HV7355DB1 Demonstration Board User's Guide

Supertex inc.
HV7355DB1
150V, 1.5A, Unipolar
Ultrasound Pulser Demoboard
General Description
The HV7355 is a monolithic eight-channel, high-speed,
high voltage, unipolar ultrasound transmitter pulser.
This integrated, high performance circuit is in a single,
8x8x0.9mm, 56-lead QFN package.
The HV7355 can deliver guaranteed ±1.5A source and sink
current to a capacitive transducer with 0 to +150V peak
voltage. It is designed for medical ultrasound imaging and
ultrasound material NDT applications. It can also be used
as a high voltage driver for other piezoelectric or capacitive
MEMS transducers, or for ATE systems and pulse signal
generators as a signal source.
The HV7355’s circuitry consists of controller logic circuits,
level translators, gate driving buffers and a high current and
high voltage MOSFET output stage. The output stages of
each channel are designed to provide peak output currents
typically over ±1.5A for pulsing, with up to 150V swings. The
upper limit frequency of the pulser waveform is dependent
upon the load capacitance. With different capacitance load
conditions the maximum output frequency is about 20MHz.
This demoboard datasheet describes how to use the
HV7355DB1 to generate the basic high voltage pulse
waveform as an ultrasound transmitting pulser.
The HV7355 circuit uses DC-coupling from a 3.3V logic input
to output TX0~7 internally, therefore the chip needs three
sets of voltage supply rails: VLL (+3.3V), VDD/VSS (+/-5.0V)
and VPP (up to +150V). The VPP high voltage supply can be
changed rather quickly, compared to the capacitor gatecoupled driving pulsers. This direct coupling topology of the
gate drivers not only saves two high voltage capacitors per
channel, but also makes the PCB layout easier.
The control signal logic-high voltage should be the same
as the VLL voltage of the IC, and the logic-low should be
referenced to GND.
The HV7355DB1 output waveforms can be displayed using
an oscilloscope by connecting the scope probe to the test
points TX0~7 and GND. The soldering jumper can select
whether or not to connect the on-board dummy load, a
330pF capacitor paralleling with a 2.5kΩ resistor. The test
points can be used to connect the user’s transducer to easily
evaluate the pulser.
Block Diagram
+5.0V
+3.3V
+5.0 to 150V
+3.3V
AVDD
VLL
EN
EXCLK
MC
OSC
CLKIN
40MHz
JTAG
LR
PWR
VSS
VDD
CWD
CPF
VPF
VPP
VPP
LT
IN0
Waveform
Generator
CPLD
EN
VDD
VDD
Q0
VPF
TX0
VDD
R2
LT
C4
330pF
RGND
VDD
6
R3
2.5k
VPP
VPP
GND
LT
IN7
WAVE
FREQ
SEL
EN
CW/RTZ
CW
LR
RTZ
PWR
EN
VDD
Q7
SET
LE
Q[7:0]
Data
Latch
CS
Shift
Register
SCK
Q7
D0
SDO
SDI
VPF
TX7
VDD
LT
TX7
RGND
RGND
SUB
VSUB
Dummy
Load
GND
VSS
-5.0V
Doc.# DSDB-HV7355DB1
B070314
Supertex inc.
www.supertex.com
HV7355DB1
The PCB Layout Techniques
This feedback may cause oscillations or spurious waveform
shapes on the edges of signal transitions. Since the input
operates with signals down to 3.3V, even small coupling
voltages may cause problems. Use of a solid ground plane
and good power and signal layout practices will prevent this
problem. Also ensure that the circulating ground return current from a capacitive load cannot react with common inductance to create noise voltages in the input logic circuitry.
The large thermal pad at the bottom of the HV7355 package
is internally connected to the IC’s substrate (VSUB). This
thermal pad should be connected to 0V or GND externally
on the PCB. The designer needs to pay attention to the connecting traces on the outputs TX0~7, as the high-voltage
and high-speed traces. In particular, controlled-impedance
to the ground plane and more trace spacing needs to be applied in this situation.
Testing the Integrated Pulser
The HV7355 pulser demoboard should be powered up with
a DC power supplie that has current limiting functions.
High-speed PCB trace design practices that are compatible
with about 50 to 100MHz operating speeds are used for the
demo board PCB layout. The internal circuitry of the HV7355
can operate at quite a high frequency, with the primary speed
limitation being load capacitance. Because of this high
speed and the high transient currents that result when driving capacitive loads, the supply voltage bypass capacitors
and the driver to the FET’s gate-coupling capacitors should
be as close to the pins as possible. The GND pin should
have low inductance feed-through via connections that are
connected directly to a solid ground plane. The VDD, VSS,
VPP and CPP voltage-supply and/or bypass capacitor pins
can draw fast transient currents of up to 2.0A, so they should
be provided with a low-impedance bypass capacitor at the
chip's pins. A ceramic capacitor of 1.0 to 2.0µF may be used.
