HV7350DB1 Demonstration Board User's Guide

Supertex inc.
HV7350DB1
Eight Channel ±60V, ±1.0A,
Ultrasound Pulser Demoboard
General Description
This demoboard datasheet describes how to use the
HV7350DB1 to generate the basic high voltage pulse
waveform as an ultrasound transmitting pulser.
The HV7350 is a monolithic eight channel, high-speed, high
voltage, ultrasound transmitter RTZ pulser. This integrated,
high performance circuit is in a single, 8x8x0.9 mm, 56-lead
QFN package.
The HV7350 can deliver a guaranteed ±1.0A source and
sink current to a capacitive transducer with +/-60V peak to
peak voltage. It is designed for portable medical ultrasound
imaging and ultrasound NDT applications. It can also be used
as a high voltage driver for other piezoelectric or capacitive
MEMS transducers, or for test systems as a signal source or
pulse signal generators.
The HV7350 circuit uses DC coupling from a 3.3V logic
input to output Tx1~8 internally, therefore the chip needs
three sets of voltage supply rails: VLL +3.3V, VDD +5.0V and
VPP/VNN ±10 to ±60V. The VPP and VNN rail voltages can be
changed rather quickly, compared to the capacitor gatecoupled driving pulsers. This direct coupling topology of the
gate drivers not only saves two high voltage capacitors per
channel, but also makes the PCB layout easier.
The HV7350’s circuitry consists of controller logic circuits,
level translators, gate driving buffers and a high current and
high voltage MOSFET output stage. The output stages of
each channel are designed to provide peak output currents
typically over ±1.0A for pulsing, with up to ±60V swings in
RTZ mode. The upper limit frequency of the pulser waveform
is depending on the load capacitance.
The HV7350DB1 output waveforms can be displayed using
an oscilloscope by connecting the scope probe directly to
the test points TX1~8 and GND. The soldering jumper can
select whether or not to connect the on-board dummy-load,
a 330pF capacitor paralleling with a 2.5kΩ resistor. The test
points can be used to connect the user’s transducer to easily
evaluate the pulser.
Block Diagram
+3.3V
+3.3V
+3.3V
CLKIN
EN
Waveform
Generator
CPLD
6
NIN1
Logic
&
Level
Translator
PWR
PHAS
OEN
OEN
REN
REN
Doc.# DSDB-HV7350DB1
A070214
+5.0V
VNF
TX1
-5V
GND
GND
SUB
DAP
GND
LRN
CNEG
TX1
R2
-5.0V
Dummy
Load
Rb
N-Driver
RTZ
FREQ
RGND
DMP
CLK
PHAS
GND
HVOUT1
VPF
NIN8
WAVE
1 of 8 Channels
P-Driver
PIN8
JTAG
VPF
1.0µF
VPP
LRP
GND
PIN1
40MHz
CPF
LRP
+4.0V +5.0V
OEN
1.0µF
CPOS
VREF
REN
OSC
1.0µF
VDD
VLL
EXCLK
+10 to +60V
1.0µF
0.1µF
C4
330pF
VNF
GND
LRN
CNF 1.0µF
VNN
RGND
RGND
R3
2.5k
RGND
1.0µF
1.0µF
-10 to -60V
Supertex inc.
www.supertex.com
HV7350DB1
The PCB Layout Techniques
Be aware of the parasitic coupling from the outputs to the input signal terminals of the HV7350. This feedback may cause
oscillations or spurious waveform shapes on the edges of the
signal transitions. Since the input operates with signals down
to 3.3V, even small coupling voltages may cause problems.
Use of a solid ground plane and good power and signal layout
practices will prevent this problem. Also ensure that the circulating ground return current from a capacitive load cannot
react with common inductance to create noise voltages in the
input logic circuitry.
The large thermal pad at the bottom of the HV7350 package
is internally connected to the IC’s substrate (VSUB). This
thermal pad should be connected to 0V or GND externally on
the PCB. Designers need to pay attention to the connecting
traces on the outputs TX1~8, specifically the high voltage and
high speed traces. In particular, controlled impedance to the
ground plane and more trace spacing needs to be applied in
this situation.
High speed PCB trace design practices that are compatible
with about 50 to 100MHz operating speeds are used for the
demoboard PCB layout. The internal circuitry of the HV7350
can operate at quite a high frequency, with the primary speed
limitation being load capacitance. Because of this high speed
and the high transient currents that result when driving capacitive loads, the supply voltage bypass capacitors and the
driver to the FET’s gate-coupling capacitors should be as
close to the pins as possible. The GND pin should have low
inductance feed-through via connections that are connected
directly to a solid ground plane. The VDD, VPP, VNN, CPF,
CNF, CNEG and CPOS voltage supply and/or bypass capacitor pins can draw fast transient currents of up to ±2.0A, so
they should be provided with a low impedance bypass capacitor at the chip’s pins. A ceramic capacitor of 1.0 to 2.0µF may
be used. Only the VPP and VNN pins to GND capacitors need
to be the high-voltage type. The CPF to VPP and CNF to VNN
capacitors maybe low voltage. Minimize the trace length to
the ground plane, and insert a ferrite bead in the power supply
lead to the capacitor to prevent resonance in the power supply lines. For applications that are sensitive to jitter and noise
and using multiple HV7350 ICs, insert another ferrite bead
between each chip’s supply lines.
Testing the Integrated Pulser
The HV7350 pulser demoboard should be powered up with
multiple lab DC power supplies with current limiting functions.
The on-board dummy load 330pF//2.5kΩ should be connected to the high voltage pulser output through the solder jumper
when using an oscilloscope’s high impedance probe to meet
the typical loading condition. To evaluate different loading
conditions, one may change the values of RC within the current and power limit of the device.
In order to drive the user’s piezo transducers with a cable, one
should match the output load impendence properly to avoid
cable and transducer reflections. A 70 to 75Ω coaxial cable is
recommended. The coaxial cable end should be soldered to
the TX1~8 and GND directly with very short leads. If a user’s
load is being used, the on-board dummy load should be disconnected by cutting the small shorting copper trace in between the 0Ω resistors R2, R9, R12, R18, R23, R53, R54 or
R55 pads. They are shorted by factory default.
All the on-board test points are designed to work with the
high impedance probe of the oscilloscope. Some probes may
have limited input voltage. When using the probe on these
high voltage test-points, make sure that VPP/VNN voltages do
not exceed the probe limit. Using the high impendence oscilloscope probe for the on-board test points, it is important to
have short ground leads to the circuit board ground plane.
Pay particular attention to minimizing trace lengths and using sufficient trace width to reduce inductance. Surface mount
components are highly recommended. Since the output impedance of the HV7350’s high voltage power stages is very
low, in some cases it may be desirable to add a small value
resistor in series with the output TX1~8 to obtain better waveform integrity at the load terminals after long cables. This will,
of course, reduce the output voltage slew rate at the terminals
of a capacitive load.
Doc.# DSDB-HV7350DB1
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If both of the inputs PIN and NIN are high, then the channel
out TX will be in Hi-Z.
2
Supertex inc.
www.supertex.com
2
C30
0.22
R25
33k
C31
0.22
SW1
2
TP18
C32
0.22
SW2
MH2
R40
200
R26
33k
R20
1k
EXTRG
SYNC
CLK
C33
0.22
SW3
R27
33k
39
40
43
MH3
R41
200
TP30
R16
1k
SYNC
3
EXTRG
R15
50
R14
1.0k
3
1
OUT
GND
TP12
MH4
R42
200
VCC
R8
1.0k
R7
1.0k
TP10
R6
1.0k
U2
XC9572XL_VQ44
R43
200
MH1
C34
0.22
SW4
R28
33k
C35
0.22
SW5
R29
33k
R44
200
Note: J4-4, 5, 6 & 7- pins for test only
VCC
J2
EXCLK
J1
EX=0
40MHz X1
4
2 1
EN
VCC
1
TP13
C18
0.22
VCC
R5
1.0k
R4
1.0k
RED
D7
VCC
R30
1
VDD
J3 JTAG
C22
0.22
41
42
8
12
13
14
16
18
19
20
21
22
33
34
37
38
C2
022
R38
INF
R37
INF
J4 HEADER 10
TP9
VNN
R32
10
CPF
TP6
R57
INF
CNEG CPOS CNF
TP51
TP50
TP49
TP48
TP47
TP46
TP45
TP44
TP29
TP28
TP27
TP25
TP22
TP19
TP20
TP16
C3
022
R31
1
VDD
NIN8
PIN8
NIN7
PIN7
NIN6
PIN6
NIN5
PIN5
NIN4
PIN4
NIN3
PIN3
NIN2
PIN2
NIN1
PIN1
C1
022
REN
OEN
C25
022
NIN8
PIN8
NIN7
PIN7
NIN6
PIN6
NIN5
PIN5
NIN4
PIN4
NIN3
PIN3
NIN2
PIN2
NIN1
PIN1
OEN
REN
PAD
R35
10
VPP
16
15
14
13
12
11
10
9
6
5
4
3
2
1
56
55
7
8
C19
022
VCC
TP2
17
GRN
VLL
D6
C12
1µF
C13
1µF
VDD
U3
HV7350
TP33
TP36
C37
1µF
TP35
TP8
VCC = +3.3V
VDD = +4.0 to 5.2V
VPP / VNN = +/-5.0 to 70V
C36
1µF
TP43
19
VDD
YLW
RTZ
4
GND
17
GND
25
GND
48
CPF
D5
REN
32
WAV
2
FRE
3
SEL
5
ENA
6
MOD
7
23
C5
1µ
C24
1µF
CPF
YLW
PHAS
LE
31
SET
30
MC
OEN
PWR
29
CS
28
EN
35
VCC
26
VCC
15
VCC
TMS
10
TDI
9
TDO
24
TCK
11
1
2
3
4
5
6
C8
1µ
TP6
20
D4
1
2
3
4
5
6
7
8
9
10
54
VLL
PAD
72
GND
18
GND
53
CPOS
36
CNEG
35
52
VDD
CNF
47
CNF
24
21
VPP
VNN
C23
1µF
25
C9
1µ
22
VPP
VNN
26
C6
1µ
49
VPP
VNN
1
6
VDD
VNN
27
50
VPP
VNN
44
VPP
51
28
30.
32
34
37
39
41
43
4
3
VCC
C27
1µF
100v
1
2
1
2
VNN
C29
330P
250V
C20
330P
250V
BAV99/SOT_1
2
D30
3
1
BAV99/SOT_1
2
D29
3
1
C40
330P
250V
C38
330P
250V
BAV99/SOT_1
2
D28
3
1
BAV99/SOT_1
2
D27
3
1
BAV99/SOT_1
2
D26
3
1
BAV99/SOT_1
2
D25
3
1
BAV99/SOT_1
2
D24
3
1
BAV99/SOT_1
2
D31
3
1
VPP
C28
1µF
100v
TP17
RGND 40
RGND 42
RGND 33
RGND 38
RGND 31
RGND 29
TX8
TX7
TX6
TX5
TX4
TX3
TX2
TX1
VPP
VNN
45
VPP
VNN
46
D20A
BAT54DW-7
RED
D20B
BAT54DW-7
3
D17
B1100-13
Doc.# DSDB-HV7350DB1
A070214
D16
B1100-13
D3
R24
2.55k
1W
TP0
TP40
R56
2.55k
1W
TP26
R55
0
R52
2.55k
1W
TP41
TX8
R53
0
TX6
TP21
R23
0
TX4
C21
330P
250V
C4
330P
250V
C39
330P
250V
C14
330P
250V
R13
2.55k
1W
TP14
TP32
R12
0
TX2
TP11
TP1
TP23
TP4
R3
2.55k
1W
R51
2.55k
1W
TP39
R54
0
TP0
TP7
R10
2.55k
1W
TX7
R9
0
TX5
TP42
TP31
R19
2.55k
1W
R18
0
TX3
R2
0
TX1
HV7350DB1
HV7350DB1 Schematic
Supertex inc.
