pdf

Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2
Resin
Sb2O3
Brominated epoxy
Carbon Black
Subtotal
Item
Fe
Ni
Mn
Co
Si
Cr
Al
Subtotal
Ag
Item
Sn
SOT 23
-3
Pb-free
Molding Compound
% of Compound
81.0
16.1
1.4
1.0
0.5
Molding Compound
Weight (g)
4.43 E-03
8.81 E-04
7.66 E-05
5.47 E-05
2.74 E-05
5.47 E-03
PPM
509009
101173
8798
6284
3142
628406
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Method
EPA Method 3052. Draft IEC62321. ICP-OES.
EPA Method 3052. Draft IEC62321. ICP-OES.
EPA Method 3052. Draft IEC62321. ICP-OES.
EPA Method 3060A. Draft IEC62321. UV-VIS
EPA Method 3540C. Draft IEC62321. GC/MS-D.
EPA Method 3540C. Draft IEC62321. GC/MS-D.
Weight (g)
1.32 E-03
9.65 E-04
1.86 E-05
1.16 E-05
6.98 E-06
2.33 E-06
2.33 E-06
2.33 E-03
PPM
151544
110918
2138
1336
802
267
267
267273
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Die Attach Paste
Method
EPA Method 3052. Draft IEC62321. ICP-OES.
EPA Method 3052. Draft IEC62321. ICP-OES.
EPA Method 3052. Draft IEC62321. ICP-OES.
EPA Method 3060A. Draft IEC62321. UV-VIS
EPA Method 3540C. Draft IEC62321. GC/MS-D.
EPA Method 3540C. Draft IEC62321. GC/MS-D.
Internal Leadframe Plating
Weight (g)
% of Plating
2.35 E-05
100
PPM
2700
External Leadframe Plating
% of Plating
Weight (g)
100
2.25 E-04
PPM
25800
Leadframe
% of Leadframe
56.7
41.5
0.8
0.5
0.3
0.1
0.1
Au
Bond Wires
% of Wire
99.99
Weight (g)
1.00 E-04
PPM
11487
Si
Chip
% of Chip
100
Weight (g)
5.00 E-04
PPM
57441
Weight (g)
4.80 E-05
9.00 E-06
3.00 E-06
6.00 E-05
PPM
5514
1034
345
6893
Item
Epoxy Resin
Silicon Dioxide
Aromatic Amine
Subtotal
Die Attach
% of Die Attach
80
15
5
Package Totals
Weight (g)
PPM
1000000
8.70 E-03
CRS-RT-E
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2
Epoxy Cresol Novolac
Phenol Novolac
Sb2O3
Brominated epoxy
Carbon black
Subtotal
SOT 23
-3
with Pb
Molding Compound
% of Compound
Weight (g)
67.20
3.68 E-03
20.00
1.09 E-03
7.00
3.83 E-04
3.00
1.64 E-04
2.50
1.37 E-04
0.30
1.64 E-05
5.47 E-03
Molding Compound
PPM
421542
125459
43911
18819
15682
1882
627294
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Method
EPA Method 3052. Draft IEC62321. ICP-OES.
EPA Method 3052. Draft IEC62321. ICP-OES.
EPA Method 3052. Draft IEC62321. ICP-OES.
EPA Method 3060A. Draft IEC62321. UV-VIS
EPA Method 3540C. Draft IEC62321. GC/MS-D.
EPA Method 3540C. Draft IEC62321. GC/MS-D.
Die Attach Paste
Item
Fe
Ni
Mn
Co
Si
Cr
Al
Subtotal
Leadframe
% of Leadframe
56.7
41.5
0.8
0.5
0.3
0.1
0.1
Weight (g)
1.32 E-03
9.65 E-04
1.86 E-05
1.16 E-05
6.98 E-06
2.33 E-06
2.33 E-06
2.33 E-03
Internal Leadframe Plating
% of Plating
Weight (g)
2.35 E-05
100
Ag
Item
Sn
Pb
Subtotal
Au
External Leadframe Plating
% of Plating
Weight (g)
85
2.04 E-04
15
3.60 E-05
2.40 E-04
Bond Wires
% of Wire
99.99
PPM
151276
110722
2134
1334
800
267
267
266801
Method
EPA Method 3052. Draft IEC62321. ICP-OES.
EPA Method 3052. Draft IEC62321. ICP-OES.
EPA Method 3052. Draft IEC62321. ICP-OES.
EPA Method 3060A. Draft IEC62321. UV-VIS
EPA Method 3540C. Draft IEC62321. GC/MS-D.
EPA Method 3540C. Draft IEC62321. GC/MS-D.
PPM
2695
PPM
23395
4128
27523
Weight (g)
1.00 E-04
PPM
Weight (g)
5.00 E-04
PPM
Weight (g)
4.80 E-05
9.00 E-06
3.00 E-06
6.00 E-05
PPM
11467
Chip
Si
Item
Silver
Epoxy Resin
Aromatic Amine
% of Chip
100
Die Attach
% of Die Attach
80
15
5
Package Totals
Weight (g)
8.72 E-03
57340
5505
1032
344
6881
PPM
1000000
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
CRS-RT-A
Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2
Resin
Sb2O3
Brominated epoxy
Carbon Black
Subtotal
Item
Fe
Ni
Mn
Co
Si
Cr
Al
Subtotal
SOT 23 - Isolated Backside
-3
Pb-free
Molding Compound
% of Compound
81.0
16.1
1.4
1.0
0.5
Leadframe
% of Leadframe
56.7
41.5
0.8
0.5
0.3
0.1
0.1
Weight (g)
4.43 E-03
8.81 E-04
7.66 E-05
5.47 E-05
2.74 E-05
5.47 E-03
PPM
509169
101205
8800
6286
3143
628603
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected
EPA Method 3052. ICP-OES
Not Detected
EPA Method 3052. ICP-OES
Not Detected
EPA Method 3052. ICP-OES
Not Detected
EPA Method 3060A & 7196A. UV-VIS
Not Detected
EPA Method 3550C/3540C. GC/MS.
Not Detected
EPA Method 3550C/3540C. GC/MS.
Weight (g)
1.32 E-03
9.65 E-04
1.86 E-05
1.16 E-05
6.98 E-06
2.33 E-06
2.33 E-06
2.33 E-03
PPM
151576
110942
2139
1337
802
267
267
267330
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Die Attach Paste
Method
PPM
Not Detected
EPA Method 3051A/3052. ICP-OES
Not Detected
EPA Method 3051A/3052. ICP-OES
Not Detected
EPA Method 3051A/3052. ICP-OES
Not Detected
EPA Method 3060A & 7196A. UV-VIS
Not Detected
EPA Method 3550C/3540C. GC/MS.
Not Detected
EPA Method 3550C/3540C. GC/MS.
Ag
Internal Leadframe Plating
% of Plating
Weight (g)
2.35 E-05
100
Sn
External Leadframe Plating
% of Plating
Weight (g)
100
2.25 E-04
Item
PPM
2701
PPM
25808
Au
Bond Wires
% of Wire
99.99
Weight (g)
1.00 E-04
PPM
11491
Si
Chip
% of Chip
100
Weight (g)
4.98 E-04
PPM
57172
Weight (g)
2.76 E-05
2.76 E-05
4.80 E-06
6.00 E-05
PPM
Item
Epoxy Resin
Silicon Dioxide
Curing Agent
Subtotal
Die Attach
% of Die Attach
46
46
8
3172
3172
552
6895
Package Totals
Weight (g)
PPM
1000000
8.70 E-03
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2
Resin
Sb2O3
Brominated epoxy
Carbon Black
Subtotal
Item
Fe
Ni
Mn
Co
Si
Cr
Al
Subtotal
SOT 23 - Isolated Backside
-3
with Pb
Molding Compound
% of Compound
Weight (g)
81.0
4.43 E-03
16.1
8.81 E-04
1.4
7.66 E-05
1.0
5.47 E-05
0.5
2.74 E-05
5.47 E-03
PPM
508274
101027
8785
6275
3137
627498
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected
EPA Method 3052. ICP-OES
Not Detected
EPA Method 3052. ICP-OES
Not Detected
EPA Method 3052. ICP-OES
Not Detected
EPA Method 3060A & 7196A. UV-VIS
Not Detected
EPA Method 3550C/3540C. GC/MS.
Not Detected
EPA Method 3550C/3540C. GC/MS.
Leadframe
% of Leadframe
Weight (g)
56.7
1.32 E-03
41.5
9.65 E-04
0.8
1.86 E-05
0.5
1.16 E-05
0.3
6.98 E-06
0.1
2.33 E-06
0.1
2.33 E-06
2.33 E-03
PPM
151310
110747
2135
1334
801
267
267
266861
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Die Attach Paste
Method
PPM
Not Detected
EPA Method 3051A/3052. ICP-OES
Not Detected
EPA Method 3051A/3052. ICP-OES
Not Detected
EPA Method 3051A/3052. ICP-OES
Not Detected
EPA Method 3060A & 7196A. UV-VIS
Not Detected
EPA Method 3550C/3540C. GC/MS.
Not Detected
EPA Method 3550C/3540C. GC/MS.
Ag
Internal Leadframe Plating
% of Plating
Weight (g)
2.35 E-05
100
Sn
Pb
Subtotal
External Leadframe Plating
% of Plating
Weight (g)
85
2.04 E-04
15
3.60 E-05
2.40 E-04
Item
PPM
2696
PPM
23392
4128
27520
Bond Wires
Au
% of Wire
99.99
Weight (g)
1.00 E-04
PPM
Weight (g)
4.98 E-04
PPM
11470
Chip
Si
Item
Epoxy Resin
Silicon Dioxide
Curing Agent
Subtotal
% of Chip
100
Die Attach
% of Die Attach
Weight (g)
46
2.76 E-05
46
2.76 E-05
8
4.80 E-06
6.00 E-05
Package Totals
Weight (g)
8.72 E-03
57071
PPM
3166
3166
551
6883
PPM
1000000
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary