CM1400-03 6 Channel EMI Filter Array with ESD Protection Product Description The CM1400−03 is a six channel low−pass filter array that reduces EMI/RFI emissions while at the same time providing ESD protection. It is used on data ports on mobile devices. To reduce EMI/RFI emissions, the CM1400−03 integrates a pi−style filter (C−R−C) for each of the 6 channels. Each high quality filter provides greater than 30 dB attenuation in the 800−2700 MHz range relative to the pass band attenuation. These pi−style filters also support bidirectional filtering, controlling EMI both to and from a data port connector. In addition, the CM1400−03 provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The input pins are designed and characterized to safely dissipate ESD strikes of ±15 kV, exceeding the maximum requirement of the IEC 61000−4−2 international standard. Using the MIL−STD−883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than ±30 kV. The CM1400−03 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package footprint and low weight. The CM1400−03 incorporates OptiGuardt coating which results in improved reliability at assembly. The CM1400−03 is available in a space−saving, low−profile chip scale package with RoHS−compliant lead−free finishing. http://onsemi.com WLCSP15 CP SUFFIX CASE 567BS MARKING DIAGRAM N003 MG G N003 = CM1400−03CP M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Features • • • • • • • • • • • Functionally and Pin Compatible with CSPEMI306A Device OptiGuardt Coated for Improved Reliability at Assembly Six Channels of EMI Filtering for Data Ports Pi−Style EMI Filters in a Capacitor−Resistor−Capacitor (C−R−C) Network 40 dB Absolute Attenuation (Typical) at 1 GHz 35 dB Attenuation (Typical) at 1 GHz Relative to Pass Band ±15 kV ESD Protection on Each Channel (IEC 61000−4−2 Level 4, Contact Discharge) ±30 kV ESD Protection on Each Channel (HBM) 15−Bump, 2.960 mm X 1.330 mm Footprint Chip Scale Package (CSP) Chip Scale Package Features Extremely Low Lead Inductance for Optimum Filter and ESD Performance These Devices are Pb−Free and are RoHS Compliant Applications • EMI Filtering and ESD Protection for Both Data and • • March, 2011 − Rev. 4 Package Shipping† CM1400−03CP CSP−15 (Pb−Free) 3500/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. • MP3 Players • Notebooks • Desktop PCs I/O Ports Wireless Handsets Handheld PCs / PDAs © Semiconductor Components Industries, LLC, 2011 Device 1 Publication Order Number: CM1400−03/D CM1400−03 BLOCK DIAGRAM 100 W FILTERn* FILTERn* 30 pF 30 pF GND (Pins B1−B3) 1 of 6 EMI/RFI + ESD Channels *See Package/Pinout Diagram for expanded pin information. PACKAGE / PINOUT DIAGRAMS Orientation Marking Table 1. PIN DESCRIPTIONS 15−bump CSP Package Name Description A1 FILTER1 Filter Channel 1 A2 FILTER2 Filter Channel 2 A3 FILTER3 Filter Channel 3 A4 FILTER4 Filter Channel 4 A5 FILTER5 Filter Channel 5 A6 FILTER6 Filter Channel 6 B1−B3 GND Device Ground C1 FILTER1 Filter Channel 1 C2 FILTER2 Filter Channel 2 C3 FILTER3 Filter Channel 3 C4 FILTER4 Filter Channel 4 C5 FILTER5 Filter Channel 5 C6 FILTER6 Filter Channel 6 A 1 2 + 6 N003 B C Bottom View (Bumps Up View) FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 C1 Orientation Marking Pin Top View (Bumps Down View) 3 4 5 C2 C3 C4 C5 C6 GND GND GND B1 B2 B3 FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 A1 A2 A3 A4 A5 A6 A1 CM1400−03CP CSP Package SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Rating Units –65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 600 mW Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range http://onsemi.com 2 Rating Units –40 to +85 °C CM1400−03 Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter R Resistance C Capacitance Conditions At 2.5 V DC TCR Temperature Coefficient of Resistance TCC Temperature Coefficient of Capacitance At 2.5 V DC Diode Voltage (reverse bias) IDIODE = 10 mA ILEAK Diode Leakage Current (reverse bias) VDIODE = 3.3 V VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10 mA VESD In−system ESD Withstand Voltage a) Human Body Model, MIL−STD−883, Method 3015 b) Contact Discharge per IEC 61000−4−2 Level 4 (Note 2) Clamping Voltage during ESD Discharge MIL−STD−883 (Method 3015), 8 kV Positive Transients Negative Transients (Notes 2 and 3) Cut−off Frequency ZSOURCE = 50 W, ZLOAD = 50 W R = 100 W, C = 30 pF VDIODE VCL fC Min Typ Max Units 80 100 120 W 24 30 36 pF 1200 ppm/°C −300 ppm/°C 6.0 V 100 5.6 −1.5 6.8 –0.8 9.0 −0.4 nA V kV ±30 ±15 V +10 –5 58 MHz 1. TA = 25°C unless otherwise specified. 2. ESD applied to input and output pins with respect to GND, one at a time. 3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. http://onsemi.com 3 CM1400−03 PERFORMANCE INFORMATION Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment) Figure 1. Insertion Loss vs. Frequency (A1−C1 to GND B2) Figure 2. Insertion Loss vs. Frequency (A2−C2 to GND B2) http://onsemi.com 4 CM1400−03 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment) Figure 3. Insertion Loss vs. Frequency (A3−C3 to GND B2) Figure 4. Insertion Loss vs. Frequency (A4−C4 to GND B2) http://onsemi.com 5 CM1400−03 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment) Figure 5. Insertion Loss vs. Frequency (A5−C5 to GND B2) Figure 6. Insertion Loss vs. Frequency (A6−C6 to GND B2) http://onsemi.com 6 CM1400−03 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (TA = 255C, 50 W Environment) Figure 7. Comparison of Filter Response Curves for CM1400−03 with DC Bias http://onsemi.com 7 CM1400−03 PERFORMANCE INFORMATION (Cont’d) Figure 8. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5 VDC and 255C) Figure 9. Resistance vs. Temperature (normalized to resistance at 255C) http://onsemi.com 8 CM1400−03 APPLICATION INFORMATION Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS Parameter Value Pad Size on PCB 0.240 mm Pad Shape Round Pad Definition Non−Solder Mask defined pads Solder Mask Opening 0.290 mm Round Solder Stencil Thickness 0.125 − 0.150 mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300 mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance − Edge To Corner Ball ±50 mm Solder Ball Side Coplanarity ±20 mm Maximum Dwell Time Above Liquidous (183°C) 60 seconds Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste Non−Solder Mask Defined Pad 0.240 mm DIA. Solder Stencil Opening 0.300 mm DIA. Solder Mask Opening 0.290 mm DIA. Figure 10. Recommended Non−Solder Mask Defined Pad Illustration Figure 11. Lead−free (SnAgCu) Solder Ball Reflow Profile http://onsemi.com 9 260°C CM1400−03 PACKAGE DIMENSIONS WLCSP15, 2.96x1.33 CASE 567BS−01 ISSUE O PIN A1 REFERENCE 2X D ÈÈ A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B E DIM A A1 A2 b D E eD eE 0.05 C 2X 0.05 C TOP VIEW A2 0.05 C A RECOMMENDED SOLDERING FOOTPRINT* 0.05 C NOTE 3 A1 C SIDE VIEW SEATING PLANE eD/2 15X 0.05 C A B 0.03 C PACKAGE OUTLINE A1 0.87 eD b eE 0.44 C 15X 0.50 PITCH B A 1 2 3 4 5 6 MILLIMETERS MIN MAX 0.65 0.56 0.21 0.27 0.40 REF 0.29 0.35 2.96 BSC 1.33 BSC 0.50 BSC 0.435 BSC 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 7 8 9 BOTTOM VIEW OptiGuardt is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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