HV7351 Beamformer User's Guide

HV7351
Ultrasound Tx Beamformer
Evaluation Board
User’s Guide
 2015 Microchip Technology Inc.
DS50002375A
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© 2015, Microchip Technology Incorporated, Printed in the
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ISBN: 978-1-63277-403-3
QUALITYMANAGEMENTSYSTEM
CERTIFIEDBYDNV
== ISO/TS16949==
DS50002375A-page 2
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
 2015 Microchip Technology Inc.
Object of Declaration: HV7351 Ultrasound Tx Beamformer Evaluation Board
 2015 Microchip Technology Inc.
DS50002375A-page 3
NOTES:
DS50002375A-page 4
 2015 Microchip Technology Inc.
HV7351
ULTRASOUND TX BEAMFORMER
EVALUATION BOARD USER’S GUIDE
Table of Contents
Preface ........................................................................................................................... 7
Introduction............................................................................................................ 7
Document Layout .................................................................................................. 7
Conventions Used in this Guide ........................................................................... 8
Recommended Reading........................................................................................ 9
The Microchip Web Site ........................................................................................ 9
Customer Support ................................................................................................. 9
Document Revision History ................................................................................... 9
Chapter 1. Product Overview
1.1 Introduction ................................................................................................... 11
1.2 HV7351 Device Overview ............................................................................ 11
1.3 Board Overview ............................................................................................ 11
1.4 What the HV7351 Ultrasound Tx Beamformer Evaluation Board
Kit Includes ............................................................................................. 13
Chapter 2. Installation and Operation
2.1 Getting Started ............................................................................................. 15
2.2 Setup Procedure .......................................................................................... 15
2.3 Evaluating The HV7351 Ultrasound Tx Beamformer Evaluation Board ....... 18
2.4 Normal Operation ......................................................................................... 18
Chapter 3. Printed Circuit Board Layout Techniques
Appendix A. Schematic and Layouts
A.1 Introduction .................................................................................................. 21
A.2 Board – Schematic ....................................................................................... 22
A.3 Board – Top Layer ....................................................................................... 23
A.4 Board – Top Silk Layer ................................................................................ 23
A.5 Board – Middle Layer ................................................................................... 24
A.6 Board – Bottom Layer .................................................................................. 24
A.7 Board – Bottom Silk Layer ........................................................................... 25
A.8 Board – All Layers, and Dimension .............................................................. 25
Appendix B. Bill of Materials (BOM)........................................................................... 27
Appendix C. Plots and Waveforms
C.1 HV7351 Typical Waveforms ........................................................................ 29
Worldwide Sales and Service .................................................................................... 34
 2015 Microchip Technology Inc.
DS50002375A-page 5
HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide
NOTES:
DS50002375A-page 6
 2015 Microchip Technology Inc.
HV7351
ULTRASOUND TX BEAMFORMER
EVALUATION BOARD USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level
of the document.
For the most up-to-date information on development tools, see the MPLAB® IDE online help.
Select the Help menu, and then Topics to open a list of available online help files.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
HV7351 Ultrasound Tx Beamformer Evaluation Board. Items discussed in this chapter
include:
• Document Layout
• Conventions Used in this Guide
• Recommended Reading
• The Microchip Web Site
• Customer Support
• Document Revision History
DOCUMENT LAYOUT
This document describes how to use the HV7351 Ultrasound Tx Beamformer
Evaluation Board as a development tool to emulate and debug firmware on a target
board. The manual layout is as follows:
• Chapter 1. “Product Overview” – Important information about the HV7351
Ultrasound Tx Beamformer Evaluation Board.
• Chapter 2. “Installation and Operation” – This chapter includes a detailed
description of each function of the demonstration board and instructions on how to
begin using the board.
• Chapter 3. “Printed Circuit Board Layout Techniques” – This chapter provides
in-depth information on the recommended PCB Layout Techniques to optimally
use the board.
• Appendix A. “Schematic and Layouts” – Shows the schematic and layout
diagrams for the HV7351 Ultrasound Tx Beamformer Evaluation Board.
• Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the
HV7351 Ultrasound Tx Beamformer Evaluation Board.
• Appendix C. “Plots and Waveforms” – Describes the various plots and
waveforms for the HV7351 Ultrasound Tx Beamformer Evaluation Board.
 2015 Microchip Technology Inc.
DS50002375A-page 7
HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide
CONVENTIONS USED IN THIS GUIDE
This manual uses the following documentation conventions:
DOCUMENTATION CONVENTIONS
Description
Arial font:
Italic characters
Represents
Referenced books
Emphasized text
A window
A dialog
A menu selection
A field name in a window or
dialog
A menu path
MPLAB® IDE User’s Guide
...is the only compiler...
the Output window
the Settings dialog
select Enable Programmer
“Save project before build”
A dialog button
A tab
A number in verilog format,
where N is the total number of
digits, R is the radix and n is a
digit.
A key on the keyboard
Click OK
Click the Power tab
4‘b0010, 2‘hF1
Italic Courier New
Sample source code
Filenames
File paths
Keywords
Command-line options
Bit values
Constants
A variable argument
Square brackets [ ]
Optional arguments
Curly brackets and pipe
character: { | }
Ellipses...
Choice of mutually exclusive
arguments; an OR selection
Replaces repeated text
#define START
autoexec.bat
c:\mcc18\h
_asm, _endasm, static
-Opa+, -Opa0, 1
0xFF, ‘A’
file.o, where file can be
any valid filename
mcc18 [options] file
[options]
errorlevel {0|1}
Initial caps
Quotes
Underlined, italic text with
right angle bracket
Bold characters
N‘Rnnnn
Text in angle brackets < >
Courier New font:
Plain Courier New
Represents code supplied by
user
DS50002375A-page 8
Examples
File>Save
Press <Enter>, <F1>
var_name [,
var_name...]
void main (void)
{ ...
}
 2015 Microchip Technology Inc.
Preface
RECOMMENDED READING
This user’s guide describes how to utilize the HV7351 Ultrasound Tx Beamformer
Evaluation Board. Another useful document is listed below. The following Microchip
document is available and recommended as a supplemental reference resource.
• HV7351 Data Sheet – “8-Channel ±70V 3A Programmable High Voltage
Ultrasound Transmit Beamformer” (DS20005412).
THE MICROCHIP WEB SITE
Microchip provides online support via our web site at www.microchip.com. This web
site is used as a means to make files and information easily available to customers.
Accessible by using your favorite Internet browser, the web site contains the following
information:
• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.
Technical support is available through the web site at:
http://www.microchip.com/support
DOCUMENT REVISION HISTORY
Revision A (June 2015)
• Initial Release of this Document.
 2015 Microchip Technology Inc.
DS50002375A-page 9
HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide
NOTES:
DS50002375A-page 10
 2015 Microchip Technology Inc.
HV7351
ULTRASOUND TX BEAMFORMER
EVALUATION BOARD USER’S GUIDE
Chapter 1. Product Overview
1.1
INTRODUCTION
This chapter discusses the following topics:
• HV7351 Device Overview
• Board Overview
• What the HV7351 Ultrasound Tx Beamformer Evaluation Board Kit Includes
1.2
HV7351 DEVICE OVERVIEW
The Microchip Technology Inc. HV7351 is a monolithic, eight channel, high-speed,
high-voltage ultrasound transmitter Return-To-Zero (RTZ) programmable pulser. This
integrated, high-performance circuit comes in a single 11 x 11 x 0.9 mm, 80-lead DFN
package.
Each channel is capable of swinging up to ±70V with an active discharge back to 0V.
The outputs can source and sink more than 3A to achieve fast output rise and fall times.
The active discharge is also capable of sourcing and sinking 3A for a fast return to
ground. The digital beamforming topology of the HV7351 will significantly reduce the
number of I/O logic control lines to the transmitter.
Each output is controlled by a 16 or 32-bit serial shift register. An arbitrary pattern can
be generated depending on what is loaded into the shift registers, including four
independent pattern options.
Once the patterns are loaded, the user can quickly select any of the four predefined
patterns without having to clock in new data. A programmable 10-bit delay counter is
provided for each output. This allows the user to program different delay times for each
channel for beamforming.
1.3
BOARD OVERVIEW
There are two built-in Complex Programmable Logic Devices (CPLDs) and one serial
EEPROM on the board to provide multiple demo waveform patterns. Other custom
experimental data can be easily downloaded to these CPLDs/PROMs via the 6-pin
Joint Test Action Group (JTAG) interface.
The HV7351 Board output waveforms can be directly displayed using an oscilloscope,
by connecting the scope probe to the test points TX1 - TX8 and GND. The soldering
jumper can select whether or not to connect the on-board dummy-load, a 330 pF
capacitor paralleling with a 2.5 k resistor. The test points can be used to connect the
user’s transducer to easily evaluate the pulser.
 2015 Microchip Technology Inc.
DS50002375A-page 11
HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide
+3.3V
+5.0V
+5.0 to 12V
+3.0 to 70V
+3.3V
VLL
VDD
VRP
VPF VPP
EXCLK
LRP
OSC
CLKIN VCC
EN
160 MHz
SPI &
Control
Logic
TCK
EN
EXTRG
VPP
Waveform
Generator
CPLD
TRIG
VPP
PGND
VRN
HVOUT
HV7351
VPF
1 of 8
VNF Channels Shown
TX1
R8
CW, SIZE, A [1:0]
Pattern
Registers
6
JTAG
VNN
GND
Delay
Registers
AGND
PGND
330 pF
WAVE
FREQ
INVERT
ENA
CW
VSS
-5.0V
FIGURE 1-1:
PGND
VRP
GND
DGND
2.5 kŸ
VRN
VRP
PreScale
Registers
CW
INV
PWR
EN
X1
VNN
SP1
IN-System
PROM
TP11
Dummy
Load
VRN
-5.0 to -12V
LRN
PGND
SUB
VNF VNN
TX8
R53
PGND
330 pF
TP37
X8
Dummy
Load
2.5 kŸ
PGND
-3.0 to -70V
Block Diagram.
1.3.1
Board Features
• Two CPLDs provided to program a wide variety of data patterns that can be
transmitted.
• Push-button selection of various Waveforms, Transmission Frequency, Waveform
Inversion, Mode (Brightness or Continuous Wave mode) and Enable (see
Table 2-3 in Chapter 2. “Installation and Operation”)
• LED indication of push button operations (see Table 2-4 in Chapter
2. “Installation and Operation”)
• Ability to bypass the crystal oscillator provided with an external clock source
• Numerous test points for probing of various input and output signals
1.3.2
HV7351 Ultrasound Tx Beamformer Evaluation Board Hardware
Components
The HV7351 Ultrasound Tx Beamformer Evaluation Board contains several
components:
• One HV7351 8-Channel ±70V, 3A Programmable Ultrasound Transmit
Beamformer.
• Two Xilinx Inc. XC9572XL_VQ44 CPLDs
• Two Xilinx Inc. XCF01SVO20C PROM
• One Fox Electronics FXO-HC73-160 crystal oscillator running at 160 MHz
TABLE 1-1:
TECHNICAL SPECIFICATIONS
Parameter
DS50002375A-page 12
Value
Modes of Operation
B-mode and CW-mode
Input Logic Level
3.3V
Transmission Frequency
1 MHz – 10 MHz
High Voltage Supply Range
±3V – ±70V
Load on Each Channel
330 pF||2.5 k
 2015 Microchip Technology Inc.
1.4
WHAT THE HV7351 ULTRASOUND TX BEAMFORMER EVALUATION
BOARD KIT INCLUDES
The HV7351 Ultrasound Tx Beamformer Evaluation Board Kit includes:
• HV7351 Ultrasound Tx Beamformer Evaluation Board (ADM00658)
• Important Information Sheet
FIGURE 1-2:
HV7351 Ultrasound Tx Beamformer Evaluation Board Front View.
FIGURE 1-3:
HV7351 Ultrasound Tx Beamformer Evaluation Board Back View.
 2015 Microchip Technology Inc.
DS50002375A-page 13
HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide
NOTES:
DS50002375A-page 14
 2015 Microchip Technology Inc.
HV7351
ULTRASOUND TX BEAMFORMER
EVALUATION BOARD USER’S GUIDE
Chapter 2. Installation and Operation
2.1
GETTING STARTED
The HV7351 Ultrasound Tx Beamformer Evaluation Board is fully assembled and
tested. The board requires external voltage sources.
2.1.1
Additional Tools Required for Operation
• A DC power supply, a bench supply that can produce 3.3V, 5V, -5V, 12V, -12V,
70V and -70V
• An oscilloscope and/or a multi-meter to observe the waveforms and measure
electrical parameters
2.2
SETUP PROCEDURE
To operate the HV7351 Ultrasound Tx Beamformer Evaluation Board, the following
steps must be followed:
WARNING
Read the HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide (this
document) fully before proceeding to board setup.
1. Connect the supplies correctly to the board as shown in Figure 2-1.
2. Set the voltages and current limits of the supply rails according to Table 2-1,
before connecting the power connector J4.
TABLE 2-1:
POWER CONNECTOR DESCRIPTION
Pin
Name
Description
1
VCC
2
GND 0V, Ground
3
VDD
+3.3V Logic voltage input for VLL and CPLD, 200 mA
+5.0V HV7351 Board positive VDD supply, 50 mA
4
VSS
-5.0V HV7351 Board negative VSS supply, 50 mA
5
VRN
-5.0V to -12V HV7351 Board negative regulator supply, 50 mA
6
VRP
+5.0V to +12V HV7351 Board positive regulator supply, 50 mA
7
GND 0V, Ground
8
VNN
9
GND 0V, Ground
10
VPP
Note 1:
 2015 Microchip Technology Inc.
-3.0V to -70V negative high-voltage supply, 10 mA to 50 mA (Note 1)
+3.0V to +70V positive high-voltage supply, 10 mA to 50 mA (Note 1)
The current limits given for VPP and VNN are good for the supplied CPLD
program in which B/CW-mode transmission is limited to about 16 cycles.
