Data Sheet

TO
-2
20A
B
PSMN2R6-60PS
N-channel 60 V, 2.6 mΩ standard level MOSFET in SOT78
5 February 2013
Product data sheet
1. General description
Standard level N-channel MOSFET in SOT78 using TrenchMOS technology. Product
design and manufacture has been optimized for use in battery operated power tools.
2. Features and benefits
•
•
•
High efficiency due to low switching & conduction losses
Robust construction for demanding applications
Standard level gate
3. Applications
•
•
•
•
Battery-powered tools
Load switching
Motor control
Uninterruptible power supplies
4. Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDS
drain-source voltage
Tj ≥ 25 °C; Tj ≤ 175 °C
-
-
60
V
ID
drain current
VGS = 10 V; Tmb = 25 °C; Fig. 1
-
-
150
A
Ptot
total power dissipation
Tmb = 25 °C; Fig. 2
-
-
326
W
VGS = 10 V; ID = 25 A; Tj = 25 °C;
-
1.97
2.6
mΩ
[1]
Static characteristics
RDSon
drain-source on-state
resistance
Fig. 11
Dynamic characteristics
QG(tot)
QGD
total gate charge
ID = 25 A; VDS = 48 V; VGS = 10 V;
-
140
-
nC
gate-drain charge
Fig. 13; Fig. 14
-
43.7
-
nC
[1]
Continuous current is limited by package.
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PSMN2R6-60PS
NXP Semiconductors
N-channel 60 V, 2.6 mΩ standard level MOSFET in SOT78
5. Pinning information
Table 2.
Pinning information
Pin
Symbol Description
1
G
gate
2
D
drain
3
S
source
Simplified outline
Graphic symbol
D
mb
G
S
mbb076
1 2 3
TO-220AB (SOT78)
6. Ordering information
Table 3.
Ordering information
Type number
Package
PSMN2R6-60PS
Name
Description
Version
TO-220AB
plastic single-ended package; heatsink mounted; 1 mounting
hole; 3-lead TO-220AB
SOT78
7. Marking
Table 4.
Marking codes
Type number
Marking code
PSMN2R6-60PS
PSMN2R6-60PS
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDS
drain-source voltage
Tj ≥ 25 °C; Tj ≤ 175 °C
-
60
V
VDGR
drain-gate voltage
RGS = 20 kΩ
-
60
V
VGS
gate-source voltage
-20
20
V
ID
drain current
IDM
peak drain current
PSMN2R6-60PS
Product data sheet
Tmb = 25 °C; VGS = 10 V; Fig. 1
[1]
-
150
A
Tmb = 100 °C; VGS = 10 V; Fig. 1
[1]
-
150
A
-
961
A
Tmb = 25 °C; pulsed; tp ≤ 10 µs; Fig. 4
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PSMN2R6-60PS
NXP Semiconductors
N-channel 60 V, 2.6 mΩ standard level MOSFET in SOT78
Symbol
Parameter
Conditions
Min
Max
Unit
Ptot
total power dissipation
Tmb = 25 °C; Fig. 2
-
326
W
Tstg
storage temperature
-55
175
°C
Tj
junction temperature
-55
175
°C
Tsld(M)
peak soldering temperature
-
260
°C
-
150
A
Source-drain diode
IS
source current
Tmb = 25 °C
ISM
peak source current
pulsed; tp ≤ 10 µs; Tmb = 25 °C
-
961
A
ID = 150 A; Vsup ≤ 60 V; RGS = 50 Ω;
-
411
mJ
[1]
Avalanche ruggedness
EDS(AL)S
non-repetitive drain-source
avalanche energy
VGS = 60 V; Tj(init) = 25 °C; unclamped;
Fig. 3
[1]
Continuous current is limited by package.
003aak809
250
ID
(A)
03aa16
120
Pder
(%)
200
80
(1)
150
100
40
50
0
0
30
60
90
120
150
Tj (°C)
(1) Capped at 150A due to package
Fig. 1.
Continuous drain current as a function of
mounting base temperature
PSMN2R6-60PS
Product data sheet
0
180
Fig. 2.
0
100
150
Tmb (°C)
200
Normalized total power dissipation as a
function of mounting base temperature
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PSMN2R6-60PS
NXP Semiconductors
N-channel 60 V, 2.6 mΩ standard level MOSFET in SOT78
IAL
(A)
003aak810
103
102
(1)
(2)
10
1
10-3
Fig. 3.
10-2
10-1
1
tAL (ms)
10
Avalanche rating; avalanche current as a function of avalanche time
ID
(A)
003aak811
103
Limit RDSon = VDS / ID
tp = 10 us
102
100 us
DC
10
1 ms
10 ms
100 ms
1
10-1
10-1
Fig. 4.
1
10
VDS (V)
102
Safe operating area; continuous and peak drain currents as a function of drain-source voltage
9. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-mb)
thermal resistance
from junction to
mounting base
Fig. 5
-
0.39
0.46
K/W
Rth(j-a)
thermal resistance
from junction to
ambient
-
60
-
K/W
PSMN2R6-60PS
Product data sheet
vertical in still air
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PSMN2R6-60PS
NXP Semiconductors
N-channel 60 V, 2.6 mΩ standard level MOSFET in SOT78
003aah663
1
Zth(j-mb)
(K/W) δ = 0.5
0.2
10-1
0.1
0.05
0.02
10-2
P
single shot
tp
10
tp
T
δ=
-3
10-6
Fig. 5.
10-5
10-4
10-3
10-2
t
T
10-1
1
tp (s)
Transient thermal impedance from junction to mounting base as a function of pulse duration
10. Characteristics
Table 7.
Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
drain-source
breakdown voltage
ID = 250 µA; VGS = 0 V; Tj = 25 °C
60
-
-
V
ID = 250 µA; VGS = 0 V; Tj = -55 °C
54
-
-
V
gate-source threshold
voltage
ID = 1 mA; VDS = VGS; Tj = 25 °C;
2.4
3
4
V
1
-
-
V
-
-
4.5
V
VDS = 60 V; VGS = 0 V; Tj = 175 °C
-
-
500
µA
VDS = 60 V; VGS = 0 V; Tj = 25 °C
-
0.09
1
µA
VGS = 20 V; VDS = 0 V; Tj = 25 °C
-
2
100
nA
VGS = -20 V; VDS = 0 V; Tj = 25 °C
-
2
100
nA
VGS = 10 V; ID = 25 A; Tj = 25 °C;
-
1.97
2.6
mΩ
-
-
5.6
mΩ
f = 1 MHz
0.39
0.79
1.58
Ω
total gate charge
ID = 25 A; VDS = 48 V; VGS = 10 V;
-
140
-
nC
gate-source charge
Fig. 13; Fig. 14
-
32.7
-
nC
Static characteristics
V(BR)DSS
VGS(th)
Fig. 9; Fig. 10
ID = 1 mA; VDS = VGS; Tj = 175 °C;
Fig. 9
ID = 1 mA; VDS = VGS; Tj = -55 °C;
Fig. 9
IDSS
IGSS
RDSon
drain leakage current
gate leakage current
drain-source on-state
resistance
Fig. 11
VGS = 10 V; ID = 25 A; Tj = 175 °C;
Fig. 11; Fig. 12
RG
gate resistance
Dynamic characteristics
QG(tot)
QGS
PSMN2R6-60PS
Product data sheet
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PSMN2R6-60PS
NXP Semiconductors
N-channel 60 V, 2.6 mΩ standard level MOSFET in SOT78
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
QGD
gate-drain charge
-
43.7
-
nC
Ciss
input capacitance
VGS = 0 V; VDS = 25 V; f = 1 MHz;
-
7629
-
pF
Tj = 25 °C; Fig. 15
Coss
output capacitance
-
968
-
pF
Crss
reverse transfer
capacitance
-
591
-
pF
td(on)
turn-on delay time
VDS = 45 V; RL = 1.8 Ω; VGS = 10 V;
-
32
-
ns
tr
rise time
RG(ext) = 5 Ω
-
50
-
ns
td(off)
turn-off delay time
-
87
-
ns
tf
fall time
-
58
-
ns
Source-drain diode
VSD
source-drain voltage
IS = 25 A; VGS = 0 V; Tj = 25 °C; Fig. 16
-
0.78
1.2
V
trr
reverse recovery time
IS = 20 A; dIS/dt = -100 A/µs; VGS = 0 V;
-
44
-
ns
Qr
recovered charge
VDS = 25 V
-
67
-
nC
003aah664
400
10
ID
(A)
8
003aah665
15
6
RDSon
(mΩ )
300
5.5
10
5
5
200
100
VGS (V) = 4.5
0
0
0.5
1
0
1.5 V (V) 2
DS
Tj = 25 °C; tp = 300 μs
Fig. 6.
Fig. 7.
Output characteristics; drain current as a
function of drain-source voltage; typical values
PSMN2R6-60PS
Product data sheet
0
10
15 V (V) 20
GS
Drain-source on-state resistance as a function
of gate-source voltage; typical values
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PSMN2R6-60PS
NXP Semiconductors
N-channel 60 V, 2.6 mΩ standard level MOSFET in SOT78
003aah667
500
ID
(A)
003aah027
5
VGS(th)
(V)
max
400
4
300
3
typ
200
2
min
Tj = 175 °C
100
0
Fig. 8.
1
Tj = 25 °C
0
2
4
6
VGS (V)
0
-60
8
Transfer characteristics; drain current as a
function of gate-source voltage; typical values
Fig. 9.
003aah028
10-1
0
60
120
180
Gate-source threshold voltage as a function of
junction temperature
003aah670
15
ID
(A)
T j (°C)
RDSon
(mΩ )
10-2
min
10-3
typ
5
10
max
5.5
6
10-4
5
10-5
8
VGS (V) = 10
10-6
0
2
4
VGS (V)
0
6
Fig. 10. Sub-threshold drain current as a function of
gate-source voltage
PSMN2R6-60PS
Product data sheet
0
100
200
300
ID (A) 400
Tj = 25 °C; tp = 300 μs
Fig. 11. Drain-source on-state resistance as a function
of drain current; typical values
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PSMN2R6-60PS
NXP Semiconductors
N-channel 60 V, 2.6 mΩ standard level MOSFET in SOT78
003aag814
2.4
VDS
a
ID
1.8
VGS(pl)
VGS(th)
1.2
VGS
QGS1
0.6
QGS2
QGS
QGD
QG(tot)
003aaa508
0
-60
0
60
120
Tj (°C)
Fig. 13. Gate charge waveform definitions
180
Fig. 12. Normalized drain-source on-state resistance
factor as a function of junction temperature
003aah672
10
VGS
(V)
003aah673
104
Ciss
C
(pF)
8
14 V
6
VDS = 48V
103
Coss
4
Crss
2
0
0
50
100
Q G (nC)
150
Fig. 14. Gate-source voltage as a function of gate
charge; typical values
PSMN2R6-60PS
Product data sheet
102
10-1
1
10
VDS (V)
102
Fig. 15. Input, output and reverse transfer capacitances
as a function of drain-source voltage; typical
values
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PSMN2R6-60PS
NXP Semiconductors
N-channel 60 V, 2.6 mΩ standard level MOSFET in SOT78
003aah674
400
IS
(A)
300
200
Tj = 175° C
100
Tj = 25 °C
0
0
0.3
0.6
0.9 V (V) 1.2
SD
Fig. 16. Source (diode forward) current as a function of source-drain (diode forward) voltage; typical values
PSMN2R6-60PS
Product data sheet
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PSMN2R6-60PS
NXP Semiconductors
N-channel 60 V, 2.6 mΩ standard level MOSFET in SOT78
11. Package outline
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB
SOT78
E
A
A1
p
q
mounting
base
D1
D
L1(1)
L2(1)
Q
L
b1(2)
(3×)
b2(2)
(2×)
1
2
3
b(3×)
e
c
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
b
b1(2)
b2(2)
c
D
D1
E
e
L
L1(1)
L2(1)
max.
p
q
Q
mm
4.7
4.1
1.40
1.25
0.9
0.6
1.6
1.0
1.3
1.0
0.7
0.4
16.0
15.2
6.6
5.9
10.3
9.7
2.54
15.0
12.8
3.30
2.79
3.0
3.8
3.5
3.0
2.7
2.6
2.2
Notes
1. Lead shoulder designs may vary.
2. Dimension includes excess dambar.
OUTLINE
VERSION
SOT78
REFERENCES
IEC
JEDEC
JEITA
3-lead TO-220AB
SC-46
EUROPEAN
PROJECTION
ISSUE DATE
08-04-23
08-06-13
Fig. 17. Package outline TO-220AB (SOT78)
PSMN2R6-60PS
Product data sheet
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PSMN2R6-60PS
NXP Semiconductors
N-channel 60 V, 2.6 mΩ standard level MOSFET in SOT78
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
12. Legal information
12.1 Data sheet status
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Document
status [1][2]
Product
status [3]
Objective
[short] data
sheet
Development This document contains data from
the objective specification for product
development.
Preliminary
[short] data
sheet
Qualification
This document contains data from the
preliminary specification.
Product
[short] data
sheet
Production
This document contains the product
specification.
[1]
[2]
[3]
Definition
Please consult the most recently issued document before initiating or
completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
the Internet at URL http://www.nxp.com.
12.2 Definitions
Preview — The document is a preview version only. The document is still
subject to formal approval, which may result in modifications or additions.
NXP Semiconductors does not give any representations or warranties as to
the accuracy or completeness of information included herein and shall have
no liability for the consequences of use of such information.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
PSMN2R6-60PS
Product data sheet
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make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
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authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their
applications and products using NXP Semiconductors products, and NXP
Semiconductors accepts no liability for any assistance with applications or
customer product design. It is customer’s sole responsibility to determine
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customer’s applications and products planned, as well as for the planned
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provide appropriate design and operating safeguards to minimize the risks
associated with their applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default
in the customer’s applications or products, or the application or use by
customer’s third party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications
and the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
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products are sold subject to the general terms and conditions of commercial
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PSMN2R6-60PS
NXP Semiconductors
N-channel 60 V, 2.6 mΩ standard level MOSFET in SOT78
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
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the product is not suitable for automotive use. It is neither qualified nor
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NXP Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
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customer (a) shall use the product without NXP Semiconductors’ warranty
of the product for such automotive applications, use and specifications, and
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Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
12.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,
ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,
QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,
TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.
HD Radio and HD Radio logo — are trademarks of iBiquity Digital
Corporation.
PSMN2R6-60PS
Product data sheet
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PSMN2R6-60PS
NXP Semiconductors
N-channel 60 V, 2.6 mΩ standard level MOSFET in SOT78
13. Contents
1
General description ............................................... 1
2
Features and benefits ............................................1
3
Applications ........................................................... 1
4
Quick reference data ............................................. 1
5
Pinning information ............................................... 2
6
Ordering information ............................................. 2
7
Marking ................................................................... 2
8
Limiting values .......................................................2
9
Thermal characteristics .........................................4
10
Characteristics ....................................................... 5
11
Package outline ................................................... 10
12
12.1
12.2
12.3
12.4
Legal information .................................................11
Data sheet status ............................................... 11
Definitions ...........................................................11
Disclaimers .........................................................11
Trademarks ........................................................ 12
© NXP B.V. 2013. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 5 February 2013
PSMN2R6-60PS
Product data sheet
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