Materials Declaration Package Body Size LeadCount Option Item SiO2 Resin Sb2O3 Brominated epoxy Carbon Black Subtotal Item Fe Ni Mn Co Si Cr Al Subtotal Ag Item Sn SOT 23 -3 Pb-free Molding Compound % of Compound 81.0 16.1 1.4 1.0 0.5 Molding Compound Weight (g) 4.43 E-03 8.81 E-04 7.66 E-05 5.47 E-05 2.74 E-05 5.47 E-03 PPM 509009 101173 8798 6284 3142 628406 Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Method EPA Method 3052. Draft IEC62321. ICP-OES. EPA Method 3052. Draft IEC62321. ICP-OES. EPA Method 3052. Draft IEC62321. ICP-OES. EPA Method 3060A. Draft IEC62321. UV-VIS EPA Method 3540C. Draft IEC62321. GC/MS-D. EPA Method 3540C. Draft IEC62321. GC/MS-D. Weight (g) 1.32 E-03 9.65 E-04 1.86 E-05 1.16 E-05 6.98 E-06 2.33 E-06 2.33 E-06 2.33 E-03 PPM 151544 110918 2138 1336 802 267 267 267273 Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Die Attach Paste Method EPA Method 3052. Draft IEC62321. ICP-OES. EPA Method 3052. Draft IEC62321. ICP-OES. EPA Method 3052. Draft IEC62321. ICP-OES. EPA Method 3060A. Draft IEC62321. UV-VIS EPA Method 3540C. Draft IEC62321. GC/MS-D. EPA Method 3540C. Draft IEC62321. GC/MS-D. Internal Leadframe Plating Weight (g) % of Plating 2.35 E-05 100 PPM 2700 External Leadframe Plating % of Plating Weight (g) 100 2.25 E-04 PPM 25800 Leadframe % of Leadframe 56.7 41.5 0.8 0.5 0.3 0.1 0.1 Au Bond Wires % of Wire 99.99 Weight (g) 1.00 E-04 PPM 11487 Si Chip % of Chip 100 Weight (g) 5.00 E-04 PPM 57441 Weight (g) 4.80 E-05 9.00 E-06 3.00 E-06 6.00 E-05 PPM 5514 1034 345 6893 Item Epoxy Resin Silicon Dioxide Aromatic Amine Subtotal Die Attach % of Die Attach 80 15 5 Package Totals Weight (g) PPM 1000000 8.70 E-03 CRS-RT-E Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size LeadCount Option Item SiO2 Epoxy Cresol Novolac Phenol Novolac Sb2O3 Brominated epoxy Carbon black Subtotal SOT 23 -3 with Pb Molding Compound % of Compound Weight (g) 67.20 3.68 E-03 20.00 1.09 E-03 7.00 3.83 E-04 3.00 1.64 E-04 2.50 1.37 E-04 0.30 1.64 E-05 5.47 E-03 Molding Compound PPM 421542 125459 43911 18819 15682 1882 627294 Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Method EPA Method 3052. Draft IEC62321. ICP-OES. EPA Method 3052. Draft IEC62321. ICP-OES. EPA Method 3052. Draft IEC62321. ICP-OES. EPA Method 3060A. Draft IEC62321. UV-VIS EPA Method 3540C. Draft IEC62321. GC/MS-D. EPA Method 3540C. Draft IEC62321. GC/MS-D. Die Attach Paste Item Fe Ni Mn Co Si Cr Al Subtotal Leadframe % of Leadframe 56.7 41.5 0.8 0.5 0.3 0.1 0.1 Weight (g) 1.32 E-03 9.65 E-04 1.86 E-05 1.16 E-05 6.98 E-06 2.33 E-06 2.33 E-06 2.33 E-03 Internal Leadframe Plating % of Plating Weight (g) 2.35 E-05 100 Ag Item Sn Pb Subtotal Au External Leadframe Plating % of Plating Weight (g) 85 2.04 E-04 15 3.60 E-05 2.40 E-04 Bond Wires % of Wire 99.99 PPM 151276 110722 2134 1334 800 267 267 266801 Method EPA Method 3052. Draft IEC62321. ICP-OES. EPA Method 3052. Draft IEC62321. ICP-OES. EPA Method 3052. Draft IEC62321. ICP-OES. EPA Method 3060A. Draft IEC62321. UV-VIS EPA Method 3540C. Draft IEC62321. GC/MS-D. EPA Method 3540C. Draft IEC62321. GC/MS-D. PPM 2695 PPM 23395 4128 27523 Weight (g) 1.00 E-04 PPM Weight (g) 5.00 E-04 PPM Weight (g) 4.80 E-05 9.00 E-06 3.00 E-06 6.00 E-05 PPM 11467 Chip Si Item Silver Epoxy Resin Aromatic Amine % of Chip 100 Die Attach % of Die Attach 80 15 5 Package Totals Weight (g) 8.72 E-03 57340 5505 1032 344 6881 PPM 1000000 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary CRS-RT-A Materials Declaration Package Body Size LeadCount Option Item SiO2 Resin Sb2O3 Brominated epoxy Carbon Black Subtotal Item Fe Ni Mn Co Si Cr Al Subtotal SOT 23 - Isolated Backside -3 Pb-free Molding Compound % of Compound 81.0 16.1 1.4 1.0 0.5 Leadframe % of Leadframe 56.7 41.5 0.8 0.5 0.3 0.1 0.1 Weight (g) 4.43 E-03 8.81 E-04 7.66 E-05 5.47 E-05 2.74 E-05 5.47 E-03 PPM 509169 101205 8800 6286 3143 628603 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected EPA Method 3052. ICP-OES Not Detected EPA Method 3052. ICP-OES Not Detected EPA Method 3052. ICP-OES Not Detected EPA Method 3060A & 7196A. UV-VIS Not Detected EPA Method 3550C/3540C. GC/MS. Not Detected EPA Method 3550C/3540C. GC/MS. Weight (g) 1.32 E-03 9.65 E-04 1.86 E-05 1.16 E-05 6.98 E-06 2.33 E-06 2.33 E-06 2.33 E-03 PPM 151576 110942 2139 1337 802 267 267 267330 Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3060A & 7196A. UV-VIS Not Detected EPA Method 3550C/3540C. GC/MS. Not Detected EPA Method 3550C/3540C. GC/MS. Ag Internal Leadframe Plating % of Plating Weight (g) 2.35 E-05 100 Sn External Leadframe Plating % of Plating Weight (g) 100 2.25 E-04 Item PPM 2701 PPM 25808 Au Bond Wires % of Wire 99.99 Weight (g) 1.00 E-04 PPM 11491 Si Chip % of Chip 100 Weight (g) 4.98 E-04 PPM 57172 Weight (g) 2.76 E-05 2.76 E-05 4.80 E-06 6.00 E-05 PPM Item Epoxy Resin Silicon Dioxide Curing Agent Subtotal Die Attach % of Die Attach 46 46 8 3172 3172 552 6895 Package Totals Weight (g) PPM 1000000 8.70 E-03 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size LeadCount Option Item SiO2 Resin Sb2O3 Brominated epoxy Carbon Black Subtotal Item Fe Ni Mn Co Si Cr Al Subtotal SOT 23 - Isolated Backside -3 with Pb Molding Compound % of Compound Weight (g) 81.0 4.43 E-03 16.1 8.81 E-04 1.4 7.66 E-05 1.0 5.47 E-05 0.5 2.74 E-05 5.47 E-03 PPM 508274 101027 8785 6275 3137 627498 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected EPA Method 3052. ICP-OES Not Detected EPA Method 3052. ICP-OES Not Detected EPA Method 3052. ICP-OES Not Detected EPA Method 3060A & 7196A. UV-VIS Not Detected EPA Method 3550C/3540C. GC/MS. Not Detected EPA Method 3550C/3540C. GC/MS. Leadframe % of Leadframe Weight (g) 56.7 1.32 E-03 41.5 9.65 E-04 0.8 1.86 E-05 0.5 1.16 E-05 0.3 6.98 E-06 0.1 2.33 E-06 0.1 2.33 E-06 2.33 E-03 PPM 151310 110747 2135 1334 801 267 267 266861 Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3060A & 7196A. UV-VIS Not Detected EPA Method 3550C/3540C. GC/MS. Not Detected EPA Method 3550C/3540C. GC/MS. Ag Internal Leadframe Plating % of Plating Weight (g) 2.35 E-05 100 Sn Pb Subtotal External Leadframe Plating % of Plating Weight (g) 85 2.04 E-04 15 3.60 E-05 2.40 E-04 Item PPM 2696 PPM 23392 4128 27520 Bond Wires Au % of Wire 99.99 Weight (g) 1.00 E-04 PPM Weight (g) 4.98 E-04 PPM 11470 Chip Si Item Epoxy Resin Silicon Dioxide Curing Agent Subtotal % of Chip 100 Die Attach % of Die Attach Weight (g) 46 2.76 E-05 46 2.76 E-05 8 4.80 E-06 6.00 E-05 Package Totals Weight (g) 8.72 E-03 57071 PPM 3166 3166 551 6883 PPM 1000000 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary