HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide 2015 Microchip Technology Inc. DS50002375A Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. 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Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-63277-403-3 QUALITYMANAGEMENTSYSTEM CERTIFIEDBYDNV == ISO/TS16949== DS50002375A-page 2 Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 2015 Microchip Technology Inc. Object of Declaration: HV7351 Ultrasound Tx Beamformer Evaluation Board 2015 Microchip Technology Inc. DS50002375A-page 3 NOTES: DS50002375A-page 4 2015 Microchip Technology Inc. HV7351 ULTRASOUND TX BEAMFORMER EVALUATION BOARD USER’S GUIDE Table of Contents Preface ........................................................................................................................... 7 Introduction............................................................................................................ 7 Document Layout .................................................................................................. 7 Conventions Used in this Guide ........................................................................... 8 Recommended Reading........................................................................................ 9 The Microchip Web Site ........................................................................................ 9 Customer Support ................................................................................................. 9 Document Revision History ................................................................................... 9 Chapter 1. Product Overview 1.1 Introduction ................................................................................................... 11 1.2 HV7351 Device Overview ............................................................................ 11 1.3 Board Overview ............................................................................................ 11 1.4 What the HV7351 Ultrasound Tx Beamformer Evaluation Board Kit Includes ............................................................................................. 13 Chapter 2. Installation and Operation 2.1 Getting Started ............................................................................................. 15 2.2 Setup Procedure .......................................................................................... 15 2.3 Evaluating The HV7351 Ultrasound Tx Beamformer Evaluation Board ....... 18 2.4 Normal Operation ......................................................................................... 18 Chapter 3. Printed Circuit Board Layout Techniques Appendix A. Schematic and Layouts A.1 Introduction .................................................................................................. 21 A.2 Board – Schematic ....................................................................................... 22 A.3 Board – Top Layer ....................................................................................... 23 A.4 Board – Top Silk Layer ................................................................................ 23 A.5 Board – Middle Layer ................................................................................... 24 A.6 Board – Bottom Layer .................................................................................. 24 A.7 Board – Bottom Silk Layer ........................................................................... 25 A.8 Board – All Layers, and Dimension .............................................................. 25 Appendix B. Bill of Materials (BOM)........................................................................... 27 Appendix C. Plots and Waveforms C.1 HV7351 Typical Waveforms ........................................................................ 29 Worldwide Sales and Service .................................................................................... 34 2015 Microchip Technology Inc. DS50002375A-page 5 HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide NOTES: DS50002375A-page 6 2015 Microchip Technology Inc. HV7351 ULTRASOUND TX BEAMFORMER EVALUATION BOARD USER’S GUIDE Preface NOTICE TO CUSTOMERS All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available. Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level of the document. For the most up-to-date information on development tools, see the MPLAB® IDE online help. Select the Help menu, and then Topics to open a list of available online help files. INTRODUCTION This chapter contains general information that will be useful to know before using the HV7351 Ultrasound Tx Beamformer Evaluation Board. Items discussed in this chapter include: • Document Layout • Conventions Used in this Guide • Recommended Reading • The Microchip Web Site • Customer Support • Document Revision History DOCUMENT LAYOUT This document describes how to use the HV7351 Ultrasound Tx Beamformer Evaluation Board as a development tool to emulate and debug firmware on a target board. The manual layout is as follows: • Chapter 1. “Product Overview” – Important information about the HV7351 Ultrasound Tx Beamformer Evaluation Board. • Chapter 2. “Installation and Operation” – This chapter includes a detailed description of each function of the demonstration board and instructions on how to begin using the board. • Chapter 3. “Printed Circuit Board Layout Techniques” – This chapter provides in-depth information on the recommended PCB Layout Techniques to optimally use the board. • Appendix A. “Schematic and Layouts” – Shows the schematic and layout diagrams for the HV7351 Ultrasound Tx Beamformer Evaluation Board. • Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the HV7351 Ultrasound Tx Beamformer Evaluation Board. • Appendix C. “Plots and Waveforms” – Describes the various plots and waveforms for the HV7351 Ultrasound Tx Beamformer Evaluation Board. 2015 Microchip Technology Inc. DS50002375A-page 7 HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide CONVENTIONS USED IN THIS GUIDE This manual uses the following documentation conventions: DOCUMENTATION CONVENTIONS Description Arial font: Italic characters Represents Referenced books Emphasized text A window A dialog A menu selection A field name in a window or dialog A menu path MPLAB® IDE User’s Guide ...is the only compiler... the Output window the Settings dialog select Enable Programmer “Save project before build” A dialog button A tab A number in verilog format, where N is the total number of digits, R is the radix and n is a digit. A key on the keyboard Click OK Click the Power tab 4‘b0010, 2‘hF1 Italic Courier New Sample source code Filenames File paths Keywords Command-line options Bit values Constants A variable argument Square brackets [ ] Optional arguments Curly brackets and pipe character: { | } Ellipses... Choice of mutually exclusive arguments; an OR selection Replaces repeated text #define START autoexec.bat c:\mcc18\h _asm, _endasm, static -Opa+, -Opa0, 1 0xFF, ‘A’ file.o, where file can be any valid filename mcc18 [options] file [options] errorlevel {0|1} Initial caps Quotes Underlined, italic text with right angle bracket Bold characters N‘Rnnnn Text in angle brackets < > Courier New font: Plain Courier New Represents code supplied by user DS50002375A-page 8 Examples File>Save Press <Enter>, <F1> var_name [, var_name...] void main (void) { ... } 2015 Microchip Technology Inc. Preface RECOMMENDED READING This user’s guide describes how to utilize the HV7351 Ultrasound Tx Beamformer Evaluation Board. Another useful document is listed below. The following Microchip document is available and recommended as a supplemental reference resource. • HV7351 Data Sheet – “8-Channel ±70V 3A Programmable High Voltage Ultrasound Transmit Beamformer” (DS20005412). THE MICROCHIP WEB SITE Microchip provides online support via our web site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://www.microchip.com/support DOCUMENT REVISION HISTORY Revision A (June 2015) • Initial Release of this Document. 2015 Microchip Technology Inc. DS50002375A-page 9 HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide NOTES: DS50002375A-page 10 2015 Microchip Technology Inc. HV7351 ULTRASOUND TX BEAMFORMER EVALUATION BOARD USER’S GUIDE Chapter 1. Product Overview 1.1 INTRODUCTION This chapter discusses the following topics: • HV7351 Device Overview • Board Overview • What the HV7351 Ultrasound Tx Beamformer Evaluation Board Kit Includes 1.2 HV7351 DEVICE OVERVIEW The Microchip Technology Inc. HV7351 is a monolithic, eight channel, high-speed, high-voltage ultrasound transmitter Return-To-Zero (RTZ) programmable pulser. This integrated, high-performance circuit comes in a single 11 x 11 x 0.9 mm, 80-lead DFN package. Each channel is capable of swinging up to ±70V with an active discharge back to 0V. The outputs can source and sink more than 3A to achieve fast output rise and fall times. The active discharge is also capable of sourcing and sinking 3A for a fast return to ground. The digital beamforming topology of the HV7351 will significantly reduce the number of I/O logic control lines to the transmitter. Each output is controlled by a 16 or 32-bit serial shift register. An arbitrary pattern can be generated depending on what is loaded into the shift registers, including four independent pattern options. Once the patterns are loaded, the user can quickly select any of the four predefined patterns without having to clock in new data. A programmable 10-bit delay counter is provided for each output. This allows the user to program different delay times for each channel for beamforming. 1.3 BOARD OVERVIEW There are two built-in Complex Programmable Logic Devices (CPLDs) and one serial EEPROM on the board to provide multiple demo waveform patterns. Other custom experimental data can be easily downloaded to these CPLDs/PROMs via the 6-pin Joint Test Action Group (JTAG) interface. The HV7351 Board output waveforms can be directly displayed using an oscilloscope, by connecting the scope probe to the test points TX1 - TX8 and GND. The soldering jumper can select whether or not to connect the on-board dummy-load, a 330 pF capacitor paralleling with a 2.5 k resistor. The test points can be used to connect the user’s transducer to easily evaluate the pulser. 2015 Microchip Technology Inc. DS50002375A-page 11 HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide +3.3V +5.0V +5.0 to 12V +3.0 to 70V +3.3V VLL VDD VRP VPF VPP EXCLK LRP OSC CLKIN VCC EN 160 MHz SPI & Control Logic TCK EN EXTRG VPP Waveform Generator CPLD TRIG VPP PGND VRN HVOUT HV7351 VPF 1 of 8 VNF Channels Shown TX1 R8 CW, SIZE, A [1:0] Pattern Registers 6 JTAG VNN GND Delay Registers AGND PGND 330 pF WAVE FREQ INVERT ENA CW VSS -5.0V FIGURE 1-1: PGND VRP GND DGND 2.5 k VRN VRP PreScale Registers CW INV PWR EN X1 VNN SP1 IN-System PROM TP11 Dummy Load VRN -5.0 to -12V LRN PGND SUB VNF VNN TX8 R53 PGND 330 pF TP37 X8 Dummy Load 2.5 k PGND -3.0 to -70V Block Diagram. 1.3.1 Board Features • Two CPLDs provided to program a wide variety of data patterns that can be transmitted. • Push-button selection of various Waveforms, Transmission Frequency, Waveform Inversion, Mode (Brightness or Continuous Wave mode) and Enable (see Table 2-3 in Chapter 2. “Installation and Operation”) • LED indication of push button operations (see Table 2-4 in Chapter 2. “Installation and Operation”) • Ability to bypass the crystal oscillator provided with an external clock source • Numerous test points for probing of various input and output signals 1.3.2 HV7351 Ultrasound Tx Beamformer Evaluation Board Hardware Components The HV7351 Ultrasound Tx Beamformer Evaluation Board contains several components: • One HV7351 8-Channel ±70V, 3A Programmable Ultrasound Transmit Beamformer. • Two Xilinx Inc. XC9572XL_VQ44 CPLDs • Two Xilinx Inc. XCF01SVO20C PROM • One Fox Electronics FXO-HC73-160 crystal oscillator running at 160 MHz TABLE 1-1: TECHNICAL SPECIFICATIONS Parameter DS50002375A-page 12 Value Modes of Operation B-mode and CW-mode Input Logic Level 3.3V Transmission Frequency 1 MHz – 10 MHz High Voltage Supply Range ±3V – ±70V Load on Each Channel 330 pF||2.5 k 2015 Microchip Technology Inc. 1.4 WHAT THE HV7351 ULTRASOUND TX BEAMFORMER EVALUATION BOARD KIT INCLUDES The HV7351 Ultrasound Tx Beamformer Evaluation Board Kit includes: • HV7351 Ultrasound Tx Beamformer Evaluation Board (ADM00658) • Important Information Sheet FIGURE 1-2: HV7351 Ultrasound Tx Beamformer Evaluation Board Front View. FIGURE 1-3: HV7351 Ultrasound Tx Beamformer Evaluation Board Back View. 2015 Microchip Technology Inc. DS50002375A-page 13 HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide NOTES: DS50002375A-page 14 2015 Microchip Technology Inc. HV7351 ULTRASOUND TX BEAMFORMER EVALUATION BOARD USER’S GUIDE Chapter 2. Installation and Operation 2.1 GETTING STARTED The HV7351 Ultrasound Tx Beamformer Evaluation Board is fully assembled and tested. The board requires external voltage sources. 2.1.1 Additional Tools Required for Operation • A DC power supply, a bench supply that can produce 3.3V, 5V, -5V, 12V, -12V, 70V and -70V • An oscilloscope and/or a multi-meter to observe the waveforms and measure electrical parameters 2.2 SETUP PROCEDURE To operate the HV7351 Ultrasound Tx Beamformer Evaluation Board, the following steps must be followed: WARNING Read the HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide (this document) fully before proceeding to board setup. 1. Connect the supplies correctly to the board as shown in Figure 2-1. 2. Set the voltages and current limits of the supply rails according to Table 2-1, before connecting the power connector J4. TABLE 2-1: POWER CONNECTOR DESCRIPTION Pin Name Description 1 VCC 2 GND 0V, Ground 3 VDD +3.3V Logic voltage input for VLL and CPLD, 200 mA +5.0V HV7351 Board positive VDD supply, 50 mA 4 VSS -5.0V HV7351 Board negative VSS supply, 50 mA 5 VRN -5.0V to -12V HV7351 Board negative regulator supply, 50 mA 6 VRP +5.0V to +12V HV7351 Board positive regulator supply, 50 mA 7 GND 0V, Ground 8 VNN 9 GND 0V, Ground 10 VPP Note 1: 2015 Microchip Technology Inc. -3.0V to -70V negative high-voltage supply, 10 mA to 50 mA (Note 1) +3.0V to +70V positive high-voltage supply, 10 mA to 50 mA (Note 1) The current limits given for VPP and VNN are good for the supplied CPLD program in which B/CW-mode transmission is limited to about 16 cycles. If the user reprograms the CPLD for more CW cycles, the current limits need to be similarly increased. DS50002375A-page 15 +5.0V +5.0 to 12V +3.0 to 70V +3.3V VLL VDD VRP VPF VPP EXCLK LRP OSC CLKIN VCC 160 MHz TCK EN EXTRG Waveform Generator CPLD VPP EN TRIG CW, SIZE, A [1:0] 6 JTAG SPI & Control Logic VPP PGND VRN HVOUT HV7351 VPF 1 of 8 VNF Channels Shown TX1 R8 2015 Microchip Technology Inc. WAVE FREQ INVERT ENA CW AGND CW INV PWR EN Pattern Registers Delay Registers VNN GND PGND 330 pF PGND VRP GND DGND VSS Power Supply and Load Connection Diagram. 2.5 k VNN VRN VRP PreScale Registers -5.0V FIGURE 2-1: X1 Dummy Load SP1 IN-System PROM TP11 VRN -5.0 to -12V LRN VNF VNN -3.0 to -70V PGND SUB TX8 PGND 330 pF R53 TP37 X8 Dummy Load 2.5 k PGND HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide DS50002375A-page 16 +3.3V 3. Connect the high-impedance probe(s) of the oscilloscope to the Tx output(s). 4. Power up the supplies according to the power-up sequence as indicated in Table 2-2. TABLE 2-2: SUPPLY POWER-UP SEQUENCE Step Name Description 1 +VCC 2 +VDD +5.0V positive power supply 3 -VSS -5.0V negative power supply 4 +VRP +5V to +12.0V positive CW power supply 5 -VRN -5V to -12.0V positive CW power supply 6 +VPP +3V to +70V positive high voltage supply 7 -VNN -3V to -70V positive high voltage supply +3.3V positive logic supply voltage for HV7351 Board VLL and CPLD VCC 5. After the HV7351 Board has been successfully powered up by following the power-up sequence, enable the board by pressing the ENA button. 6. Change the output waveform and transmit frequency by pressing the WAVE and FREQ buttons, respectively. An overview of Push Button Operations is provided in Table 2-3. TABLE 2-3: PUSH BUTTON OPERATIONS Button Description WAVE Toggle select pulse waveforms FREQ Toggle select B-mode demo frequency INVERT Toggle select non-inverting or inverting waveform CW Toggle select CW-mode or B-mode (Note 1) ENA Toggle ON or OFF HV7351 Board enable signal EN In CW-mode, VPP/VNN voltages must be reduced to ±8V Note 1: 7. The output waveform can be inverted by pressing the INVERT button. Table 2-4 lists all LED Indicators. TABLE 2-4: LED INDICATORS LED CW Description CW-mode indicator INVERT Inverting waveform output indicator PWR VLL 3.3V and CPLD chip VCC power supply ON indicator ENA IC-enabled indicator. CPDL power-up default is OFF 8. The transmission mode can be toggled by pressing the CW button. In CW-mode, the typical waveforms are 16-cycle 5 MHz. To prevent the HV7351 Board from overheating, the following parameters are recommended when setting VPP/VNN voltages in CW-mode: • +3VVPP +8V • -3V VNN -8V 2015 Microchip Technology Inc. DS50002375A-page 17 HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide WARNING Carefully double-check the voltage of every supply rail, current-limit value and polarity individually to avoid board damage. Take extreme care while connecting the supplies to the board since connecting them incorrectly to the wrong pins could result in permanent damage to the entire board. 2.3 EVALUATING THE HV7351 ULTRASOUND TX BEAMFORMER EVALUATION BOARD The best way to evaluate the HV7351 Ultrasound Tx Beamformer Evaluation Board is to explore the circuit and measure the voltages and currents with a Digital Voltage Meter (DVM) while probing the board with an oscilloscope. 2.4 NORMAL OPERATION The HV7351 Ultrasound Tx Beamformer Evaluation Board should be powered up with multiple lab DC power supplies that feature current-limiting functions. To meet the typical loading condition when using the high-impedance probe of an oscilloscope, the on-board dummy load (330 pF||2.5 k) should be connected to the high-voltage pulser output through the solder jumper. To evaluate different loading conditions, the values of the RC may be changed within the current and power limits of the device. In order to drive the user’s piezoelectric transducers with a cable, the output load impedance should be properly matched to avoid cable and transducer reflections. A 70 to 75 k coaxial cable is recommended. The coaxial cable end should be soldered to the TX1 - TX8 and GND directly with very short leads. If the user’s load is being used, the on-board dummy load should be disconnected by cutting the small shorting copper trace in between the 0k resistors (R8, R12, R29, R30, R10, R37, R52 and R53) and the eight resistor pads. They are shorted by factory default. All on-board test points are designed to work with the high-impedance probe of an oscilloscope. Some probes may have limited input voltage range. When using the probe on these high-voltage test points, make sure that the VPP/VNN voltages do not exceed the probe limit. When using the high-impedance oscilloscope probe on the on-board test points, it is important to have short ground leads to the circuit board ground plane. DS50002375A-page 18 2015 Microchip Technology Inc. HV7351 ULTRASOUND TX BEAMFORMER EVALUATION BOARD USER’S GUIDE Chapter 3. Printed Circuit Board Layout Techniques The large thermal pad at the bottom of the HV7351 package is internally connected to the IC’s substrate (VSUB). This thermal pad should be connected to 0V or GND externally on the PCB. The designer needs to pay attention to the connecting traces on the outputs TX1 - TX8, specifically the high-voltage and high-speed traces. In particular, controlled impedance to ground plane and more trace spacing needs to be applied in such situations. High-speed PCB trace design practices that are compatible with about 50 MHz to 100 MHz operating speeds are used for the HV7351 PCB layout. The internal circuitry of the HV7351 can operate at rather high frequencies, the primary speed limitation being the load capacitance. Because of the high-speed and high-transient currents that result when driving