PANASONIC 2SB930A

Power Transistors
2SB0930 (2SB930), 2SB0930A (2SB930A)
Silicon PNP epitaxial planar type
For power amplification
Complementary to 2SD1253, 2SD1253A
Unit: mm
Rating
Unit
VCBO
−60
V
2
−80
2SB0930A
−60
V
Collector-emitter voltage 2SB0930
(Base open)
2SB0930A
VCEO
Emitter-base voltage (Collector open)
VEBO
−5
V
Collector current
IC
−4
A
Peak collector current
ICP
−8
A
Collector power dissipation
PC
40
W
−80
Ta = 25°C
14.4±0.5
3.0+0.4
–0.2
4.4±0.5
1.5+0
–0.4
1
(1.5)
Symbol
2SB0930
0 to 0.4
0.8±0.1 R = 0.5
R = 0.5
2.54±0.3
1.0±0.1
1.4±0.1
0.4±0.1
5.08±0.5
(8.5)
(6.0)
1.3
3
(7.6)
Parameter
Collector-base voltage
(Emitter open)
1.0±0.1
2.0±0.5
■ Absolute Maximum Ratings TC = 25°C
6.0±0.2
4.4±0.5
• High forward current transfer ratio hFE which has satisfactory linearity
• Low collector-emitter saturation voltage VCE(sat)
• N type package enabling direct soldering of the radiating fin to the
printed circuit board, etc. of small electronic equipment.
3.4±0.3
10.0±0.3
1.5±0.1
■ Features
8.5±0.2
(6.5)
1 : Base
2 : Collector
3 : Emitter
N-G1 Package
Note) Self-supported type package is also prepared.
1.3
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to +150
°C
■ Electrical Characteristics TC = 25°C ± 3°C
Parameter
Symbol
Collector-emitter voltage
(Base open)
2SB0930
Collector-emitter cutoff
current (E-B short)
2SB0930
Collector-emitter cutoff
current (Base open)
2SB0930
Conditions
−400
VCE = −80 V, VBE = 0
−400
VCE = −30 V, IB = 0
−700
VCE = −60 V, IB = 0
−700
VEB = −5 V, IC = 0
−1
mA
250

V
−80
ICEO
IEBO
µA
µA
VCE = −4 V, IC = −1 A
70
hFE2
VCE = −4 V, IC = −3 A
15
VBE
VCE = −4 V, IC = −3 A
−2.0
V
VCE(sat)
IC = −4 A, IB = −0.4 A
−1.5
V
hFE1
Collector-emitter saturation voltage
−60
Unit
VCE = −60 V, VBE = 0
2SB0930A
Base-emitter voltage
Max
ICES
2SB0930A
Forward current transfer ratio
Typ
IC = −30 mA, IB = 0
2SB0930A
Emitter-base cutoff current (Collector open)
Min
VCEO
*
Transition frequency
fT
VCE = −10 V, IC = − 0.5 A, f = 10 MHz
20
MHz
Turn-on time
ton
IC = −4 A,
0.2
µs
Storage time
tstg
IB1 = − 0.4 A, IB2 = 0.4 A
0.5
µs
Fall time
tf
VCC = −50 V
0.2
µs
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Rank classification
Rank
Q
P
hFE1
70 to 150
120 to 250
Publication date: April 2003
Note) The part number in the parenthesis shows conventional part number.
SJD00012BED
1
2SB0930, 2SB0930A
PC  Ta
IC  VCE
−6
40
(1)
30
20
IC  VBE
IB = −120 mA
−4
−60 mA
−3
−40 mA
−20 mA
−2
VCE = −4 V
−8
−80 mA
−10 mA
−6
TC = 100°C
25°C
−25°C
−4
−2
−8 mA
−1
(2)
TC = 25°C
−100 mA
−5
10
−10
Collector current IC (A)
(1)TC = Ta
(2)With a 50 mm × 50 mm
× 2 mm Al heat sink
(3)Without heat sink
(PC = 1.3 W)
Collector current IC (A)
Collector power dissipation PC (W)
50
−5 mA
(3)
0
0
40
80
120
160
−2
0
−4
VCE(sat)  IC
Forward current transfer ratio hFE
Collector-emitter saturation voltage VCE(sat) (V)
−10
−1
25°C
TC = 100°C
−25°C
− 0.01
− 0.01
− 0.1
−10
−1
TC = 100°C
25°C
−25°C
10
1
− 0.01
−10
− 0.1
−1
t = 10 ms
t = 300 ms
− 0.1
− 0.01
−1
−10
−100
10
− 0.1
−1
−10
Collector current IC (A)
−1 000
(1)Without heat sink
(2)With a 50 mm × 50 mm × 2 mm Al heat sink
(1)
102
(2)
10
1
10−1
10−2
10−4
10−3
10−2
10−1
1
Time t (s)
Collector-emitter voltage VCE (V)
2
102
1
− 0.01
−10
103
Thermal resistance Rth (°C/W)
Collector current IC (A)
t = 1 ms
SJD00012BED
−2.0
VCE = −5 V
f = 1 MHz
TC = 25°C
Rth  t
ICP
−1
−1.6
103
Collector current IC (A)
Non repetitive pulse
TC = 25°C
IC
−1.2
104
VCE = −4 V
102
− 0.8
fT  I C
Safe operation area
−10
− 0.4
0
Base-emitter voltage VBE (V)
103
Collector current IC (A)
−100
0
−12
hFE  IC
104
IC / IB = 10
− 0.1
−8
Collector-emitter voltage VCE (V)
Ambient temperature Ta (°C)
−100
−6
Transition frequency fT (MHz)
0
10
102
103
104
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government
if any of the products or technologies described in this material and controlled under the "Foreign
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product or technologies as described in this material.
(4) The products described in this material are intended to be used for standard applications or general
electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
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reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
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2002 JUL