www.supertex.com
HV7350DB1
HV7350DB1 PCB and Board Layout
Actual Board Size: 72.4mm x 68.4mm
Power Connector Description
1
+VCC
+3.3V Logic voltage input for VLL and CPLD. (100mA)
2
GND
0V, Ground
3
+VDD
+5.0V HV7350 positive VDD supply. (25mA)
4
CNEG
-5.0V HV7350 negative VNEG supply, only when REN=0
5
CPOS
+5.0V HV7350 Positive VPOS supply, only when REN=0
6
CNF
HV7350 VNF supply reference to VNN, ( VNF - VNN) = +5.0V, only when REN=0
7
CPF
HV7350 VPF supply reference to VPP, ( VPP - VPF) = +5.0V, only when REN=0
8
-VNN
-10 to -60V negative high voltage supply. (-5.0mA)
9
GND
0V, Ground
10
+VPP
+10 to +60V positive high voltage supply. (+5.0mA)
Note: J4-4 to 7 are for external power connection of VNEG, VPOS, VNF, VPF, when REN = 0. Note, as default the resistors R34, R37, R38 and R57 is not
installed. Do not need to connect these four pins to any power supply when internal regulators are be used when REN=1.
Voltage Supply Power-Up and Operation Sequence
1
+VCC
Power on +3.3V positive logic supply voltage for HV7350’s VLL and CPLD VCC
2
+VDD
Power on +5.0V VDD positive supply
3
OEN & REN
4
+VPP / -VNN
5
OEN & REN
Turn on OEN & REN LED on
6
WAVE Button
Push WAVE button to select waveforms
Turn both OEN & REN LED off
Power on VPP/VNN = ±10 to 60V positive and negative high voltage supply
Note: Power-down in the 6,5… to 1 reversing order.
Push Button Operations
WAV
Toggle select pulse B-mode waveforms: None, 1-cycle, 1-cycle inverting, 3-cycle & 3-cycle inverting
FREQ
Toggle select B-mode demo frequency of 10, 5, 2.5, 1.25 & 0.625MHz when X1 oscillator is 40MHz
PHAS
Toggle select B-mode waveform phase polarity
OEN
Toggle on or off HV7350 chip output signal OEN
REN
Toggle select on or off HV7350 internal voltage-regulators signal REN
Doc.# DSDB-HV7350DB1
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4
Supertex inc.
www.supertex.com
HV7350DB1
LED Indicator
RTZ
RTZ indication, default is on
PHAS
Phase polarity indication
PWR
HV7350DB1 VLL 3.3V and CPLD chip VCC power supply indication
OEN
HV7350 chip enable EN signal indication, power on default is off until OEN button is pushed
REN
HV7350 built-in regulators enable indication, power on default is off until REN button is pushed
Typical Waveforms
Figure 1. VPP/VNN = +/-60V 5MHz with 330pF//2.5kΩ load and 8-Channel pulsing
Figure 2. VPP/VNN = +/-60V 5MHz with 330pF//2.5kΩ load and 8-Channel pulsing
Doc.# DSDB-HV7350DB1
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Supertex inc.
www.supertex.com
HV7350DB1
Typical Waveforms (cont.)
Figure 3. VPP/VNN = +/-60V 10MHz with 330pF//2.5kΩ load and 8-Channel pulsing
Figure. 4. Rise and Fall time at VPP/VNN = +/-60V with 330pF//2.5kΩ load
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Supertex inc.
www.supertex.com
HV7350DB1
Typical Waveforms (cont.)
Figure 5. VPP/VNN = +/-60V 5MHz with 330pF//2.5kΩ load and 8-Channel pulsing
Figure 6. Damping fall time at VPP/VNN = +/-60V with 330pF//2.5kΩ load
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Supertex inc.
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HV7350DB1
Typical Waveforms (cont.)
Figure 7. Damping rise time at VPP/VNN = +/-60V with 330pF//2.5kΩ load
Figure 8. VPP/VNN = +/-60V 5MHz with 330pF//2.5kΩ load 4 of the 8-Channel waveforms shown
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Supertex inc.
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HV7350DB1
Typical Waveforms (cont.)
Figure 9. HD2 at VPP/VNN = +/-50V 2.5MHz with 330pF//2.5kΩ load
Doc.# DSDB-HV7350DB1
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Supertex inc.
