Materials Declaration Package Body Size LeadCount Option 6600H SOIC-EP 150 mils 8 Pb-Free Molding Compound Weight (g) % of Compound 87.00 3.99 E-02 5.90 2.68 E-03 4.10 1.90 E-03 3.00 1.38 E-03 PPM 504920 33950 24084 17405 Leadframe % of Leadframe 97.5 2.35 0.12 0.03 Weight (g) 2.88 E-02 6.94 E-04 3.50 E-05 9.00 E-06 PPM 364302 8778 443 114 Ag Internal Leadframe Plating % of Plating Weight (g) 4.29 E-04 100.0 PPM 5426 Sn External Leadframe Plating % of Plating Weight (g) 100.0 1.80 E-03 PPM 22717 Item SiO2 Filler Epoxy resin Sb2O3 Phenol Resin Item Cu Fe Zn P Item Au Bond Wires % of Wire 99.99 Weight (g) 2.30 E-04 PPM 2909 Si Chip % of Chip 100.0 Weight (g) 6.48 E-04 PPM 8197 Die Attach % of Die Attach 70.0 21.0 3.0 3.0 3.0 Weight (g) 3.74 E-04 1.12 E-04 1.60 E-05 1.60 E-05 1.60 E-05 PPM 4731 1417 202 202 202 Item Ag Filler 8290 Resin Metal Oxide Amine Gamma Butyrolactone Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Molding Compound Method US EPA 3050B. Analysis was performed by ICP-AES US EPA 3050B. Analysis was performed by ICP-AES US EPA 3052. Analysis was performed by ICP-AES US EPA 3060A. Analysis was performed by UV-VIS US EPA 3450C. Analysis was performed by GC/MS US EPA 3450C. Analysis was performed by GC/MS Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Die Attach Paste Method US EPA 3050B. Analysis was performed by ICP-AES EN 1122 Method B. Analysis was performed by ICP-AES US EPA 3052. Analysis was performed by ICP-AES EPA 3060A & 7196A US EPA 3540 or 3550. Analysis by HPLC/DAD, LC/MS or GC/MS US EPA 3540 or 3550. Analysis by HPLC/DAD, LC/MS or GC/MS Package Totals PPM Weight (g) 1000000 7.91 E-02 6600H 8290 AMK-RD-B Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability t any inaccuracy of such information. ADI Proprietary 6600H 11/8/06 8290 Materials Declaration Package Body Size LeadCount Option SOIC-EP 150 mils 8 Sn/Pb Molding Compound % of Compound 87.00 5.90 4.10 3.00 Weight (g) 3.99 E-02 2.68 E-03 1.90 E-03 1.38 E-03 PPM 504920 33950 24084 17405 Cu Fe Zn P Leadframe % of Leadframe 97.5 2.35 0.12 0.03 Weight (g) 2.88 E-02 6.94 E-04 3.50 E-05 9.00 E-06 PPM 364302 8778 443 114 Ag Internal Leadframe Plating % of Plating Weight (g) 4.29 E-04 100.0 Item SiO2 Filler Epoxy resin Sb2O3 Phenol Resin Item Item Sn Pb Au Si Item Ag Filler Resin Metal Oxide Amine Gamma Butyrolactone Molding Compound External Leadframe Plating % of Plating Weight (g) 85.0 1.53 E-03 15.0 2.69 E-04 1.80 E-03 Bond Wires % of Wire Weight (g) 99.99 2.30 E-04 PPM 5426 Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Method US EPA 3050B. Analysis was performed by ICP-AES US EPA 3050B. Analysis was performed by ICP-AES US EPA 3052. Analysis was performed by ICP-AES US EPA 3060A. Analysis was performed by UV-VIS US EPA 3450C. Analysis was performed by GC/MS US EPA 3450C. Analysis was performed by GC/MS Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Die Attach Paste Method US EPA 3050B. Analysis was performed by ICP-AES EN 1122 Method B. Analysis was performed by ICP-AES US EPA 3052. Analysis was performed by ICP-AES EPA 3060A & 7196A US EPA 3540 or 3550. Analysis by HPLC/DAD, LC/MS or GC/MS US EPA 3540 or 3550. Analysis by HPLC/DAD, LC/MS or GC/MS PPM 19310 3408 PPM 2909 Chip % of Chip 100.0 Weight (g) 6.48 E-04 PPM Die Attach % of Die Attach 70.0 21.0 3.0 3.0 3.0 Weight (g) 3.74 E-04 1.12 E-04 1.60 E-05 1.60 E-05 1.60 E-05 PPM 8197 4731 1417 202 202 202 Package Totals Weight (g) PPM 1000000 7.91 E-02 AMK-RD-B Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability t any inaccuracy of such information. ADI Proprietary 11/8/06