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Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Biphenyl resin
Antimony_Sb2O3
Brominated Resin
Subtotal
Item
Cu
Ni
Si
Mg
Subtotal
Ag
Item
Sn
TSSOP
4.4
24
Pb-Free
Molding Compound
% of Compound
85
14.15
0.5
0.35
Weight (g)
3.66 E-02
6.03 E-03
2.15 E-04
1.51 E-04
4.30 E-02
PPM
446540
73548
2627
1839
524553
Weight (g)
2.68 E-02
8.37 E-04
1.81 E-04
4.19 E-05
2.79 E-02
PPM
327733
10220
2214
511
340679
Internal Leadframe Plating
% of Plating
Weight (g)
1.28 E-03
100
PPM
15678
External Leadframe Plating
Weight (g)
% of Plating
2.19 E-03
100
PPM
26732
Leadframe
% of Leadframe
96.2
3
0.65
0.15
Au
Bond Wires
% of Wire
99.99
Weight (g)
1.01 E-03
PPM
12327
Si
Chip
% of Chip
100
Weight (g)
5.22 E-03
PPM
63763
Weight (g)
1.00 E-03
2.67 E-04
6.66 E-05
1.33 E-03
PPM
12201
3254
813
16269
Item
Ag Filler
Resin
Aromatic Amine
Subtotal
Die Attach
% of Die Attach
75
20
5
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected EPA Method 3051A /3052. ICP-OES
Not Detected EPA Method 3051A /3052. ICP-OES
Not Detected EPA Method 3051A /3052. ICP-OES
Not Detected EPA Method 3060A & 7196A. UV-VIS
Not Detected EPA Method 3540C/3550C. GC/MS
Not Detected EPA Method 3540C/3550C. GC/MS
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Die Attach Paste
Method
PPM
Not Detected EPA Method 3051A /3052. ICP-OES
Not Detected EPA Method 3051A /3052. ICP-OES
Not Detected EPA Method 3051A /3052. ICP-OES
Not Detected EPA Method 3060A & 7196A. UV-VIS
Not Detected EPA Method 3540C/3550C. GC/MS
Not Detected EPA Method 3540C/3550C. GC/MS
Package Totals
PPM
Weight (g)
1000000
8.19 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Biphenyl resin
Antimony_Sb2O3
Brominated Resin
Subtotal
Item
Cu
Ni
Si
Mg
Subtotal
Ag
Item
Sn
Pb
Subtotal
TSSOP
4.4
24
Sn/Pb
Molding Compound
% of Compound
85
14.15
0.5
0.35
Weight (g)
3.66 E-02
6.03 E-03
2.15 E-04
1.51 E-04
4.30 E-02
PPM
446540
73548
2627
1839
524553
Weight (g)
2.68 E-02
8.37 E-04
1.81 E-04
4.19 E-05
2.79 E-02
PPM
327733
10220
2214
511
340679
Internal Leadframe Plating
% of Plating
Weight (g)
1.28 E-03
100
PPM
15678
External Leadframe Plating
Weight (g)
% of Plating
1.86 E-03
85
3.29 E-04
15
2.19 E-03
PPM
22722
4010
26732
Leadframe
% of Leadframe
96.2
3
0.65
0.15
Au
Bond Wires
% of Wire
99.99
Weight (g)
1.01 E-03
PPM
12327
Si
Chip
% of Chip
100
Weight (g)
5.22 E-03
PPM
63763
Weight (g)
1.00 E-03
2.67 E-04
6.66 E-05
1.33 E-03
PPM
12201
3254
813
16269
Item
Ag Filler
Resin
Aromatic Amine
Subtotal
Die Attach
% of Die Attach
75
20
5
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected EPA Method 3051A /3052. ICP-OES
Not Detected EPA Method 3051A /3052. ICP-OES
Not Detected EPA Method 3051A /3052. ICP-OES
Not Detected EPA Method 3060A & 7196A. UV-VIS
Not Detected EPA Method 3540C/3550C. GC/MS
Not Detected EPA Method 3540C/3550C. GC/MS
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Die Attach Paste
Method
EPA Method 3051A /3052. ICP-OES
EPA Method 3051A /3052. ICP-OES
EPA Method 3051A /3052. ICP-OES
EPA Method 3060A & 7196A. UV-VIS
EPA Method 3540C/3550C. GC/MS
EPA Method 3540C/3550C. GC/MS
Package Totals
PPM
Weight (g)
1000000
8.19 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary