PANASONIC XN0F256

Composite Transistors
XN0F256
Silicon NPN epitaxial planar type
Unit: mm
2.90+0.20
–0.05
1.9±0.1
(0.95) (0.95)
■ Absolute Maximum Ratings Ta = 25°C
3
2
0.4±0.2
2.8+0.2
–0.3
6
1
(0.65)
• Two elements incorporated into one package
(Collector-coupled transistors with built-in resistor)
• Low collector-emitter saturation voltage VCE(sat)
• Reduction of the mounting area and assembly cost by one half
5
1.50+0.25
–0.05
4
■ Features
5˚
For muting
0.16+0.10
–0.06
0.30+0.10
–0.05
0.50+0.10
–0.05
Rating
Unit
Collector-base voltage (Emitter open)
VCBO
30
V
Collector-emitter voltage (Base open)
VCEO
20
V
Emitter-base voltage (Collector open)
VEBO
5
V
Collector current
IC
600
mA
Total power dissipation
PT
300
mW
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to +150
°C
1.1+0.2
–0.1
Symbol
0 to 0.1
Parameter
1.1+0.3
–0.1
10˚
1: Emitter (Tr1)
2: Collector
3: Emitter (Tr2)
EIAJ: SC-74
4: Base (Tr2)
5: N.C.
6: Base (Tr1)
Mini6-G1 Package
Marking Symbol: 6A
Internal Connection
4
5
Tr2
3
6
Tr1
2
1
■ Electrical Characteristics Ta = 25°C ± 3°C
Parameter
Symbol
Collector-base voltage (Emitter open)
VCBO
IC = 1 µA, IE = 0
30
V
Collector-emitter voltage (Base open)
VCEO
IC = 1 mA, IB = 0
20
V
Emitter-base voltage (Collector open)
VEBO
IE = 1 µA, IC = 0
5
Collector-base cutoff current (Emitter open)
ICBO
VCB = 30 V, IE = 0
Emitter-base cutoff current (Collector open)
IEBO
VEB = 5 V, IC = 0
Forward current transfer ratio
hFE
VCE = 5 V, IC = 50 mA
Collector-emitter saturation voltage
VCE(sat)
Input resistance
R1
Transition frequency
fT
Conditions
Min
Typ
IC = 50 mA, IB = 2.5 mA
VCB = 10 V, IE = −50 mA, f = 200 MHz
Unit
V
100
−30%
Max
4.7
200
1
µA
1
µA
600

80
mV
+30%
kΩ
MHz
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
Publication date: July 2003
SJJ00120BED
1
XN0F256
PT  Ta
IC  VCE
Ta = 25°C
300
200
25
1.6 mA
1.2 mA
400
0.8 mA
200
0.4 mA
100
0
40
80
120
160
0
15
10
Collector-emitter saturation voltage VCE(sat) (V)
25°C
Ta = 75°C
60
−25°C
40
20
0.5
1.0
1.5
4
10
5
0
6
0
2.0
Base-emitter voltage VBE (V)
2.5
0.1
Ta = 75°C
−25°C
1
10
100
Collector current IC (mA)
SJJ00120BED
0.4
0.6
0.8
1.0
1.2
hFE  IC
25°C
0.01
0.2
Base current IB (mA)
600
IC / IB = 20
1
0.001
0
3
VCE(sat)  IC
VCE = 5 V
80
2
Collector-emitter voltage VCE (V)
IC  VBE
100
1
Forward current transfer ratio hFE
0
120
Collector current IC (mA)
20
5
Ambient temperature Ta (°C)
0
VCE = 5 V
IB = 2.0 mA
Collector current IC (mA)
400
0
2
IC  I B
30
600
Collector current IC (mA)
Total power dissipation PT (mW)
500
1 000
VCE = 5 V
500
Ta = 75°C
25°C
400
−25°C
300
200
100
0
1
10
100
Collector current IC (mA)
1 000
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government
if any of the products or technologies described in this material and controlled under the "Foreign
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(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the
product or technologies as described in this material.
(4) The products described in this material are intended to be used for standard applications or general
electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
on the systems such as redundant design, arresting the spread of fire or preventing glitch are
recommended in order to prevent physical injury, fire, social damages, for example, by using the
products.
(7) When using products for which damp-proof packing is required, observe the conditions (including
shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets
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2002 JUL