PANASONIC 2SA2164

Transistors
2SA2164
Silicon PNP epitaxial planar type
For high-frequency amplification
Unit: mm
0.33+0.05
–0.02
 Features
0.10+0.05
–0.02
0.80±0.05
1.20±0.05
Collector-base voltage (Emitter open)
VCBO
–30
V
Collector-emitter voltage (Base open)
VCEO
–20
V
Emitter-base voltage (Collector open)
VEBO
–5
V
Collector current
IC
–30
mA
Collector power dissipation
PC
100
mW
Junction temperature
Tj
125
°C
Storage temperature
Tstg
–55 to +125
°C
5°
1: Base
2: Emitter
3: Collector
0.15 max.
Unit
0.52±0.03
Rating
0 to 0.01
Symbol
0.15 min.
5°
(0.40) (0.40)
 Absolute Maximum Ratings Ta = 25°C
Parameter
2
0.15 min.
1
0.23+0.05
–0.02
1.20±0.05
0.80±0.05
3
 High transfer ratio fT
 SSS-Mini type package, allowing downsizing of the equipment and automatic insertion through the tape packing.
SSSMini3-F1 Package
Marking Symbol : E
 Electrical Characteristics Ta = 25°C±3°C
Parameter
Symbol
Conditions
Min
Typ
Max
Base-emitter voltage
VBE
VCE = –10 V, IC = –1 mA
Collector-base cutoff current (Emitter open)
ICBO
VCB = –10 V, IE = 0
– 0.1
µA
Collector-emitter cut-off current (Base open)
ICEO
VCE = –20 V, IB = 0
–100
µA
Emitter-base cut-off current (Collector open)
IEBO
VEB = –5 V, IC = 0
–10
µA
Forward current transfer ratio
hFE
VCB = –10 V, IE = 1 mA
220

VCE(sat)
IC = –10 mA, IB = –1 mA
Collector-emitter saturation voltage
– 0.7
Unit
70
150
V
– 0.1
V
300
MHz
Transition frequency
fT
VCB = –10 V, IE = 1 mA, f = 200 MHz
Noise figure
NF
VCB = –10 V, IE = 1 mA, f = 5 MHz
2.8
dB
Reverse transfer impedance
Zrb
VCB = –10 V, IE = 1 mA, f = 2 MHz
22
Ω
Common-emitter reverse transfer capacitance
Cre
VCB = –10 V, IE = 1 mA, f = 10.7 MHz
1.2
pF
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
Publication date : December 2004
SJC00330AED
1
2SA2164
2SA2164_ PC-Ta
IC  VCE
−25
VCE = −10 V
80
60
40
20
20
40
80
60
−200 µA
−15
−100 µA
−10
−50 µA
−5
0
100 120 140
−150 µA
−10
Ta = 85°C
−20
25°C
−15
−25°C
−10
−5
0
−2
−4
−6
−8
−10
0
− 0.3 − 0.4 − 0.5 − 0.6 − 0.7 − 0.8 − 0.9 −1
−12
Ambient temperature Ta (°C)
Collector-emitter voltage VCE (V)
Base-emitter voltage VBE (V)
2SA2164_ VCE(sat)-IC
2SA2164_ hFE-IC
2SA2164_ Cob-VCB
hFE  IC
Cob  VCB
160
IC / IB = 10
−1
Ta = 85°C
− 0.1
− 0.01
− 0.1
−25
−25°C
25°C
−1
−10
Collector current IC (mA)
−100
140
120
Ta = 85°C
VCE = −10 V
25°C
100
80
−25°C
60
40
20
0
−0.1
−1
−10
Collector current IC (mA)
SJC00330AED
−100
Collector output capacitance
(Common base, input open circuited) Cob (pF)
0
−20
Collector current IC (mA)
100
Forward current transfer ratio hFE
Collector-emitter saturation voltage VCE(sat) (V)
IB = −300 µA
Ta = 25°C
VCE(sat)  IC
2
IC  VBE
−30
−250 µA
Collector current IC (mA)
Collector power dissipation PC (mW)
120
0
2SA2164_ IC-VBE
2SA2164_ IC-VCE
PC  Ta
10
f = 1 MHz
Ta = 25°C
1
0.1
0
5
10
15
20
25
30
Collector-base voltage VCB (V)
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of
the products or technical information described in this material and controlled under the "Foreign Exchange
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applied circuits examples of the products. It neither warrants non-infringement of intellectual property right
or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical
information as described in this material.
(4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are
required, or if the failure or malfunction of the products may directly jeopardize life or harm the human
body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products,
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not
be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such
as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent
physical injury, fire, social damages, for example, by using the products.
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and amount of time let standing of unsealed items) agreed upon when specification sheets are individually
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2003 SEP