If the user reprograms the CPLD for more CW cycles, the current limits
need to be similarly increased.
DS50002375A-page 15
+5.0V
+5.0 to 12V
+3.0 to 70V
+3.3V
VLL
VDD
VRP
VPF VPP
EXCLK
LRP
OSC
CLKIN VCC
160 MHz
TCK
EN
EXTRG
Waveform
Generator
CPLD
VPP
EN
TRIG
CW, SIZE, A [1:0]
6
JTAG
SPI &
Control
Logic
VPP
PGND
VRN
HVOUT
HV7351
VPF
1 of 8
VNF Channels Shown
TX1
R8
 2015 Microchip Technology Inc.
WAVE
FREQ
INVERT
ENA
CW
AGND
CW
INV
PWR
EN
Pattern
Registers
Delay
Registers
VNN
GND
PGND
330 pF
PGND
VRP
GND
DGND
VSS
Power Supply and Load Connection Diagram.
2.5 kŸ
VNN
VRN
VRP
PreScale
Registers
-5.0V
FIGURE 2-1:
X1
Dummy
Load
SP1
IN-System
PROM
TP11
VRN
-5.0 to -12V
LRN
VNF VNN
-3.0 to -70V
PGND
SUB
TX8
PGND
330 pF
R53
TP37
X8
Dummy
Load
2.5 kŸ
PGND
HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide
DS50002375A-page 16
+3.3V
3. Connect the high-impedance probe(s) of the oscilloscope to the Tx output(s).
4. Power up the supplies according to the power-up sequence as indicated in
Table 2-2.
TABLE 2-2:
SUPPLY POWER-UP SEQUENCE
Step
Name
Description
1
+VCC
2
+VDD
+5.0V positive power supply
3
-VSS
-5.0V negative power supply
4
+VRP
+5V to +12.0V positive CW power supply
5
-VRN
-5V to -12.0V positive CW power supply
6
+VPP
+3V to +70V positive high voltage supply
7
-VNN
-3V to -70V positive high voltage supply
+3.3V positive logic supply voltage for HV7351 Board VLL and
CPLD VCC
5. After the HV7351 Board has been successfully powered up by following the
power-up sequence, enable the board by pressing the ENA button.
6. Change the output waveform and transmit frequency by pressing the WAVE and
FREQ buttons, respectively. An overview of Push Button Operations is provided
in Table 2-3.
TABLE 2-3:
PUSH BUTTON OPERATIONS
Button
Description
WAVE
Toggle select pulse waveforms
FREQ
Toggle select B-mode demo frequency
INVERT Toggle select non-inverting or inverting waveform
CW
Toggle select CW-mode or B-mode (Note 1)
ENA
Toggle ON or OFF HV7351 Board enable signal EN
In CW-mode, VPP/VNN voltages must be reduced to  ±8V
Note 1:
7. The output waveform can be inverted by pressing the INVERT button. Table 2-4
lists all LED Indicators.
TABLE 2-4:
LED INDICATORS
LED
CW
Description
CW-mode indicator
INVERT Inverting waveform output indicator
PWR
VLL 3.3V and CPLD chip VCC power supply ON indicator
ENA
IC-enabled indicator. CPDL power-up default is OFF
8. The transmission mode can be toggled by pressing the CW button. In CW-mode,
the typical waveforms are 16-cycle 5 MHz. To prevent the HV7351 Board from
overheating, the following parameters are recommended when setting VPP/VNN
voltages in CW-mode:
• +3VVPP +8V
• -3V  VNN -8V
 2015 Microchip Technology Inc.
DS50002375A-page 17
HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide
WARNING
Carefully double-check the voltage of every supply rail, current-limit value and
polarity individually to avoid board damage.
Take extreme care while connecting the supplies to the board since
connecting them incorrectly to the wrong pins could result in permanent
damage to the entire board.
2.3
EVALUATING THE HV7351 ULTRASOUND TX BEAMFORMER EVALUATION
BOARD
The best way to evaluate the HV7351 Ultrasound Tx Beamformer Evaluation Board is
to explore the circuit and measure the voltages and currents with a Digital Voltage
Meter (DVM) while probing the board with an oscilloscope.
2.4
NORMAL OPERATION
The HV7351 Ultrasound Tx Beamformer Evaluation Board should be powered up with
multiple lab DC power supplies that feature current-limiting functions.
To meet the typical loading condition when using the high-impedance probe of an
oscilloscope, the on-board dummy load (330 pF||2.5 k) should be connected to the
high-voltage pulser output through the solder jumper. To evaluate different loading
conditions, the values of the RC may be changed within the current and power limits of
the device.
