TP8 www.vishay.com Vishay Sprague Solid Tantalum Chip Capacitors, MICROTAN®, High CV Leadframeless Molded Automotive Grade FEATURES • Highest capacitance-voltage product in industry in given case size • Small sizes include 0603 footprint • Lead (Pb)free L-shaped terminations • AEC-Q200 qualified. PPAP available upon request • 8 mm tape and reel packaging available per EIA-481 • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 PERFORMANCE/ELECTRICAL CHARACTERISTICS Capacitance Range: 1.0 μF to 100 μF Capacitance Tolerance: ± 10 %, ± 20 % Voltage Rating: 6.3 VDC to 40 VDC www.vishay.com/doc?40215 Operating Temperature: -55 °C to +125 °C (above 85 °C, voltage derating is required) ORDERING INFORMATION TP8 M 105 M 010 C TYPE CASE CODE CAPACITANCE CAPACITANCE TOLERANCE DC VOLTAGE RATING AT +85 °C TERMINATION/ PACKAGING See Ratings and Case Codes table. This is expressed in picofarads. The first two digits are the significant figures. The third is the number of zeros to follow. K = ± 10 % M = ± 20 % This is expressed in V. To complete the three-digit block, zeros precede the voltage rating. A decimal point is indicated by an “R” (6R3 = 6.3 V). C = 100 % tin 7" [178 mm] reel Note • We reserve the right to supply higher voltage ratings and tighter capacitance tolerance capacitors in the same case size. Voltage substitutions will be marked with the higher voltage rating. DIMENSIONS in inches [millimeters] Anode Termination W C P1 CASE CODE M W R P A N T B Revision: 11-May-16 Anode Polarity Bar P2 L 0.063 ± 0.008 [1.60 ± 0.2] 0.079 ± 0.008 [2.00 ± 0.2] 0.081 ± 0.008 [2.05 ± 0.2] 0.094 ± 0.004 [2.4 ± 0.1] 0.126 ± 0.008 [3.2 ± 0.2] 0.138 ± 0.008 [3.5 ± 0.2] 0.138 ± 0.008 [3.5 ± 0.2] 0.138 ± 0.008 [3.5 ± 0.2] Cathode Termination H L P1 W 0.033 ± 0.008 [0.85 ± 0.2] 0.050 ± 0.008 [1.25 ± 0.2] 0.053 ± 0.008 [1.35 ± 0.2] 0.057 ± 0.004 [1.45 ± 0.1] 0.063 ± 0.008 [1.6 ± 0.2] 0.112 ± 0.008 [2.8 ± 0.2] 0.112 ± 0.008 [2.8 ± 0.2] 0.112 ± 0.008 [2.8 ± 0.2] H (MAX.) 0.035 [0.9] 0.048 [1.2] 0.063 [1.6] 0.047 [1.2] 0.071 [1.8] 0.048 [1.2] 0.063 [1.6] 0.08 [2.0] P1 0.020 ± 0.004 [0.50 ± 0.1] 0.020 ± 0.004 [0.50 ± 0.1] 0.020 ± 0.004 [0.50 ± 0.1] 0.020 ± 0.004 [0.50 ± 0.1] 0.031 ± 0.004 [0.80 ± 0.1] 0.031 ± 0.008 [0.80 ± 0.2] 0.031 ± 0.008 [0.80 ± 0.2] 0.031 ± 0.008 [0.80 ± 0.2] P2 (REF.) 0.024 [0.60] 0.040 [1.00] 0.043 [1.1] 0.057 [1.40] 0.063 [1.60] 0.077 [1.95] 0.077 [1.95] 0.077 [1.95] C 0.024 ± 0.004 [0.60 ± 0.1] 0.035 ± 0.004 [0.90 ± 0.1] 0.035 ± 0.004 [0.9 ± 0.1] 0.035 ± 0.004 [0.90 ± 0.1] 0.047 ± 0.004 [1.20 ± 0.1] 0.094 ± 0.004 [2.4 ± 0.1] 0.094 ± 0.004 [2.4 ± 0.1] 0.094 ± 0.004 [2.4 ± 0.1] Document Number: 40151 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TP8 www.vishay.com Vishay Sprague RATINGS AND CASE CODES μF 6.3 V 1.0 10 V 16 V 20 V 25 V 40 V M M M/W R P 2.2 M 3.3 4.7 M 6.8 10 M M R M P W N/B R 15 R 22 A 47 A/R P A T/B 100 A MARKING VOLTAGE CODE CAPACITANCE CODE P, R, W-Case M-Case V Voltage code Polarity bar N, T, B-Case Voltage 47 10 2 Revision: 11-May-16 CAP, μF CODE Polarity bar A Polarity bar Capacitance CODE Vishay marking 6.3 J 1.0 A 10 A 2.2 J 16 C 3.3 N 20 D 4.7 S 25 E 6.8 W 35 V 10 40 g 15 e 50 T 22 j 33 n 47 s 68 w 100 A Voltage Capacitance code code AW A-Case Polarity bar Voltage EIA capacitance code (pF) code J 107 Document Number: 40151 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TP8 www.vishay.com Vishay Sprague STANDARD RATINGS CAPACITANCE (μF) CASE CODE PART NUMBER MAX. DCL AT +25 °C (μA) MAX. DF AT +25 °C 120 Hz (%) MAX. ESR AT +25 °C 100 kHz () MAX. RIPPLE 100 kHz IRMS (A) 8 6 0.06 6.3 VDC AT +85 °C; 4 VDC AT +125 °C 4.7 M TP8M475M6R3C 0.50 10 M TP8M106M6R3C 0.63 8 5 0.07 100 A TP8A107(1)6R3C 6.30 30 3 0.16 10 VDC AT +85 °C; 7 VDC AT +125 °C 1.0 M TP8M105M010C 0.50 6 12 0.05 3.3 M TP8M335(1)010C 0.50 8 6 0.06 4.7 M TP8M475M010C 0.50 8 6 0.06 6.8 W TP8W685(1)010C 0.68 8 8 0.06 10 R TP8R106(1)010C 1.00 8 8 0.08 15 R TP8R156(1)010C 1.50 8 5 0.09 22 A TP8A226(1)010C 2.20 8 8 0.10 47 B TP8B476(1)010C 4.70 8 2 0.20 47 T TP8T476(1)010C 4.70 8 1 0.29 16 VDC AT +85 °C; 10 VDC AT +125 °C 1.0 M TP8M105M016C 0.50 6 12 0.05 2.2 M TP8M225M016C 0.50 10 12 0.05 10 A TP8A106(1)016C 1.60 8 6 0.11 10 R TP8R106(1)016C 1.60 8 8 0.08 6 12 0.05 20 VDC AT +85 °C; 13 VDC AT +125 °C 1.0 M TP8M105M020C 0.50 1.0 W TP8W105M020C 0.50 8 8 0.06 3.3 R TP8R335(1)020C 0.70 8 8 0.08 4.7 P TP8P475(1)020C 0.90 6 6 0.09 6.8 B TP8B685(1)020C 1.36 8 6 0.12 6.8 N TP8N685(1)020C 1.36 8 6 0.11 10 A TP8A106(1)020C 2.00 8 3 0.16 25 VDC AT +85 °C; 17 VDC AT +125 °C 1.0 R TP8R105(1)025C 0.50 6 10 0.07 4.7 P TP8P475(1)025C 1.20 6 6 0.09 8 10 0.07 40 VDC AT +85 °C; 28 VDC AT +125 °C 1.0 P TP8P105(1)040C 0.50 Note • Part number definition: (1) Tolerance: For 10 % tolerance, specify “K”; for 20 % tolerance, change to “M” Revision: 11-May-16 Document Number: 40151 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TP8 www.vishay.com Vishay Sprague AEC-Q200 QUALIFICATION TESTING NO. 1 3 4 7 8 9 10 12 13 14 15 17 18 19 22 AEC-Q200 TEST ITEM Pre- and post stress electrical test High temperature exposure (storage) Temperature cycling Biased humidity Operational life External visual Physical dimension Resistance to solvents Mechanical shock Vibration Resistance to soldering heat ESD Solderability (1) Electrical characterization Terminal strength (SMD) REFERENCE Internal spec AEC-Q200 AEC-Q200 AEC-Q200 AEC-Q200 AEC-Q200 AEC-Q200 AEC-Q200 AEC-Q200 AEC-Q200 AEC-Q200 AEC-Q200 AEC-Q200 Internal spec AEC-Q200 Note (1) Exception: Instead of Solder Bath/Dip and Look Test (J-STD-002, method B at 215 °C, category 3) was performed “Method 2 - Surface Mount Process Simulation Test” per JESD22-B102E as specified in AEC-Q005 REV-A. STANDARD PACKAGING QUANTITY CASE CODE M W R P A N T B QUANTITY (pcs/reel) 7" REEL 4000 2500 2500 3000 2000 2500 2500 2000 POWER DISSIPATION CASE CODE M W R P A N T B PRODUCT INFORMATION Micro Guide Moisture Sensitivity SELECTOR GUIDES Solid Tantalum Selector Guide FAQ Frequently Asked Questions Revision: 11-May-16 MAXIMUM PERMISSIBLE POWER DISSIPATION AT +25 °C (W) IN FREE AIR 0.025 0.040 0.045 0.045 0.075 0.075 0.084 0.085 www.vishay.com/doc?40115 www.vishay.com/doc?40135 www.vishay.com/doc?49053 www.vishay.com/doc?40110 Document Number: 40151 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Micro Guide www.vishay.com Vishay Sprague Guide for Leadframeless Molded Tantalum Capacitors INTRODUCTION Tantalum electrolytic capacitors are the preferred choice in applications where volumetric efficiency, stable electrical parameters, high reliability, and long service life are primary considerations. The stability and resistance to elevated temperatures of the tantalum / tantalum oxide / manganese dioxide system make solid tantalum capacitors an appropriate choice for today’s surface mount assembly technology. Vishay Sprague has been a pioneer and leader in this field, producing a large variety of tantalum capacitor types for consumer, industrial, automotive, military, and aerospace electronic applications. Tantalum is not found in its pure state. Rather, it is commonly found in a number of oxide minerals, often in combination with Columbium ore. This combination is known as “tantalite” when its contents are more than one-half tantalum. Important sources of tantalite include Australia, Brazil, Canada, China, and several African countries. Synthetic tantalite concentrates produced from tin slags in Thailand, Malaysia, and Brazil are also a significant raw material for tantalum production. Electronic applications, and particularly capacitors, consume the largest share of world tantalum production. Other important applications for tantalum include cutting tools (tantalum carbide), high temperature super alloys, chemical processing equipment, medical implants, and military ordnance. Vishay Sprague is a major user of tantalum materials in the form of powder and wire for capacitor elements and rod and sheet for high temperature vacuum processing. Rating for rating, tantalum capacitors tend to have as much as three times better capacitance / volume efficiency than aluminum electrolytic capacitors. An approximation of the capacitance / volume efficiency of other types of capacitors may be inferred from the following table, which shows the dielectric constant ranges of the various materials used in each type. Note that tantalum pentoxide has a dielectric constant of 26, some three times greater than that of aluminum oxide. This, in addition to the fact that extremely thin films can be deposited during the electrolytic process mentioned earlier, makes the tantalum capacitor extremely efficient with respect to the number of microfarads available per unit volume. The capacitance of any capacitor is determined by the surface area of the two conducting plates, the distance between the plates, and the dielectric constant of the insulating material between the plates. COMPARISON OF CAPACITOR DIELECTRIC CONSTANTS DIELECTRIC Air or Vacuum Paper 1.0 2.0 to 6.0 Plastic 2.1 to 6.0 Mineral Oil 2.2 to 2.3 Silicone Oil 2.7 to 2.8 Quartz 3.8 to 4.4 Glass 4.8 to 8.0 Porcelain 5.1 to 5.9 Mica 5.4 to 8.7 THE BASICS OF TANTALUM CAPACITORS Aluminum Oxide Most metals form crystalline oxides which are