Data Sheet

Freescale Semiconductor
Technical Data
Document Number: AFT09MP055N
Rev. 0, 7/2013
RF Power LDMOS Transistors
AFT09MP055NR1
AFT09MP055GNR1
High Ruggedness N--Channel
Enhancement--Mode Lateral MOSFETs
Designed for mobile two--way radio applications with frequencies from
764 to 941 MHz. The high gain, ruggedness and broadband performance of
these devices make them ideal for large--signal, common source amplifier
applications in mobile radio equipment.
Narrowband Performance
(In Freescale Test Circuit: 12.5 Vdc, IDQ(A+B) = 550 mA, TA = 25°C, CW)
Frequency
(MHz)
Gps
(dB)
ηD
(%)
Pout
(W)
870
17.5
69.0
57
764--941 MHz, 55 W, 12.5 V
BROADBAND
RF POWER LDMOS TRANSISTORS
800 MHz Broadband Performance
(In Freescale Reference Circuit: 12.5 Vdc, IDQ(A+B) = 800 mA, Pin = 1.5 W, TA = 25°C, CW)
Frequency
(MHz)
Gps
(dB)
ηD
(%)
Pout
(W)
764
16.1
56.0
61
816
15.8
58.0
57
870
15.7
61.0
56
TO--270WB--4
AFT09MP055NR1
Load Mismatch/Ruggedness
Frequency
(MHz)
Signal
Type
870 (1)
CW
VSWR
Pin
(W)
Test
Voltage
>65:1 at all
Phase Angles
3
(3 dB Overdrive)
17
TO--270WB--4 GULL
AFT09MP055GNR1
Result
No Device
Degradation
1. Measured in 764--870 MHz broadband test circuit.
Features
• Characterized for Operation from 764 to 941 MHz
• Integrated Input Matching Improves Broadband Performance
• Integrated ESD Protection
• Broadband — Full Power Across the Band (764--870 MHz)
• 225°C Capable Plastic Package
• Exceptional Thermal Performance
• Extreme Ruggedness
• High Linearity for: TETRA, SSB
• Cost--effective Over--molded Plastic Packaging
• In Tape and Reel. R1 Suffix = 500 Units, 44 mm Tape Width, 13--inch Reel.
Gate A
Drain A
Gate B
Drain B
(Top View)
Note: Exposed backside of the package is
the source terminal for the transistor.
Figure 1. Pin Connections
Typical Applications
• Output Stage 800 MHz Band Mobile Radio
• Output Stage 700 MHz Band Mobile Radio
This document contains information on a preproduction product. Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2013. All rights reserved.
RF Device Data
Freescale Semiconductor, Inc.
AFT09MP055NR1 AFT09MP055GNR1
1
Table 1. Maximum Ratings
Rating
Symbol
Value
Unit
Drain--Source Voltage
VDSS
--0.5, +40
Vdc
Gate--Source Voltage
VGS
--6.0, +12
Vdc
Operating Voltage
VDD
19, +0
Vdc
Storage Temperature Range
Tstg
--65 to +150
°C
TC
--40 to +150
°C
TJ
--40 to +225
°C
PD
625
3.13
W
W/°C
Symbol
Value (2,3)
Unit
RθJC
0.32
°C/W
Case Operating Temperature Range
Operating Junction Temperature Range
(1,2)
Total Device Dissipation @ TC = 25°C
Derate above 25°C
Table 2. Thermal Characteristics
Characteristic
Thermal Resistance, Junction to Case
Case Temperature 78°C, 55 W CW, 12.5 Vdc, IDQ(A+B) = 550 mA, 870 MHz
Table 3. ESD Protection Characteristics
Test Methodology
Class
Human Body Model (per JESD22--A114)
2, passes 2500 V
Machine Model (per EIA/JESD22--A115)
A, passes 150 V
Charge Device Model (per JESD22--C101)
IV, passes 2000 V
Table 4. Moisture Sensitivity Level
Test Methodology
Per JESD22--A113, IPC/JEDEC J--STD--020
Rating
Package Peak Temperature
Unit
3
260
°C
Table 5. Electrical Characteristics (TA = 25°C unless otherwise noted)
Symbol
Min
Typ
Max
Unit
Zero Gate Voltage Drain Leakage Current
(VDS = 40 Vdc, VGS = 0 Vdc)
IDSS
—
—
3
μAdc
Zero Gate Voltage Drain Leakage Current
(VDS = 12.5 Vdc, VGS = 0 Vdc)
IDSS
—
—
2
μAdc
Gate--Source Leakage Current
(VGS = 5 Vdc, VDS = 0 Vdc)
IGSS
—
—
1
μAdc
Gate Threshold Voltage
(VDS = 10 Vdc, ID = 270 μAdc)
VGS(th)
1.6
2.1
2.6
Vdc
Drain--Source On--Voltage
(VGS = 10 Vdc, ID = 2.85 Adc)
VDS(on)
—
0.14
—
Vdc
Forward Transconductance (4)
(VGS = 10 Vdc, ID = 7.5 Adc)
gfs
—
7
—
S
Characteristic
Off Characteristics
On Characteristics
1. Continuous use at maximum temperature will affect MTTF.
2. MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access MTTF
calculators by product.
3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.
Select Documentation/Application Notes -- AN1955.
4. Each side of device measured separately.
(continued)
AFT09MP055NR1 AFT09MP055GNR1
2
RF Device Data
Freescale Semiconductor, Inc.
Table 5. Electrical Characteristics (TA = 25°C unless otherwise noted) (continued)
Characteristic
Symbol
Min
Typ
Max
Unit
Reverse Transfer Capacitance
(VDS = 12.5 Vdc ± 30 mV(rms)ac @ 1 MHz, VGS = 0 Vdc)
Crss
—
1.9
—
pF
Output Capacitance
(VDS = 12.5 Vdc ± 30 mV(rms)ac @ 1 MHz, VGS = 0 Vdc)
Coss
—
61
—
pF
Input Capacitance
(VDS = 12.5 Vdc, VGS = 0 Vdc ± 30 mV(rms)ac @ 1 MHz)
Ciss (2)
—
690
—
pF
Dynamic Characteristics (1)
Functional Tests (3) (In Freescale Narrowband Test Fixture, 50 ohm system) VDD = 12.5 Vdc, IDQ(A+B) = 550 mA, Pin = 1 W, f = 870 MHz
Common--Source Amplifier Output Power
Drain Efficiency
Pout
—
57
—
W
ηD
—
69.0
—
%
1. Each side of device measured separately.
2. Value includes input matching network.
3. Measurement made with device in straight lead configuration before any lead forming operation is applied. Lead forming is used for gull
wing (GN) parts.
AFT09MP055NR1 AFT09MP055GNR1
RF Device Data
Freescale Semiconductor, Inc.
3
TYPICAL CHARACTERISTICS
10
1000
IDS, DRAIN CURRENT (AMPS)
C, CAPACITANCE (pF)
100
Coss
Measured with ±30 mV (rms ) ac
@ 1 MHz, VGS = 0 Vdc
10
TA = 25°C
9
Ciss
Crss
VGS = 3.75 Vdc
8
7
3.5 Vdc
6
5
4
3.25 Vdc
3
2
3 Vdc
1
2.5 Vdc
0
1
0
5
15
10
0
20
2
4
6
8
10
12
14
16
18
20
VDS, DRAIN--SOURCE VOLTAGE (VOLTS)
VDS, DRAIN--SOURCE VOLTAGE (VOLTS)
Note: Each side of device measured separately.
Ciss value includes input matching network.
Note: Measured with both sides of the transistor
tied together.
Figure 2. Capacitance versus Drain--Source Voltage
Figure 3. Drain Current versus Drain--Source Voltage
109
VDD = 12.5 Vdc
108
MTTF (HOURS)
ID = 5.13 Amps
107
6.41 Amps
7.71 Amps
106
105
104
90
110
130
150
170
190
210
230
250
TJ, JUNCTION TEMPERATURE (°C)
Note: MTTF value represents the total cumulative operating time
under indicated test conditions.
MTTF calculator available at http://www.freescale.com/rf. Select
Software & Tools/Development Tools/Calculators to access MTTF
calculators by product.
Figure 4. MTTF versus Junction Temperature -- CW
AFT09MP055NR1 AFT09MP055GNR1
4
RF Device Data
Freescale Semiconductor, Inc.
870 MHz NARROWBAND PRODUCTION TEST FIXTURE
C1
C11
C9
B1
B3
C5 C7
L1
R1
C20
C16
L3
C3
AFT09MP055N
Rev. 3
C18
C14
C22
R3
C13
C15
R2
L2
C6 C8
B2
C17
C10
CUT OUT AREA
R4
C19
C24
C23
C21
C4
L4
B4
C12
C2
Figure 5. AFT09MP055NR1 Narrowband Test Circuit Component Layout — 870 MHz
Table 6. AFT09MP055NR1 Narrowband Test Circuit Component Designations and Values — 870 MHz
Part
Description
Part Number
Manufacturer
B1, B2
RF Beads, Short
2743019447
Fair-Rite
B3, B4
RF Beads, Long
2743021447
Fair-Rite
C1, C2, C3, C4
10 μF Chip Capacitors
GRM55DR61H106KA88L
Murata
C5, C6
0.1 μF Chip Capacitors
GRM32MR71H104JA01L
Murata
C7, C8
1 μF Chip Capacitors
GRM31MR71H105KA88L
Murata
C9, C10
68 pF Chip Capacitors
ATC100B680JT500XT
ATC
C11, C12, C22, C23
56 pF Chip Capacitors
ATC100B560CT500XT
ATC
C13
7.5 pF Chip Capacitor
GQM2195C2E7R5BB15
Murata
C14, C15
7.5 pF Chip Capacitors
ATC100B7R5CT500XT
ATC
C16, C17
12 pF Chip Capacitors
ATC600F120JT250XT
ATC
C18, C19, C20, C21
9.1 pF Chip Capacitors
GQM2195C2E9R1BB15
Murata
C24
3 pF Chip Capacitor
ATC600F3R0BT250XT
ATC
L1, L2, L3, L4
2.5 nH Inductors
A01TKLC
Coilcraft
R1, R2
10 Ω Chip Resistors
CRCW120610R0JNEA
Vishay
R3
2.0 Ω Chip Resistor
ERJ-14YJ2R0U
Panasonic
R4
5.9 Ω Chip Resistor
CRCW12065R90FKEA
Vishay
PCB
0.030″, εr = 4.8
RF35A2
Taconic
AFT09MP055NR1 AFT09MP055GNR1
RF Device Data
Freescale Semiconductor, Inc.
5
AFT09MP055NR1 AFT09MP055GNR1
6
RF Device Data
Freescale Semiconductor, Inc.
RF
INPUT
C13
Z2
VBIAS
Z4
C2
Z6
C6
C17
Z8
Z7
Z9
C8
B2
Z10
R3
C7
C16
C5
C10
L2
R2
Z12
Z11
R1
L1
DUT
C9
Z14
Z13
L4
Z16
Z15
L3
C12
C18
Z18
Z17
B4
C19
C11
B3
C4
C3
Z20
R4
Z19
0.670″ × 0.120″ Microstrip
0.025″ × 0.400″ Microstrip
0.025″ × 0.400″ Microstrip
Z3*, Z4*
Z5, Z6
Z7, Z8
* Line length includes microstrip bends
0.595″ × 0.065″ Microstrip
Z2
Description
0.721″ × 0.065″ Microstrip
Z1
Microstrip
VSUPPLY
C21
Z22
Z21
C23
C22
C20
VSUPPLY
Z24
Z23
Microstrip
Z17, Z18
Z15, Z16
Z13, Z14
Z11, Z12
Z9, Z10
Description
0.213″ × 0.400″ Microstrip
0.100″ × 0.400″ Microstrip
0.075″ × 0.400″ Microstrip
0.075″ × 0.400″ Microstrip
0.295″ × 0.400″ Microstrip
Z26
Z25
Z23*, Z24*
Z21, Z22
Z19, Z20
Microstrip
C24
Z26
Description
Z25
0.901″ × 0.065″ Microstrip
0.175″ × 0.065″ Microstrip
0.885″ × 0.120″ Microstrip
0.025″ × 0.400″ Microstrip
0.007″ × 0.400″ Microstrip
Figure 6. AFT09MP055NR1 Narrowband Test Circuit Schematic — 870 MHz
C15
C14
Z5
C1
B1
Table 7. AFT09MP055NR1 Narrowband Test Circuit Microstrips — 870 MHz
Z1
Z3
VBIAS
RF
OUTPUT
TYPICAL CHARACTERISTICS — 870 MHz
100
Pout, OUTPUT POWER (WATTS)
90
VDD = 13.6 Vdc, Pin = 1 W
80
VDD = 12.5 Vdc, Pin = 1 W
70
60
VDD = 13.6 Vdc, Pin = 0.5 W
50
VDD = 12.5 Vdc
Pin = 0.5 W
40
30
20
10
f = 870 MHz
0
0
1
0.5
2
1.5
2.5
3
4
3.5
4.5
VGS, GATE--SOURCE VOLTAGE (VOLTS)
Figure 7. Output Power versus Gate--Source Voltage
at a Constant Input Power
20
18
60
17
50
40
16
15
14
13
ηD
30
VDD = 12.5 Vdc, IDQ(A+B) = 550 mA
f = 870 MHz
Pout
12
0.1
20
10
Pout, OUTPUT POWER (WATTS)
70
Gps
ηD, DRAIN EFFICIENCY (%)
Gps, POWER GAIN (dB)
19
80
0
3
1
Pin, INPUT POWER (WATTS)
Figure 8. Power Gain, Drain Efficiency and Output
Power versus Input Power
VDD = 12.5 Vdc, IDQ(A+B) = 550 mA, Pout = 57 W Avg.
f
MHz
Zsource
Ω
Zload
Ω
870
1.40 -- j1.00
0.61 -- j0.14
Zsource = Test circuit impedance as measured from
gate to ground.
Zload
50 Ω
Input
Matching
Network
= Test circuit impedance as measured from
drain to ground.
Device
Under
Test
Zsource
Output
Matching
Network
50 Ω
Zload
Figure 9. Narrowband Series Equivalent Source and Load Impedance — 870 MHz
AFT09MP055NR1 AFT09MP055GNR1
RF Device Data
Freescale Semiconductor, Inc.
7
764--870 MHz BROADBAND REFERENCE CIRCUIT
Table 8. 764--870 MHz Broadband Performance (In Freescale Reference Circuit, 50 ohm system)
VDD = 12.5 Vdc, IDQ(A+B) = 800 mA, Pout = 55 W, TA = 25°C, CW
Frequency
(MHz)
Gps
(dB)
ηD
(%)
Pout
(W)
764
16.6
54.2
55
816
16.0
59.2
55
870
15.8
61.1
55
Table 9. Load Mismatch/Ruggedness (In Freescale Reference Circuit)
Frequency
(MHz)
Signal
Type
764
CW
VSWR
Pin
(W)
>65:1 at all
Phase Angles
3
(3 dB Overdrive)
Test Voltage, VDD
Result
15
No Device
Degradation
AFT09MP055NR1 AFT09MP055GNR1
8
RF Device Data
Freescale Semiconductor, Inc.
764--870 MHz BROADBAND REFERENCE CIRCUIT
C26 C30
AFT09MP055N
Rev. 1
C32
C34
B3
C28 C24
R5
B1
C36
C4
L1
R3
C5
C7*
L3
C15 C13
C22
C9
C1*
R1
Q1
C12*
C2*
R2
C21
C23
C8*
R4
L2
C19
C20
C10
C11*
C17
C16 C14
C18
L4
C27 C31
C6
B2
C3
C33 C29 C25
C35
R6
C37
B4
*C1, C2, C7, C8, C11 and C12 are mounted vertically.
Figure 10. AFT09MP055NR1 Broadband Reference Circuit Component Layout — 764--870 MHz
Table 10. AFT09MP055NR1 Broadband Reference Circuit Component Designations and Values — 764--870 MHz
Part
Description
Part Number
Manufacturer
B1, B2, B3, B4
RF Beads, Short
2743019447
Fair-Rite
C1, C2, C3, C4
56 pF Chip Capacitors
ATC100B560GT1500XT
ATC
C5, C6, C7, C8
10 pF Chip Capacitors
ATC600F100GT250XT
ATC
C9, C10
8.2 pF Chip Capacitors
ATC600F8R2JT250XT
ATC
C11
4.7 pF Chip Capacitor
ATC600F4R7GT250XT
ATC
C12
5.6 pF Chip Capacitor
ATC600F5R6GT250XT
ATC
C13, C14
15 pF Chip Capacitors
ATC600F150JT250XT
ATC
C15, C16, C17, C18
3.9 pF Chip Capacitors
ATC600F3R9GT250XT
ATC
C19
6.8 pF Chip Capacitor
ATC600F6R8GT250XT
ATC
C20, C21
2.2 pF Chip Capacitors
ATC600F2R2GT250XT
ATC
C22, C23
1.5 pF Chip Capacitors
ATC600F1R5GT250XT
ATC
C24, C25, C26, C27
0.1 μF Chip Capacitors
GRM32MR71H104JA01L
Murata
C28, C29, C30, C31
1 μF Chip Capacitors
GRM31MR71H105KA88L
Murata
C32, C33, C34, C35
10 μF Chip Capacitors
GRM55DR61H106KA88L
Murata
C36, C37
470 μF, 63 V Electrolytic Capacitors
MCGPR63V477M13X26-RH
Multicomp
L1, L2, L3, L4
12.5 nH Chip Inductors
A04TKLC
Coilcraft
Q1
RF Power LDMOS Transistor
AFT09MP055NR1
Freescale
R1, R2, R3, R4, R5, R6
10 Ω, Chip Resistors
CRCW201010R0FKEF
Vishay
PCB
0.030″, εr = 4.8
S1000-2
Shengyi
AFT09MP055NR1 AFT09MP055GNR1
RF Device Data
Freescale Semiconductor, Inc.
9
RF
INPUT
Z1
C1
10
C11
Z3
VBIAS
C12
Z4
B2
Z6
Z5
B1
C29
C10
Z8
C25
C8
C9
Z7
C7
C28
C33
Z10
R1
Z9
C32
C6
DUT
C5
Z12
Z11
C16
Z14
Z13
C15
C14
Z16
Z15
C13
Z18
R2
Z17
R6
R5
C21
C20
B4
C23
C22
L3
B3
0.052″ × 0.051″ Microstrip
0.185″ × 0.051″ Microstrip
0.408″ × 0.071″ Microstrip
0.035″ × 0.393″ Microstrip
Z3
Z4
Z5*, Z6*
Z7, Z8
* Line length includes microstrip bends
0.043″ × 0.051″ Microstrip
Z2
Description
0.157″ × 0.051″ Microstrip
Z1
Microstrip
L4
Z20
Z19
Z22
C3
C18
C26
C27
C17
Z21
C4
C31
Z23
C30
Microstrip
Z17, Z18
Z15, Z16
Z13, Z14
Z11, Z12
Z9, Z10
Description
0.083″ × 0.393″ Microstrip
0.119″ × 0.393″ Microstrip
0.052″ × 0.393″ Microstrip
0.097″ × 0.393″ Microstrip
0.319″ × 0.393″ Microstrip
Microstrip
Z25
Z24
Z23
Z21*, Z22*
Z19, Z20
0.157″ × 0.051″ Microstrip
0.280″ × 0.051″ Microstrip
0.240″ × 0.051″ Microstrip
0.500″ × 0.071″ Microstrip
C35
C19
0.190″ × 0.071″ Microstrip
Description
C34
Z24
Figure 11. AFT09MP055NR1 Broadband Reference Circuit Schematic — 764--870 MHz
L2
R4
R3
L1
C24
C2
VSUPPLY
C37
VSUPPLY
RF
OUTPUT
Z25
C36
+
Table 11. AFT09MP055NR1 Broadband Reference Circuit Microstrips — 764--870 MHz
Z2
VBIAS
+
AFT09MP055NR1 AFT09MP055GNR1
RF Device Data
Freescale Semiconductor, Inc.
TYPICAL CHARACTERISTICS — 764--870 MHz BROADBAND
REFERENCE CIRCUIT
ηD
17
64
60
56
16.5
16
Gps
15.5
15
Pout
14.5
14
760
800
840
ηD, DRAIN
EFFICIENCY (%)
Gps, POWER GAIN (dB)
17.5
68
VDD = 12.5 Vdc, Pin = 1.5 W (Avg.)
IDQ(A+B) = 800 mA
52
65
60
55
50
880
Pout, OUTPUT
POWER (WATTS)
18
f, FREQUENCY (MHz)
Figure 12. Power Gain, Output Power and Drain Efficiency versus
Frequency at a Constant Input Power — 12.5 Vdc
ηD
17
60
55
16.5
16
Gps
15.5
15
Pout
14.5
14
760
65
800
840
ηD, DRAIN
EFFICIENCY (%)
Gps, POWER GAIN (dB)
17.5
70
VDD = 13.6 Vdc, Pin = 1 W (Avg.)
