Si7868DP Datasheet

Si7868DP
Vishay Siliconix
N-Channel 20-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
rDS(on) (Ω)
ID (A)
0.00225 @ VGS = 10 V
29
D
D
D
D
0.00275 @ VGS = 4.5 V
25
APPLICATIONS
VDS (V)
20
TrenchFETr Power MOSFET
Low rDS(on)
PWM (Qgd and Rg) Optimized
100% Rg Tested
D Low Output Voltage Synchronous Rectifier
PowerPAKr SO-8
S
6.15 mm
D
5.15 mm
1
S
2
S
3
G
4
D
8
G
D
7
D
6
D
5
S
Bottom View
N-Channel MOSFET
Ordering Information: Si7868DP-T1
Si7868DP-T1—E3 (Lead (Pb)-Free)
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
10 secs
Steady State
Drain-Source Voltage
VDS
20
Gate-Source Voltage
VGS
16
Continuous Drain Current (TJ = 150_C)a
TA = 25_C
TA = 70_C
Pulsed Drain Current (10 ms Pulse Width)
Continuous Source Current (Diode
IS
Avalanche Current
L=0
0.1
1 mH
Single Pulse Avalanche Energy
TA = 25_C
Maximum Power Dissipationa
TA = 70_C
Operating Junction and Storage Temperature Range
18
25
IDM
Conduction)a
V
29
ID
14
60
A
4.5
1.6
IAS
50
EAS
125
PD
mJ
5.4
1.9
3.4
1.2
TJ, Tstg
Unit
W
_C
--55 to 150
THERMAL RESISTANCE RATINGS
Parameter
M i
Maximum
JJunction-to-Ambient
ti t A bi ta
Maximum Junction-to-Case (Drain)
Symbol
t ≤ 10 sec
Steady State
Steady State
RthJA
RthJC
Typical
Maximum
18
23
50
65
1.0
1.5
Unit
_C/W
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Document Number: 71849
S-41576—Rev. D, 23-Aug-04
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Si7868DP
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
VGS(th)
VDS = VGS, ID = 250 mA
0.6
IGSS
Typ
Max
Unit
1.5
V
VDS = 0 V, VGS = 16 V
100
nA
VDS = 20 V, VGS = 0 V
1
VDS = 20 V, VGS = 0 V, TJ = 55_C
5
Static
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
rDS(on)
Forward Transconductancea
Diode Forward Voltagea
VDS ≥ 5 V, VGS = 10 V
mA
30
A
VGS = 10 V, ID = 29 A
0.0018
0.00225
VGS = 4.5 V, ID = 25 A
0.0022
0.00275
gfs
VDS = 6 V, ID = 29 A
95
VSD
IS = 4.5 A, VGS = 0 V
0.63
1.1
50
75
Ω
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
Turn-On Delay Time
nC
12
11
1.2
1.8
td(on)
53
80
tr
49
75
150
240
75
110
65
100
Rise Time
Turn-Off Delay Time
VDS = 10 V, VGS = 4.5 V, ID = 29 A
0.5
VDD = 10 V, RL = 10 Ω
ID ≅ 1 A, VGEN = 4.5 V, RG = 6 Ω
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
IF = 2.9 A, di/dt = 100 A/ms
Ω
ns
Notes
a. Pulse test; pulse width ≤ 300 ms, duty cycle ≤ 2%.
b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
60
60
VGS = 10 thru 3 V
50
I D -- Drain Current (A)
I D -- Drain Current (A)
50
40
30
2V
20
10
40
30
TC = 125_C
20
25_C
10
--55_C
0
0
1
2
3
4
VDS -- Drain-to-Source Voltage (V)
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2
5
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
VGS -- Gate-to-Source Voltage (V)
Document Number: 71849
S-41576—Rev. D, 23-Aug-04
Si7868DP
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Drain Current
Capacitance
10000
VGS = 4.5 V
0.0025
0.0020
8000
C -- Capacitance (pF)
r DS(on) -- On-Resistance ( Ω )
0.0030
VGS = 10 V
0.0015
0.0010
Ciss
6000
4000
Coss
2000
0.0005
Crss
0.0000
0
0
10
20
30
40
50
60
0
4
ID -- Drain Current (A)
Gate Charge
16
20
On-Resistance vs. Junction Temperature
2.0
VDS = 10 V
ID = 29 A
4.8
VGS = 10 V
ID = 29 A
1.8
rDS(on) -- On-Resiistance
(Normalized)
V GS -- Gate-to-Source Voltage (V)
12
VDS -- Drain-to-Source Voltage (V)
6.0
3.6
2.4
1.6
1.4
1.2
1.0
1.2
0.8
0.0
0
14
28
42
56
0.6
--50
70
--25
0
Qg -- Total Gate Charge (nC)
Source-Drain Diode Forward Voltage
50
75
100
125
150
On-Resistance vs. Gate-to-Source Voltage
0.010
r DS(on) -- On-Resistance ( Ω )
TJ = 150_C
10
TJ = 25_C
0.008
0.006
ID = 29 A
0.004
0.002
0.000
1
0.00
25
TJ -- Junction Temperature (_C)
60
I S -- Source Current (A)
8
0.2
0.4
0.6
0.8
VSD -- Source-to-Drain Voltage (V)
Document Number: 71849
S-41576—Rev. D, 23-Aug-04
1.0
1.2
0
2
4
6
8
10
VGS -- Gate-to-Source Voltage (V)
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Si7868DP
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
Single Pulse Power
0.4
200
160
ID = 250 mA
Power (W)
V GS(th) Variance (V)
0.2
--0.0
--0.2
--0.4
120
80
40
--0.6
--50
--25
0
25
50
75
100
125
150
0
0.001
0.01
TJ -- Temperature (_C)
0.1
1
10
Time (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 50_C/W
3. TJM -- TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10 --4
10 --3
10 --2
10 --1
1
Square Wave Pulse Duration (sec)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Case
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
Single Pulse
0.05
0.02
0.01
10 --4
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4
10 --3
10 --2
10 --1
Square Wave Pulse Duration (sec)
1
10
Document Number: 71849
S-41576—Rev. D, 23-Aug-04
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Document Number: 91000
Revision: 18-Jul-08
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