Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Byphenyl resin Phenol Resin Antimony_Sb2O3 Brominated Resin Subtotal Molding Compound % of Compound 85 9 5 0.5 0.5 Weight (g) 4.65 E-02 4.92 E-03 2.74 E-03 2.74 E-04 2.74 E-04 5.47 E-02 PPM 471229 49895 27719 2772 2772 554387 Weight (g) 3.02 E-02 9.41 E-04 2.04 E-04 4.71 E-05 3.14 E-02 PPM 305941 9541 2067 477 318026 Item Internal Leadframe Plating Weight (g) % of Plating 1.50 E-03 100 PPM 15186 Item External Leadframe Plating % of Plating Weight (g) 2.30 E-03 100 PPM 23310 Item Cu Ni Si Mg Subtotal Ag Sn Leadframe % of Leadframe 96.2 3 0.65 0.15 Item Bond Wires % of Wire 99.99 Weight (g) 1.10 E-03 PPM 11147 Item Chip % of Chip 100 Weight (g) 6.36 E-03 PPM 64437 Item Die Attach % of Die Attach 75 25 Weight (g) 1.00 E-03 3.33 E-04 1.33 E-03 PPM 10131 3377 13507 Au Si Ag Filler Resin Subtotal TSSOP 4.4 28 Pb-Free Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3060A & 7196A. UV-VIS. Not Detected EPA Method 3540C/3550C. GC/MS. Not Detected EPA Method 3540C/3550C. GC/MS. Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3060A & 7196A. UV-VIS. Not Detected EPA Method 3540C/3550C. GC/MS. Not Detected EPA Method 3540C/3550C. GC/MS. Package Totals PPM Weight (g) 1000000 9.87 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Byphenyl resin Phenol Resin Antimony_Sb2O3 Brominated Resin Subtotal Item Cu Ni Si Mg Subtotal Item Ag Item Sn Pb Subtotal Molding Compound % of Compound 85 9 5 0.5 0.5 Weight (g) 4.65 E-02 4.92 E-03 2.74 E-03 2.74 E-04 2.74 E-04 5.47 E-02 PPM 471229 49895 27719 2772 2772 554387 Weight (g) 3.02 E-02 9.41 E-04 2.04 E-04 4.71 E-05 3.14 E-02 PPM 305941 9541 2067 477 318026 Internal Leadframe Plating Weight (g) % of Plating 1.50 E-03 100 PPM 15186 External Leadframe Plating % of Plating Weight (g) 1.96 E-03 85 3.45 E-04 15 2.30 E-03 PPM 19813 3496 23310 Leadframe % of Leadframe 96.2 3 0.65 0.15 Item Bond Wires % of Wire 99.99 Weight (g) 1.10 E-03 PPM 11147 Item Chip % of Chip 100 Weight (g) 6.36 E-03 PPM 64437 Item Die Attach % of Die Attach 75 25 Weight (g) 1.00 E-03 3.33 E-04 1.33 E-03 PPM 10131 3377 13507 Au Si Ag Filler Resin TSSOP 4.4 28 Sn/Pb Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3060A & 7196A. UV-VIS. Not Detected EPA Method 3540C/3550C. GC/MS. Not Detected EPA Method 3540C/3550C. GC/MS. Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Die Attach Paste Method EPA Method 3051A/3052. ICP-OES EPA Method 3051A/3052. ICP-OES EPA Method 3051A/3052. ICP-OES EPA Method 3060A & 7196A. UV-VIS. EPA Method 3540C/3550C. GC/MS. EPA Method 3540C/3550C. GC/MS. Package Totals PPM Weight (g) 1000000 9.87 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary