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Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Byphenyl resin
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Subtotal
Molding Compound
% of Compound
85
9
5
0.5
0.5
Weight (g)
4.65 E-02
4.92 E-03
2.74 E-03
2.74 E-04
2.74 E-04
5.47 E-02
PPM
471229
49895
27719
2772
2772
554387
Weight (g)
3.02 E-02
9.41 E-04
2.04 E-04
4.71 E-05
3.14 E-02
PPM
305941
9541
2067
477
318026
Item
Internal Leadframe Plating
Weight (g)
% of Plating
1.50 E-03
100
PPM
15186
Item
External Leadframe Plating
% of Plating
Weight (g)
2.30 E-03
100
PPM
23310
Item
Cu
Ni
Si
Mg
Subtotal
Ag
Sn
Leadframe
% of Leadframe
96.2
3
0.65
0.15
Item
Bond Wires
% of Wire
99.99
Weight (g)
1.10 E-03
PPM
11147
Item
Chip
% of Chip
100
Weight (g)
6.36 E-03
PPM
64437
Item
Die Attach
% of Die Attach
75
25
Weight (g)
1.00 E-03
3.33 E-04
1.33 E-03
PPM
10131
3377
13507
Au
Si
Ag Filler
Resin
Subtotal
TSSOP
4.4
28
Pb-Free
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected EPA Method 3051A/3052. ICP-OES
Not Detected EPA Method 3051A/3052. ICP-OES
Not Detected EPA Method 3051A/3052. ICP-OES
Not Detected EPA Method 3060A & 7196A. UV-VIS.
Not Detected
EPA Method 3540C/3550C. GC/MS.
Not Detected
EPA Method 3540C/3550C. GC/MS.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Die Attach Paste
Method
PPM
Not Detected EPA Method 3051A/3052. ICP-OES
Not Detected EPA Method 3051A/3052. ICP-OES
Not Detected EPA Method 3051A/3052. ICP-OES
Not Detected EPA Method 3060A & 7196A. UV-VIS.
Not Detected
EPA Method 3540C/3550C. GC/MS.
Not Detected
EPA Method 3540C/3550C. GC/MS.
Package Totals
PPM
Weight (g)
1000000
9.87 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Byphenyl resin
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Subtotal
Item
Cu
Ni
Si
Mg
Subtotal
Item
Ag
Item
Sn
Pb
Subtotal
Molding Compound
% of Compound
85
9
5
0.5
0.5
Weight (g)
4.65 E-02
4.92 E-03
2.74 E-03
2.74 E-04
2.74 E-04
5.47 E-02
PPM
471229
49895
27719
2772
2772
554387
Weight (g)
3.02 E-02
9.41 E-04
2.04 E-04
4.71 E-05
3.14 E-02
PPM
305941
9541
2067
477
318026
Internal Leadframe Plating
Weight (g)
% of Plating
1.50 E-03
100
PPM
15186
External Leadframe Plating
% of Plating
Weight (g)
1.96 E-03
85
3.45 E-04
15
2.30 E-03
PPM
19813
3496
23310
Leadframe
% of Leadframe
96.2
3
0.65
0.15
Item
Bond Wires
% of Wire
99.99
Weight (g)
1.10 E-03
PPM
11147
Item
Chip
% of Chip
100
Weight (g)
6.36 E-03
PPM
64437
Item
Die Attach
% of Die Attach
75
25
Weight (g)
1.00 E-03
3.33 E-04
1.33 E-03
PPM
10131
3377
13507
Au
Si
Ag Filler
Resin
TSSOP
4.4
28
Sn/Pb
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected EPA Method 3051A/3052. ICP-OES
Not Detected EPA Method 3051A/3052. ICP-OES
Not Detected EPA Method 3051A/3052. ICP-OES
Not Detected EPA Method 3060A & 7196A. UV-VIS.
Not Detected
EPA Method 3540C/3550C. GC/MS.
Not Detected
EPA Method 3540C/3550C. GC/MS.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Die Attach Paste
Method
EPA Method 3051A/3052. ICP-OES
EPA Method 3051A/3052. ICP-OES
EPA Method 3051A/3052. ICP-OES
EPA Method 3060A & 7196A. UV-VIS.
EPA Method 3540C/3550C. GC/MS.
EPA Method 3540C/3550C. GC/MS.
Package Totals
PPM
Weight (g)
1000000
9.87 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary