Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Epoxy resin Phenol Resin Sb2O3 Brominated Resin Carbon Black Subtotal Item Cu Ni Si Mg Subtotal LQFP 7X7 48 Pb Free Molding Compound % of Compound 86 8 5 0.4 0.4 0.2 Leadframe % of Leadframe 96.2 3 0.65 0.15 Weight (g) 5.32 E-02 4.94 E-03 3.09 E-03 2.47 E-04 2.47 E-04 1.24 E-04 6.18 E-02 PPM 385996 35907 22442 1795 1795 898 448833 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected EPA Method 3051A /3052. ICP-OES Not Detected EPA Method 3051A /3052. ICP-OES Not Detected EPA Method 3051A /3052. ICP-OES Not Detected EPA Method 3060A & 7196A. UV-VIS Not Detected EPA Method 3540C/3550C. GC/MS Not Detected EPA Method 3540C/3550C. GC/MS Weight (g) 4.93 E-02 1.54 E-03 3.33 E-04 7.69 E-05 5.13 E-02 PPM 358195 11170 2420 559 372344 Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM Not Detected EPA Method 3051A /3052. ICP-OES Not Detected EPA Method 3051A /3052. ICP-OES Not Detected EPA Method 3051A /3052. ICP-OES Not Detected EPA Method 3060A & 7196A. UV-VIS Not Detected EPA Method 3540C/3550C. GC/MS Not Detected EPA Method 3540C/3550C. GC/MS Ag Internal Leadframe Plating % of Plating Weight (g) 8.00 E-04 100 Sn External Leadframe Plating Weight (g) % of Plating 100 2.50 E-03 Item PPM 5810 PPM 18155 Weight (g) 9.74 E-04 PPM Au Bond Wires % of Wire 99.99 Si Chip % of Chip 100 Weight (g) 1.85 E-02 PPM 134465 Weight (g) 1.36 E-03 4.77 E-04 1.83 E-03 PPM Item Ag Filler Resin Subtotal Die Attach % of Die Attach 74 26 7070 9859 3464 13323 Package Totals Weight (g) PPM 1000000 1.38 E-01 STS-ST-D Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Epoxy resin Phenol Resin Sb2O3 Brominated Resin Carbon Black Subtotal Item Cu Ni Si Mg Subtotal LQFP 7X7 48 Sn/Pb Molding Compound % of Compound Weight (g) 86 5.32 E-02 8 4.94 E-03 5 3.09 E-03 0.4 2.47 E-04 0.4 2.47 E-04 0.2 1.24 E-04 6.18 E-02 Leadframe % of Leadframe 96.2 3 0.65 0.15 Weight (g) 4.93 E-02 1.54 E-03 3.33 E-04 7.69 E-05 5.13 E-02 Ag Internal Leadframe Plating % of Plating Weight (g) 8.00 E-04 100 Sn Pb Subtotal External Leadframe Plating Weight (g) % of Plating 85 2.13 E-03 15 3.75 E-04 2.50 E-03 Item Bond Wires % of Wire 99.99 Au PPM 385996 35907 22442 1795 1795 898 448833 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected EPA Method 3051A /3052. ICP-OES Not Detected EPA Method 3051A /3052. ICP-OES Not Detected EPA Method 3051A /3052. ICP-OES Not Detected EPA Method 3060A & 7196A. UV-VIS Not Detected EPA Method 3540C/3550C. GC/MS Not Detected EPA Method 3540C/3550C. GC/MS PPM 358195 11170 2420 559 372344 Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM Not Detected EPA Method 3051A /3052. ICP-OES Not Detected EPA Method 3051A /3052. ICP-OES Not Detected EPA Method 3051A /3052. ICP-OES Not Detected EPA Method 3060A & 7196A. UV-VIS Not Detected EPA Method 3540C/3550C. GC/MS Not Detected EPA Method 3540C/3550C. GC/MS PPM 5810 PPM 15431 2723 18155 Weight (g) 9.74 E-04 PPM Weight (g) 1.85 E-02 PPM 134465 Weight (g) 1.36 E-03 4.77 E-04 1.83 E-03 PPM 7070 Chip % of Chip 100 Si Item Ag Filler Resin Subtotal Die Attach % of Die Attach 74 26 9859 3464 13323 Package Totals Weight (g) PPM 1000000 1.38 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary STS-ST-E