non-protecting, such as rust on iron or black oxide on copper. A few metals form dense, stable, tightly adhering, electrically insulating oxides. These are the so-called “valve” metals and include titanium, zirconium, niobium, tantalum, hafnium, and aluminum. Only a few of these permit the accurate control of oxide thickness by electrochemical means. Of these, the most valuable for the electronics industry are aluminum and tantalum. Capacitors are basic to all kinds of electrical equipment, from radios and television sets to missile controls and automobile ignitions. Their function is to store an electrical charge for later use. Capacitors consist of two conducting surfaces, usually metal plates, whose function is to conduct electricity. They are separated by an insulating material or dielectric. The dielectric used in all tantalum electrolytic capacitors is tantalum pentoxide. Tantalum pentoxide compound possesses high-dielectric strength and a high-dielectric constant. As capacitors are being manufactured, a film of tantalum pentoxide is applied to their electrodes by means of an electrolytic process. The film is applied in various thicknesses and at various voltages and although transparent to begin with, it takes on different colors as light refracts through it. This coloring occurs on the tantalum electrodes of all types of tantalum capacitors. Tantalum Pentoxide Revision: 09-Mar-16 e DIELECTRIC CONSTANT Ceramic 8.4 26 12 to 400K In the tantalum electrolytic capacitor, the distance between the plates is very small since it is only the thickness of the tantalum pentoxide film. As the dielectric constant of the tantalum pentoxide is high, the capacitance of a tantalum capacitor is high if the area of the plates is large: eA C = ------t where C = capacitance e = dielectric constant A = surface area of the dielectric t = thickness of the dielectric Tantalum capacitors contain either liquid or solid electrolytes. In solid electrolyte capacitors, a dry material (manganese dioxide) forms the cathode plate. A tantalum lead is embedded in or welded to the pellet, which is in turn connected to a termination or lead wire. The drawings show the construction details of the surface mount types of tantalum capacitors shown in this catalog. Document Number: 40115 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Micro Guide www.vishay.com Vishay Sprague SOLID ELECTROLYTE TANTALUM CAPACITORS Solid electrolyte capacitors contain manganese dioxide, which is formed on the tantalum pentoxide dielectric layer by impregnating the pellet with a solution of manganous nitrate. The pellet is then heated in an oven, and the manganous nitrate is converted to manganese dioxide. The pellet is next coated with graphite, followed by a layer of metallic silver, which provides a conductive surface between the pellet and the leadframe. Molded chip tantalum capacitor encases the element in plastic resins, such as epoxy materials. After assembly, the capacitors are tested and inspected to assure long life and reliability. It offers excellent reliability and high stability for consumer and commercial electronics with the added feature of low cost. Surface mount designs of “Solid Tantalum” capacitors use lead frames or lead frameless designs as shown in the accompanying drawings. Side Cathode Termination (-) Voltage Code Excluding 0402 (1005 metric) case size TANTALUM CAPACITORS FOR ALL DESIGN CONSIDERATIONS Solid electrolyte designs are the least expensive for a given rating and are used in many applications where their very small size for a given unit of capacitance is of importance. They will typically withstand up to about 10 % of the rated DC working voltage in a reverse direction. Also important are their good low temperature performance characteristics and freedom from corrosive electrolytes. Vishay Sprague patented the original solid electrolyte capacitors and was the first to market them in 1956. Vishay Sprague has the broadest line of tantalum capacitors and has continued its position of leadership in this field. Data sheets covering the various types and styles of Vishay Sprague capacitors for consumer and entertainment electronics, industry, and military applications are available where detailed performance characteristics must be specified. Epoxy Resin Encapsulation Polarity Bar Marking Sintered Tantalum Pellet Side Anode Termination (+) MnO2/Carbon/ Silver Coating Bottom Cathode Termination (-) Silver Adhesive Epoxy Glass Reinforced Epoxy Resin Bottom Anode Termination (+) Fig. 1 - Leadframeless Molded Capacitors, All Types Revision: 09-Mar-16 Document Number: 40115 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Micro Guide www.vishay.com Vishay Sprague SOLID TANTALUM CAPACITORS - LEADFRAMELESS MOLDED SERIES TL8 298D 298W TR8 PRODUCT IMAGE TYPE Solid tantalum leadframeless molded chip capacitors Small size including 0603 and 0402 foot print FEATURES Ultra low profile Industrial grade Industrial grade, extended range Low ESR TEMPERATURE RANGE Operating Temperature: -55 °C to +125 °C (above 40 °C, voltage derating is required) Operating Temperature: -55 °C to +125 °C (above 85 °C, voltage derating is required) Operating Temperature: -55 °C to +125 °C (above 40 °C, voltage derating is required) Operating Temperature: -55 °C to +125 °C (above 85 °C, voltage derating is required) CAPACITANCE RANGE 0.68 μF to 220 μF 0.68 μF to 330 μF 2.2 μF to 220 μF 1 μF to 330 μF 4 V to 25 V 2.5 V to 50 V 4 V to 16 V 2.5 V to 25 V VOLTAGE RANGE CAPACITANCE TOLERANCE DISSIPATION FACTOR ± 20 %, ± 10 % 6 % to 80 % 6 % to 80 % 30 % to 80 % 6 % to 80 % CASE CODES W9, A0, B0 K, M, R, P, Q, A, S, B K, M, Q M, R, P, Q, A, B TERMINATION 100 % tin 100 % tin or gold plated SOLID TANTALUM CAPACITORS - LEADFRAMELESS MOLDED SERIES TP8 TM8 DLA 11020 T42 PRODUCT IMAGE TYPE Solid tantalum leadframeless molded chip capacitors Built in fuse, double-stacked Small size including 0603 and 0402 foot print FEATURES High performance, automotive grade VOLTAGE RANGE CASE CODES TERMINATION Revision: 09-Mar-16 High reliability, ultra-low ESR 1 μF to 100 μF 0.68 μF to 47 μF 1 μF to 47 μF 10 μF to 470 μF 6.3 V to 40 V 2 V to 40 V 6.3 V to 40 V 16 V to 75 V CAPACITANCE TOLERANCE DISSIPATION FACTOR High reliability, DLA approved Operating Temperature: -55 °C to +125 °C (above 85 °C, voltage derating is required) TEMPERATURE RANGE CAPACITANCE RANGE High reliability ± 20 %, ± 10 % 6 % to 30 % 6 % to 20 % 6 % to 8 % M, W, R, P, A, N, T, B K, M, W, R, P, A, N, T M, W, R, P, A, N, T 6 % to 15 % M2 100 % tin Tin / lead solder plated or 100 % tin Tin / lead solder plated or gold plated Tin / lead solder plated or 100 % tin Document Number: 40115 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Micro Guide www.vishay.com Vishay Sprague PLASTIC TAPE AND REEL PACKAGING in inches [millimeters] 0.157 ± 0.004 [4.0 ± 0.10] Tape thickness Deformation between embossments 0.014 [0.35] max. 0.059 + 0.004 - 0.0 [1.5 + 0.10 - 0.0] Top cover tape B1 (max.) (6) 10 pitches cumulative tolerance on tape ± 0.008 [0.200] Embossment 0.079 ± 0.002 0.069 ± 0.004 [2.0 ± 0.05] [1.75 ± 0.10] A0 K0 0.030 [0.75] min. (3) B0 W 0.030 [0.75] min. (4) Top cover tape For tape feeder 0.004 [0.10] max. reference only including draft. Concentric around B0 (5) F 20° Maximum component rotation (Side or front sectional view) Center lines of cavity P1 D1 (min.) for components (5) . 0.079 x 0.047 [2.0 x 1.2] and larger USER DIRECTION OF FEED Maximum cavity size (1) Cathode (-) Anode (+) DIRECTION OF FEED 20° maximum component rotation Typical component cavity center line B0 A0 (Top view) Typical component center line 3.937 [100.0] 0.039 [1.0] max. Tape 0.039 [1.0] max. 0.9843 [250.0] Camber (Top view) Allowable camber to be 0.039/3.937 [1/100] Non-cumulative over 9.843 [250.0] Tape and Reel Specifications: all case sizes are available on plastic embossed tape per EIA-481. Standard reel diameter is 7" [178 mm]. Notes • Metric dimensions will govern. Dimensions in inches are rounded and for reference only. (1) A , B , K , are determined by the maximum dimensions to the ends of the terminals extending from the component body and / or the body 0 0 0 dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the cavity (A0, B0, K0) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20°. (2) Tape with components shall pass around radius “R” without damage. The minimum trailer length may require additional length to provide “R” minimum for 12 mm embossed tape for reels with hub diameters approaching N minimum. (3) This dimension is the flat area from the edge of the sprocket hole to either outward deformation of the carrier tape between the embossed cavities or to the edge of the cavity whichever is less. (4) This dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier tape between the embossed cavity or to the edge of the cavity whichever is less. (5) The embossed hole location shall be measured from the sprocket hole controlling the location of the embossement. Dimensions of embossement location shall be applied independent of each other. (6) B dimension is a reference dimension tape feeder clearance only. 1 CARRIER TAPE DIMENSIONS in inches [millimeters] FOR 298D, 298W, TR8, TP8, TL8 CASE CODE M (2) W R P A A0, Q B W9, S B0 TAPE SIZE 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm 12 mm B1 (MAX.) (1) 0.075 [1.91] 0.112 [2.85] 0.098 [2.46] 0.108 [2.75] 0.153 [3.90] 0.157 [4.0] 0.126 [3.20] 0.181 [4.61] D1 (MIN.) 0.02 [0.5] 0.039 [1.0] 0.039 [1.0] 0.02 [0.5] 0.039 [1.0] 0.02 [0.5] 0.039 [1.0] 0.029 [0.75] 0.059 [1.5] F 0.138 [3.5] 0.138 [3.5] 0.138 [3.5] 0.138 [3.5] 0.138 [3.5] 0.138 [3.5] 0.138 [3.5] 0.138 [3.5] 0.217 [5.5] K0 (MAX.) 0.043 [1.10] 0.053 [1.35] 0.066 [1.71] 0.054 [1.37] 0.078 [2.00] 0.049 [1.25] 0.087[2.22] 0.045 [1.15] 0.049 [1.25] P1 0.157 [4.0] 0.157 [4.0] 0.157 [4.0] 0.157 [4.0] 0.157 [4.0] 0.157 [4.0] 0.157 [4.0] 0.157 [4.0] 0.157 [4.0] W 0.315 [8.0] 0.315 [8.0] 0.315 [8.0] 0.315 [8.0] 0.315 [8.0] 0.315 [8.0] 0.315 [8.0] 0.315 [8.0] 0.472 [12.0] Notes For reference only Packaging of M case in plastic tape is available per request (1) (2) Revision: 09-Mar-16 Document Number: 40115 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Micro Guide www.vishay.com Vishay Sprague CARRIER TAPE DIMENSIONS in inches [millimeters] FOR TM8 CASE CODE TAPE SIZE B1 (MAX.) (1) D1 (MIN.) F K0 (MAX.) P1 W M 8 mm 0.075 [1.91] 0.02 [0.5] 0.138 [3.5] 0.043 [1.10] 0.157 [4.0] 0.315 [8.0] W 8 mm 0.112 [2.85] 0.039 [1.0] 0.138 [3.5] 0.053 [1.35] 0.157 [4.0] 0.315 [8.0] R 8 mm 0.098 [2.46] 0.039 [1.0] 0.138 [3.5] 0.066 [1.71] 0.157 [4.0] 0.315 [8.0] P 8 mm 0.108 [2.75] 0.02 [0.5] 0.138 [3.5] 0.054 [1.37] 0.157 [4.0] 0.315 [8.0] A 8 mm 0.153 [3.90] 0.039 [1.0] 0.138 [3.5] 0.078 [2.00] 0.157 [4.0] 0.315 [8.0] N 12 mm 0.154 [3.90] 0.059 [1.5] 0.216 [5.5] 0.051 [1.30] 0.157 [4.0] 0.472 [12.0] T 12 mm 0.154 [3.90] 0.059 [1.5] 0.216 [5.5] 0.067 [1.70] 0.157 [4.0] 0.472 [12.0] Notes (1) For reference only CARRIER TAPE DIMENSIONS in inches [millimeters] FOR T42 CASE CODE TAPE SIZE B1 (MAX.) (1) D1 (MIN.) F K0 (MAX.) P1 W M2 16 mm 0.404 [10.3] 0.059 [1.5] 0.295 [7.5] 0.176 [4.5] 0.472 [12.0] 0.630 [16.0] Note (1) For reference only PAPER TAPE AND REEL PACKAGING in inches [millimeters] FOR 298D, 298W, TR8, TP8, TL8 T P2 Ø D0 P0 [10 pitches cumulative tolerance on tape ± 0.2 mm] E1 A0 Bottom cover tape F W B0 E2 Top cover tape P1 Cavity center lines Anode Cavity size (1) G Bottom cover tape USER FEED DIRECTION CASE TAPE SIZE SIZE A0 B0 D0 P0 P1 P2 E F W T K 8 mm 0.033 ± 0.002 0.053 ± 0.002 0.06 ± 0.004 0.157 ± 0.004 0.078 ± 0.004 0.079 ± 0.002 0.069 ± 0.004 0.0138 ± 0.002 0.315 ± 0.008 0.03 ± 0.002 [0.85 ± 0.05] [1.35 ± 0.05] [1.5 ± 0.1] [4.0 ± 0.1] [2.0 ± 0.1] [2.0 ± 0.05] [1.75 ± 0.1] [3.5 ± 0.05] [8.0 ± 0.2] [0.75 ± 0.05] M 8 mm 0.041 ± 0.002 0.071 ± 0.002 0.06 ± 0.004 0.157 ± 0.004 0.157 ± 0.004 0.079 ± 0.002 0.069 ± 0.004 0.0138 ± 0.002 0.315 ± 0.008 0.037 ± 0.002 [1.05 ± 0.05] [1.8 ± 0.05] [1.5 ± 0.1] [4.0 ± 0.1] [4.0 ± 0.1] [2.0 ± 0.05] [1.75 ± 0.1] [3.5 ± 0.05] [8.0 ± 0.2] [0.95 ± 0.05] Note (1) A , B are determined by the maximum dimensions to the ends of the terminals extending from the component body and / or the body 0 0 dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the cavity (A0, B0) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20°. Revision: 09-Mar-16 Document Number: 40115 5 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Micro Guide www.vishay.com Vishay Sprague RECOMMENDED REFLOW PROFILES TP tp Max. Ramp Up Rate = 3 °C/s Max. Ramp Down Rate = 6 °C/s TL Temperature TSmax. tL Preheat Area TSmin. tS 25 Time 25 °C to Peak Time PROFILE FEATURE SnPb EUTECTIC ASSEMBLY LEAD (Pb)-FREE ASSEMBLY Temperature min. (TSmin.) 100 °C 150 °C Temperature max. (TSmax.) 150 °C 200 °C 60 s to 90 s 60 s to 150 s PREHEAT AND SOAK Time (tS) from (TSmin. to TSmax.) RAMP UP Ramp-up rate (TL to Tp) 3 °C/s maximum Liquidous temperature (TL) 183 °C 217 °C Time (tL) maintained above TL 60 s to 150 s Peak package body temperature (Tp) max. Time (tp) within 5 °C of the peak max. temperature 235 °C 260 °C 20 s 30 s RAMP DOWN Ramp-down rate (Tp to TL) 6 °C/s maximum Time from 25 °C to peak temperature 6 min maximum 8 min maximum Note • Capacitors should withstand reflow profile as per J-STD-020 standard PAD DIMENSIONS in inches [millimeters] B D C A CASE CODE A (MIN.) B (NOM.) C (NOM.) D (NOM.) K 0.028 [0.70] 0.018 [0.45] 0.024 [0.60] 0.059 [1.50] M 0.039 [1.00] 0.028 [0.70] 0.024 [0.60] 0.080 [2.00] R, W, W9, S 0.059 [1.50] 0.031 [0.80] 0.039 [1.00] 0.102 [2.60] P 0.063 [1.60] 0.031 [0.80] 0.047 [1.20] 0.110 [2.80] A, Q, A0 0.071 [1.80] 0.067 [1.70] 0.053 [1.35] 0.187 [4.75] B, B0, N, T 0.118 [3.00] 0.071 [1.80] 0.065 [1.65] 0.207 [5.25] M2 0.315 [8.00] 0.098 [2.50] 0.197 [5.00] 0.394 [10.0] Revision: 09-Mar-16 