capacitive loads, the supply-voltage bypass capacitors should be as close to the pins as possible. The GND pin should have low inductance feed-through via connections that are soldered directly to a solid ground plane. The device’s VLL, AVDD, DVDD, PVDD, PVSS, VPP, VNN, VPF, VNF and VRN voltage supplies and bypass capacitors pins must have a ceramic capacitor per pin and be placed close to the pin. A ceramic capacitor of 1.0 µF may be used. Only the VPP and VNN to GND capacitors need to be high-voltage type. The VPF to VPP and VNF to VNN capacitors can be low-voltage. It is advisable to minimize the trace length to the ground plane and to insert a ferrite bead in the power supply lead to the capacitor to prevent resonance within the power supply lines. For applications that are sensitive to jitter and noise, and when using multiple HV7351 ICs, another ferrite bead between each of the chip’s supply line should be inserted. To reduce inductance, special attention should be paid to minimizing trace lengths and using sufficient trace width. Surface mount components are highly recommended. Since the output impedance of the HV7351 high-voltage power stages is very low, in some cases it may be desirable to add a small value resistor in series with the output TX1 - TX8. This results in obtaining better waveform integrity at the load terminals after long cables and will also reduce the output voltage slew rate at the terminals of a capacitive load. Special attention should be paid to the parasitic coupling from the outputs to the input signal terminals of the HV7351. This feedback may cause oscillations or spurious waveform shapes on the edges of signal transitions. Since the input operates with signals down to 3.3V, even small coupling voltages may cause problems. The use of a solid ground plane and good power and signal layout practices will prevent this problem. It should also be ensured that the circulating ground return current from the capacitive load cannot react with common inductance to create noise voltages in the input circuitry. 2015 Microchip Technology Inc. DS50002375A-page 19 HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide NOTES: DS50002375A-page 20 2015 Microchip Technology Inc. HV7351 ULTRASOUND TX BEAMFORMER EVALUATION BOARD USER’S GUIDE Appendix A. Schematic and Layouts A.1 INTRODUCTION This appendix contains the following schematics and layouts for the HV7351 Ultrasound Tx Beamformer Evaluation Board: • • • • • • • Board – Schematic Board – Top Layer Board – Top Silk Layer Board – Middle Layer Board – Bottom Layer Board – Bottom Silk Layer Board – All Layers, and Dimension 2015 Microchip Technology Inc. DS50002375A-page 21 TP11 PWR VLL 19 TP9 TP8 12 8 20 22 16 23 14 13 17 EN TP15 SDI TP18 16 3 12 R15 1k C20 0.1 1 2 3 4 5 6 9 TP16 TRIG J6 JTAG 7 TP14 SCK VCC 2 TP10 SDO CS TDO TCK TDI TMS 18 TP7 19 21 TP1 13 CLKOUT C12 0.1 14 27 74 R14 1k VCC TP44 TP48 DS50002375A-page 22 R42 4.99k MH2 MH3 MH4 MH1 TP46 R43 4.99k VCC A1 TX4 EN TX5 TX6 DIN1 R18 33k R19 33k R20 33k DIN2 DOUT2 SCK SW1 SW2 C30 0.1 R23 200 SW3 C31 0.1 R24 200 SW4 C37 0.1 TX8 PGND PGND PGND PGND PGND PGND PGND PGND CS1 CS2 TRIG TCK TCK NC NC R25 200 TP32 33 TX4 C42 1μF C32 330p 250V 39 62 68 TP13 71 TX5 C35 0.1 R10 C13 330p 250V 23 78 53 48 46 77 55 24 TP26 TX6 C24 330p 250V TP24 TX7 VRN R52 TP37 R32 2.55k 1W TP33 R53 C39 330p 250V VNN TP40 R54 2.55k 1W TP39 C23 330p 250V C27 C46 C33 C47 1μF 1μF 1μF 1μF 100V 100V 100V 100V C26 1μF R11 2.55k 1W TP21 R37 TP28 TP41 C55 C45 C34 C28 1μF 1μF 1μF 1μF R28 2.55k 1W TP34 65 TX8 VSS R30 36 R26 200 SW5 C38 0.1 C36 1μF 30 TP30 R21 33k C43 C44 1μF 1μF R22 200 TX7 U1 HV7351 DOUT1 81 11 51 43 58 R17 33k D0 FCLK CF OERST CE CEO TP47 A0 TX3 TP36 TP45 11 TX2 R34 2.55k 1W TP38 TP20 VCC R31 1 VDD VSS R40 1 VRN R39 1 VRP R35 1 R38 1 VNN R33 10 VPP R36 10 VCC = +3.3V VRP J4 HEADER 10 VRN VDD VCC VDD VPP VNN VSS 2 1 D17 VDD/VSS = +/-5V VRP/VRN = +/-5V to +/-10V 6 VPP/VNN = +/-5 to +/-70V 1 4 3 6 1 4 3 VSS 6 1 D21A BAT54DW-7 1 3 7 8 10 13 TX1 CW D20B BAT54DW-7 U4 D0 XCF01SVO20C