In order to drive the user’s piezoelectric transducers with a cable, the output load
impedance should be properly matched to avoid cable and transducer reflections.
A 70 to 75 k coaxial cable is recommended. The coaxial cable end should be
soldered to the TX1 - TX8 and GND directly with very short leads. If the user’s load is
being used, the on-board dummy load should be disconnected by cutting the small
shorting copper trace in between the 0k resistors (R8, R12, R29, R30, R10, R37, R52
and R53) and the eight resistor pads. They are shorted by factory default.
All on-board test points are designed to work with the high-impedance probe of an
oscilloscope. Some probes may have limited input voltage range. When using the
probe on these high-voltage test points, make sure that the VPP/VNN voltages do not
exceed the probe limit. When using the high-impedance oscilloscope probe on the
on-board test points, it is important to have short ground leads to the circuit board
ground plane.
DS50002375A-page 18
 2015 Microchip Technology Inc.
HV7351
ULTRASOUND TX BEAMFORMER
EVALUATION BOARD USER’S GUIDE
Chapter 3. Printed Circuit Board Layout Techniques
The large thermal pad at the bottom of the HV7351 package is internally connected to
the IC’s substrate (VSUB). This thermal pad should be connected to 0V or GND
externally on the PCB. The designer needs to pay attention to the connecting traces on
the outputs TX1 - TX8, specifically the high-voltage and high-speed traces. In
particular, controlled impedance to ground plane and more trace spacing needs to be
applied in such situations.
High-speed PCB trace design practices that are compatible with about
50 MHz to 100 MHz operating speeds are used for the HV7351 PCB layout. The
internal circuitry of the HV7351 can operate at rather high frequencies, the primary
speed limitation being the load capacitance.
Because of the high-speed and high-transient currents that result when driving
capacitive loads, the supply-voltage bypass capacitors should be as close to the pins
as possible. The GND pin should have low inductance feed-through via connections
that are soldered directly to a solid ground plane.
The device’s VLL, AVDD, DVDD, PVDD, PVSS, VPP, VNN, VPF, VNF and VRN voltage
supplies and bypass capacitors pins must have a ceramic capacitor per pin and be
placed close to the pin. A ceramic capacitor of 1.0 µF may be used. Only the VPP and
VNN to GND capacitors need to be high-voltage type. The VPF to VPP and VNF to VNN
capacitors can be low-voltage.
It is advisable to minimize the trace length to the ground plane and to insert a ferrite
bead in the power supply lead to the capacitor to prevent resonance within the power
supply lines. For applications that are sensitive to jitter and noise, and when using
multiple HV7351 ICs, another ferrite bead between each of the chip’s supply line should
be inserted.
To reduce inductance, special attention should be paid to minimizing trace lengths and
using sufficient trace width. Surface mount components are highly recommended.
Since the output impedance of the HV7351 high-voltage power stages is very low, in
some cases it may be desirable to add a small value resistor in series with the output
TX1 - TX8. This results in obtaining better waveform integrity at the load terminals after
long cables and will also reduce the output voltage slew rate at the terminals of a
capacitive load.
Special attention should be paid to the parasitic coupling from the outputs to the input
signal terminals of the HV7351. This feedback may cause oscillations or spurious
waveform shapes on the edges of signal transitions. Since the input operates with
signals down to 3.3V, even small coupling voltages may cause problems. The use of a
solid ground plane and good power and signal layout practices will prevent this
problem.
It should also be ensured that the circulating ground return current from the capacitive
load cannot react with common inductance to create noise voltages in the input
circuitry.
 2015 Microchip Technology Inc.
DS50002375A-page 19
HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide
NOTES:
DS50002375A-page 20
 2015 Microchip Technology Inc.
HV7351
ULTRASOUND TX BEAMFORMER
EVALUATION BOARD USER’S GUIDE
Appendix A. Schematic and Layouts
A.1
INTRODUCTION
This appendix contains the following schematics and layouts for the HV7351
Ultrasound Tx Beamformer Evaluation Board:
•
•
•
•
•
•
•
Board – Schematic
Board – Top Layer
Board – Top Silk Layer
Board – Middle Layer
Board – Bottom Layer
Board – Bottom Silk Layer
Board – All Layers, and Dimension
 2015 Microchip Technology Inc.
DS50002375A-page 21
TP11
PWR
VLL
19
TP9
TP8
12
8
20
22
16
23
14
13
17
EN
TP15
SDI
TP18
16
3
12
R15
1k
C20
0.1
1
2
3
4
5
6
9
TP16
TRIG
J6
JTAG
7
TP14
SCK
VCC
2
TP10
SDO
CS
TDO
TCK
TDI
TMS
18
TP7
19
21
TP1
13
CLKOUT
C12
0.1
14
27
74
R14
1k
VCC
TP44
TP48
DS50002375A-page 22
R42
4.99k
MH2
MH3
MH4
MH1
TP46
R43
4.99k
VCC
A1
TX4
EN
TX5
TX6
DIN1
R18
33k
R19
33k
R20
33k
DIN2
DOUT2
SCK
SW1
SW2
C30
0.1
R23
200
SW3
C31
0.1
R24
200
SW4
C37
0.1
TX8
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
CS1
CS2
TRIG
TCK
TCK
NC
NC
R25
200
TP32
33
TX4
C42
1μF
C32
330p
250V
39
62
68
TP13
71
TX5
C35
0.1
R10
C13
330p
250V
23
78
53
48
46
77
55
24
TP26
TX6
C24
330p
250V
TP24
TX7
VRN
R52
TP37
R32
2.55k
1W
TP33
R53
C39
330p
250V
VNN
TP40
R54
2.55k
1W
TP39
C23
330p
250V
C27 C46 C33 C47
1μF 1μF 1μF 1μF
100V 100V 100V 100V
C26
1μF
R11
2.55k
1W
TP21
R37
TP28
TP41
C55 C45 C34 C28
1μF 1μF 1μF 1μF
R28
2.55k
1W
TP34
65
TX8
VSS
R30
36
R26
200
SW5
C38
0.1
C36
1μF
30
TP30
R21
33k
C43 C44
1μF 1μF
R22
200
TX7
U1
HV7351
DOUT1
81
11
51
43
58
R17
33k
D0
FCLK
CF
OERST
CE
CEO
TP47
A0
TX3
TP36
TP45
11
TX2
R34
2.55k
1W
TP38
TP20
VCC
R31
1
VDD
VSS
R40
1
VRN
R39
1
VRP
R35
1
R38
1
VNN
R33
10
VPP
R36
10
VCC = +3.3V
VRP
J4
HEADER 10
VRN
VDD
VCC
VDD
VPP
VNN
VSS
2
1
D17
VDD/VSS = +/-5V
VRP/VRN = +/-5V to +/-10V
6
VPP/VNN = +/-5 to +/-70V
1
4
3
6
1
4
3
VSS
6
1
D21A
BAT54DW-7
1
3
7
8
10
13
TX1
CW
D20B
BAT54DW-7
U4
D0
XCF01SVO20C CLK
CF
OE_RST
CE
CEO
GND
R41
4.99k
INV
D19B
BAT54DW-7
NC
NC
NC
NC
NC
NC
TP43
C29
0.1
1
2
3
4
5
6
7
8
9
10
20
VCCJ
19
VCCO
18
VVVINT
2
9
12
15
14
16
5
TMS
4
TDI3
17
TDO3
6
TCK
VCC
C40
0.1
SIZE
R27
2.55k
1W
TP31
4
3
VCC
1
2
1
2
D15
B1100-13
Z
Y
X
V
U
6
D16
B1100-13
EN
5
R13
2.55k
1W
TP22
R29
D17
B1100-13
A1
U2
XC9572XL_VQ44
4
TP12
20
D21B
BAT54DW-7
A0
TP4
TP6
18
R12
C22
330p
250V
D20A
BAT54DW-7
VCC
VCC
VCC
NC12
NC11
NC10
35
26
15
43
CLKIN
CLKOUT
CW
37
D19A
BAT54DW-7
SDI
SDO
SCK
CS
TRIG
INV
TP23
VRN
22
16
23
14
13
SIZE
R9
2.55k
1W
TP17
C25
330p
250V
TX3
31
30
27
SDI
SDO
SCK
CS
TRIG
EN
C
D
E
F
G
H
I
J
K
L
M
N
10
TMS
9
TDI1
24
TDO1
11
TCK
TCK
TDO2
TDI2
EN
12
OERST
36
40
32
29
28
33
8
38
42
1
41
34
39
44
OERST
21
B0
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
B11
11
24
9
TMS
10
D0
FCLK
CF
CE
CEO
2
3
5
6
7
18
NC9
20
NC8
19
NC7
TX2
C49 C56
1μF
1μF
100V 100V
TP35
VCC TP42
C21
0.1
75
56
26
45
EN
C19 C52
1μF 1μF
21
LED2
TP19
C16 C18 C48
C50 C51 C15 C5 1μF 1μF 1μF
1μF 1μF 1μF 1μF 100V 100V 100V
80
LED1
C9 C10 C11
0.1 0.1 0.1
EXTRG
35
26
15
VCC
VCC
VCC
43
39
44
37
31
30
27
LED1
LED2
PWR
CLKIN
EXTRG
AA
BB
C8
0.1
D0
FCLK
CF
CE
CEO
4
17
25
C7
0.1
CLKOUT
15
C6
0.1
U3
XC9572XL_VQ44
GND
GND
GND
CC
DD
EE
FF
GG
HH
II
JJ
KK
LL
MM
NN
VCC
TP5
VCC
TP2 TP3
C41
0.1
TP27 VPP
1
50
10
79
22
52
49
R7
50
36
40
32
29
28
33
8
38
42
1
41
34
VDD
R6
1k
1
2
B0
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
B11
R5
1k
C53 C14 C17
1μF 1μF 1μF
4
GND
17
GND
25
GND
2
WAV
3 FRE
5 INVERT
6 CW
7 ENA
J3
EXTRG
3
TP25
2
R4
1k
38
37
31
70
69
63
32
64
44
57
2
2
R3
1k
VPF
VPF
VPF
VPF
2
VRP
3
C4
330p
250V
C54
1μF
VPP
VPP
VPP
VPP
VPP
VPP
VPP
VPP
VPP
VPP
1
VNF
VNF
VNF
VNF
VNN
VNN
VNN
VNN
VNN
VNN
VNN
VNN
VNN
VNN
1
59
42
73
28
61
40
35
34
67
66
29
60
41
72
1
R8
TP29
PVSS
OUT
1
C1
0.1
PVSS
GND
4
VRP
PVSS
VCC
D3
GRN
76
2
EN
D2
RED
PVSS
1
2
1
J2
EX = 0
D1
YLW
54
R2
50
VCC
D4
YLW
47
2
TX1
X1
FXO-HC73-160
25
R1
1k
1
AVDD
DVDD
DVDD
PVDD
PVDD
PVDD
PVDD
3
GND
DGND
DGND
DGND
DGND
J1
EXCLK
BOARD – SCHEMATIC
LED1
LED2
PWR
 2015 Microchip Technology Inc.
A.2
VNN
A.3
BOARD – TOP LAYER
A.4
BOARD – TOP SILK LAYER
 2015 Microchip Technology Inc.
DS50002375A-page 23
HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide
A.5
BOARD – MIDDLE LAYER
A.6
BOARD – BOTTOM LAYER
DS50002375A-page 24
 2015 Microchip Technology Inc.
A.7
BOARD – BOTTOM SILK LAYER
A.8
BOARD – ALL LAYERS, AND DIMENSION
 2015 Microchip Technology Inc.
DS50002375A-page 25
HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide
NOTES:
DS50002375A-page 26
 2015 Microchip Technology Inc.
HV7351
ULTRASOUND TX BEAMFORMER
EVALUATION BOARD USER’S GUIDE
Appendix B. Bill of Materials (BOM)
TABLE B-1:
Qty
BILL OF MATERIALS (BOM)
Reference
18
C1, 6-12, 20, 21,
29-31, 35, 37, 38,
40, 41
8
Description
Part Number
TDK Corporation
C1608X7R1C224K
C4,13, 22-25, 32, 39 330 pF, 200V X7R
ceramic capacitor
TDK Corporation
CGJ3E3C0G2D331J080AA
19
C5, 14, 15, 17, 19,
26, 28, 34, 36,
42-45, 50-55
1 µF, 16V X7R
ceramic capacitor
TDK Corporation
C1608X7R1C105M
9
C16, 18, 27, 33,
46-49, 56
1 µF, 20% 100V X7R
ceramic capacitor
Taiyo Yuden Co., Ltd.
HMK325B7105KN-T
2
D1, D4
LED Thin 585 nm, Yellow Diff.
Lumex® Inc.
SML-LXT0805YW-TR
1
D2
LED Thin 635 nm, Red Diff.
Lumex Inc.
SML-LXT0805IW-TR
1
D3
LED Thin 565 nm, Green Diff.
Lumex Inc.
SML-LXT0805GW-TR
3
D15, D16, D17
100V 1A Schottky Diode
Diodes® Incorporated
B1100-13
3
D19, D20, D21
30V Dual Schottky Diode
Diodes Incorporated
BAT54DW-7
2
J1, J3
Connector Jack End Launch
PCB Gold SM
Cinch Connectivity
Solutions
142-0711-821
1
J2
Connector Header 2 POS, 100 Molex®
Vert. Gold
22-28-4023
1
J4
Connector Header 10 POS,
100 Vert. Gold
1-640454-0
1
J6
Connector Header 6 POS, 100 Molex
Vert. Gold
22-28-4063
4
MH1, MH2, MH3,
MH4
Screw Machine Phillips
4-40X1/4
Building Fasteners
PMS 440 0025 PH
1
PCB
HV7351 Ultrasound Tx
Beamformer Evaluation Board
– Printed Circuit Board
—
04-10397
7
R1, R3, R4, R5, R6, 1 k, 1/16W, 1% resistor
R14, R15
ROHM Semiconductor
MCR03EZP5J10
2
R2, R7
Panasonic® - ECG
ERJ-3EKF49R9V
8
R8, R10, R12, R29, Solder Gap (short)
R30, R37, R52, R53
NA
NA
8
R9, R11, R13, R27, 2.55 k, 1W, 1% resistor
R28, R32, R34, R54
Panasonic - ECG
ERJ-1TNF2551U
5
R17, R18, R19, R20, 33.2 k, 1/16W, 1% resistor
R21
Panasonic - ECG
ERJ-3EKF3322V
5
R22, R23, R24, R25, 200, 1/16W, 1% resistor
R26
ROHM Semiconductor
MCR03FZPEJ201
Note 1:
0.22 µF, 10% 16V X7R
ceramic capacitor
Manufacturer
49.9, 1/16W, 1% resistor
TE Connectivity Ltd.