Only VPP to GND capacitors need be high voltage. CPF to
VPP capacitors only need be low voltage. Minimize the trace
length to the ground plane, and insert a ferrite bead in the
power supply lead to the capacitor to prevent resonance in
the power supply lines. For applications that are sensitive
to jitter and noise when using multiple HV7355 ICs, insert
another ferrite bead between each chips supply line.
To meet the typical loading conditions, the on-board dummy
load 330pF//2.5kΩ should be connected to the high voltage
pulser output through the solder jumper when using an oscilloscope’s high impedance probe. To evaluate different loading conditions, the values of the RC within the current and
power limit of the device may be changed.
In order to drive the user’s piezo transducers with a cable,
one should match the output load impendence properly to
avoid cable and transducer reflections. A 70 to 75Ω coaxial
cable is recommended. The coaxial cable end should be soldered to TX0~7 and GND directly with very short leads. If a
user’s load is being used, the on-board dummy load should
be disconnected by cutting the small shorting copper trace in
between the zeroΩ resistor’s (R2, R12 etc.) pads. They are
shorted by factory default.
All of the on-board test points are designed to work with the
high impedance probe of the oscilloscope. Some probes
may have limited input voltage. When using the probe on
these high voltage test-points, make sure that VPP voltages
do not exceed the probe limit. Using the high impendence
oscilloscope probe for the on-board test points, it is important to have short ground leads to the circuit board ground
plane.
Pay particular attention to minimizing trace lengths and
using sufficient trace width to reduce inductance. Surface
mount components are highly recommended. Since the output impedance of the HV7355’s high voltage power stages
is very low, to obtain better waveform integrity at the load
terminals after long cables, in some cases it may be desirable to add a small value resistor in series with the outputs
TX0~7. This will, of course, reduce the output voltage slew
rate at the terminals of a capacitive load. Be aware of the
parasitic coupling from the outputs to the input signal terminals of the HV7355.
Doc.# DSDB-HV7355DB1
B070314
2
Supertex inc.
www.supertex.com
2
C30
0.22
VCC
J2
EXCLK
J1
C31
0.22
R40
200
C32
0.22
SW2
R26
33k
R41
200
SCK SDI
SDO
SCK
CLK
R5
1.0k
YLW
C34
0.22
R28
33k
C33
0.22
R42
200
VCC
R51 50
R50 50
R49 50
R48 50
R47 50
R8
1.0k
R7
1.0k
VCC
RED
D7
GRN
D6
W4
ZE;794ZNaXS66
SW4
R27
33k
R6
1.0k
YLW
SW3
TP30
39
40
43
TP13
TP18
3
R20
50
R15
50
R14
1.0k
OUT
R20
50
R25
33k
1
SW1
2
3
GND
EX=0
40MHz X1
2 1
4
EN
VCC
1
C18
0.22
VCC
R4
1.0k
RED
31
D5
R43
200
C35
0.22
SW5
R29
33k
IN7
IN6
IN5
IN4
IN3
IN2
IN1
IN0
C1
022
R45
200
R30
1.0
VCC
MH2
TP40
R22 50
R23 50
R36 50
R39 50
R45 50
R46 50
22
21
19
18
14
13
MH3
MH4
MH1
4 5 6
HEADER 6 J4
1 2 3
R38
1.0
C22
0.22
CS
SET
MC
TP3
R35
1.0
R9
1.0k
MC
LE
SET
CS
SCK
SDI
TP28
TP25
TP19
TP16
EN
LE
VPP
R21 50
37
VCC
R17 50
38
C3
022
VDD VSS
R31
1.0
JTAG J3
TP10
TP12
C2
022
1 2 3 4 5 6
TP6
TP9
8
7
6
5
4
3
2
13
15
11
14
9
12
10
1
6
TP2
4
3
C12
1µ
D20B
VSS
SDO
MC
LE
SET
CS
SCK
SDI
IN7
IN6
IN5
IN4
IN3
IN2
IN1
IN0
EN
D20A
VDD
TP17
TP29
TP27
TP22
TP20
1
56
C19
0.22
VCC
C14
1µ
VDD
C13
1µ
TP8
48
D4
32
SET
30
WAV
2
FRE
3
SEL
5
ENA