IDQ(A+B) = 800 mA
50
65
60
55
50
880
Pout, OUTPUT
POWER (WATTS)
18
f, FREQUENCY (MHz)
Figure 13. Power Gain, Output Power and Drain Efficiency versus
Frequency at a Constant Input Power — 13.6 Vdc
AFT09MP055NR1 AFT09MP055GNR1
RF Device Data
Freescale Semiconductor, Inc.
11
TYPICAL CHARACTERISTICS — 764--870 MHz BROADBAND
REFERENCE CIRCUIT
80
50
VDD = 13.6 Vdc, Pin = 1 W
60
Pout, OUTPUT POWER (WATTS)
Pout, OUTPUT POWER (WATTS)
VDD = 13.6 Vdc, Pin = 1.5 W
f = 816 MHz
70
VDD = 12.5 Vdc, Pin = 1.5 W
50
VDD = 12.5 Vdc
Pin = 1 W
40
30
Detail A
20
10
0
2
1
3
VDD = 13.6 Vdc, Pin = 1.5 W
VDD = 13.6 Vdc, Pin = 1 W
30
VDD = 12.5 Vdc, Pin = 1.5 W
20
10
0
0
f = 816 MHz
40
VDD = 12.5 Vdc
Pin = 1 W
1
0.5
0
1.5
2
2.5
VGS, GATE--SOURCE VOLTAGE (VOLTS)
4
Detail A
VGS, GATE--SOURCE VOLTAGE (VOLTS)
Figure 14. Output Power versus Gate--Source Voltage
Gps
17
870 MHz
100
816 MHz
80
764 MHz
816 MHz
16
764 MHz
60
870 MHz
40
15
ηD
870 MHz
14
13
0.1
Pout
764 MHz
20
816 MHz
ηD, DRAIN EFFICIENCY (%)
18
Gps, POWER GAIN (dB)
120
VDD = 12.5 Vdc, IDQ(A+B) = 800 mA
Pout, OUTPUT POWER (WATTS)
19
0
1
3
Pin, INPUT POWER (WATTS)
Figure 15. Power Gain, Output Power and Drain
Efficiency versus Input Power and Frequency
AFT09MP055NR1 AFT09MP055GNR1
12
RF Device Data
Freescale Semiconductor, Inc.
764--870 MHz BROADBAND REFERENCE CIRCUIT
Zo = 2 Ω
f = 870 MHz
f = 760 MHz
f = 870 MHz
Zsource
Zload
f = 760 MHz
VDD = 12.5 Vdc, IDQ(A+B) = 800 mA, Pout = 55 W Avg.
f
MHz
Zsource
Ω
Zload
Ω
760
1.24 + j0.09
1.00 -- j0.81
770
1.30 + j0.15
1.00 -- j0.75
780
1.35 + j0.21
1.00 - j0.72
790
1.43 + j0.34
1.01 - j0.61
800
1.54 + j0.34
1.03 - j0.58
810
1.66 + j0.18
0.99 - j0.65
820
1.63 + j0.06
0.90 - j0.63
830
1.55 - j0.07
0.78 - j0.60
840
1.42 - j0.12
0.71 - j0.48
850
1.21 - j0.13
0.56 - j0.37
860
1.15 - j0.12
0.52 - j0.28
870
1.01 - j0.10
0.43 - j0.17
Zsource = Test circuit impedance as measured from
gate to ground.
Zload
50 Ω
Input
Matching
Network
= Test circuit impedance as measured from
drain to ground.
Device
Under
Test
Zsource
Output
Matching
Network
50 Ω
Zload
Figure 16. Broadband Series Equivalent Source and Load Impedance — 764--870 MHz
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PACKAGE DIMENSIONS
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PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS
Refer to the following documents, software and tools to aid your design process.
Application Notes
• AN1955: Thermal Measurement Methodology of RF Power Amplifiers
Engineering Bulletins
• EB212: Using Data Sheet Impedances for RF LDMOS Devices
Software
• Electromigration MTTF Calculator
• RF High Power Model
• .s2p File
Development Tools
• Printed Circuit Boards
For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the
Software & Tools tab on the part’s Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
Date
0
July 2013
Description
• Initial Release of Data Sheet
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RF Device Data
Freescale Semiconductor, Inc.
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Number:
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