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Materials Declaration
Package
Body Size
LeadCount
Option
6600H
SOIC-EP
150 mils
8
Pb-Free
Molding Compound
Weight (g)
% of Compound
87.00
3.99 E-02
5.90
2.68 E-03
4.10
1.90 E-03
3.00
1.38 E-03
PPM
504920
33950
24084
17405
Leadframe
% of Leadframe
97.5
2.35
0.12
0.03
Weight (g)
2.88 E-02
6.94 E-04
3.50 E-05
9.00 E-06
PPM
364302
8778
443
114
Ag
Internal Leadframe Plating
% of Plating
Weight (g)
4.29 E-04
100.0
PPM
5426
Sn
External Leadframe Plating
% of Plating
Weight (g)
100.0
1.80 E-03
PPM
22717
Item
SiO2 Filler
Epoxy resin
Sb2O3
Phenol Resin
Item
Cu
Fe
Zn
P
Item
Au
Bond Wires
% of Wire
99.99
Weight (g)
2.30 E-04
PPM
2909
Si
Chip
% of Chip
100.0
Weight (g)
6.48 E-04
PPM
8197
Die Attach
% of Die Attach
70.0
21.0
3.0
3.0
3.0
Weight (g)
3.74 E-04
1.12 E-04
1.60 E-05
1.60 E-05
1.60 E-05
PPM
4731
1417
202
202
202
Item
Ag Filler
8290 Resin
Metal Oxide
Amine
Gamma Butyrolactone
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Molding Compound
Method
US EPA 3050B. Analysis was performed by ICP-AES
US EPA 3050B. Analysis was performed by ICP-AES
US EPA 3052. Analysis was performed by ICP-AES
US EPA 3060A. Analysis was performed by UV-VIS
US EPA 3450C. Analysis was performed by GC/MS
US EPA 3450C. Analysis was performed by GC/MS
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Die Attach Paste
Method
US EPA 3050B. Analysis was performed by ICP-AES
EN 1122 Method B. Analysis was performed by ICP-AES
US EPA 3052. Analysis was performed by ICP-AES
EPA 3060A & 7196A
US EPA 3540 or 3550. Analysis by HPLC/DAD, LC/MS or GC/MS
US EPA 3540 or 3550. Analysis by HPLC/DAD, LC/MS or GC/MS
Package Totals
PPM
Weight (g)
1000000
7.91 E-02
6600H
8290
AMK-RD-B
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability t
any inaccuracy of such information.
ADI Proprietary
6600H
11/8/06
8290
Materials Declaration
Package
Body Size
LeadCount
Option
SOIC-EP
150 mils
8
Sn/Pb
Molding Compound
% of Compound
87.00
5.90
4.10
3.00
Weight (g)
3.99 E-02
2.68 E-03
1.90 E-03
1.38 E-03
PPM
504920
33950
24084
17405
Cu
Fe
Zn
P
Leadframe
% of Leadframe
97.5
2.35
0.12
0.03
Weight (g)
2.88 E-02
6.94 E-04
3.50 E-05
9.00 E-06
PPM
364302
8778
443
114
Ag
Internal Leadframe Plating
% of Plating
Weight (g)
4.29 E-04
100.0
Item
SiO2 Filler
Epoxy resin
Sb2O3
Phenol Resin
Item
Item
Sn
Pb
Au
Si
Item
Ag Filler
Resin
Metal Oxide
Amine
Gamma Butyrolactone
Molding Compound
External Leadframe Plating
% of Plating
Weight (g)
85.0
1.53 E-03
15.0
2.69 E-04
1.80 E-03
Bond Wires
% of Wire
Weight (g)
99.99
2.30 E-04
PPM
5426
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Method
US EPA 3050B. Analysis was performed by ICP-AES
US EPA 3050B. Analysis was performed by ICP-AES
US EPA 3052. Analysis was performed by ICP-AES
US EPA 3060A. Analysis was performed by UV-VIS
US EPA 3450C. Analysis was performed by GC/MS
US EPA 3450C. Analysis was performed by GC/MS
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Die Attach Paste
Method
US EPA 3050B. Analysis was performed by ICP-AES
EN 1122 Method B. Analysis was performed by ICP-AES
US EPA 3052. Analysis was performed by ICP-AES
EPA 3060A & 7196A
US EPA 3540 or 3550. Analysis by HPLC/DAD, LC/MS or GC/MS
US EPA 3540 or 3550. Analysis by HPLC/DAD, LC/MS or GC/MS
PPM
19310
3408
PPM
2909
Chip
% of Chip
100.0
Weight (g)
6.48 E-04
PPM
Die Attach
% of Die Attach
70.0
21.0
3.0
3.0
3.0
Weight (g)
3.74 E-04
1.12 E-04
1.60 E-05
1.60 E-05
1.60 E-05
PPM
8197
4731
1417
202
202
202
Package Totals
Weight (g)
PPM
1000000
7.91 E-02
AMK-RD-B
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability t
any inaccuracy of such information.
ADI Proprietary
11/8/06