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Materials Declaration
Package
Body Size
Ball Count
Option
Item
Epoxy resin
SiO2 Filler
Phenol Resin
Carbon Black
Metal Hydroxide
Item
BT-Epoxy
Glass Fiber
Copper
Gold
Nickel
Solder Mask
Brominated Compound
Mini BGA
9X9
148
Pb-Free
Molding Compound
% of Compound
7
85
6.5
0.5
1
Weight (g)
6.59 E-03
8.00 E-02
6.12 E-03
4.70 E-04
9.41 E-04
PPM
32249
391597
29946
2304
4607
Weight (g)
28
1.73 E-02
25
1.54 E-02
19
1.17 E-02
11
6.79 E-03
7.8
4.82 E-03
9.35
5.77 E-03
Confidential Not Determined
PPM
84632
75564
57429
33248
23576
28261
Laminate
% of Laminate
Solder Ball
% of Plating
Sn
Ag
Cu
96.5
3
0.5
Weight (g)
1.70 E-02
5.27 E-04
8.79 E-05
PPM
83076
2583
430
Au
Bond Wires
% of Wire
99.99
Weight (g)
1.74 E-03
PPM
8504
100
Weight (g)
1.41 E-02
PPM
68941
24
76
Weight (g)
3.58 E-03
1.13 E-02
PPM
17533
55521
Chip
% of Chip
Si
Item
Resin
Ag Filler
Die Attach
% of Die Attach
Item
Pb
Cd
Hg
Cr+6
PPM
<2.0
<2.0
<2.0
<2.0
Item
Pb
Cd
Hg
Cr+6
PPM
<5.0
<5.0
<5.0
<5.0
Molding Compound
Method
EPA method #3052 (ICPAES)
BS EN 1122:2001B (ICPaes)
Mercury Analyser
EPA method #3060A(UV)
Die Attach Paste
Method
ICP-AES
ICP-AES
ICP-AES
ICP-AES
Package Totals
PPM
Weight (g)
1000000
2.04 E-01
STS-BC-I
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
6/10/04
Materials Declaration
Package
Body Size
Ball Count
Option
Item
Silica
Epoxy resin
Phenol resin
Antimony trioxide
Bromine
Item
BT-Epoxy
Glass Fiber
Copper
Gold
Nickel
Solder Mask
Brominated Compound
Mini BGA
9X9
148
SnPbAg
Molding Compound
% of Compound
90
4.8
3.91
0.69
0.6
Weight (g)
8.29 E-02
4.42 E-03
3.60 E-03
6.36 E-04
5.53 E-04
PPM
459218
24492
19950
3521
3061
Weight (g)
28
1.73 E-02
25
1.54 E-02
19
1.17 E-02
11
6.79 E-03
7.8
4.82 E-03
9.35
5.77 E-03
Confidential Not Determined
PPM
95748
85489
64972
37615
26673
31973
Laminate
% of Laminate
Solder Ball
% of Plating
Sn
Pb
Ag
62
36
2
Weight (g)
1.09 E-02
6.33 E-03
3.52 E-04
PPM
60386
35063
1948
Bond Wires
% of Wire
99.99
Weight (g)
1.74 E-03
PPM
Au
100
Weight (g)
6.34 E-03
PPM
35098
Weight (g)
2.15 E-04
7.19 E-04
PPM
23
77
Chip
% of Chip
Si
Item
Resin
Ag Filler
Die Attach
% of Die Attach
Item
Cd
PPM
<5
Item
Pb
Cd
Hg
Cr+6
PPM
<5.0
<5.0
<5.0
<5.0
Molding Compound
Method
BS EN 1122:2001B (ICPaes)
Die Attach Paste
Method
ICP-AES
ICP-AES
ICP-AES
ICP-AES
9621
1189
3981
Package Totals
PPM
Weight (g)
1000000
1.81 E-01
STS-BC-D
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
6/10/04