The components listed in this Bill of Materials are representative of the PCB assembly. The released
BOM used in manufacturing uses all RoHS-compliant components.
 2015 Microchip Technology Inc.
DS50002375A-page 27
HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide
TABLE B-1:
Qty
BILL OF MATERIALS (BOM) (CONTINUED)
Reference
Description
Manufacturer
Part Number
5
R31, R35, R38, R39, 1, 1/10W, 1% resistor
R40
Stackpole Electronics,
Inc.
RNCP0603FTD1R00
2
R33,3R6
10, 1/10W, 1% resistor
Stackpole Electronics,
Inc.
RMCF0603JT10R0
3
R41, R42, R43
4.99 k, 1/16W, 1% resistor
Panasonic - ECG
ERJ-3EKF4991V
5
SW1-SW5
Switch LT 4.7 mm X 3.5 mm
100 GF SMD
Panasonic - ECG
EVQ-P2002M
2
TP20, TP28
Test Point PC Multi-Purpose
Block
Keystone Electronics
Corp.
5011
1
U1
IC HV7351K6-G 8-Ch ±70V,
3A Beamformer
Microchip Technology
Inc.
HV7351K6-G
2
U2, U3
IC CPLD 72 MC cell C-Temp
44-VQFP
Xilinx Inc.
XC9572XL-5VQ44C
1
U4
IC Prom IN Syst. Prg. 3.3V
20TSSOP
Xilinx Inc.
XCF01SVOG20C
1
X1
160 MHz Clock Oscillator, 3.3V Fox Electronics
SMD
FXO-HV73x-160
4
for MH1-4
Standoff Hex 4-40THR 0.25”L
Alum.
Keystone Electronics
Corp.
1891
1
for J2
Shunt, ECON, PHBR 5 AU,
Black
TE Connectivity Ltd
382811-8
Note 1:
The components listed in this Bill of Materials are representative of the PCB assembly. The released
BOM used in manufacturing uses all RoHS-compliant components.
DS50002375A-page 28
 2015 Microchip Technology Inc.
HV7351
ULTRASOUND TX BEAMFORMER
EVALUATION BOARD USER’S GUIDE
Appendix C. Plots and Waveforms
C.1
HV7351 TYPICAL WAVEFORMS
C.1.1
Four Outputs of Eight Channels, 5 MHz ±70V with Different
Beamforming Delays, with 330 pF||2.5 k Load
C.1.2
Tx Output at 10 MHz ±70V with 330 pF||2.5 k Load
 2015 Microchip Technology Inc.
DS50002375A-page 29
HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide
DS50002375A-page 30
C.1.3
Tx RTZ Output at ±70V with 330 pF|| 2.5k Load
C.1.4
RTZ Output tr/tf Time at 0 to +70V with 330 pF|| 2.5k Load
 2015 Microchip Technology Inc.
Plots and Waveforms
C.1.5
RTZ Output tr/tf Time at 0 to -70V with 330 pF||2.5 k Load
C.1.6
5 MHz tr/tf Time at ±50V Output with 330 pF||2.5 k Load
 2015 Microchip Technology Inc.
DS50002375A-page 31
HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide
DS50002375A-page 32
C.1.7
±50V 5 MHz 8-Cycle Output & HD2 with 330 pF||2.5 k Load
C.1.8
5 MHz ±75V B-Mode Waveform and Flip Waveform
 2015 Microchip Technology Inc.
Plots and Waveforms
C.1.9
 2015 Microchip Technology Inc.
Four Outputs of Eight Channels, 5 MHz ±5.0V CW-Mode Output
Waveform
DS50002375A-page 33
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Tel: 86-755-8864-2200
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Tel: 886-7-213-7828
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Tel: 49-7231-424750
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Tel: 39-0331-742611
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Tel: 39-049-7625286
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01/27/15
DS50002375A-page 34
 2015 Microchip Technology Inc.