
are recommended only as guidelines.
FOUT and nFOUT are low impedance follower outputs that
generate ECL/LVPECL compatible outputs. Therefore, terminating resistors (DC current path to ground) or current sources
must be used for functionality. These outputs are designed to
3.3V
Zo = 50Ω
125Ω
FOUT
FIN
Zo = 50Ω
Zo = 50Ω
FOUT
50Ω
1
RTT =
Z
((VOH + VOL) / (VCC – 2)) – 2 o
FIN
50Ω
Zo = 50Ω
VCC - 2V
RTT
84Ω
FIGURE 2A. LVPECL OUTPUT TERMINATION
8535AG-21
125Ω
84Ω
FIGURE 2B. LVPECL OUTPUT TERMINATION
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8
REV. A OCTOBER 20, 2004
ICS8535-21
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-2
LVCMOS/LVTTL-TO-3.3V LVPECL FANOUT BUFFER
SCHEMATIC EXAMPLE
Figure 3 shows a schematic example of the ICS8535-21. The
decoupling capacitors should be physically located near the
power pin. For ICS8535-21, the unused clock outputs can be
left floating.
Zo = 50
+
Zo = 50
VCC = 3.3V
R2
50
CLK1
1
2
3
4
5
6
7
R1
50
R3
50
U2
CLK_EN
CLK_SEL
CLK0
-
VEE
CLK_EN
CLK_SEL
CLK0
VEE
CLK1
VCC
VCC
Q0
nQ0
nc
Q1
nQ1
VCC
14
13
12
11
10
9
8
8535-21
Vcco = 3.3V
R4
133
VCC
C1
10uf
(U1-7)
(U1-8)
C2
.1uF
(U1-14)
C3
.1uF
R6
133
Zo = 50
C4
.1uF
+
Zo = 50
R5
82.5
R7
82.5
Optional Termination
FIGURE 3. ICS8535-21 LVPECL BUFFER SCHEMATIC EXAMPLE
8535AG-21
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9
REV. A OCTOBER 20, 2004
Integrated
Circuit
Systems, Inc.
ICS8535-21
LOW SKEW, 1-TO-2
LVCMOS/LVTTL-TO-3.3V LVPECL FANOUT BUFFER
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS8535-21.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS8535-21 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
•
•
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 50mA = 173.25mW
Power (outputs)MAX = 30mW/Loaded Output pair
If all outputs are loaded, the total power is 2 x 30mW = 60mW
Total Power_MAX (3.465V, with all outputs switching) = 173.25mW + 60mW = 233.25mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of
the device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = Junction Temperature
θJA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming a
moderate air low of 200 linear feet per minute and a multi-layer board, the appropriate value is 85.5°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.233W * 85.5°C/W = 90°C. This is well below the limit of 125°C.
This calculation is only an example, and the Tj will obviously vary depending on the number of outputs that are loaded, supply
voltage, air flow, and the type of board (single layer or multi-layer).
TABLE 6. THERMAL RESISTANCE θ JA FOR 14-PIN TSSOP, FORCED CONVECTION
θ JA by Velocity (Linear Feet per Minute)
0
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
146.4°C/W
93.2°C/W
200
125.2°C/W
85.5°C/W
500
112.1°C/W
81.2°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
8535AG-21
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REV. A OCTOBER 20, 2004
ICS8535-21
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-2
LVCMOS/LVTTL-TO-3.3V LVPECL FANOUT BUFFER
3. Calculations and Equations.
The purpose of this section is to derive the power dissipated into the load.
LVPECL output driver circuit and termination are shown in Figure 4.
VCC
Q1
VOUT
RL
50
VCC - 2V
FIGURE 4. LVPECL DRIVER CIRCUIT AND TERMINATION
To calculate worst case power dissipation into the load, use the following equations which assume a 50Ω load, and a
termination voltage of V - 2V.
CC
•
For logic high, VOUT = V
OH_MAX
(V
CC_MAX
•
-V
OH_MAX
OL_MAX
CC_MAX
-V
OL_MAX
CC_MAX
– 0.9V
) = 0.9V
For logic low, VOUT = V
(V
=V
=V
CC_MAX
– 1.7V
) = 1.7V
Pd_H is power dissipation when the output drives high.
Pd_L is the power dissipation when the output drives low.
Pd_H = [(V
OH_MAX
– (V
CC_MAX
- 2V))/R ] * (V
CC_MAX
L
-V
OH_MAX
) = [(2V - (V
CC_MAX
-V
OH_MAX
))/R ] * (V
CC_MAX
L
-V
OH_MAX
)=
[(2V - 0.9V)/50Ω] * 0.9V = 19.8mW
Pd_L = [(V
OL_MAX
– (V
CC_MAX
- 2V))/R ] * (V
L
CC_MAX
-V
OL_MAX
) = [(2V - (V
CC_MAX
-V
OL_MAX
))/R ] * (V
L
CC_MAX
-V
OL_MAX
)=
[(2V - 1.7V)/50Ω] * 1.7V = 10.2mW
Total Power Dissipation per output pair = Pd_H + Pd_L = 30mW
8535AG-21
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11
REV. A OCTOBER 20, 2004
ICS8535-21
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-2
LVCMOS/LVTTL-TO-3.3V LVPECL FANOUT BUFFER
RELIABILITY INFORMATION
TABLE 7. θJAVS. AIR FLOW TABLE FOR 14 LEAD TSSOP
θ JA by Velocity (Linear Feet per Minute)
0
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
146.4°C/W
93.2°C/W
200
125.2°C/W
85.5°C/W
500
112.1°C/W
81.2°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
TRANSISTOR COUNT
The transistor count for ICS8535-21 is: 412
8535AG-21
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REV. A OCTOBER 20, 2004
ICS8535-21
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-2
LVCMOS/LVTTL-TO-3.3V LVPECL FANOUT BUFFER
PACKAGE OUTLINE - G SUFFIX FOR 14 LEAD TSSOP
TABLE 8. PACKAGE DIMENSIONS
Millimeters
SYMBOL
Minimum
N
A
Maximum
14
--
1.20
A1
0.05
0.15
A2
0.80
1.05
b
0.19
0.30
c
0.09
0.20
D
4.90
5.10
E
E1
6.40 BASIC
4.30
e
4.50
0.65 BASIC
L
0.45
α
0°
8°
aaa
--
0.10
0.75
REFERENCE DOCUMENT: JEDEC PUBLICATION 95, MO-153
8535AG-21
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13
REV. A OCTOBER 20, 2004
<
ICS8535-21
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-2
LVCMOS/LVTTL-TO-3.3V LVPECL FANOUT BUFFER
TABLE 9. ORDERING INFORMATION
Part/Order Number
Marking
Package
Count
Temperature
ICS8535AG-21
8535AG21
14 lead TSSOP
94 per tube
0°C to 70°C
ICS8535AG-21T
8535AG21
14 lead TSSOP on Tape and Reel
2500
0°C to 70°C
The aforementioned trademark, HiPerClockS™ is a trademark of Integrated Circuit Systems, Inc. or its subsidiaries in the United States and/or other countries.
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorporated (ICS) assumes no responsibility for either its use or
for infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal
commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use
in life support devices or critical medical instruments.
8535AG-21
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14
REV. A OCTOBER 20, 2004