Reliability Monitor Report High Temperature Operating Life Data Retention Bake Temperature Cycle Temperature & Humidity Bias/ HAST Steam Pressure Pot Third QUARTER 2009 ATMEL PROPRIETARY Table of Contents 1. Executive Summary 1 2. HTOL (sorted by product BU) 2 3. HTOL (sorted by technology) 3-4 4. Data Retention Bake (sorted by product BU) 5 5. Data Retention Bake (sorted by technology) 6 6. Temperature Cycle 7 7. Temperature Humidity Bias & HAST 8 8. Steam Pressure Pot 9 9. Technology List 10 10. Failure Rate Calculations 11 11. Definitions 12 RELIABILITY MONITOR -- ATMEL PROPRIETARY Reliability Monitor Report Date: Dec 18, 2009 Executive Summary The intent of the Reliability Monitor Program is to measure the reliability of previously qualified devices on a quarterly basis. This is achieved by selecting representative devices within a process, package or business unit and performing a series of reliability tests to ensure that the reliability has maintained over time. Listed below are the overall results for the last quarter. 1. High Temperature Operating Life (125° - 150°C; 0 failures) Failure Rate: 7 FITS (2,529K device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Also, Thermal and Voltage Acceleration are used to compute the overall acceleration factor. Weighted acceleration factors (WAF) for a group of products are calculated by taking the weighted average of each device’s acceleration factor multiplied by its corresponding device hours. All failures were inconclusive. 2. Data Retention Bake (150°C; 0 failures) Failure Rate: 6 FITS (1,420K device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Since there is no bias applied during testing and the stress temperature is fixed for all devices at 150°C, the acceleration factor is 117 for all groupings. 3. Temperature Cycle (-65°C to 150°C, 500 cycles) * Failure Rate: 0.00% (0 failures out of 1,386 units) 4. Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) * Failure Rate: 0.00% (0 failures out of 1,767K device-hours) Note: A 20:1 Acceleration Factor is used to combine HAST results with THB). 5. Steam Pressure Pot (121°C/100%RH) * Failure Rate: 0.00% (0 failures out of 1,381 units) RELIABILITY MONITOR -- ATMEL PROPRIETARY * indicates that preconditioning is performed prior to the stress test. 1 High Temperature Operating Life (sorted by FAMILY) BU QTR 48 Hours 168 Hours 500 Hours 1K Hours REJ SS REJ SS REJ SS REJ SS Device-Hours* WAF EFR PPM FITS APG 2 LAST 4Q 0 0 162 1,286 0 0 162 1,286 0 0 162 668 0 0 162 668 162,000 771,824 35 36 0 0 160 33 ASIC 2 LAST 4Q 0 0 3,821 9,150 0 1 729 5,457 0 5 729 4,068 0 0 575 1,560 800,416 3,224,616 13 60 0 0 86 38 MEMORY 2 LAST 4Q 0 0 1,100 5,185 0 0 500 2,959 0 0 496 1,855 0 0 487 1,846 520,972 2,142,820 55 80 0 0 32 5 MCU 2 LAST 4Q 0 0 3,070 13,894 0 0 463 1,532 0 0 463 1,380 0 0 463 995 588,136 1,806,412 12 12 0 0 127 42 RFA 2 LAST 4Q 0 0 306 2,996 0 0 306 2,996 0 0 306 2,996 0 0 306 2,767 458,000 3,110,500 166 143 0 0 12 2 ATMEL 2 LAST 4Q 0 0 8,459 32,511 0 1 2,160 14,230 0 5 2,156 10,967 0 0 1,993 7,836 2,529,524 11,056,172 51 78 0 0 7 9 RELIABILITY MONITOR -- ATMEL PROPRIETARY 2 High Temperature Operating Life (sorted by TECHNOLOGY) TECH Z92 UHF SCMOS2 SCMOS3 BCDMOS BICMOS2 BICMOS UHF5 75K 63K 58.8K 58K 57.5K 57K 56.9K 56.8K QTR 48 Hours 168 Hours 500 Hours 1K Hours Device-Hours* WAF EFR PPM FITS 154 335,112 3 154 373,612 3 0 0 957 857 0 76 152,000 52 0 734 810,000 69 0 0 116 16 90 0 0 45,000 4 0 4,559 0 199 0 154 176,500 103 0 51 237 0 237 0 237 237,000 119 0 33 0 160 0 160 0 160 160,000 117 0 49 153 0 153 0 153 0 153 230,000 206 0 19 80 0 80 0 80 0 80 80,000 117 0 98 0 0 15 4 52 15 REJ SS REJ SS REJ SS REJ SS 2 LAST 4Q 0 2,477 0 308 0 308 0 0 2,554 0 385 0 385 0 2 LAST 4Q 0 76 0 76 0 76 0 734 0 734 0 734 2 LAST 4Q 0 90 0 90 0 2 LAST 4Q 0 199 0 199 2 LAST 4Q 0 237 0 2 LAST 4Q 0 160 2 LAST 4Q 0 2 LAST 4Q 0 2 LAST 4Q 0 154 0 154 0 154 0 154 154,000 392 0 1,019 0 1,019 0 1,019 0 1,019 1,019,000 228 2 LAST 4Q 0 600 0 200 0 196 0 187 211,372 84 0 2,086 0 660 0 656 0 647 720,620 84 0 0 2 LAST 4Q 0 1,232 0 1,232 1 769 0 0 462,284 117 0 37 2 LAST 4Q 0 2,372 0 230 0 155 0 155 270,416 11 0 296 2 LAST 4Q 0 1,307 1 1,306 2 767 0 0 474,100 117 0 75 2 LAST 4Q 0 144 0 144 0 144 0 144 144,000 17 0 571 0 571 0 571 0 526 548,500 20 0 0 372 82 2 LAST 4Q 0 80 0 80 0 80 0 80 80,000 48 0 630 0 630 0 340 0 340 388,720 48 0 0 237 49 0 616 0 616 0 231 0 0 180,180 117 0 43 2 LAST 4Q RELIABILITY MONITOR -- ATMEL PROPRIETARY 3 High Temperature Operating Life (sorted by TECHNOLOGY) TECH 56K 55K 46K 35K 34K 19K ATMEL QTR 2 LAST 4Q 2 LAST 4Q 48 Hours 168 Hours 500 Hours 1K Hours Device-Hours* WAF EFR PPM FITS 177 211,704 12 0 403 448,704 16 0 0 350 126 614 0 0 307,336 117 0 86 0 0 492 105 0 0 37 10 0 0 736 22 0 0 201 27 0 0 7 9 REJ SS REJ SS REJ SS REJ SS 0 900 0 177 0 177 0 0 1,148 0 425 0 425 0 616 0 616 2 2 LAST 4Q 0 82 0 82 0 82 0 82 82,000 23 0 656 0 656 0 328 0 328 383,104 23 2 LAST 4Q 0 3,346 0 739 0 739 0 739 940,136 26 0 13,952 0 3,532 0 2,355 0 2,047 2,974,896 32 2 LAST 4Q 0 300 0 100 0 100 0 100 109,600 11 0 900 0 300 0 300 0 300 328,800 128 2 LAST 4Q 0 300 0 100 0 100 0 100 109,600 42 0 1,199 0 399 0 399 0 399 437,400 78 2 LAST 4Q 0 8,459 0 2,160 0 2,156 0 1,993 2,529,524 51 0 32,511 1 14,230 5 10,967 0 7,836 11,056,172 78 * The Device-Hours computation includes additional read-outs not detailed in the report. RELIABILITY MONITOR -- ATMEL PROPRIETARY 4 Data Retention Bake (sorted by FAMILY) BU QTR 168 Hours 500 Hours 1K Hours REJ SS REJ SS REJ SS Device-Hours AF FITS ASIC 2 LAST 4Q 0 0 308 693 0 0 308 693 0 0 231 616 269,500 654,500 117 117 29 12 MEMORY 2 0 231 0 231 0 231 231,000 34 LAST 4Q 0 1,348 0 1,348 0 1,348 1,348,000 117 117 MCU 2 LAST 4Q 0 0 920 2,180 0 0 920 2,103 0 0 919 1,660 919,500 1,894,436 117 117 9 4 ATMEL 2 LAST 4Q 0 0 1,459 4,221 0 0 1,459 4,144 0 0 1,381 3,624 1,420,000 3,896,936 117 117 6 2 RELIABILITY MONITOR -- ATMEL PROPRIETARY 6 5 Data Retention Bake (sorted by TECHNOLOGY) TECH QTR 168 Hours 500 Hours 1K Hours REJ SS REJ SS REJ SS Device-Hours AF FITS Z92 2 LAST 4Q 0 0 154 231 0 0 154 231 0 0 77 77 115,500 154,000 117 117 68 51 63 K 2 LAST 4Q 0 0 154 542 0 0 154 542 0 0 154 542 154,000 542,000 117 117 51 14 56K 2 LAST 4Q 0 0 77 231 0 0 77 231 0 0 77 231 77,000 231,000 117 117 102 34 35K 2 LAST 4Q 0 0 920 2,398 0 0 920 2,321 0 0 919 2,032 919,500 2,189,436 117 117 9 4 34K 2 LAST 4Q 0 0 77 234 0 0 77 234 0 0 77 234 77,000 234,000 117 117 102 33 19K 2 LAST 4Q 0 0 77 311 0 0 77 311 0 0 77 311 77,000 311,000 117 117 102 25 58K 2 LAST 4Q 0 274 0 274 0 197 235,500 117 33 2 LAST 4Q 0 0 1,459 4,221 0 0 1,459 4,144 0 0 1,381 3,624 1,420,000 3,896,936 117 117 6 2 ATMEL RELIABILITY MONITOR -- ATMEL PROPRIETARY 6 Temperature Cycle PACKAGE QTR 100 Cycles 200 Cycles 500 Cycles 1K Cycles % Defective REJ SS REJ SS REJ SS REJ SS 2 LAST 4Q 0 77 0 77 0 77 0 70 0.00% 2 LAST 4Q 0 77 0 77 0 77 0 77 0.00% MLF / QFN 2 LAST 4Q 0 0 154 785 0 0 154 785 0 0 154 785 0 0 154 378 0.00% 0.00% QFP 2 LAST 4Q 0 308 0 308 0 308 0 221 0.00% PDIP 2 LAST 4Q 0 0 77 307 0 0 77 307 0 0 77 307 0 0 77 307 0.00% 0.00% PLCC 2 LAST 4Q 0 0 77 307 0 0 77 307 0 0 77 307 0 0 77 307 0.00% 0.00% SOIC 2 LAST 4Q 0 0 385 1,088 0 0 385 1,088 0 0 385 1,088 0 0 385 837 0.00% 0.00% SOT-23 2 LAST 4Q 0 0 77 77 0 0 77 77 0 0 77 77 0 0 77 77 0.00% 0.00% TQFP 2 LAST 4Q 0 0 308 384 0 0 308 384 0 0 308 384 0 0 298 298 0.00% 0.00% TSOP / VSOP 2 LAST 4Q 0 0 77 230 0 0 77 230 0 0 77 230 0 0 77 230 0.00% 0.00% TSSOP 2 LAST 4Q 0 0 231 477 0 0 231 477 0 0 231 477 0 0 231 231 0.00% 0.00% ATMEL 2 LAST 4Q 0 0 1,386 4,117 0 0 1,386 4,117 0 0 1,386 4,117 0 0 1,376 3,033 0.00% 0.00% CBGA LGA RELIABILITY MONITOR -- ATMEL PROPRIETARY 7 Temperature Humidity Bias / HAST Temperature Humidity Bias HAST PACKAGE QTR 168 Hours 500 Hours 1K Hours 100 Hours Device-Hours* % Defective REJ SS REJ SS REJ SS REJ SS CBGA 2 LAST 4Q 0 77 0 77 0 77 0 0 77,000 0.00% MLF / QFN 2 LAST 4Q 0 0 154 708 0 0 154 708 0 0 148 471 0 0 0 54 151,000 697,500 0.00% 0.00% QFP 2 LAST 4Q 0 308 0 308 0 231 0 0 269,500 0.00% SOIC 2 LAST 4Q 0 0 308 708 0 0 308 708 0 0 308 631 0 0 77 385 462,000 1,439,500 0.00% 0.00% TQFP 2 LAST 4Q 0 0 307 383 0 0 307 383 0 0 307 307 0 0 0 0 307,000 345,000 0.00% 0.00% TSSOP 2 LAST 4Q 0 0 231 477 0 0 231 477 0 0 231 477 0 0 0 0 231,000 477,000 0.00% 0.00% ATMEL 2 LAST 4Q 0 0 1,000 2,661 0 0 1,000 2,661 0 0 994 2,194 0 0 385 1,440 1,767,000 5,307,500 0.00% 0.00% RELIABILITY MONITOR -- ATMEL PROPRIETARY 8 Steam Pressure Pot PACKAGE QTR 96 Hours 168 Hours 240 Hours % Defective REJ SS REJ SS REJ SS 2 LAST 4Q 0 77 0 0 0 0 0.0% 2 LAST 4Q 0 77 0 77 0 77 0.0% MLF / QFN 2 LAST 4Q 0 0 151 382 0 0 0 77 0 0 0 77 0.0% 0.0% QFP 2 LAST 4Q 0 214 0 0 0 0 0.0% PDIP 2 LAST 4Q 0 0 77 308 0 0 77 308 0 0 77 308 0.0% 0.0% PLCC 2 LAST 4Q 0 0 77 308 0 0 77 308 0 0 77 308 0.0% 0.0% SOIC 2 LAST 4Q 0 0 385 1,093 0 0 77 385 0 0 77 385 0.0% 0.0% SOT-23 2 LAST 4Q 0 0 77 77 0 0 77 77 0 0 77 77 0.0% 0.0% TQFP 2 LAST 4Q 0 0 306 382 0 0 0 0 0 0 0 0 0.0% 0.0% TSOP / VSOP 2 LAST 4Q 0 0 77 231 0 0 77 231 0 0 77 231 0.0% 0.0% TSSOP 2 LAST 4Q 0 0 231 477 0 0 0 0 0 0 0 0 0.0% 0.0% ATMEL 2 LAST 4Q 0 0 1,381 3,626 0 0 385 1,463 0 0 385 1,463 0.00% 0.00% CBGA LGA RELIABILITY MONITOR -- ATMEL PROPRIETARY 9 Technology List FAB TECH TYPE CMOS / BIP LITHOGRAPHY [µm] TYPICAL PRODUCTS / APPLICATIONS 5 15.3 EEPROM 1.8 - 2.3 sEEPROM 5 19.3 EEPROM 1.1 sEEPROM 5 19.5 Embedded Memory Configurator 1.0 Configurator 5 19.6 Embedded Memory 0.7 EEPROM, MC (Intel core), MC (AVR core) PLD 5 19.7 EPLD 0.5 5 19.76 EPLD 0.5 PLD 5 19.8 CMOS 0.7 ASIC 5 19.8 Embedded Memory Configurator 0.7 5 19.9 Embedded Memory 0.7 sEEPROM, PEROM, EEPROM, Configurator Smartcard, AVR, µC 5 25 BiCMOS 1.0 ASIC 5 26 Logic 0.7 ASIC 5 33.5 FLASH 0.5 EPROM 0.5 5 34 NTO 35 5 35.5 Embedded Memory Configurator 0.35 EEPROM, FLASH, MICRO, EPLD 5 37 EEPROM 0.35 FLASH, PEROM, DATA FLASH, sEEPROM 5 39 EEPROM 0.25 DATA FLASH 5 39.1 EEPROM 0.25 FLASH, DATA FLASH BiCMOS 0.6 5 42 GFO / CSO 43 HNO 46 5 55 Logic 5 55.8 5 56 5 EPROM ASIC ASIC, TX RF RFA 0.5 ASIC CMOS 0.5 ASIC Logic 0.35 ASIC 56.8 Embedded Memory 0.35 ASIC 7 57.0 CMOS 0.25 ASIC 7 57.5 CMOS 0.21 ASIC / RFA 7 58.0 CMOS 0.18 ASIC / RFA SJO 61 CMOS 0.18 FLASH SJO 63 HNO 75 RFA HNO 6UH6+BICMOS RFA HNO BCDMOS HNO BICMOS HNO BICMOS2 GFO HCCD1 NMOS 2.5 6BD1 0.8 ASIC / RFA ASIC / RFA RFA CCD GFO HCCD3 NMOS 1.5 CCD HNO I²L 6IL4 2 ASIC HNO SCMOS3 HNO SIGE2 6SG1 0.8 RFA HNO UHF 6UH6 0.5 ASIC / RFA HNO UNI3 NTO Z86 CMOS Digital 0.8 SRAM,MICRO, VAN DLC RFA RFA NTO Z91 CMOS Digital 0.6 SRAM, ASIC, MICRO NTO Z92 CMOS Digital 0.5 ASIC, MICRO,VAN DLC CMOS + EPROM 0.5 OTP MICRO NTO Z94 HNO Z95 RFA HNO Z96 RFA RELIABILITY MONITOR -- ATMEL PROPRIETARY 10 Failure Rate Calculations Failure Rate: χ2 λ = where, λ χ2 α n AF DH = = = = = = (1 − α 100 , 2⋅n + 2 ) ⋅ 109 2 ⋅ AF ⋅ DH Failure Rate (FITS) Failure Estimate Confidence Level (60% or 90%) Number of Failures Overall Acceleration Factor (TAF x VAF) Device Hours Thermal Acceleration: TAF where, TAF EA k T f s P θJA = = = = = = = = = e ea 1 1 ⋅ − k Tf + ( Pf ⋅θ JAf ) Ts + ( Ps ⋅θ JAs ) Thermal Acceleration Factor Activation Energy (eV) Boltzman’s Constant (8.617 x 10-5 eV/°K) Temperature (°K) Field Conditions Stress Conditions Power Dissipation (W) Thermal Resistance Coefficient - Junction to Ambient (°C/W) Voltage Acceleration: VAF where, VAF Vs Vn Z = = = = = eZ ⋅ [ VS − Vn ] Voltage Acceleration Factor Stress Voltage (V) Nominal Voltage (V) Voltage Acceleration Constant (typically, 0.5 < Z < 1.0) RELIABILITY MONITOR -- ATMEL PROPRIETARY 11 Definitions Data Retention Bake (DRB): This test is used to measure a device’s ability to retain a charge for extended periods of time without applying voltage bias. Stressing at high temperatures (150°C for plastic packages) accelerates any discharge causing the memory state to change. Failures In Time (FITS): This is the unit measure for expressing failure rates and is identical to the expression PPM/K hours. For example, three failures out of a million components tested for one thousand hours equates to 3 FITS. High Temperature Operating Life (HTOL): The purpose of this test is to accelerate thermally activated failure mechanisms through the use of high temperatures (typically between 125°C and 150°C), increased voltage, and dynamic bias conditions. Readouts at various time points are taken to determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR is expressed in defective parts per million (DPPM) and IFR is expressed in Failures in Time (FITS at 55°C). Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a plastic packaged component’s ability to withstand harsh environmental conditions with extreme temperature and humidity levels. The parts are stressed to high temperature (130°C) and relative humidity (85%RH) conditions in a biased state to achieve maximum acceleration. Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged component’s ability to withstand severe conditions of pressure (15 psig), temperature (121°C), and humidity (100%RH). Temperature Cycle (TC): This test is used to measure a product’s sensitivity to thermal stresses due to differences in expansion and contraction characteristics of the die and mold compound by repeated alternating temperature dwells between high and low temperature extremes. Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is identical to HAST. The only difference is that HAST accelerates THB by a factor of 20:1 due to the increase in temperature during test. RELIABILITY MONITOR -- ATMEL PROPRIETARY 12