Reliability Monitor Report High Temperature Operating Life Data Retention Bake Temperature Cycle Temperature & Humidity Bias/ HAST Steam Pressure Pot Second QUARTER 2009 ATMEL PROPRIETARY Table of Contents 1. Executive Summary 1 2. HTOL (sorted by product BU) 2 3. HTOL (sorted by technology) 3-4 4. Data Retention Bake (sorted by product BU) 5 5. Data Retention Bake (sorted by technology) 6 6. Temperature Cycle 7 7. Temperature Humidity Bias & HAST 8 8. Steam Pressure Pot 9 9. Technology List 10 10. Failure Rate Calculations 11 11. Definitions 12 RELIABILITY MONITOR -- ATMEL PROPRIETARY Reliability Monitor Report Date: Nov 19, 2009 Executive Summary The intent of the Reliability Monitor Program is to measure the reliability of previously qualified devices on a quarterly basis. This is achieved by selecting representative devices within a process, package or business unit and performing a series of reliability tests to ensure that the reliability has maintained over time. Listed below are the overall results for the last quarter. 1. High Temperature Operating Life (125° - 150°C; 0 failures) Failure Rate: 8 FITS (1,954K device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Also, Thermal and Voltage Acceleration are used to compute the overall acceleration factor. Weighted acceleration factors (WAF) for a group of products are calculated by taking the weighted average of each device’s acceleration factor multiplied by its corresponding device hours. All failures were inconclusive. 2. Data Retention Bake (150°C; 0 failures) Failure Rate: 15 FITS (534K device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Since there is no bias applied during testing and the stress temperature is fixed for all devices at 150°C, the acceleration factor is 117 for all groupings. 3. Temperature Cycle (-65°C to 150°C, 500 cycles) * Failure Rate: 0.00% (0 failures out of 461 units) 4. Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) * Failure Rate: 0.00% (0 failures out of 762K device-hours) Note: A 20:1 Acceleration Factor is used to combine HAST results with THB). 5. Steam Pressure Pot (121°C/100%RH) * Failure Rate: 0.00% (0 failures out of 461 units) RELIABILITY MONITOR -- ATMEL PROPRIETARY * indicates that preconditioning is performed prior to the stress test. 1 High Temperature Operating Life (sorted by FAMILY) BU QTR 48 Hours 168 Hours 500 Hours 1K Hours REJ SS REJ SS REJ SS REJ SS Device-Hours* WAF EFR PPM FITS APG 1 LAST 4Q 0 0 162 2,058 0 0 162 2,058 0 0 162 847 0 0 162 847 162,000 1,050,448 35 39 0 0 160 23 ASIC 1 LAST 4Q 0 0 1,472 9,425 0 2 1,272 8,624 0 5 964 6,767 0 0 326 1,265 706,344 4,366,424 73 87 0 0 18 22 MEMORY 1 LAST 4Q 0 0 1,086 5,384 0 0 480 3,359 0 0 480 1,759 0 0 480 1,759 509,088 2,125,000 92 87 0 0 20 5 MCU 1 LAST 4Q 0 0 1,698 13,087 0 0 356 1,321 0 0 356 1,169 0 0 48 706 266,416 1,527,804 3 15 0 0 984 39 RFA 1 LAST 4Q 0 0 311 3,480 0 0 311 3,480 0 0 311 3,480 0 0 311 3,010 311,000 3,398,000 32 151 0 0 92 2 ATMEL 1 LAST 4Q 0 0 4,729 33,434 0 2 2,581 18,842 0 5 2,273 14,022 0 0 1,327 7,587 1,954,848 12,467,676 59 92 0 0 8 7 RELIABILITY MONITOR -- ATMEL PROPRIETARY 2 High Temperature Operating Life (sorted by TECHNOLOGY) TECH Z92 UHF SMD SCMOS2 SCMOS3 BCDMOS BICMOS2 BICMOS UHF5 75K 63K 58.8K 58K 57.5K 57K 56.9K 56.8K QTR 48 Hours 168 Hours 500 Hours 1K Hours Device-Hours* WAF EFR PPM FITS 0 38,500 3 0 8,192 0 154 154,000 3 0 895 933,500 79 0 0 2,092 12 77 0 0 38,500 21 0 1,132 0 135 0 45 90,000 4 0 2,652 199 0 199 0 154 176,500 103 0 51 0 80 0 80 0 80 80,000 6 0 237 0 237 0 237 237,000 119 0 0 1,937 33 160 0 160 0 160 0 160 160,000 117 0 49 0 153 0 153 0 153 0 153 230,000 206 0 19 0 80 0 80 0 80 0 80 80,000 117 0 98 1 LAST 4Q 0 77 0 77 0 77 0 77 77,000 117 0 1,177 0 1,177 0 1,177 0 1,177 1,253,000 229 0 0 102 3 1 LAST 4Q 0 586 0 180 0 180 0 180 199,488 84 0 1,786 0 560 0 560 0 560 618,848 84 0 0 55 18 1 LAST 4Q 0 462 0 462 0 462 0 0 231,000 117 0 2,309 0 2,309 1 1,842 0 0 999,456 117 0 0 34 17 1 LAST 4Q 0 534 0 48 0 48 0 48 71,328 4 0 3,237 0 469 0 394 0 229 456,964 13 0 0 3,216 153 1 LAST 4Q 0 231 0 231 0 0 0 0 38,808 117 0 1,461 1 1,460 2 844 0 0 525,536 117 0 0 202 68 1 LAST 4Q 0 100 0 100 0 100 0 100 100,000 23 0 562 0 562 0 562 0 517 539,500 17 0 0 403 101 1 LAST 4Q 0 80 0 80 0 80 0 80 80,000 48 0 930 0 930 0 360 0 360 455,760 48 0 0 237 42 1 LAST 4Q 0 231 0 231 0 154 0 0 89,936 117 0 3,083 1 2,698 0 2,080 0 82 1,203,304 111 0 0 87 15 REJ SS REJ SS REJ SS REJ SS 0 77 0 77 0 77 0 0 154 0 154 0 154 0 972 0 972 0 972 1 LAST 4Q 0 77 0 77 0 1 LAST 4Q 0 135 0 135 1 LAST 4Q 0 199 0 0 80 0 237 1 LAST 4Q 0 1 LAST 4Q 1 LAST 4Q 1 LAST 4Q 1 LAST 4Q 1 LAST 4Q RELIABILITY MONITOR -- ATMEL PROPRIETARY 3 High Temperature Operating Life (sorted by TECHNOLOGY) TECH 56K 55K 46K 44K 35K 34K 19K ATMEL QTR 1 LAST 4Q 1 LAST 4Q 1 LAST 4Q 1 LAST 4Q 48 Hours 168 Hours 500 Hours 1K Hours Device-Hours* WAF EFR PPM FITS 126 137,000 17 0 226 237,000 20 0 0 385 197 845 0 0 448,708 117 0 59 0 82 0 82 82,000 23 0 328 0 328 396,880 23 0 0 492 102 308 0 77 0 77 115,808 48 0 163 0 0 89 10 0 0 45 15 0 0 201 27 0 0 8 7 REJ SS REJ SS REJ SS REJ SS 0 148 0 148 0 148 0 0 248 0 248 0 248 0 1,001 0 1,001 2 0 82 0 82 0 738 0 738 0 308 0 1 LAST 4Q 0 1,364 0 508 0 508 0 200 395,088 26 0 12,406 0 3,593 0 1,916 0 1,608 2,466,760 37 1 LAST 4Q 0 300 0 100 0 100 0 100 109,600 187 0 899 0 300 0 300 0 300 328,752 187 1 LAST 4Q 0 300 0 100 0 100 0 100 109,600 42 0 1,199 0 399 0 399 0 399 437,400 78 1 LAST 4Q 0 4,729 0 2,581 0 2,273 0 1,327 1,954,848 59 0 33,434 2 18,842 5 14,022 0 7,587 12,467,676 92 * The Device-Hours computation includes additional read-outs not detailed in the report. RELIABILITY MONITOR -- ATMEL PROPRIETARY 4 Data Retention Bake (sorted by FAMILY) BU ASIC QTR 168 Hours 1 LAST 4Q REJ 0 0 500 Hours SS 77 531 REJ 0 0 1K Hours SS 77 531 REJ 0 0 SS 77 531 Device-Hours AF FITS 77,000 531,000 117 117 102 15 1 0 231 0 231 0 231 231,000 0 1,348 0 1,348 0 1,348 1,348,000 117 117 34 LAST 4Q MCU 1 LAST 4Q 0 0 303 1,713 0 0 303 1,636 0 0 149 1,049 226,000 1,355,436 117 117 35 6 ATMEL 1 LAST 4Q 0 0 611 3,592 0 0 611 3,515 0 0 457 2,928 534,000 3,234,436 117 117 15 2 MEMORY RELIABILITY MONITOR -- ATMEL PROPRIETARY 6 5 Data Retention Bake (sorted by TECHNOLOGY) TECH QTR 168 Hours 500 Hours 1K Hours Device-Hours AF FITS REJ SS REJ SS REJ SS 1 LAST 4Q 0 77 0 77 0 0 38,500 117 203 63 K 1 LAST 4Q 0 0 154 542 0 0 154 542 0 0 154 542 154,000 542,000 117 117 51 14 56K 1 LAST 4Q 0 223 0 223 0 223 223,000 117 35 35K 1 LAST 4Q 0 0 254 1,856 0 0 254 1,779 0 0 100 1,421 177,000 1,612,936 117 117 44 5 34K 1 LAST 4Q 0 0 77 234 0 0 77 234 0 0 77 234 77,000 234,000 117 117 102 33 19K 1 LAST 4Q 0 0 77 311 0 0 77 311 0 0 77 311 77,000 311,000 117 117 102 25 58K 1 LAST 4Q 0 0 49 349 0 0 49 349 0 0 49 197 49,000 273,000 117 117 160 29 ATMEL 1 LAST 4Q 0 0 611 3,592 0 0 611 3,515 0 0 457 2,928 534,000 3,234,436 117 117 15 2 Z92 RELIABILITY MONITOR -- ATMEL PROPRIETARY 6 Temperature Cycle PACKAGE QTR 100 Cycles 200 Cycles 500 Cycles 1K Cycles % Defective REJ SS REJ SS REJ SS REJ SS 1 LAST 4Q 0 77 0 77 0 77 0 70 0.00% 1 LAST 4Q 0 77 0 77 0 77 0 77 0.00% 1 LAST 4Q 0 77 0 77 0 77 0 77 0.00% MLF / QFN 1 LAST 4Q 0 0 77 862 0 0 77 862 0 0 77 862 0 0 77 440 0.00% 0.00% QFP 1 LAST 4Q 0 616 0 616 0 616 0 447 0.00% PDIP 1 LAST 4Q 0 0 154 384 0 0 154 384 0 0 154 384 0 0 154 384 0.00% 0.00% PLCC 1 LAST 4Q 0 230 0 230 0 230 0 230 0.00% SOIC 1 LAST 4Q 0 0 77 780 0 0 77 780 0 0 77 780 0 0 77 529 0.00% 0.00% TQFP 1 LAST 4Q 0 0 76 76 0 0 76 76 0 0 76 76 0 0 0 0 0.00% 0.00% TSOP / VSOP 1 LAST 4Q 0 0 77 153 0 0 77 153 0 0 77 153 0 0 77 153 0.00% 0.00% TSSOP 1 LAST 4Q 0 246 0 246 0 246 0 0 0.00% 1 LAST 4Q 0 0 461 3,578 0 0 461 3,578 0 0 461 3,578 0 0 385 2,407 0.00% 0.00% CBGA BGA LGA ATMEL RELIABILITY MONITOR -- ATMEL PROPRIETARY 7 Temperature Humidity Bias / HAST Temperature Humidity Bias HAST PACKAGE QTR CBGA 1 LAST 4Q 0 77 0 77 0 77 0 0 77,000 0.00% MLF / QFN 1 LAST 4Q 0 0 0 785 0 0 0 785 0 0 0 554 0 0 54 54 108,000 777,500 0.00% 0.00% QFP 1 LAST 4Q 0 539 0 539 0 385 0 77 616,000 0.00% SOIC 1 LAST 4Q 0 0 0 400 0 0 0 400 0 0 0 323 0 