V I S H AY I N T E R T E C H N O L O G Y, I N C . POWER MODULES VS-GP100TS60SFPbF, VS-GP250SA60S, VS-GP300TD60S, and VS-GP400TD60S IGBT Power Modules Increase Efficiency and Reduce Conduction Losses in TIG Welding Machines KEY BENEFITS • • • • • • • • • • • Trench PT IGBT technology Low collector-to-emitter voltages down to 1.10 V Turn-off switching energy down to 11 mJ HEXFRED® and FRED Pt® anti-parallel diodes (half-bridge devices) INT-A-PAK, low-profile Dual INT-A-PAK, and SOT-227 packages Low stray inductance of ≤ 5 nH typical (VS-GP250SA60S) Operating frequencies to 1 kHz 600 V collector-to-emitter voltages Continuous collector current from 100 A to 400 A Direct mounting to heatsinks RoHS-compliant APPLICATIONS • Output inverter stages for TIG welding machines RESOURCES • Datasheet: see back page • For technical questions contact [email protected], [email protected], [email protected] • Material categorization: For definitions of compliance, please see www.vishay.com/99912 PRODUCT SHEET 1/2 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 A WORLD OF SOLUTIONS VMN-PT0466-1511 www.vishay.com V I S H AY I N T E R T E C H N O L O G Y, I N C . POWER MODULES VS-GP100TS60SFPbF, VS-GP250SA60S, VS-GP300TD60S, and VS-GP400TD60S Four half-bridge and single-switch IGBT power modules designed specifically for TIG welding machines are now available. Built on Vishay’s proprietary Trench PT IGBT technology, the VS-GP100TS60SFPBF, VS-GP250SA60S, VS-GP300TD60S, and VS-GP400TD60S provide extremely low collector-to-emitter voltages down to 1.10 V and turn-off switching energy down to 11 mJ for output inverter stages. • Smaller size than planar IGBTs for higher current density and lower thermal resistance (junction-to-case) without compromising on performance • Low collector-to-emitter voltage enables extremely low conduction losses • Turn-off switching energy is 50 % lower than previous-generation devices for increased efficiency and long-term reliability • Dual INT-A-PAK package features an extremely low profile of 17 mm • Low EMI reduces snubbing requirements PART # VS-GP100TS60SFPBF VS-GP250SA60S VS-GP300TD60S VS-GP400TD60S IC 100 A 250 A 300 A 400 A VCE(ON) 1.16 V 1.10 V 1.30 V 1.30 V PACKAGE INT-A-PAK SOT-227 DIAP, low profile DIAP, low profile Eoff 15.3 mJ 11 mJ 33 mJ 45 mJ CIRCUIT Half Bridge Single Switch Half Bridge Half Bridge IGBT Trench PT Trench PT Trench PT Trench PT DIODE FRED Pt® None HEXFRED® HEXFRED® PRODUCT SHEET 2/2 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VMN-PT0466-1511 www.vishay.com