Document Number: 40115 6 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Micro Guide www.vishay.com Vishay Sprague TYPICAL LEAKAGE CURRENT FACTOR RANGE LEAKAGE CURRENT FACTOR 100 + 125 °C + 85 °C 10 + 55 °C + 25 °C 1.0 0 °C 0.1 - 55 °C 0.01 0.001 0 10 20 30 40 50 60 70 80 90 100 PERCENT OF RATED VOLTAGE Notes • At +25 °C, the leakage current shall not exceed the value listed in the Standard Ratings table • At +85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings table • At +125 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings table TYPICAL CURVES AT +25 °C, IMPEDANCE AND ESR VS. FREQUENCY “M” Case “M” Case 100 100 IMPEDANCE ESR IMPEDANCE ESR ESR/Z, Ω ESR/Z, Ω 10 10 47 μF - 4 V 1 22 μF - 4 V 1 0.1 1 10 FREQUENCY, kHz 100 0.1 0.1 1000 1 100 1000 FREQUENCY, kHz “M” Case 1000 10 “M” Case 1000 IMPEDANCE ESR IMPEDANCE ESR 100 ESR/Z, Ω ESR/Z, Ω 100 10 4.7 μF - 10 V 10 1 10 μF - 6 V 1 0.1 Revision: 09-Mar-16 1 10 FREQUENCY, kHz 100 1000 0.1 0.1 1 10 100 1000 FREQUENCY, kHz Document Number: 40115 7 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Micro Guide www.vishay.com Vishay Sprague TYPICAL CURVES AT +25 °C, IMPEDANCE AND ESR VS. FREQUENCY “M” Case “M” Case 10 000 1000 IMPEDANCE ESR IMPEDANCE ESR 1000 ESR/Z, Ω ESR/Z, Ω 100 100 10 1 μF - 16 V 10 10 μF - 10 V 1 0.1 1 1 10 100 1000 0.1 1 10 100 1000 FREQUENCY, kHz FREQUENCY, kHz “P” CASE “P” CASE 100.0 1000.0 IMPEDANCE IMPEDANCE ESR ESR 100.0 ESR/Z, Ω ESR/Z, Ω 10.0 10.0 1.0 1.0 4.7 μF - 25 V 33 μF - 10 V 0.1 0.1 0.1 0.1 1 10 100 1000 1 FREQUENCY, kHz 10 100 1000 FREQUENCY, kHz “P” CASE “P” CASE 10.0 100.0 IMPEDANCE ESR IMPEDANCE ESR ESR/Z, Ω ESR/Z, Ω 10.0 1.0 1.0 47 μF - 10 V 0.1 0.1 1 10 FREQUENCY, kHz Revision: 09-Mar-16 100 1000 220 μF - 4 V 0.1 0.1 1 10 100 1000 FREQUENCY, kHz Document Number: 40115 8 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Micro Guide www.vishay.com Vishay Sprague GUIDE TO APPLICATION 1. AC Ripple Current: the maximum allowable ripple current shall be determined from the formula: I R MS = 2. P -----------R ESR where, P= power dissipation in watts at +25 °C (see paragraph number 5 and the table Power Dissipation as given in the tables in the product datasheets) RESR = the capacitor equivalent series resistance at the specified frequency AC Ripple Voltage: the maximum allowable ripple voltage shall be determined from the formula: P V R MS = Z -----------R ESR or, from the formula: V RMS = I R MS x Z 2.1 2.2 3. 4. where, P= power dissipation in watts at +25 °C (see paragraph number 5 and the table Power Dissipation as given in the tables in the product datasheets) RESR = the capacitor equivalent series resistance at the specified frequency Z= the capacitor impedance at the specified frequency The sum of the peak AC voltage plus the applied DC voltage shall not exceed the DC voltage rating of the capacitor. The sum of the negative peak AC voltage plus the applied DC voltage shall not allow a voltage reversal exceeding 10 % of the DC working voltage at +25 °C. Reverse Voltage: these capacitors are capable of withstanding peak voltages in the reverse direction equal to 10 % of the DC rating at +25 °C, 5 % of the DC rating at +25 °C, 5 % of the DC rating at +85 °C, and 1 % of the DC rating at +125 °C. Temperature Derating: if these capacitors are to be operated at temperatures above +25 °C, the permissible RMS ripple current shall be calculated using the derating factors as shown: TEMPERATURE +25 °C +85 °C +125 °C 5. DERATING FACTOR 1.0 0.9 0.4 Power Dissipation: power dissipation will be affected by the heat sinking capability of the mounting surface. Non-sinusoidal ripple current may produce heating effects which differ from those shown. It is important that the equivalent IRMS value be established when calculating permissible operating levels. (Power Dissipation calculated using +25 °C temperature rise.) Revision: 09-Mar-16 6. Printed Circuit Board Materials: molded capacitors are compatible with commonly used printed circuit board materials (alumina substrates, FR4, FR5, G10, PTFE-fluorocarbon and porcelanized steel). 7. Attachment: 7.1 Solder Paste: the recommended thickness of the solder paste after application is 0.007" ± 0.001" [0.178 mm ± 0.025 mm]. Care should be exercised in selecting the solder paste. The metal purity should be as high as practical. The flux (in the paste) must be active enough to remove the oxides formed on the metallization prior to the exposure to soldering heat. In practice this can be aided by extending the solder preheat time at temperatures below the liquidous state of the solder. 