0 77 385 154,000 1,131,500 0.00% 0.00% TQFP 1 LAST 4Q 0 0 76 76 0 0 76 76 0 0 0 0 0 0 0 0 38,000 38,000 0.00% 0.00% TSSOP 1 LAST 4Q 0 246 0 246 0 246 0 0 246,000 0.00% 1 LAST 4Q 0 0 76 2,123 0 0 76 2,123 0 0 0 1,585 0 0 362 1,363 762,000 4,580,000 0.00% 0.00% ATMEL 168 Hours 500 Hours 1K Hours 100 Hours Device-Hours* % Defective REJ SS REJ SS REJ SS REJ SS RELIABILITY MONITOR -- ATMEL PROPRIETARY 8 Steam Pressure Pot PACKAGE QTR 96 Hours 168 Hours 240 Hours % Defective REJ SS REJ SS REJ SS 1 LAST 4Q 0 77 0 0 0 0 0.0% 1 LAST 4Q 0 77 0 77 0 77 0.0% 1 LAST 4Q 0 77 0 77 0 77 0.0% MLF / QFN 1 LAST 4Q 0 0 77 462 0 0 77 77 0 0 77 77 0.0% 0.0% QFP 1 LAST 4Q 0 513 0 77 0 77 0.0% PDIP 1 LAST 4Q 0 0 154 385 0 0 154 385 0 0 154 385 0.0% 0.0% PLCC 1 LAST 4Q 0 231 0 231 0 231 0.0% SOIC 1 LAST 4Q 0 0 77 785 0 0 77 385 0 0 77 385 0.0% 0.0% TQFP 1 LAST 4Q 0 0 76 76 0 0 0 0 0 0 0 0 0.0% 0.0% CBGA BGA LGA TSOP / VSOP TSSOP ATMEL 1 0 77 0 77 0 77 0.0% LAST 4Q 0 154 0 154 0 154 0.0% 1 LAST 4Q 0 246 0 0 0 0 0.0% 1 LAST 4Q 0 0 461 3,083 0 0 385 1,463 0 0 385 1,463 0.00% 0.00% RELIABILITY MONITOR -- ATMEL PROPRIETARY 9 Technology List FAB TECH TYPE CMOS / BIP LITHOGRAPHY [µm] TYPICAL PRODUCTS / APPLICATIONS 5 15.3 EEPROM 1.8 - 2.3 sEEPROM 5 19.3 EEPROM 1.1 sEEPROM 5 19.5 Embedded Memory Configurator 1.0 Configurator 5 19.6 Embedded Memory 0.7 EEPROM, MC (Intel core), MC (AVR core) PLD 5 19.7 EPLD 0.5 5 19.76 EPLD 0.5 PLD 5 19.8 CMOS 0.7 ASIC 5 19.8 Embedded Memory Configurator 0.7 5 19.9 Embedded Memory 0.7 sEEPROM, PEROM, EEPROM, Configurator Smartcard, AVR, µC 5 25 BiCMOS 1.0 ASIC 5 26 Logic 0.7 ASIC 5 33.5 FLASH 0.5 EPROM 0.5 5 34 NTO 35 5 35.5 Embedded Memory Configurator 0.35 EEPROM, FLASH, MICRO, EPLD 5 37 EEPROM 0.35 FLASH, PEROM, DATA FLASH, sEEPROM 5 39 EEPROM 0.25 DATA FLASH 5 39.1 EEPROM 0.25 FLASH, DATA FLASH BiCMOS 0.6 5 42 GFO / CSO 43 HNO 46 5 55 Logic 5 55.8 5 56 5 EPROM ASIC ASIC, TX RF RFA 0.5 ASIC CMOS 0.5 ASIC Logic 0.35 ASIC 56.8 Embedded Memory 0.35 ASIC 7 57.0 CMOS 0.25 ASIC 7 57.5 CMOS 0.21 ASIC / RFA 7 58.0 CMOS 0.18 ASIC / RFA SJO 61 CMOS 0.18 FLASH SJO 63 HNO 75 RFA HNO 6UH6+BICMOS RFA HNO BCDMOS HNO BICMOS HNO BICMOS2 GFO HCCD1 NMOS 2.5 6BD1 0.8 ASIC / RFA ASIC / RFA RFA CCD GFO HCCD3 NMOS 1.5 CCD HNO I²L 6IL4 2 ASIC HNO SCMOS3 HNO SIGE2 6SG1 0.8 RFA HNO UHF 6UH6 0.5 ASIC / RFA HNO UNI3 NTO Z86 CMOS Digital 0.8 SRAM,MICRO, VAN DLC RFA RFA NTO Z91 CMOS Digital 0.6 SRAM, ASIC, MICRO NTO Z92 CMOS Digital 0.5 ASIC, MICRO,VAN DLC CMOS + EPROM 0.5 OTP MICRO NTO Z94 HNO Z95 RFA HNO Z96 RFA RELIABILITY MONITOR -- ATMEL PROPRIETARY 10 Failure Rate Calculations Failure Rate: χ2 λ = where, λ χ2 α n AF DH = = = = = = (1 − α 100 , 2⋅n + 2 ) ⋅ 109 2 ⋅ AF ⋅ DH Failure