SUD50NP04-94 Datasheet

SUD50NP04-94
Vishay Siliconix
New Product
Complementary N- and P-Channel 40-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
rDS(on) (Ω)
ID (A)a
0.041 at VGS = 10 V
8
0.045 at VGS = 4.5 V
8
0.053 at VGS = - 10 V
-8
0.072 at VGS = - 4.5 V
-8
VDS (V)
N-Channel
P-Channel
40
- 40
Qg (Typ)
• TrenchFET® Power MOSFET
• 100 % Rg and UIS Tested
RoHS
8
COMPLIANT
APPLICATIONS
9
• CCFL Inverter
- LCD TV and Monitor
TO-252-4L
D-PAK
D
D
Top View
Drain Connected to
Tab
G1
G2
S1
S1 G1 S2 G2
S2
N-Channel MOSFET
Ordering Information: SUD50NP04-94-T4-E3 (Lead (Pb)-free)
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
N-Channel
P-Channel
Drain-Source Voltage
VDS
40
- 40
Gate-Source Voltage
VGS
± 12
± 16
TC = 25 °C
8
-8
TC = 70 °C
8
-8
Continuous Drain Current (TJ = 150 °C)
TA = 25 °C
ID
8
TA = 70 °C
Source-Drain Current Diode Current
TC = 25 °C
TA = 25 °C
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L = 0.1 mH
8
-8
4.9b, c
35
- 5b, c
- 35
IAS
13
16
EAS
8.5
13
13.2
15.6
8.5
10
IS
TC = 25 °C
Maximum Power Dissipation
TC = 70 °C
TA = 25 °C
PD
6.1b, c
3.8b, c
3.9b, c
TJ, Tstg
A
mJ
b, c
5.9
TA = 70 °C
Operating Junction and Storage Temperature Range
- 6.3b, c
- 35
7.1
35
ISM
Pulsed Source-Drain Current
V
- 8b, c
b, c
IDM
Pulsed Drain Current (10 µs Pulse Width)
b, c
Unit
W
- 55 to 150
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambientb, d
Maximum Junction-to-Case (Drain)
Symbol
N-Channel
Typ
P-Channel
Max
Typ
Max
t ≤ 10 sec
RthJA
17.5
21
16.8
20.5
Steady State
RthJC
7.8
9.4
6.6
8
Unit
°C/W
Notes:
a. Based on TC = 25 °C.
b. Surface Mounted on 1" x 1" FR4 Board.
c. t = 10 sec.
d. Maximum under Steady State conditions is 58 °C/W (N-Channel) and 53 °C/W (P-Channel).
Document Number: 74410
S-62077-Rev. A, 23-Oct-06
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1
SUD50NP04-94
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min
Typa
Max
Unit
Static
Drain-Source Breakdown Voltage
VDS Temperature Coefficient
VGS(th) Temperature Coefficient
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currentb
Drain-Source On-State Resistanceb
Forward Transconductanceb
VDS
ΔVDS/TJ
ΔVGS(th)/TJ
VGS(th)
IGSS
IDSS
ID(on)
rDS(on)
gfs
VGS = 0 V, ID = 250 µA
N-Ch
40
VGS = 0 V, ID = - 250 µA
P-Ch
- 40
ID = 250 µA
N-Ch
40
ID = - 250 µA
P-Ch
- 40
ID = 250 µA
N-Ch
- 3.8
V
ID = - 250 µA
P-Ch
VDS = VGS, ID = 250 µA
N-Ch
0.6
1.7
VDS = VGS, ID = - 250 µA
P-Ch
- 0.8
- 2.2
VDS = 0 V, VGS = ± 12 V
N-Ch
100
VDS = 0 V, VGS = ± 16 V
P-Ch
- 100
VDS = 40 V, VGS = 0 V
N-Ch
1
VDS = - 40 V, VGS = 0 V
P-Ch
-1
VDS = 40 V, VGS = 0 V, TJ = 55 °C
N-Ch
10
3.4
VDS = - 40 V, VGS = 0 V, TJ = 55 °C
P-Ch
VDS = 5 V, VGS = 10 V
N-Ch
20
VDS = - 5 V, VGS = - 10 V
P-Ch
- 20
nA
µA
- 10
A
