LGA Package 76-Lead (15mm × 11.25mm × 4.32mm) (Reference LTC DWG # 05-08-1560 Rev A) DETAIL A SEE NOTES 7 4.22 – 4.42 8 aaa Z 7 6 5 4 3 2 1 PAD 1 A PAD “A1” CORNER B 4 C D E 15.00 BSC 12.70 BSC MOLD CAP F G SUBSTRATE H 0.270 – 0.370 3.95 – 4.05 J Z bbb Z DETAIL B K L X aaa Z 11.25 BSC Y 8.89 BSC DETAIL B PACKAGE TOP VIEW 4.445 3.175 1.905 0.635 0.635 1.905 3 0.635 ±0.025 75SQ eee S X Y eee S X Y 3.175 PADS SEE NOTES PACKAGE BOTTOM VIEW 0.635 ±0.025 75SQ 4.445 1.27 BSC DETAIL C DETAIL A DETAIL C 6.350 5.080 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 3.810 2. ALL DIMENSIONS ARE IN MILLIMETERS 2.540 3 LAND DESIGNATION PER JESD MO-222 1.270 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 0.000 1.270 5. PRIMARY DATUM -Z- IS SEATING PLANE 2.540 6. THE TOTAL NUMBER OF PADS: 76 3.810 7 5.080 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY 6.350 SUGGESTED PCB LAYOUT TOP VIEW SYMBOL TOLERANCE aaa 0.15 bbb 0.10 eee 0.05 COMPONENT PIN “A1” TRAY PIN 1 BEVEL LTMXXXXXX µModule PACKAGE IN TRAY LOADING ORIENTATION LGA 76 1212 REV A