INTERSIL HI5675JCB

HI5675
Data Sheet
April 1999
File Number
4711
8-Bit, 20MSPS, Flash A/D Converter
Features
The HI5675 is an 8-bit, analog-to-digital converter built in an
advanced CMOS process. The low power, low differential
gain and phase, high sampling rate, and single 5V supply
make the HI5675 ideal for video and imaging applications.
• Resolution . . . . . . . . . . . . . . . . . . . . 8-Bit ±0.3 LSB (DNL)
The adoption of a 2-step flash architecture achieves low
power consumption (60mW) at a maximum conversion
speed of 20MSPS with only a 2.5 clock cycle data latency.
The HI5675 also features digital output enable/disable and a
built in voltage reference. The HI5675 can be configured to
use the internal reference or an external reference if higher
precision is required.
Ordering Information
PART NUMBER
HI5675JCB
TEMP.
RANGE (oC)
-40 to 85
• Maximum Sampling Frequency . . . . . . . . . . . . . .20MSPS
• Low Power Consumption . . . . . . . . . . . . . . . . . . . . .60mW
(Reference Current Excluded)
• Built-In Sample and Hold Circuit
• Built-In Reference Voltage Self Bias Circuit
• Three-State TTL Compatible Output
• Single +5V Power Supply
• Low Input Capacitance . . . . . . . . . . . . . . . . . . . 11pF (Typ)
• Reference Impedance . . . . . . . . . . . . . . . . . . . 300Ω (Typ)
• Low Cost
PACKAGE
24 Ld SOIC
PKG. NO.
• Direct Replacement for TLC5510 and ADC1175
M24.2-S
Applications
• Video Digitizing
Pinout
• PC Video Capture
HI5675 (SOIC)
TOP VIEW
• Image Scanners
OE
1
24 DVSS
• TV Set Top Boxes
DVSS
2
23 VRB
• Multimedia
D0 (LSB)
3
22 VRBS
• Personal Communication Systems (PCS)
D1
4
21 AVSS
D2
5
20 AVSS
D3
6
19 VIN
D4
7
18 AVDD
D5
8
17 VRT
D6
9
16 VRTS
D7 (MSB)
10
15 AVDD
DVDD
11
14 AVDD
CLK
12
13 DVDD
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
HI5675
Functional Block Diagram
OE
1
DVSS
2
D0 (LSB)
3
D1
4
D2
5
D3
6
D4
7
D5
8
D6
24 DVSS
REFERENCE VOLTAGE
23 VRB
22
LOWER
ENCODER
(4-BIT)
LOWER
DATA
LATCHES
21 AVSS
20 AVSS
LOWER
ENCODER
(4-BIT)
LOWER
COMPARATORS
WITH S/H (4-BIT)
UPPER
ENCODER
(4-BIT)
UPPER
COMPARATORS
WITH S/H (4-BIT)
19 VIN
18 AVDD
17 VRT
UPPER
DATA
LATCHES
9
LOWER
COMPARATORS
WITH S/H (4-BIT)
D7 (MSB) 10
16
VRTS
2.6V (Typ)
15 AVDD
DVDD 11
CLK 12
VRBS
0.6V (Typ)
14 AVDD
13 DVDD
CLOCK GENERATOR
Typical Application Schematic
HC04
CA158A
+5V
+5V
R4
+
-
C9 +
4.7µF
R13
R11
R3
ICL8069
CLK
CLOCK IN
C10
0.1µF
13
12
14
11
15
10
D7 (MSB)
16
9
D6
17
8
D5
7
D4
19
6
D3
20
5
D2
21
4
D1
22
3
D0 (LSB)
23
2
24
1
R5
R12
+
-
CA158A
C12
0.1µF
HA2544
VIN
+
C8
18
†
HI5675
R1
R2
C11
0.1µF
C7 +
4.7µF
+5V
†
: Ceramic Chip Capacitor 0.1µF
: Analog GND
: Digital GND
NOTE: It is necessary that AVDD and DVDD pins be driven from the same supply. The gain of analog input signal can be changed by adjusting the
ratio of R2 to R1.
2
HI5675
Pin Descriptions
PIN
NUMBER
SYMBOL
1
OE
2, 24
DVSS
3-10
D0 to D7
11, 13
DVDD
12
CLK
Clock Input.
16
VRTS
Shorted with VRT generates, +2.6V.
17
VRT
Reference Voltage (Top).
23
VRB
Reference Voltage (Bottom).
14, 15, 18
AVDD
19
VIN
Analog Input.
20, 21
AVSS
Analog GND.
22
VRBS
Shorted with VRB generates +0.6V.
DESCRIPTION
When OE = Low, Data is valid. When OE = High, D0 to D7 pins high impedance.
3
Digital GND.
D0 (LSB) to D7 (MSB) Output.
Digital +5V. (Connect to AVDD to avoid Latchup).
Analog +5V. Digital +5V. (Connect to DVDD to avoid Latchup).
HI5675
Absolute Maximum Ratings
Thermal Information
Supply Voltage, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7V
Reference Voltage, VRT, VRB . . . . . . . . . . . . . . . . . . . . VDD to VSS
Analog Input Voltage, VIN . . . . . . . . . . . . . . . . . . . . . . . VDD to VSS
Digital Input Voltage, CLK . . . . . . . . . . . . . . . . . . . . . . . VDD to VSS
Digital Output Voltage, VOH, VOL. . . . . . . . . . . . . . . . . . VDD to VSS
Thermal Resistance (Typical, Note 1)
θJA (oC/W)
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . .
98
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range, TSTG . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
Operating Conditions
(Note 1)
Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
Supply Voltage
AVDD, AVSS , DVDD, DVSS . . . . . . . . . . . . . . . . +4.75V to +5.25V
|DGND-AGND|. . . . . . . . . . . . . . . . . . . . . . . . . . . . 0mV to 100mV
Reference Input Voltage
VRB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0V and Above
VRT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.8V and Below
Analog Input Range, VIN . . . . . . . VRB to VRT (1.8VP-P to 2.8VP-P)
Clock Pulse Width
tPW1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25ns (Min)
tPW0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25ns (Min)
Die Characteristics
Die Size: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.23 x 2.24mm
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
fC = 20MSPS, AVDD = DVDD = 5V, VRB = 0.5V, VRT = 2.5V, TA = 25oC (Note 1)
Electrical Specifications
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
EOT
-60
-35
-10
mV
EOB
0
+15
+45
mV
SYSTEM PERFORMANCE
Offset Voltage
Integral Non-Linearity, INL
fC = 20MSPS, VIN = 0.6V to 2.6V
-
±0.5
±1.3
LSB
Differential Non-Linearity, DNL
fC = 20MSPS, VIN = 0.6V to 2.6V
-
±0.3
±0.5
LSB
Effective Number of Bits, ENOB
fIN = 1MHz
-
7.6
-
Bits
Spurious Free Dynamic Range
fIN = 1MHz
-
51
-
dB
Signal to Noise Ratio, SINAD
fC = 20MHz, fIN = 1MHz
-
46
-
dB
fC = 20MHz, fIN = 3.58MHz
-
46
-
dB
20
-
-
MSPS
-
-
0.5
MSPS
-
1.0
-
%
Differential Phase Error, DP
-
0.5
-
Degree
Aperture Jitter, tAJ
-
30
-
ps
Sampling Delay, tDS
-
4
-
ns
Data Latency, tLAT
-
-
2.5
Cycles
-
18
-
MHz
-
11
-
pF
DYNAMIC CHARACTERISTICS
RMS Signal
= -----------------------------------------------------------------RMS Noise + Distortion
Maximum Conversion Speed, fC
VIN = 0.6V to 2.6V, fIN = 1kHz Ramp
Minimum Conversion Speed
Differential Gain Error, DG
NTSC 40 IRE Mod Ramp, fC = 14.3MSPS
ANALOG INPUTS
Analog Input Bandwidth (-1dB), BW
Analog Input Capacitance, CIN
VIN = 1.5V + 0.07VRMS
4
HI5675
fC = 20MSPS, AVDD = DVDD = 5V, VRB = 0.5V, VRT = 2.5V, TA = 25oC (Note 1) (Continued)
Electrical Specifications
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Reference Pin Current, IREF
4.5
6.6
8.7
mA
Reference Resistance (VRT to VRB), RREF
230
300
450
Ω
0.60
0.64
0.68
V
1.96
2.09
2.21
V
2.25
2.39
2.53
V
VIH
4.0
-
-
V
VIL
-
-
1.0
V
VIH = VDD
-
-
5
µA
VIL = 0V
-
-
5
µA
VOH = VDD -0.5V
-1.1
-
-
mA
VOL = 0.4V
3.7
-
-
mA
VOH = VDD
-
0.01
16
µA
VOL = 0V
-
0.01
16
µA
-
18
30
ns
-
12
17
mA
REFERENCE INPUT
INTERNAL VOLTAGE REFERENCE
Self Bias Mode 1
VRB
Short VRB and VRBS , Short VRT and VRTS
VRT - VRB
Self Bias Mode 2, VRT
VRB = AGND, Short VRT and VRTS
DIGITAL INPUTS
Digital Input Voltage
Digital Input Current
IIH
VDD = Max
IIL
DIGITAL OUTPUTS
Digital Output Current
IOH
OE = VSS , VDD = Min
IOL
Digital Output Current
IOZH
OE = VDD , VDD = Max
IOZL
TIMING CHARACTERISTICS
Output Data Delay, tDL
POWER SUPPLY CHARACTERISTIC
Supply Current, IDD
fC = 20MSPS, NTSC Ramp Wave Input
NOTE:
2. Electrical specifications guaranteed only under the stated operating conditions.
Timing Diagrams
tPW1
tPW0
CLOCK
ANALOG INPUT
N
DATA OUTPUT
N+1
N-3
: POINT FOR ANALOG SIGNAL SAMPLING
N-2
tD = 18ns
FIGURE 1.
5
N-2
N-1
N+3
N
N+4
N+1
HI5675
Timing Diagrams
(Continued)
VI (1)
VI (2)
VI (3)
VI (4)
ANALOG INPUT
EXTERNAL CLOCK
UPPER COMPARATOR BLOCK
S (1)
S (1)
DIGITAL OUTPUT
C (3)
MD (2)
C (0)
RV (3)
H (3)
C (3)
LD (1)
S (2)
LD (-2)
OUT (-2)
C (4)
MD (3)
S (3)
LD (-1)
H (0)
S (4)
RV (2)
C (1)
H (2)
C (2)
LD (0)
OUT (-1)
FIGURE 2.
6
S (3)
RV (1)
H (1)
LOWER DATA A
LOWER DATA B
C (2)
MD (1)
RV (0)
LOWER REFERENCE VOLTAGE
LOWER COMPARATOR BLOCK B
S (2)
MD (0)
UPPER DATA
LOWER COMPARATOR BLOCK A
C (1)
S (4)
H (4)
LD (2)
OUT (0)
OUT (1)
HI5675
TABLE 1. A/D OUTPUT CODE TABLE
DIGITAL OUTPUT CODE
INPUT SIGNAL
VOLTAGE
STEP
MSB
D6
D5
D4
D3
D2
D1
LSB
VRT
255
1
1
1
1
1
1
1
1
•
•
•
•
•
•
•
•
VRB
•
•
•
•
•
•
128
1
0
0
0
0
0
0
0
127
0
1
1
1
1
1
1
1
0
0
0
•
•
•
•
•
•
0
0
0
0
0
0
Detailed Description
The HI5675 is a 2-step A/D converter featuring a 4-bit upper
comparator group and two lower comparator groups of 4 bits
each. The reference voltage can be obtained from the
onboard bias generator or be supplied externally. This IC uses
an offset canceling type comparator that operates
synchronously with an external clock. The operating modes of
the part are input sampling (S), hold (H), and compare (C).
Analog Input
The operation of the part is illustrated in Figure 2. A
reference voltage that is between VRT -VRB is constantly
applied to the upper 4-bit comparator group. VI(1) is
sampled with the falling edge of the first clock by the upper
comparator block. The lower block A also samples VI(1) on
the same edge. The upper comparator block finalizes
comparison data MD(1) with the rising edge of the first clock.
