PANASONIC XP111F

Composite Transistors
XP0111F (XP111F)
Silicon PNP epitaxial planar type
Unit: mm
(0.425)
For switching/digital circuits
0.20±0.05
5
0.12+0.05
–0.02
4
5˚
• Two elements incorporated into one package
(Emitter-coupled transistors with built-in resistor)
• Reduction of the mounting area and assembly cost by one half
0.2±0.1
1.25±0.10
2.1±0.1
■ Features
1
3
2
(0.65) (0.65)
1.3±0.1
2.0±0.1
■ Basic Part Number
• UNR211F (UN211F) × 2
0.9±0.1
Parameter
Symbol
Rating
Unit
Collector-base voltage (Emitter open)
VCBO
−50
V
Collector-emitter voltage (Base open)
VCEO
−50
V
Collector current
IC
−100
mA
Total power dissipation
PT
150
mW
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to +150
°C
0 to 0.1
■ Absolute Maximum Ratings Ta = 25°C
0.9+0.2
–0.1
10˚
1: Base (Tr1)
2: Emitter
3: Base (Tr2)
EIAJ: SC-88A
4: Collector (Tr2)
5: Collector (Tr1)
SMini5-G1 Package
Marking Symbol: 7O
Internal Connection
5
4
Tr1
Tr2
1
■ Electrical Characteristics Ta = 25°C ± 3°C
Parameter
Symbol
VCBO
IC = −10 µA, IE = 0
−50
Collector-emitter voltage (Base open)
VCEO
IC = −2 mA, IB = 0
−50
Collector-base cutoff current (Emitter open)
ICBO
VCB = −50 V, IE = 0
− 0.1
Collector-emitter cutoff current (Base open)
ICEO
VCE = −50 V, IB = 0
− 0.5
µA
Emitter-base cutoff current (Collector open)
IEBO
VEB = −6 V, IC = 0
−1.0
mA
hFE
VCE = −10 V, IC = −5 mA
30
hFE(Small
VCE = −10 V, IC = −5 mA
0.50
hFE Ratio *
Min
Typ
3
Collector-base voltage (Emitter open)
Forward current transfer ratio
Conditions
2
Max
Unit
V
V
µA


0.99
/Large)
Collector-emitter saturation voltage
VCE(sat)
IC = −10 mA, IB = − 0.3 mA
Output voltage high-level
VOH
VCC = −5 V, VB = − 0.5 V, RL = 1 kΩ
Output voltage low-level
VOL
VCC = −5 V, VB = −2.5 V, RL = 1 kΩ
− 0.25
V
− 0.2
V
−4.9
V
Input resistance
R1
−30%
4.7
+30%
kΩ
Resistance ratio
R1 / R 2
0.37
0.47
0.57

Transition frequency
fT
VCB = −10 V, IE = 1 mA, f = 200 MHz
80
MHz
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Ratio between 2 elements
Note) The part number in the parenthesis shows conventional part number.
Publication date: February 2004
SJJ00132BED
1
XP0111F
IC  VCE
Collector current IC (mA)
Total power dissipation PT (mW)
Ta = 25°C
IB = −1.0 mA
− 0.9 mA
− 0.8 mA
− 0.7 mA
− 0.6 mA
−200
200
−160
150
−120
100
50
0
− 0.5 mA
−80
− 0.4 mA
− 0.3 mA
−40
0
0
40
80
120
160
− 0.2 mA
−2
0
120
Ta = 75°C
25°C
−25°C
40
−10
−8
−100
−1 000
Collector current IC (mA)
6
5
3
2
Input voltage VIN (V)
25°C
− 0.1
−25°C
− 0.01
− 0.1
−1
0
− 0.1
−1
−10
−100
Collector-base voltage VCB (V)
−1
− 0.1
−10
−10
−100
Collector current IC (mA)
−104
VO = −5 V
Ta = 25°C
−103
−102
−10
1
VO = − 0.2 V
Ta = 25°C
−1
Ta = 75°C
IO  VIN
4
−10
− 0.01
− 0.1
−1
f = 1 MHz
IE = 0
Ta = 25°C
VIN  IO
−100
−10
Output current IO (µA)
Forward current transfer ratio hFE
VCE = −10 V
0
−1
−6
IC / IB = 10
Cob  VCB
Collector output capacitance
C (pF)
(Common base, input open circuited) ob
hFE  IC
160
80
−4
− 0.1 mA
−10 −12
−100
Collector-emitter voltage VCE (V)
Ambient temperature Ta (°C)
−100
Output current IO (mA)
2
VCE(sat)  IC
−240
Collector-emitter saturation voltage VCE(sat) (V)
PT  Ta
250
SJJ00132BED
−1
− 0.4
− 0.6
− 0.8
−1.0
−1.2
Input voltage VIN (V)
−1.4
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
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the products or technical information described in this material and controlled under the "Foreign Exchange
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applied circuits examples of the products. It neither warrants non-infringement of intellectual property right
or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical
information as described in this material.
(4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are
required, or if the failure or malfunction of the products may directly jeopardize life or harm the human
body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products,
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not
be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such
as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent
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2003 SEP