PANASONIC 2SB939A

Power Transistors
2SB0939 (2SB939), 2SB0939A (2SB939A)
Silicon PNP epitaxial planar type Darlington
Unit: mm
Collector-base voltage
(Emitter open)
Unit
VCBO
−60
V
2
−80
2SB0939A
Collector-emitter voltage 2SB0939
(Base open)
2SB0939A
VCEO
Emitter-base voltage (Collector open)
VEBO
−60
14.4±0.5
3.0+0.4
–0.2
0.8±0.1 R = 0.5
R = 0.5
2.54±0.3
1.0±0.1
1.4±0.1
0.4±0.1
5.08±0.5
(8.5)
(6.0)
1.3
3
(7.6)
Rating
0 to 0.4
4.4±0.5
1.5+0
–0.4
1
Symbol
2SB0939
1.0±0.1
(1.5)
■ Absolute Maximum Ratings TC = 25°C
Parameter
6.0±0.2
4.4±0.5
• High forward current transfer ratio hFE
• High-speed switching
• N type package enabling direct soldering of the radiating fin to the
printed circuit board, etc. of small electronic equipment.
3.4±0.3
2.0±0.5
■ Features
8.5±0.2
10.0±0.3
1.5±0.1
For midium-speed power switching
Complementary to 2SD1262, 2SD1262A
(6.5)
V
1 : Base
2 : Collector
3 : Emitter
N-G1 Package
−80
−7
V
Collector current
IC
−8
A
Note) Self-supported type package is also prepared.
Peak collector current
ICP
−12
A
Internal Connection
Collector power dissipation
PC
45
W
Ta = 25°C
1.3
C
B
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to +150
°C
E
■ Electrical Characteristics TC = 25°C ± 3°C
Parameter
Symbol
Collector-emitter voltage
(Base open)
2SB0939
Collector-base cut-off
2SB0939
current (Emitter open)
2SB0939A
Conditions
IC = −30 mA, IB = 0
VCEO
Min
Typ
Max
−60
Unit
V
−80
2SB0939A
ICBO
VCB = −60 V,IE = 0
−100
VCB = −80 V,IE = 0
−100
Emitter-base cutoff current (Collector open)
IEBO
VEB = −7 V,IC = 0
Forward current transfer ratio
hFE1 *
VCE = −3 V, IC = −4 A
2 000
500
hFE2
VCE = −3 V, IC = −8 A
Base-emitter saturation voltage
VBE(sat)
IC = −4 A,IB = −8 mA
Collector-emitter saturation voltage
VCE(sat)
IC = −4 A, IB = −8 mA
µA
−2
mA
10 000

−2
V
−1.5
V
fT
VCE = −10 V, IC = −0.5 A, f = 1 MHz
20
MHz
Turn-on time
ton
IC = −4 A,
0.5
µs
Strage time
tstg
IB1 = −8 mA, IB2 = 8 mA
2
µs
Fall time
tf
VCC = −50 V
1
µs
Transition frequency
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Rank classification
Rank
hFE1
Q
P
2 000 to 5 000 4 000 to 10 000
Note) The part number in the parenthesis shows conventional part number.
Publication date: March 2003
SJD00020BED
1
2SB0939, 2SB0939A
PC  Ta
IC  VCE
TC=25˚C
–0.8mA
–0.6mA
–0.4mA
−2
10
–0.2mA
(2)
(3)
0
40
80
120
0
160
−1
0
Ambient temperature Ta (°C)
(3)
(2)
(1)
−1
−10
−100
Base-emitter saturation voltage VBE(sat) (V)
Collector-emitter saturation voltage VCE(sat) (V)
(1) IC/IB=250
(2) IC/IB=500
(3) IC/IB=1000
TC=25 C
−1
TC=–25˚C
25˚C
100˚C
−1
− 0.01
− 0.1
−1
103
−1
−10
Collector current IC (A)
2
(1)IC/IB=250
(2)IC/IB=500
(3)IC/IB=1000
TC=25˚C
−10
(1)
(2)
(3)
−1
− 0.1
− 0.1
−10
−1
Safe operation area
−100
104
Non repetitive pulse
TC=25˚C
IE=0
f=1MHz
TC=25˚C
103
102
10
1
− 0.1
−1
−10
−100
Collector-base voltage VCB (V)
SJD00020BED
−10
Collector current IC (A)
Collector current IC (A)
–25˚C
−10
−100
Collector current IC (A)
Collector output capacitance
C (pF)
(Common base, input open circuited) ob
Forward current transfer ratio hFE
25˚C
−1
Collector current IC (A)
Cob  VCB
VCE=–3V
104
102
− 0.1
− 0.1
− 0.1
VBE(sat)  IC
−10
hFE  IC
TC=100˚C
−5
IC/IB=500
Collector current IC (A)
105
−4
–25˚C
VBE(sat)  IC
−10
− 0.1
− 0.1
−3
−1
Collector-emitter voltage VCE (V)
VCE(sat)  IC
−100
−2
25˚C
TC=100˚C
Base-emitter saturation voltage VBE(sat) (V)
0
−10
ICP
−10
t=1ms
IC
t=10ms
−1
t=300ms
− 0.1
− 0.01
−1
−10
2SB0939A
20
−4
IC/IB=500
2SB0939
30
IB=–2.0mA
–1.8mA
–1.6mA
–1.4mA
–1.2mA
–1.0mA
−6
Collector current IC (A)
40
Collector-emitter saturation voltage VCE(sat) (V)
(1)TC=Ta
(2)With a 50×50×2mm
Al heat sink
(3)Without heat sink
(PC=1.3W)
(1)
Collector power dissipation PC (W)
VCE(sat)  IC
−100
−8
50
−100
−1 000
Collector-emitter voltage VCE (V)
2SB0939, 2SB0939A
Rth  t
Thermal resistance Rth (°C/W)
103
(1)Without heat sink
(2)With a 50×50×2mm Al heat sink
(1)
102
(2)
10
1
10−1
10−2
10−4
10−3
10−2
10−1
1
10
102
103
104
Time t (s)
SJD00020BED
3
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government
if any of the products or technologies described in this material and controlled under the "Foreign
Exchange and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the
product or technologies as described in this material.
(4) The products described in this material are intended to be used for standard applications or general
electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
on the systems such as redundant design, arresting the spread of fire or preventing glitch are
recommended in order to prevent physical injury, fire, social damages, for example, by using the
products.
(7) When using products for which damp-proof packing is required, observe the conditions (including
shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets
are individually exchanged.
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written
permission of Matsushita Electric Industrial Co., Ltd.
2002 JUL