CLK CF OE_RST CE CEO GND R41 4.99k INV D19B BAT54DW-7 NC NC NC NC NC NC TP43 C29 0.1 1 2 3 4 5 6 7 8 9 10 20 VCCJ 19 VCCO 18 VVVINT 2 9 12 15 14 16 5 TMS 4 TDI3 17 TDO3 6 TCK VCC C40 0.1 SIZE R27 2.55k 1W TP31 4 3 VCC 1 2 1 2 D15 B1100-13 Z Y X V U 6 D16 B1100-13 EN 5 R13 2.55k 1W TP22 R29 D17 B1100-13 A1 U2 XC9572XL_VQ44 4 TP12 20 D21B BAT54DW-7 A0 TP4 TP6 18 R12 C22 330p 250V D20A BAT54DW-7 VCC VCC VCC NC12 NC11 NC10 35 26 15 43 CLKIN CLKOUT CW 37 D19A BAT54DW-7 SDI SDO SCK CS TRIG INV TP23 VRN 22 16 23 14 13 SIZE R9 2.55k 1W TP17 C25 330p 250V TX3 31 30 27 SDI SDO SCK CS TRIG EN C D E F G H I J K L M N 10 TMS 9 TDI1 24 TDO1 11 TCK TCK TDO2 TDI2 EN 12 OERST 36 40 32 29 28 33 8 38 42 1 41 34 39 44 OERST 21 B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 11 24 9 TMS 10 D0 FCLK CF CE CEO 2 3 5 6 7 18 NC9 20 NC8 19 NC7 TX2 C49 C56 1μF 1μF 100V 100V TP35 VCC TP42 C21 0.1 75 56 26 45 EN C19 C52 1μF 1μF 21 LED2 TP19 C16 C18 C48 C50 C51 C15 C5 1μF 1μF 1μF 1μF 1μF 1μF 1μF 100V 100V 100V 80 LED1 C9 C10 C11 0.1 0.1 0.1 EXTRG 35 26 15 VCC VCC VCC 43 39 44 37 31 30 27 LED1 LED2 PWR CLKIN EXTRG AA BB C8 0.1 D0 FCLK CF CE CEO 4 17 25 C7 0.1 CLKOUT 15 C6 0.1 U3 XC9572XL_VQ44 GND GND GND CC DD EE FF GG HH II JJ KK LL MM NN VCC TP5 VCC TP2 TP3 C41 0.1 TP27 VPP 1 50 10 79 22 52 49 R7 50 36 40 32 29 28 33 8 38 42 1 41 34 VDD R6 1k 1 2 B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 R5 1k C53 C14 C17 1μF 1μF 1μF 4 GND 17 GND 25 GND 2 WAV 3 FRE 5 INVERT 6 CW 7 ENA J3 EXTRG 3 TP25 2 R4 1k 38 37 31 70 69 63 32 64 44 57 2 2 R3 1k VPF VPF VPF VPF 2 VRP 3 C4 330p 250V C54 1μF VPP VPP VPP VPP VPP VPP VPP VPP VPP VPP 1 VNF VNF VNF VNF VNN VNN VNN VNN VNN VNN VNN VNN VNN VNN 1 59 42 73 28 61 40 35 34 67 66 29 60 41 72 1 R8 TP29 PVSS OUT 1 C1 0.1 PVSS GND 4 VRP PVSS VCC D3 GRN 76 2 EN D2 RED PVSS 1 2 1 J2 EX = 0 D1 YLW 54 R2 50 VCC D4 YLW 47 2 TX1 X1 FXO-HC73-160 25 R1 1k 1 AVDD DVDD DVDD PVDD PVDD PVDD PVDD 3 GND DGND DGND DGND DGND J1 EXCLK BOARD – SCHEMATIC LED1 LED2 PWR 2015 Microchip Technology Inc. A.2 VNN A.3 BOARD – TOP LAYER A.4 BOARD – TOP SILK LAYER 2015 Microchip Technology Inc. DS50002375A-page 23 HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide A.5 BOARD – MIDDLE LAYER A.6 BOARD – BOTTOM LAYER DS50002375A-page 24 2015 Microchip Technology Inc. A.7 BOARD – BOTTOM SILK LAYER A.8 BOARD – ALL LAYERS, AND DIMENSION 2015 Microchip Technology Inc. DS50002375A-page 25 HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide NOTES: DS50002375A-page 26 2015 Microchip Technology Inc. HV7351 ULTRASOUND TX BEAMFORMER EVALUATION BOARD USER’S GUIDE Appendix B. Bill of Materials (BOM) TABLE B-1: Qty BILL OF MATERIALS (BOM) Reference 18 C1, 6-12, 20, 21, 29-31, 35, 37, 38, 40, 41 8 Description Part Number TDK Corporation C1608X7R1C224K C4,13, 22-25, 32, 39 330 pF, 200V X7R ceramic capacitor TDK Corporation CGJ3E3C0G2D331J080AA 19 C5, 14, 15, 17, 19, 26, 28, 34, 36, 42-45, 50-55 1 µF, 16V X7R ceramic capacitor TDK Corporation C1608X7R1C105M 9 C16, 18, 27, 33, 46-49, 56 1 µF, 20% 100V X7R ceramic capacitor Taiyo Yuden Co., Ltd. HMK325B7105KN-T 2 D1, D4 LED Thin 585 nm, Yellow Diff. Lumex® Inc. SML-LXT0805YW-TR 1 D2 LED Thin 635 nm, Red Diff. Lumex Inc. SML-LXT0805IW-TR 1 D3 LED Thin 565 nm, Green Diff. Lumex Inc. SML-LXT0805GW-TR 3 D15, D16, D17 100V 1A Schottky Diode Diodes® Incorporated B1100-13 3 D19, D20, D21 30V Dual Schottky Diode Diodes Incorporated BAT54DW-7 2 J1, J3 Connector Jack End Launch PCB Gold SM Cinch Connectivity Solutions 142-0711-821 1 J2 Connector Header 2 POS, 100 Molex® Vert. Gold 22-28-4023 1 J4 Connector Header 10 POS, 100 Vert. Gold 1-640454-0 1 J6 Connector Header 6 POS, 100 Molex Vert. Gold 22-28-4063 4 MH1, MH2, MH3, MH4 Screw Machine Phillips 4-40X1/4 Building Fasteners PMS 440 0025 PH 1 PCB HV7351 Ultrasound Tx Beamformer Evaluation Board – Printed Circuit Board — 04-10397 7 R1, R3, R4, R5, R6, 1 k, 1/16W, 1% resistor R14, R15 ROHM Semiconductor MCR03EZP5J10 2 R2, R7 Panasonic® - ECG ERJ-3EKF49R9V 8 R8, R10, R12, R29, Solder Gap (short) R30, R37, R52, R53 NA NA 8 R9, R11, R13, R27, 2.55 k, 1W, 1% resistor R28, R32, R34, R54 Panasonic - ECG ERJ-1TNF2551U 5 R17, R18, R19, R20, 33.2 k, 1/16W, 1% resistor R21 Panasonic - ECG ERJ-3EKF3322V 5 R22, R23, R24, R25, 200, 1/16W, 1% resistor R26 ROHM Semiconductor MCR03FZPEJ201 Note 1: 0.22 µF, 10% 16V X7R ceramic capacitor Manufacturer 49.9, 1/16W, 1% resistor TE Connectivity Ltd. The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. 2015 Microchip Technology Inc. DS50002375A-page 27 HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide TABLE B-1: Qty BILL OF MATERIALS (BOM) (CONTINUED) Reference Description Manufacturer Part Number 5 R31, R35, R38, R39, 1, 1/10W, 1% resistor R40 Stackpole Electronics, Inc. RNCP0603FTD1R00 2 R33,3R6 10, 1/10W, 1% resistor Stackpole Electronics, Inc. RMCF0603JT10R0 3 R41, R42, R43 4.99 k, 1/16W, 1% resistor Panasonic - ECG ERJ-3EKF4991V 5 SW1-SW5 Switch LT 4.7 mm X 3.5 mm 100 GF SMD Panasonic - ECG EVQ-P2002M 2 TP20, TP28 Test Point PC Multi-Purpose Block Keystone Electronics Corp. 5011 1 U1 IC HV7351K6-G 8-Ch ±70V, 3A Beamformer Microchip Technology Inc. HV7351K6-G 2 U2, U3 IC CPLD 72 MC cell C-Temp 44-VQFP Xilinx Inc. XC9572XL-5VQ44C 1 U4 IC Prom IN Syst. Prg. 3.3V 20TSSOP Xilinx Inc. XCF01SVOG20C 1 X1 160 MHz Clock Oscillator, 3.3V Fox Electronics SMD FXO-HV73x-160 4 for MH1-4 Standoff Hex 4-40THR 0.25”L Alum. Keystone Electronics Corp. 1891 1 for J2 Shunt, ECON, PHBR 5 AU, Black TE Connectivity Ltd 382811-8 Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. DS50002375A-page 28 2015 Microchip Technology Inc. HV7351 ULTRASOUND TX BEAMFORMER EVALUATION BOARD USER’S GUIDE Appendix C. Plots and Waveforms C.1 HV7351 TYPICAL WAVEFORMS C.1.1 Four Outputs of Eight Channels, 5 MHz ±70V with Different Beamforming Delays, with 330 pF||2.5 k Load C.1.2 Tx Output at 10 MHz ±70V with 330 pF||2.5 k Load 2015 Microchip Technology Inc. DS50002375A-page 29 HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide DS50002375A-page 30 C.1.3 Tx RTZ Output at ±70V with 330 pF|| 2.5k Load C.1.4 RTZ Output tr/tf Time at 0 to +70V with 330 pF|| 2.5k Load 2015 Microchip Technology Inc. Plots and Waveforms C.1.5 RTZ Output tr/tf Time at 0 to -70V with 330 pF||2.5 k Load C.1.6 5 MHz tr/tf Time at ±50V Output with 330 pF||2.5 k Load 2015 Microchip Technology Inc. DS50002375A-page 31 HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide DS50002375A-page 32 C.1.7 ±50V 5 MHz 8-Cycle Output & HD2 with 330 pF||2.5 k Load C.1.8 5 MHz ±75V B-Mode Waveform and Flip Waveform 2015 Microchip Technology Inc. Plots and Waveforms C.1.9 2015 Microchip Technology Inc. Four Outputs of Eight Channels, 5 MHz ±5.0V CW-Mode Output Waveform DS50002375A-page 33 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 Germany - Dusseldorf Tel: 49-2129-3766400 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Hong Kong Tel: 852-2943-5100 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 Austin, TX Tel: 512-257-3370 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Canada - Toronto Tel: 905-673-0699 Fax: 905-673-6509 China - Dongguan Tel: 86-769-8702-9880 China - Hangzhou Tel: 86-571-8792-8115 Fax: 86-571-8792-8116 India - Pune Tel: 91-20-3019-1500 Japan - Osaka Tel: 81-6-6152-7160 Fax: 81-6-6152-9310 Japan - Tokyo Tel: 81-3-6880- 3770 Fax: 81-3-6880-3771 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 China - Hong Kong SAR Tel: 852-2943-5100 Fax: 852-2401-3431 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 China - Shenzhen Tel: 86-755-8864-2200 Fax: 86-755-8203-1760 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 Taiwan - Kaohsiung Tel: 886-7-213-7828 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Germany - Pforzheim Tel: 49-7231-424750 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Venice Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Poland - Warsaw Tel: 48-22-3325737 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 Taiwan - Taipei Tel: 886-2-2508-8600 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 01/27/15 DS50002375A-page 34 2015 Microchip Technology Inc.