Plastic Packages for Integrated Circuits Package Outline Drawing W4x6.24 4X6 ARRAY 24 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) Rev 1, 9/10 1.60± 0.02 24X 0.270 ± 0.03 1.20 PIN A1 F E D 2.40± 0.02 2.00 C B 0.40 A 1 TOP VIEW 2 3 4 BOTTOM VIEW 0.305 ± 0.025 0.55 mm MAX Z SEATING PLANE 0.19 ± 0.03 0.27 ± 0.03 0.05 Z Ø0.10 M Z X Y Ø0.05 M Z SIDE VIEW 0.275 PACKAGE OUTLINE NOTES: 1. All dimensions are in millimeters. 2. Dimension and tolerance per ASMEY 14.5M-1994, and JESD 95-1 SPP-010. 3. NSMD refers to Non-solder Mask Defined pad design per Intersil Tech Brief TB451 located at: http://www.intersil.com/data/tb/tb451.pdf. 0.225 0.40 3 NSMD TYPICAL RECOMMENDED LAND PATTERN 1