7.2 Soldering: capacitors can be attached by conventional soldering techniques; vapor phase, convection reflow, infrared reflow, wave soldering and hot plate methods. The Soldering Profile charts show recommended time / temperature conditions for soldering. Preheating is recommended. The recommended maximum ramp rate is 2 °C per s. Attachment with a soldering iron is not recommended due to the difficulty of controlling temperature and time at temperature. The soldering iron must never come in contact with the capacitor. 7.2.1 Backward and Forward Compatibility: capacitors with SnPb or 100 % tin termination finishes can be soldered using SnPb or lead (Pb)-free soldering processes. 8. Cleaning (Flux Removal) After Soldering: molded capacitors are compatible with all commonly used solvents such as TES, TMS, Prelete, Chlorethane, Terpene and aqueous cleaning media. However, CFC / ODS products are not used in the production of these devices and are not recommended. Solvents containing methylene chloride or other epoxy solvents should be avoided since these will attack the epoxy encapsulation material. 8.1 When using ultrasonic cleaning, the board may resonate if the output power is too high. This vibration can cause cracking or a decrease in the adherence of the termination. DO NOT EXCEED 9W/l at 40 kHz for 2 min. 9. Recommended Mounting Pad Geometries: proper mounting pad geometries are essential for successful solder connections. These dimensions are highly process sensitive and should be designed to minimize component rework due to unacceptable solder joints. The dimensional configurations shown are the recommended pad geometries for both wave and reflow soldering techniques. These dimensions are intended to be a starting point for circuit board designers and may be fine tuned if necessary based upon the peculiarities of the soldering process and / or circuit board design. Document Number: 40115 9 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Typical Performance Characteristics www.vishay.com Vishay Sprague Molded Chip Tantalum Capacitors, Automotive Grade ELECTRICAL PERFORMANCE CHARACTERISTICS ITEM PERFORMANCE CHARACTERISTICS Category temperature range -55 °C to +85 °C (to +125 °C / +150 °C / +175 °C with voltage derating - refer to graph “Category Voltage vs. Temperature”) (1) Capacitance tolerance ± 20 %, ± 10 %, tested via bridge method, at 25 °C, 120 Hz Dissipation factor Limits per Standard Ratings table. Tested via bridge method, at 25 °C, 120 Hz ESR Limits per Standard Ratings table. Tested via bridge method, at 25 °C, 100 kHz Leakage current After application of rated voltage applied to capacitors for 5 min using a steady source of power with 1 k resistor in series with the capacitor under test, leakage current at 25 °C is not more than 0.01 CV or 0.5 μA, whichever is greater. Note that the leakage current varies with temperature and applied voltage. See graph “Typical Leakage Current Temperature Factor” for the appropriate adjustment factor. Capacitance change by temperature +30 % max. (at +175 °C) +20 % max. (at +125 °C and +150 °C) +10 % max. (at +85 °C) -10 % max. (at -55 °C) Reverse voltage Capacitors are capable of withstanding peak voltages in the reverse direction equal to: 10 % of the DC rating at +25 °C 5 % of the DC rating at +85 °C 1 % of the DC rating at +125 °C Ripple current For maximum ripple current values (at 25 °C) refer to relevant datasheet. If capacitors are to be used at temperatures above +25 °C, the permissible RMS ripple current (or voltage) shall be calculated using the derating factors: 1.0 at +25 °C 0.9 at +85 °C 0.4 at +125 °C 0.3 at +150 °C 0.2 at +175 °C Maximum operating and surge voltages vs. temperature +85 °C +125 °C +150 °C / +175 °C RATED VOLTAGE (V) SURGE VOLTAGE (V) CATEGORY VOLTAGE (V) SURGE VOLTAGE (V) CATEGORY VOLTAGE (V) 4 5.2 2.7 3.4 n/a 6.3 8 4 5 3 10 13 7 8 5 16 20 10 12 8 20 26 13 16 10 25 32 17 20 12.5 35 46 23 28 17.5 50 65 33 40 25 50 (2) 60 33 40 n/a 63 75 42 50 n/a 75 (3) 75 50 50 n/a Notes • All information presented in this document reflects typical performance characteristics. (1) Series TH3 - up to 150 °C; TH4 - up to 175 °C. (2) Capacitance value 15 μF and higher. (3) For 293D and TR3 only. Revision: 11-May-15 Document Number: 40215 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Typical Performance Characteristics www.vishay.com Vishay Sprague CATEGORY VOLTAGE VS. TEMPERATURE Category Voltage (V) 1.0 0.8 0.6 0.4 0.2 Voltage-Temperature Derating Coefficient 0 -55 0 25 85 125 150 175 Temperature (°C) Note • Below 85 °C category voltage is equal to rated voltage. TYPICAL LEAKAGE