Rate (FITS) Failure Estimate Confidence Level (60% or 90%) Number of Failures Overall Acceleration Factor (TAF x VAF) Device Hours Thermal Acceleration: TAF where, TAF EA k T f s P θJA = = = = = = = = = e ea 1 1 ⋅ − k Tf + ( Pf ⋅θ JAf ) Ts + ( Ps ⋅θ JAs ) Thermal Acceleration Factor Activation Energy (eV) Boltzman’s Constant (8.617 x 10-5 eV/°K) Temperature (°K) Field Conditions Stress Conditions Power Dissipation (W) Thermal Resistance Coefficient - Junction to Ambient (°C/W) Voltage Acceleration: VAF where, VAF Vs Vn Z = = = = = eZ ⋅ [ VS − Vn ] Voltage Acceleration Factor Stress Voltage (V) Nominal Voltage (V) Voltage Acceleration Constant (typically, 0.5 < Z < 1.0) RELIABILITY MONITOR -- ATMEL PROPRIETARY 11 Definitions Data Retention Bake (DRB): This test is used to measure a device’s ability to retain a charge for extended periods of time without applying voltage bias. Stressing at high temperatures (150°C for plastic packages) accelerates any discharge causing the memory state to change. Failures In Time (FITS): This is the unit measure for expressing failure rates and is identical to the expression PPM/K hours. For example, three failures out of a million components tested for one thousand hours equates to 3 FITS. High Temperature Operating Life (HTOL): The purpose of this test is to accelerate thermally activated failure mechanisms through the use of high temperatures (typically between 125°C and 150°C), increased voltage, and dynamic bias conditions. Readouts at various time points are taken to determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR is expressed in defective parts per million (DPPM) and IFR is expressed in Failures in Time (FITS at 55°C). Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a plastic packaged component’s ability to withstand harsh environmental conditions with extreme temperature and humidity levels. The parts are stressed to high temperature (130°C) and relative humidity (85%RH) conditions in a biased state to achieve maximum acceleration. Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged component’s ability to withstand severe conditions of pressure (15 psig), temperature (121°C), and humidity (100%RH). Temperature Cycle (TC): This test is used to measure a product’s sensitivity to thermal stresses due to differences in expansion and contraction characteristics of the die and mold compound by repeated alternating temperature dwells between high and low temperature extremes. Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is identical to HAST. The only difference is that HAST accelerates THB by a factor of 20:1 due to the increase in temperature during test. RELIABILITY MONITOR -- ATMEL PROPRIETARY 12