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HV7350DB1
Bill of Materials
Component
Description
Manufacturer
Part Number
C1 - C3, C18, C19,
C22, C25, C30 - C35
CAP CER .22µF 16V X7R 10% 0603
TDK
C1608X7R1C224K
C4, C14, C20, C21,
C29, C38 - C40
CAP CERC 330PF 200V X7R 0603
Panasonic
ECJ-1VB2D331K
C5, C8, C12, C13,
C23, C24, C36, C37
CAP CER 1.0µF 16V X7R 0603
TDK
C1608X7R1C105M
C6, C9, C27, C28
CAP CER 1µF 100V X7R 20% 1210
TDK
C3225X7R2A105M
D3, D7
LED THIN 635NM RED DIFF 0805 SMD
Lumex
SML-LXT0805IW-TR
D4, D5
LED THIN 585NM YEL DIFF 0805 SMD
Lumex
SML-LXT0805YW-TR
D6
LED THIN 565NM GRN DIFF 0805 SMD
Lumex
SML-LXT0805GW-TR
D16, D17
DIODE SCHOTTKY 100V 1A SMA
Diodes Inc.
B1100-13
D20
DIODE SCHOTTKY DUAL 30V SOT-363
Diodes Inc.
BAT54DW-7
D24 - D31
DIODE SWITCH SS DUAL 70V SOT323
Fairchild
BAV99WT1G
J1
CONN HEADER 2POS .100 VERT GOLD
Molex
22-28-4023
J2
CONN JACK END LAUNCH PCB GOLD SMA
Johnson
142-0711-821
J3
CONN HEADER 6POS .100 VERT GOLD
Molex
22-28-4063
J4
CONN HEADER 10POS .100 VERT GOLD
Tyco
1-640454-0
R2, R9, R12, R18,
R23, R53 - R55
Solder Gap (SHORT)
NA
NA
R3, R10, R13, R19,
R24, R51, R52, R56
RES 2.55kΩ 1W 1% 2512 SMD
Panasonic
ERJ-1TNF2551U
R4 - R8, R14, R16,
R20
RES 1.00kΩ 1/16W 1% 0603 SMD
Panasonic
ERJ-3EKF1001V
R15
RES 49.9Ω 1/16W 1% 0603 SMD
Panasonic
ERJ-3EKF49R9V
R25, R26, R27, R28,
R29
RES 33.2kΩ 1/16W 1% 0603 SMD
Panasonic
ERJ-3EKF3322V
R30, R31
RES 1.00Ω 1/10W 1% 0603 SMD
Rohm
MCR03EZPFL1R00
R32, R35
RES 10.0Ω 1/10W 1% 0603 SMD
Panasonic
ERJ-3EKF10R0V
R34, R37, R38, R57
NA
NA
NA
R40, R41, R42, R43,
R44
RES 200 OHM 1/16W 1% 0603 SMD
Panasonic
ERJ-3EKF2000V
SW1, SW2, SW3,
SW4, SW5
SWITCH LT 4.7MMX3.5MM 100GF SMD
Panasonic
EVQ-P2002M
TP3, TP15
TEST POINT PC MULTI PURPOSE BLK
Keystone
5011
U2
IC CPLD 72 MCELL C-TEMP 44-VQFP
Xilinx
XC9572XL-5VQ44C
U3
IC HV7350K6-G 8-ch RTZ
Supertex Inc.
HV7350K6-G
X1
OSC CLOCK 40.000 MHZ 3.3V SMD
CTS
CB3LV-3C-40.0000-T
Supertex inc. does not recommend the use of its products in life support applications, and will not knowingly sell them for use in such applications unless it receives
an adequate “product liability indemnification insurance agreement.” Supertex inc. does not assume responsibility for use of devices described, and limits its liability
to the replacement of the devices determined defective due to workmanship. No responsibility is assumed for possible omissions and inaccuracies. Circuitry and
specifications are subject to change without notice. For the latest product specifications refer to the Supertex inc. (website: http//www.supertex.com)
Supertex inc.
©2014 Supertex inc. All rights reserved. Unauthorized use or reproduction is prohibited.
Doc.# DSDB-HV7350DB1
A070214
10
1235 Bordeaux Drive, Sunnyvale, CA 94089
Tel: 408-222-8888
www.supertex.com