CURRENT FACTOR 100 +175 °C +150 °C +125 °C 10 Leakage Current Factor +85 °C +55 °C 1 +25 °C 0 °C 0.1 - 55 °C 0.01 0.001 0 10 20 30 40 50 60 70 80 90 100 Percent of Rated Voltage Note • At +25 °C, the leakage current shall not exceed the value listed in the Standard Ratings table. At +85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings table. At +125 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings table. At +150 °C, the leakage current shall not exceed 15 times the value listed in the Standard Ratings table. At +175 °C, the leakage current shall not exceed 18 times the value listed in the Standard Ratings table. Revision: 11-May-15 Document Number: 40215 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Typical Performance Characteristics www.vishay.com Vishay Sprague ENVIRONMENTAL PERFORMANCE CHARACTERISTICS ITEM CONDITION POST TEST PERFORMANCE High temperature exposure (storage) MIL-STD-202, method 108 1000 h, at maximum rated temperature, unpowered Capacitance change Dissipation factor Leakage current ESR Within ± 20 % of initial value Initial specified limit Initial specified limit Initial specified limit Operational life test at +125 °C AEC-Q200 1000 h application 2/3 of rated voltage Capacitance change Dissipation factor Leakage current ESR Within ± 20 % of initial value Initial specified limit Shall not exceed 10 times the initial limit Initial specified limit Operational life test at +150 °C (for TH3) and at +175 °C (for TH4) AEC-Q200 1000 h application 1/2 of rated voltage Capacitance change Dissipation factor Leakage current ESR Within ± 20 % of initial value Shall not exceed 3 times the initial limit Shall not exceed 10 times the initial limit Shall not exceed 3 times the initial limit Surge voltage MIL-PRF-55365: 1000 successive test cycles at 85 °C of surge voltage (as specified in the table above), in series with a 33 resistor at the rate of 30 s ON, 30 s OFF Capacitance change Dissipation factor Leakage current ESR Within ± 30 % of initial value Shall not exceed 1.5 times the initial limit Shall not exceed 2 times the initial limit Shall not exceed 1.5 times the initial limit Biased humidity test AEC-Q200 At 85 °C / 85 % RH, 1000 h, with rated voltage applied Capacitance change Dissipation factor Leakage current ESR Within ± 20 % of initial value Shall not exceed 3 times the initial limit Shall not exceed 10 times the initial limit Shall not exceed 3 times the initial limit Temperature cycling AEC-Q200 / JESD22, method JA-104 -55 °C / +125 °C, for 1000 cycles Capacitance change Dissipation factor Leakage current ESR Within ± 20 % of initial value Initial specified limit Initial specified limit Initial specified limit MECHANICAL PERFORMANCE CHARACTERISTICS ITEM CONDITION POST TEST PERFORMANCE Vibration MIL-STD-202, method 204: 10 Hz to 2000 Hz, 5 g peak for 20 min, 12 cycles each of 3 orientations (total 36 cycles), at rated voltage Capacitance change Dissipation factor Leakage current Within ± 20 % of initial value Initial specified limit Initial specified limit There shall be no mechanical or visual damage to capacitors post-conditioning. Mechanical shock MIL-STD-202, method 213, condition F, 1500 g peak, 0.5 ms, half-sine Capacitance change Dissipation factor Leakage current Within ± 20 % of initial value Initial specified limit Initial specified limit There shall be no mechanical or visual damage to capacitors post-conditioning. Resistance to solder heat MIL-STD-202, method 210, condition D Solder dip 260 °C ± 5 °C, 10 s Capacitance change Dissipation factor Leakage current Within ± 20 % of initial value Initial specified limit Initial specified limit Resistance to solvents MIL-STD-202, method 215 Capacitance change Dissipation factor Leakage current Within ± 20 % of initial value Initial specified limit Initial specified limit There shall be no mechanical or visual damage to capacitors post-conditioning. Body marking shall remain legible. Solderability AEC-Q200 / J-STD-002 Electrical test not required Terminal strength / Shear force test AEC-Q200-006 Apply a pressure load of 17.7 N (1.8 kg) for 60 s horizontally to the center of capacitor side body Exception: for case size 0603 pressure load is 5N Part should not be sheared off the pads and no body cracking post-conditioning. Electrical test not required. Flammability Encapsulation materials meet UL 94 V-0 with an oxygen index of 32 % n/a Revision: 11-May-15 Document Number: 40215 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. 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We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000