Plastic Packages for Integrated Circuits Package Outline Drawing W5x5.25 5X5 ARRAY 25 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) Rev 1, 2/13 2.000 2.600 ±0.030 X 25X 0.320 ± 0.030 Y E D 2.600 ±0.030 C B 0.500 A 0.10 (4X) 0.300 1 PIN 1 (A1 CORNER) 2 3 4 5 0.500 TOP VIEW 0.300 BOTTOM VIEW PACKAGE OUTLINE 0.330 0.280 0.540±0.040mm 0.500 0.240 ± 0.030 0.320 ± 0.030 X25 0.10 0.05 3 NSMD ZXY Z TYPICAL RECOMMENDED LAND PATTERN Z SEATING PLANE 0.05 Z SIDE VIEW NOTES: 1. All dimensions are in millimeters. 2. Dimension and tolerance per ASMEY 14.5M-1994, and JESD 95-1 SPP-010. 3. NSMD refers to Non-solder Mask Defined pad design per Intersil Tech Brief TB451 located at: http://www.intersil.com/data/tb/tb451.pdf 1