Materials Declaration Package Body Size Ball Count Option Ball Size Item Epoxy resin SiO2 Filler Phenol Resin Carbon Black Metal Hydroxide Item BT-Epoxy Glass Fiber Copper Gold Nickel Solder Mask Brominated Compound CSP BGA 12 X 12 204 Pb-Free 0.4 Molding Compound % of Compound 7 85 6.5 0.5 1 Sub-Total Weight (g) 1.34 E-02 1.63 E-01 1.25 E-02 9.60 E-04 1.92 E-03 1.92 E-01 PPM 36155 439026 33573 2583 5165 516501 Item Pb Cd Hg Cr+6 PPM <2.0 <2.0 <2.0 <2.0 Weight (g) 28 2.84 E-02 25 2.53 E-02 19 1.93 E-02 11 1.12 E-02 7.8 7.91 E-03 9.35 9.48 E-03 Confidential Not Determined Sub-Total 1.02 E-01 PPM 76361 68179 51816 29999 21272 25499 Item Pb Cd Hg Cr+6 PPM <5.0 <5.0 <5.0 <5.0 Laminate % of Laminate Solder Ball % of Plating Sn Ag Cu Au Weight (g) 5.93 E-02 1.84 E-03 3.07 E-04 6.15 E-02 PPM 159644 4963 827 165434 Bond Wires % of Wire 99.99 Weight (g) 1.13 E-03 PPM 3048 100 Weight (g) 1.41 E-02 PPM 37877 Weight (g) 3.58 E-04 1.13 E-03 PPM 24 76 Sub-Total 1.49 E-03 Chip % of Chip Item Resin Ag Filler Die Attach % of Die Attach Die Attach Paste Method ICP-AES ICP-AES ICP-AES ICP-AES 273127 96.5 3 0.5 Sub-Total Si Molding Compound Method EPA method #3052 (ICPAES) BS EN 1122:2001B (ICPaes) Mercury Analyser EPA method #3060A(UV) 963 3050 4014 Package Totals PPM Weight (g) 1000000 3.72 E-01 STS-BC-F Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 1/12/05 Materials Declaration Package Body Size Ball Count Option Ball Size Item Silica epoxy resin Phenol resin Antimony trioxide Bromine Item BT-Epoxy Glass Fiber Copper Gold Nickel Solder Mask Brominated Compound CSP BGA 12 X 12 204 SnPbAg 0.4 Molding Compound % of Compound 90 4.8 3.91 0.69 0.6 Sub-Total Weight (g) 1.70 E-01 9.04 E-03 7.37 E-03 1.30 E-03 1.13 E-03 1.88 E-01 PPM 460579 24564 20010 3531 3071 511754 Item Cd PPM <5 Weight (g) 28 2.84 E-02 25 2.53 E-02 19 1.93 E-02 11 1.12 E-02 7.8 7.91 E-03 9.35 9.48 E-03 Confidential Not Determined Sub-Total 1.02 E-01 PPM 77111 68849 52325 30293 21481 25749 Item Pb Cd Hg Cr+6 PPM <5.0 <5.0 <5.0 <5.0 Laminate % of Laminate Solder Ball % of Plating Sn Pb Ag 62 36 2 Sub-Total Bond Wires % of Wire Item PPM 103576 60141 3341 167058 Weight (g) PPM 3078 100 Weight (g) 1.41 E-02 PPM 38249 Weight (g) 3.43 E-04 1.15 E-03 PPM 23 77 Sub-Total 1.49 E-03 Si Resin Ag Filler Weight (g) 3.81 E-02 2.21 E-02 1.23 E-03 6.15 E-02 1.13 E-03 Chip % of Chip Die Attach % of Die Attach Die Attach Paste Method ICP-AES ICP-AES ICP-AES ICP-AES 275808 99.99 Au Molding Compound Method BS EN 1122:2001B (ICPaes) 932 3121 4053 Package Totals PPM Weight (g) 1000000 3.68 E-01 STS-BC-C Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 1/12/05