Simultaneously the reference supply generates a reference
voltage RV(1) that corresponds to the upper results and
applies it to the lower comparator block A. The lower
comparator block finalizes comparison data LD(1) with the
rising edge of the second clock. MD(1) and LD(1) are
combined and output as OUT(1) with the rising edge of the
third clock. There is a 2.5 cycle clock delay from the analog
input sampling point to the corresponding digital output data.
Notice how the lower comparator blocks A and B alternate
generating the lower data in order to increase the overall A/D
sampling rate.
Reference Input
Power, Grounding, and Decoupling
To reduce noise effects, separate the analog and digital
grounds.
In order to avoid latchup at power up, it is necessary
that AVDD and DVDD be driven from the same supply.
Bypass both the digital and analog VDD pins to their
respective grounds with a ceramic 0.1µF capacitor close to
the pin.
7
The input capacitance is small when compared with other
flash type A/D converters. However, it is necessary to drive
the input with an amplifier with sufficient bandwidth and drive
capability. In order to prevent parasitic oscillation, it may be
necessary to insert a low value (i.e., 0.24Ω) resistor between
the output of the amplifier and the A/D input.
The range of the A/D is set by the voltage between VRT and
VRB . The internal bias generator will set VRTS to 2.6V and
VRBS to 0.6V. These can be used as the part reference by
shorting VRT and VRTS and VRB to VRBS . The analog input
range of the A/D will now be from 0.6V to 2.6V and is
referred to as Self Bias Mode 1. Self Bias Mode 2 is where
VRB is connected to AGND and VRT is shorted to VRTS .
The analog input range will now be from 0V to 2.4V.
HI5675
Test Circuits
+V
S1: ON IF A < B
S2: ON IF A > B
S2
S1
+
A<B
VIN
8
DUT
HI5675
A>B
COMPARATOR
-V
A8
TO
A1
A0
“0”
8
B8
TO
B1
B0
BUFFER
“1”
DVM
CLK (20MHz)
000 • • • 00
TO
111 • • • 10
8
CONTROLLER
FIGURE 3. INTEGRAL AND DIFFERENTIAL NON-LINEARITY ERROR AND OFFSET VOLTAGE TEST CIRCUIT
2.6V
ERROR RATE
fC -1kHz
SG
HPF
0.6V
1
100
IRE
0
-40
SG
(CW)
VIN
AMP
2
NTSC
SIGNAL
SOURCE
40 IRE
MODULATION
COUNTER
HI20201
DUT
HI5675
8
TTL
1
8
10-BIT
D/A
ECL
620
2
VECTOR
SCOPE
CLK
2.6V
BURST
DG
DP
-5.2V
620
0.6V
SYNC
TTL
fC
-5.2V
ECL
FIGURE 4. MAXIMUM OPERATIONAL SPEED AND DIFFERENTIAL GAIN AND PHASE ERROR TEST CIRCUIT
VDD
VRT
2.6V
2.6V
IOL
VIN
0.6V
HI5675
CLK
OE
+
VOL
GND
-
VRB
HI5675
CLK
OE
FIGURE 5. DIGITAL OUTPUT CURRENT TEST CIRCUIT
8
IOH
VIN
VRB
0.6V
VDD
VRT
+
VOH
GND
-
HI5675
Static Performance Definitions
Offset, full scale, and gain all use a measured value of the
internal voltage reference to determine the ideal plus and
minus full scale values. The results are all displayed in LSBs.
Total Harmonic Distortion
Offset Error (EOB)
2nd and 3rd Harmonic Distortion
The first code transition should occur at a level 1/2 LSB
above the bottom reference voltage. Offset is defined as the
deviation of the actual code transition from this point. Note
that this is adjustable to zero.
This is the ratio of the RMS sum of the first 5 harmonic
components to the RMS value of the measured input signal.
This is the ratio of the RMS value of the 2nd and 3rd
harmonic component respectively to the RMS value of the
measured input signal.
Spurious Free Dynamic Range (SFDR)
Full Scale Error (EOT)
The last code transition should occur for a analog input that
is 11/2 LSBs below full scale. Full scale error is defined as
the deviation of the actual code transition from this point.
SFDR is the ratio of the fundamental RMS amplitude to the
RMS amplitude of the next largest spur or spectral
component. If the harmonics are buried in the noise floor it is
the largest peak.
Differential Linearity Error (DNL)
Full Power Input Bandwidth
DNL is the worst case deviation of a code width from the
ideal value of 1 LSB. The converter is guaranteed to have no
missing codes.
Full power bandwidth is the frequency at which the
amplitude of the digitally reconstructed output has
decreased 3dB below the amplitude of the input sine wave.
The input sine wave has a peak-to-peak amplitude equal to
the reference voltage. The bandwidth given is measured at
the specified sampling frequency.
Integral Linearity Error (INL)
INL is the worst case deviation of a code center from a best
fit straight line calculated from the measured data.
Dynamic Performance Definitions
Timing Definitions
Fast Fourier Transform (FFT) techniques are used to
evaluate the dynamic performance of the HI5675. A low
distortion sine wave is applied to the input, it is sampled, and
the output is stored in RAM. The data is then transformed
into the frequency domain with a 1024 point FFT and
analyzed to evaluate the dynamic performance of the A/D.
The sine wave input to the part is -0.5dB down from fullscale
for all these tests. The distortion numbers are quoted in dBc
(decibels with respect to carrier) and DO NOT include any
correction factors for normalizing to fullscale.
Sampling Delay (tSD)
Signal-to-Noise Ratio (SNR)
SNR is the measured RMS signal to RMS noise at a
specified input and sampling frequency. The noise is the
RMS sum of all of the spectral components except the
fundamental and the first five harmonics.
Signal-to-Noise + Distortion Ratio (SINAD)
SINAD is the measured RMS signal to RMS sum of all
other spectral components below the Nyquist frequency
excluding DC.
Effective Number Of Bits (ENOB)
The effective number of bits (ENOB) is derived from the
SINAD data. ENOB is calculated from:
ENOB = (SINAD - 1.76 + VCORR) / 6.02,
where:
VCORR = 0.5dB.
9
Sampling delay is the time delay between the external
sample command (the falling edge of the clock) and the time
at which the signal is actually sampled. This delay is due to
internal clock path propagation delays.
Aperture Jitter (tAJ)
This is the RMS variation in the sampling delay due to
variation of internal clock path delays.
Data Latency (tLAT)
After the analog sample is taken, the data on the bus is
available after 2.5 cycles of the clock. This is due to the
architecture of the converter where the data has to ripple
through the stages. This delay is specified as the data
latency. After the data latency time, the data representing
each succeeding sample is output at the following clock
pulse. The digital data lags the analog input by 2.5 cycles.
Output Data Delay (tD)
Output Data Delay is the delay time from when the data is
valid (rising clock edge) to when it shows up at the output
bus. This is due to internal delays at the digital output.
HI5675
Small Outline Plastic Packages (SOIC)
M24.2-S
N
INDEX
AREA
1
2
24 LEAD SMALL OUTLINE PLASTIC PACKAGE (200 MIL)
H
INCHES
E
3
L
SEATING PLANE
D
A
e
A1
B
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
0.067
0.088
1.70
2.25
-
A1
0.002
0.011
0.05
0.30
-
B
0.014
0.021
0.35
0.55
-
C
0.006
0.011
D
0.587
0.606
14.9
15.4
1
E
0.205
0.220
5.2
5.6
2
e
α
C
0.15(0.006)
0.24 M
MILLIMETERS
0.050 BSC
0.15
0.30
-
1.27 BSC
-
H
0.296
0.326
7.5
8.3
-
L
0.012
0.027
0.30
0.70
3
10o
0o
N
α
24
0o
24
4
10o
Rev. 1 4/95
NOTES:
1. Dimension “D” does not include mold flash, protrusions or gate burrs.
2. Dimension “E” does not include interlead flash or protrusions.
3. “L” is the length of terminal for soldering to a substrate.
4. “N” is the number of terminal positions.
5. Terminal numbers are shown for reference only.
6. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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10
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