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Materials Declaration
Package
Body Size
Ball Count
Option
Ball Size
Item
Epoxy resin
SiO2 Filler
Phenol Resin
Carbon Black
Metal Hydroxide
Item
BT-Epoxy
Glass Fiber
Copper
Gold
Nickel
Solder Mask
Brominated Compound
CSP BGA
12 X 12
204
Pb-Free
0.4
Molding Compound
% of Compound
7
85
6.5
0.5
1
Sub-Total
Weight (g)
1.34 E-02
1.63 E-01
1.25 E-02
9.60 E-04
1.92 E-03
1.92 E-01
PPM
36155
439026
33573
2583
5165
516501
Item
Pb
Cd
Hg
Cr+6
PPM
<2.0
<2.0
<2.0
<2.0
Weight (g)
28
2.84 E-02
25
2.53 E-02
19
1.93 E-02
11
1.12 E-02
7.8
7.91 E-03
9.35
9.48 E-03
Confidential Not Determined
Sub-Total
1.02 E-01
PPM
76361
68179
51816
29999
21272
25499
Item
Pb
Cd
Hg
Cr+6
PPM
<5.0
<5.0
<5.0
<5.0
Laminate
% of Laminate
Solder Ball
% of Plating
Sn
Ag
Cu
Au
Weight (g)
5.93 E-02
1.84 E-03
3.07 E-04
6.15 E-02
PPM
159644
4963
827
165434
Bond Wires
% of Wire
99.99
Weight (g)
1.13 E-03
PPM
3048
100
Weight (g)
1.41 E-02
PPM
37877
Weight (g)
3.58 E-04
1.13 E-03
PPM
24
76
Sub-Total
1.49 E-03
Chip
% of Chip
Item
Resin
Ag Filler
Die Attach
% of Die Attach
Die Attach Paste
Method
ICP-AES
ICP-AES
ICP-AES
ICP-AES
273127
96.5
3
0.5
Sub-Total
Si
Molding Compound
Method
EPA method #3052 (ICPAES)
BS EN 1122:2001B (ICPaes)
Mercury Analyser
EPA method #3060A(UV)
963
3050
4014
Package Totals
PPM
Weight (g)
1000000
3.72 E-01
STS-BC-F
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
1/12/05
Materials Declaration
Package
Body Size
Ball Count
Option
Ball Size
Item
Silica
epoxy resin
Phenol resin
Antimony trioxide
Bromine
Item
BT-Epoxy
Glass Fiber
Copper
Gold
Nickel
Solder Mask
Brominated Compound
CSP BGA
12 X 12
204
SnPbAg
0.4
Molding Compound
% of Compound
90
4.8
3.91
0.69
0.6
Sub-Total
Weight (g)
1.70 E-01
9.04 E-03
7.37 E-03
1.30 E-03
1.13 E-03
1.88 E-01
PPM
460579
24564
20010
3531
3071
511754
Item
Cd
PPM
<5
Weight (g)
28
2.84 E-02
25
2.53 E-02
19
1.93 E-02
11
1.12 E-02
7.8
7.91 E-03
9.35
9.48 E-03
Confidential Not Determined
Sub-Total
1.02 E-01
PPM
77111
68849
52325
30293
21481
25749
Item
Pb
Cd
Hg
Cr+6
PPM
<5.0
<5.0
<5.0
<5.0
Laminate
% of Laminate
Solder Ball
% of Plating
Sn
Pb
Ag
62
36
2
Sub-Total
Bond Wires
% of Wire
Item
PPM
103576
60141
3341
167058
Weight (g)
PPM
3078
100
Weight (g)
1.41 E-02
PPM
38249
Weight (g)
3.43 E-04
1.15 E-03
PPM
23
77
Sub-Total
1.49 E-03
Si
Resin
Ag Filler
Weight (g)
3.81 E-02
2.21 E-02
1.23 E-03
6.15 E-02
1.13 E-03
Chip
% of Chip
Die Attach
% of Die Attach
Die Attach Paste
Method
ICP-AES
ICP-AES
ICP-AES
ICP-AES
275808
99.99
Au
Molding Compound
Method
BS EN 1122:2001B (ICPaes)
932
3121
4053
Package Totals
PPM
Weight (g)
1000000
3.68 E-01
STS-BC-C
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
1/12/05