VGS = 10 V, ID = 5.2 A
N-Ch
0.034
0.041
VGS = - 10 V, ID = - 4.5 A
P-Ch
0.044
0.053
VGS = 4.5 V, ID = 4.9 A
N-Ch
0.037
0.045
VGS = - 4.5 V, ID = - 3.9 A
P-Ch
0.059
0.072
VDS = 15 V, ID = 5.2 A
N-Ch
13
VDS = - 15 V, ID = - 4.5 A
P-Ch
18
Ω
S
Dynamica
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
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2
Crss
Qg
N-Channel
VDS = 20 V, VGS = 0 V, f = 1 MHz
P-Channel
VDS = - 20 V, VGS = 0 V, f = 1 MHz
Rg
700
P-Ch
805
N-Ch
76
P-Ch
120
N-Ch
45
P-Ch
85
pF
VDS = 20 V, VGS = 10 V, ID = 5.2 A
N-Ch
18
27
VDS = - 20 V, VGS = - 10 V, ID = - 4.5 A
P-Ch
18.5
28
N-Ch
8
12
N-Channel
VDS = 20 V, VGS = 4.5 V, ID = 5.2 A
P-Ch
9
14
N-Ch
1.5
P-Channel
VDS = - 20 V, VGS = - 4.5 V, ID = - 4.5 A
P-Ch
2
N-Ch
2.4
P-Ch
3.6
Qgs
Qgd
N-Ch
f = 1 MHz
N-Ch
1.9
3
P-Ch
11.5
18
nC
Ω
Document Number: 74410
S-62077-Rev. A, 23-Oct-06
SUD50NP04-94
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Dynamic
Symbol
Test Conditions
Min
Typa
Max
Unit
a
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
td(on)
tr
td(off)
tf
td(on)
tr
N-Channel
VDD = 20 V, RL = 4 Ω
ID ≅ 5 A, VGEN = 10 V, Rg = 1 Ω
P-Channel
VDD = - 20 V, RL = 4 Ω
ID ≅ - 5 A, VGEN = - 10 V, Rg = 1 Ω
N-Channel
VDD = 20 V, RL = 4 Ω
ID ≅ 5 A, VGEN = 4.5 V, Rg = 1 Ω
tf
P-Channel
VDD = - 20 V, RL = 4 Ω
ID ≅ - 5 A, VGEN = - 4.5 V, Rg = 1 Ω
IS
TC = 25 °C
td(off)
N-Ch
6
12
P-Ch
6
12
N-Ch
20
30
P-Ch
22
35
N-Ch
20
30
P-Ch
34
55
N-Ch
8
13
P-Ch
46
70
N-Ch
10
15
40
P-Ch
30
N-Ch
60
90
P-Ch
91
137
N-Ch
30
45
P-Ch
30
45
N-Ch
64
96
P-Ch
47
72
ns
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Currenta
Body Diode Voltage
ISM
VSD
N-Ch
8
P-Ch
-8
N-Ch
35
P-Ch
- 35
IS = 1.7 A
N-Ch
0.75
1.2
IS = - 1.7 A
P-Ch
- 0.79
- 1.2
Body Diode Reverse Recovery Time
trr
Body Diode Reverse Recovery Charge
Qrr
N-Channel
IF = 1.7 A, di/dt = 100 A/µs, TJ = 25 °C
Reverse Recovery Fall Time
ta
P-Channel
IF = - 1.7 A, di/dt = - 100 A/µs, TJ = 25 °C
Reverse Recovery Rise Time
tb
A
N-Ch
25
40
P-Ch
27
45
N-Ch
17
26
P-Ch
17
26
N-Ch
14
P-Ch
13
N-Ch
11
P-Ch
14
V
ns
nC
ns
Notes:
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Document Number: 74410
S-62077-Rev. A, 23-Oct-06
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SUD50NP04-94
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless noted
20
2.5
I D - Drain Current (A)
I D - Drain Current (A)
VGS = 10 thru 3 V
16
12
8
2V
2.0
1.5
1.0
TC = 125 °C
4
0.5
25 °C
- 55 °C
0
0
1
2
3
4
0.0
0.0
5
0.6
VDS - Drain-to-Source Voltage (V)
1.8
2.4
3.0
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
0.042
1200
0.040
1000
C - Capacitance (pF)
rDS(on) - On-Resistance (Ω)
1.2
VGS = 4.5 V
0.038
0.036
VGS = 10 V
800
Ciss
600
400
0.034
200
0.032
Crss
Coss
0
0
4
8
12
16
20
0
8
ID - Drain Current (A)
24
32
40
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
1.8
10
ID = 5.2 A
ID = 5.2 A
1.6
8
VDS = 10 V
rDS(on) - On-Resistance
(Normalized)
VGS - Gate-to-Source Voltage (V)
16
6
VDS = 20 V
4
2
1.4
1.2
1.0
0.8
0
0
4
8
12
Qg - Total Gate Charge (nC)
Gate Charge
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16
20
0.6
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
Document Number: 74410
S-62077-Rev. A, 23-Oct-06
SUD50NP04-94
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless noted
0.20
rDS(on) - Drain-to-Source On-Resistance (Ω)
I S - Source Current (A)
100
10
TJ = 150 °C
TJ = 25 °C
1
0.1
0
0.3
0.6
0.9
1.2
ID = 5.2 A
0.16
0.12
0.08
TC = 125 °C
0.04
TC = 25 °C
0.00
1.5
0
2
VSD - Source-to-Drain Voltage (V)
4
6
8
10
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
50
0.4
ID = 250 µA
40
Power (W)
VGS(th) (V)
0.2
0.0
30
- 0.2
20
- 0.4
10
- 0.6
- 50
0
- 25
0
25
50
75
100
125
0.001
150
0.01
0.1
1
10
100
Time (sec)
TJ - Temperature ( C)
Single Pulse Power, Junction-to-Ambient
Threshold Voltage
100
50
*Limited by rDS(on)
40
I D - Drain Current (A)
Power (W)
10
30
20
100 µs
1 ms
1
10 ms
100 ms
10 s
0.1
10
DC
TA = 25 °C
Single Pulse
0
0.001
0.01
0.01
0.1
1
Time (sec)
Single Pulse Power, Junction-to-Case
10
0.01
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
*VGS
minimum VGS at which rDS(on) is specified
Safe Operating Area, Junction-to-Ambient
Document Number: 74410
S-62077-Rev. A, 23-Oct-06
www.vishay.com
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SUD50NP04-94
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless noted
100
6
*Limited by rDS(on)
5
100 µs
1 ms
10 ms
100 ms
DC
1
0.1
ID - Drain Current (A)
I D - Drain Current (A)
10
4
3
2
1
TC = 25 °C
Single Pulse
0
0.01
0.01
0.1
1
10
0
100
25
VDS - Drain-to-Source Voltage (V)
*VGS
minimum VGS at which rDS(on) is specified
100
125
150
Current Derating, Junction-to-Ambient
15
3.0
12
2.4
Power Dissipation (W)
Power Dissipation (W)
75
TC - Case Temperature (°C)
Safe Operating Area, Junction-to-Case
Limited by Package
9
50
6
3
1.8
1.2
0.6
0
0.0
0
25
50
75
100
125
150
0
25
50
75
100
125
TC - Case Temperature (°C)
TC - Case Temperature (°C)
Current Derating, Junction-to-Case
Power Derating, Junction-to-Ambient
150
16.0
Power Dissipation (W)
12.8
9.6
6.4
3.2
*The power dissipation PD is based on TJ(max) = 150 °C, using junc-
0.0
0
25
50
75
100
125
TC - Case Temperature (°C)
Power Derating, Junction-to-Case
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6
150
tion-to-case thermal resistance, and is more useful in settling the
upper dissipation limit for cases where additional heatsinking is
used. It is used to determine the current rating, when this rating falls
below the package limit.
Document Number: 74410
S-62077-Rev. A, 23-Oct-06
SUD50NP04-94
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless noted
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
Notes:
0.05
PDM
0.02
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 58 °C/W
3. TJM – TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10-4
10-3
10-2
10-1
1
Square Wave Pulse Duration (sec)
10
100
1000
Normalized Thermal Transient Impedance, Junction-to-Ambient
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.05
0.1
0.02
Single Pulse
0.01
10-4
10-3
10-2
10-1
Square Wave Pulse Duration (sec)
1
10
Normalized Thermal Transient Impedance, Junction-to-Case
Document Number: 74410
S-62077-Rev. A, 23-Oct-06
www.vishay.com
7
SUD50NP04-94
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless noted
2.5
20
2.0
I D - Drain Current (A)
I D - Drain Current (A)
VGS = 10 thru 4 V
16
12
3V
8
1.5
1.0
TC = 125 °C
4
0.5
0
0.0
0.0
25 °C
- 55 °C
0
1
2
3
4
5
0.8
2.4
3.2
4.0
VGS - Gate-to-Source Voltage (V)
VDS - Drain-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
0.070
1240
0.064
992
C - Capacitance (pF)
rDS(on) - On-Resistance (Ω)
1.6
VGS = 4.5 V
0.058
0.052
Ciss
744
496
VGS = 10 V
0.046
248
Coss
0.040
0
4
8
12
16
20
0
8
16
24
32
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
40
1.8
10
1.6
8
rDS(on) - On-Resistance
(Normalized)
VGS - Gate-to-Source Voltage (V)
Crss
0
6
4
2
1.4
1.2
1.0
0.8
0
0
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8
5
10
15
20
0.6
- 50
- 25
0
25
50
75
100
125
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
150
Document Number: 74410
S-62077-Rev. A, 23-Oct-06
SUD50NP04-94
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless noted
0.30
rDS(on) - Drain-to-Source On-Resistance (Ω)
I S - Source Current (A)
100
10
TJ = 150 °C
TJ = 25 °C
1
ID = 4.5 A
0.24
0.18
0.12
TA = 125 °C
0.06
TA = 25 °C
0.00
0.1
0.0
0.3
0.6
0.9
1.2
1.5
0
2
4
6
8
10
VGS - Gate-to-Source Voltage (V)
VSD - Source-to-Drain Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
Source-Drain Diode Forward Voltage
0.6
50
ID = 250 µA
40
Power (W)
VGS(th) (V)
0.4
0.2
0.0
- 0.2
- 0.4
- 50
30
20
10
- 25
0
25
50
75
100
125
0
0.001
150
0.01
TJ - Temperature (°C)
0.1
1
10
100
Time (sec)
Threshold Voltage
Single Pulse Power, Junction-to-Ambient
100
50
*Limited by rDS(on)
10
I D - Drain Current (A)
Power (W)
40
30
20
100 µs
10 ms
100 ms
10 s
0.1
10
0
0.001
1 ms
1
DC
TA = 25 °C
Single Pulse
0.01
0.01
0.1
1
Time (sec)
Single Pulse Power, Junction-to-Case
Document Number: 74410
S-62077-Rev. A, 23-Oct-06
10
0.0
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
*VGS
minimum VGS at which rDS(on) is specified
Safe Operating Area, Junction-to-Ambient
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SUD50NP04-94
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless noted
100
6
*Limited by rDS(on)
4
100 µs
1 ms
1
10 ms
100 ms
1s
0.1
ID - Drain Current (A)
I D - Drain Current (A)
10
3
2
1
TC = 25 °C
Single Pulse
0.01
0
0.0
0.1
*VGS
1
10
0
100
VDS - Drain-to-Source Voltage (V)
minimum VGS at which rDS(on) is specified
75
100
125
150
Current Derating, Junction-to-Ambient
15
3.0
12
2.4
Power Dissipation (W)
I D - Drain Current (A)
50
TC - Case Temperature (°C)
Safe Operating Area, Junction-to-Case
Limited by Package
9
25
6
3
1.8
1.2
0.6
0
0.0
0
25
50
75
100
125
150
0
25
50
75
100
125
TC - Case Temperature (°C)
TC - Case Temperature (°C)
Current Derating, Junction-to-Case
Power Derating, Junction-to-Ambient
150
20
Power Dissipation (W)
16
12
8
4
*The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the
0
0
25
50
75
100
125
TC - Case Temperature (°C)
Power Derating, Junction-to-Case
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10
150
upper dissipation limit for cases where additional heatsinking is
used. It is used to determine the current rating, when this rating falls
below the package limit.
Document Number: 74410
S-62077-Rev. A, 23-Oct-06
SUD50NP04-94
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless noted
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
Notes:
0.1
PDM
0.05
0.02
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 53 °C/W
3. TJM – TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10-4
10-3
10-2
10-1
1
Square Wave Pulse Duration (sec)
10
100
1000
Normalized Thermal Transient Impedance, Junction-to-Ambient
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.05
0.1
0.02
Single Pulse
0.01
10-4
10-3
10-2
10-1
Square Wave Pulse Duration (sec)
1
10
Normalized Thermal Transient Impedance, Junction-to-Case
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data, see http://www.vishay.com/ppg?74410.
Document Number: 74410
S-62077-Rev. A, 23-Oct-06
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Document Number: 91000
Revision: 18-Jul-08
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