PANASONIC PUA3117

Power Transistor Arrays
PUA3117 (PU3117)
Silicon NPN triple diffusion planar type
For power amplification and switching
Unit: mm
20.2±0.3
4.0±0.2
9.5±0.2
1.65±0.2
• High forward current transfer ratio hFE
• Satisfactory linearity of forward current transfer ratio hFE
• NPN 3 elements
Solder Dip
5.3±0.5
4.4±0.5
0.8±0.25
■ Absolute Maximum Ratings TC = 25°C
Parameter
Symbol
Rating
Unit
Collector-base voltage (Emitter open)
VCBO
80
V
Collector-emitter voltage (Base open)
VCEO
60
V
Emitter-base voltage (Collector open)
VEBO
6
V
Collector current
IC
3
A
Peak collector current
ICP
6
A
Base current
IB
1
A
15
W
Collector power dissipation
PC
Ta = 25°C
8.0±0.2
■ Features
0.5±0.15
1.0±0.25
2.54±0.2
0.5±0.15
7 × 2.57 = 17.78±0.25
C 1.5±0.5
1: Emitter
2: Base
3: Collector
1 2 3 4 5 6 7 8
4: Base
5: Collector
6: Base
7: Collector
8: Emitter
SIP8-A1 Package
2.4
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to +150
°C
■ Electrical Characteristics TC = 25°C ± 3°C
Parameter
Symbol
Collector-emitter voltage (Base open)
VCEO
IC = 25 mA, IB = 0
Collector-base cutoff current (Emitter open)
ICBO
VCB = 80 V, IE = 0
100
µA
Collector-emitter cutoff current (Base open)
ICEO
VCE = 40 V, IB = 0
100
µA
Emitter-base cutoff current (Collector open)
IEBO
VEB = 6 V, IC = 0
100
µA
Forward current transfer ratio
hFE
VCE = 4 V, IC = 0.5 A
2 500

VCE(sat)
IC = 2 A, IB = 0.05 A
Collector-emitter saturation voltage
Transition frequency
fT
Conditions
VCE = 12 V, IC = 0.2 A, f = 10 MHz
Min
Typ
Max
60
Unit
V
500
1.0
50
V
MHz
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
■ Internal Connection
5
3
2
4
1
7
6
8
Note) The part number in the parenthesis shows conventional part number.
Publication date: April 2003
SJK00007AED
1
PUA3117
PC  Ta
8
(2)
0
(3)
0.6 mA
0.6
0.5 mA
0.4 mA
0.4
0.3 mA
0.2mA
80
120
0
160
0
Ambient temperature Ta (°C)
2
Forward current transfer ratio hFE
Collector-emitter saturation voltage VCE(sat) (V)
TC = 100°C
25°C
1
−25°C
0.1
1
TC = 100°C
102
10
10
103
100
Non repetitve pulse
TC = 25°C (Per circuit)
102
10
10
100
10
ICP
t = 1 ms
t = 10 ms
1
0.1
0.01
1
10
100
1 000
Collector-emitter voltage VCE (V)
SJK00007AED
0.4
0.6
0.8
1.0
1.2
VCE = 12 V
TC = 25°C
103
102
10
1
0.01
0.1
1
Collector current IC (A)
Collector current IC (A)
Collector current IC (A)
Collector output capacitance
C (pF)
(Common base, input open circuited) ob
1
Safe operation area
Collector-base voltage VCB (V)
2
25°C
0.1
0.2
Base-emitter voltage VBE (V)
fT  I C
−25°C
1
0.01
10
IE = 0
f = 1 MHz
TC = 25°C
1
0
104
103
Cob  VCB
1
0.1
0
12
VCE = 4 V
Collector current IC (A)
104
10
hFE  IC
10
0.01
0.01
8
104
IC / IB = 40
0.1
6
2
Collector-emitter voltage VCE (V)
VCE(sat)  IC
100
4
−25°C
3
1
0.1 mA
40
25°C
TC = 100°C
4
0.7 mA
0.2
(4)
0
VCE = 4 V
1 mA
0.8
12
4
IB = 1.2 mA TC = 25°C
Collector current IC (A)
(1)
IC  VBE
5
Transition frequency fT (MHz)
16
IC  VCE
1.0
(1) TC = Ta
(2) With a 50 × 50 × 2 mm
Al heat sink
(3) With a 50 × 25 × 2 mm
Al heat sink
(4) Without heat sink
Collector current IC (A)
Collector power dissipation PC (W)
20
10
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and semiconductors described in this material
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if any of the products or technologies described in this material and controlled under the "Foreign
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Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
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(5) The products and product specifications described in this material are subject to change without
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
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2002 JUL