6
MOD
7
LE
4
GND
17
GND
25
GND
MC
29
CS
28
EN
35
VCC
26
VCC
15
VCC
1
6
JX9577
D22A
VCC
4
3
D22B
VDD
VSS
TP36
VCC
C36
1µ
C8
1µF
TP5
C5
1µF
TP35
18
D3
BAT54DW-7
10 TMS
9 TDI
24
TDO
11
TCK
16
VLL
55
GND
57
23
AVDD
GND
54
BAT54DW-7
VDD
VSS
53
44
RGND
25
RGND
46
RGND
BAT54DW-7
17
VDD
BAT54DW-7
CPF
49
CPF
21
VPP
20
VPP
2
1
VPP
D17
VPP
26
RGND
47
52
VPP
27
RGND
51
VPP
RGND
B1100-13
C27
C9
1µF 1µF
160V 160V
VPP
19
VDD
2
1
D15
VPP
TP15
TX7
TX7
TX6
TX6
TX5
TX5
TX4
TX4
TX3
TX3
TX2
TX2
TX1
TX1
TX0
TX0
VPP
50
VPP
RGND
24
3
45
RGND
22
VPP
Doc.# DSDB-HV7355DB1
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B1100-13
28
29
30
31
32
33
34
35
36
37
38
39
40
41
43
42
TP37
TP24
TP26
TP7
TP32
TP23
VCC = +3.3V
VDD/VSS = +/-5.0V
VPP = +5.0 to +150V
VZ9
VZ8
VZ7
VZ6
VZ5
VZ4
VZ3
VZ2
C6
C28
1µF 1µF
160V 160V
TP11
TP1
C37
330pF
250V
0
R53
C23
330pF
250V
0
R52
C24
330pF
250V
0
R37
C7
330pF
250V
0
R10
C29
330pF
250V
0
R23
C21
330pF
250V
0
R18
C20
330pF
250V
0
R12
C4
330pF
250V
0
R2
TP38
R34
2.55k
1W
R32
2.55k
1W
TP33
TP39
R54
2.55k
1W
TP21
R11
2.55k
1W
TP34
R24
2.55k
1W
TP31
R19
2.55k
1W
TP14
R13
2.55k
1W
TP4
R3
2.55k
1W
HV7355DB1
HV7355DB1 Schematic
Supertex inc.
www.supertex.com
HV7355DB1
HV7355DB1 PCB and Board Layout
Actual Board Size: 72.4mm x 68.4mm
Power Connector Description
1
VCC
+3.3V Logic voltage input for VLL and CPLD. (100mA)
2
GND
3
VDD
+5.0V HV7355 positive VDD supply. (25mA)
4
VSS
-5.0V HV7355 negative VSS supply. (-25mA)
5
GND
6
VPP
0V, Ground
0V, Ground
+10 to +150V positive high voltage supply. (5mA)
Voltage Supply Power-Up and Operation Sequence
1
+VCC
2
+VDD / -VSS
3
+VPP
+3.3V positive logic supply voltage for HV7355’s VLL and CPLD VCC.
±5.0V positive and negative VDD and VSS power supply.
+10 to +150V positive high voltage.
Note:
Power-down in reverse order
Push Button Operations
WAV
FREQ
Toggle select pulse B-mode waveforms: None, 1-cycle, 3-cycles, 7-cycles.
Toggle select frequency: 20, 10, 5, 2.5, 1.25 and 0.625MHz when X1 oscillator is 40MHz.
SEL
Toggle select. Increases the off-time between 2 consecutive pulses.
EN
Toggle ON or OFF HV7355 chip enable
MODE
Toggle select between B-mode and CW.
LED Indicator
SET
Set the latch registers of serial interface, when high, all latches are set to logic high.
LE
Latch enable when low, data can be latched into the registers of serial interface.
MC
Mode control, high indicates B-mode and low indicates CW.
PWR
HV7355 VLL 3.3V and CPLD chip VCC power supply indicator.
EN
HV7355 chip enable signal indicator. Power state initially is OFF until EN is pushed.
Doc.# DSDB-HV7355DB1
B070314
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Supertex inc.
www.supertex.com
HV7355DB1
Typical Waveforms
Figure 1. Input logic and TX output waveforms of 5.0MHz (0 to +150V with 330pF//2.5kΩ load)
Figure 2. Rise and fall time at 0 to +150V (with 330pF//2.5kΩ load)
Doc.# DSDB-HV7355DB1
B070314
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Supertex inc.
www.supertex.com
HV7355DB1
Typical Waveforms (cont.)
Figure 3. Multiple channel at 5.0MHz (0 to +150V with 330pF//2.5kΩ load)
Figure 4. FFT Plot of Second Harmonic Distortion (HD2) -36dB at 5.0MHz,
VPP = 150V (with 330pF//2.5kΩ load)
Doc.# DSDB-HV7355DB1
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Supertex inc.
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HV7355DB1
Typical Waveforms (cont.)
Figure 5. Output Waveform at 10MHz and VPP = 120V (with 330pF//2.5kΩ load)
Figure 6. Output Waveform at 2.5MHz and VPP = 120V (with 330pF//2.5kΩ load)
Doc.# DSDB-HV7355DB1
B070314
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Supertex inc.
www.supertex.com
HV7355DB1
Typical Waveforms (cont.)
Figure 7. Output Waveform at 20MHz at VPP = 75V (with 330pF//2.5kΩ load)
Figure 8. Power on EN chip enable to VPF setting time
Doc.# DSDB-HV7355DB1
B070314
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Supertex inc.
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HV7355DB1
Bill of Materials
Component
Description
Manufacturer
Part Number
C1 - C3, C18, C19,
C22, C30 - C35
CAP CER 0.22µF 16V X7R 10% 0603
TDK
C1608X7R1C224K
C4, C7, C20 - C24,
C29, C37
CAP CER 330pF 200V X7R 0603
Panasonic
ECJ-1VB2D331K
C5, C8, C12, C13,
C14, C36
CAP CER 1.0µF 16V X7R 0603
TDK
C1608X7R1C105M
C6, C9, C27, C28
CAP CER 1µF 100V X7R 20% 1210
TDK
C3225X7R2A105M
D3, D7
LED THIN 635NM RED DIFF 0805 SMD
Lumex
SML-LXT0805IW-TR
D4, D5
LED THIN 585NM YEL DIFF 0805 SMD
Lumex
SML-LXT0805YW-TR
D6
LED THIN 565NM GRN DIFF 0805 SMD
Lumex
SML-LXT0805GW-TR
D15, D17
DIODE SCHOTTKY 100V 1A SMA
Diodes Inc.
B1100-13
D20, D22
DIODE SCHOTTKY DUAL 30V SOT-363
Diodes Inc.
BAT54DW-7
J1
CONN HEADER 2POS .100 VERT GOLD
Molex
22-28-4023
J2
CONN JACK END LAUNCH PCB GOLD SMA
Johnson
142-0711-821
J3
CONN HEADER 6POS .100 VERT GOLD
Molex
22-28-4063
J4
CONN HEADER 10POS .100 VERT GOLD
Tyco
1-640454-0
R2, R10, R12, R18,
R23, R37, R52, R53
Solder Gap (SHORT)
NA
NA
R3, R11, R13, R19,
R24, R32, R34, R54
RES 2.55kΩ 1W 1% 2512 SMD
Panasonic
ERJ-1TNF2551U
R4, R5, R6, R7, R8,
R9, R14
RES 1.00kΩ 1/16W 1% 0603 SMD
Panasonic
ERJ-3EKF1001V
R15 - R17, R20 - R22,
R33, R36, R39,
R45 - R51
RES 49.9Ω 1/16W 1% 0603 SMD
Panasonic
ERJ-3EKF49R9V
R25, R26, R27, R28,
R29
RES 33.2kΩ 1/16W 1% 0603 SMD
Panasonic
ERJ-3EKF3322V
R30, R31, R35, R38
RES 1.00Ω 1/10W 1% 0603 SMD
Rohm
MCR03EZPFL1R00
R40, R41, R42, R43,
R44
RES 200Ω 1/16W 1% 0603 SMD
Panasonic
ERJ-3EKF2000V
SW1, SW2, SW3,
SW4, SW5
SWITCH LT 4.7MMX3.5MM 100GF SMD
Panasonic
EVQ-P2002M
TP3, TP15
TEST POINT PC MULTI PURPOSE BLK
Keystone
5011
U2
IC CPLD 72 MCELL C-TEMP 44-VQFP
Xilinx
XC9572XL-5VQ44C
U3
IC HV7355K6-G 4-ch RTZ
Supertex Inc.
HV7355K6-G
X1
OSC CLOCK 40.000MHz 3.3V SMD
CTS
CB3LV-3C-40.0000-T
Supertex inc. does not recommend the use of its products in life support applications, and will not knowingly sell them for use in such applications unless it receives
an adequate “product liability indemnification insurance agreement.” Supertex inc. does not assume responsibility for use of devices described, and limits its liability
to the replacement of the devices determined defective due to workmanship. No responsibility is assumed for possible omissions and inaccuracies. Circuitry and
specifications are subject to change without notice. For the latest product specifications refer to the Supertex inc. (website: http//www.supertex.com)
Supertex inc.
©2014 Supertex inc. All rights reserved. Unauthorized use or reproduction is prohibited.
Doc.# DSDB-HV7355DB1
B070314
9
1235 Bordeaux Drive, Sunnyvale, CA 94089
Tel: 408-222-8888
www.supertex.com