Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Biphenyl resin Antimony_Sb2O3 Brominated Resin Subtotal Item Cu Ni Si Mg Subtotal Ag Item Sn TSSOP 4.4 24 Pb-Free Molding Compound % of Compound 85 14.15 0.5 0.35 Weight (g) 3.66 E-02 6.03 E-03 2.15 E-04 1.51 E-04 4.30 E-02 PPM 446540 73548 2627 1839 524553 Weight (g) 2.68 E-02 8.37 E-04 1.81 E-04 4.19 E-05 2.79 E-02 PPM 327733 10220 2214 511 340679 Internal Leadframe Plating % of Plating Weight (g) 1.28 E-03 100 PPM 15678 External Leadframe Plating Weight (g) % of Plating 2.19 E-03 100 PPM 26732 Leadframe % of Leadframe 96.2 3 0.65 0.15 Au Bond Wires % of Wire 99.99 Weight (g) 1.01 E-03 PPM 12327 Si Chip % of Chip 100 Weight (g) 5.22 E-03 PPM 63763 Weight (g) 1.00 E-03 2.67 E-04 6.66 E-05 1.33 E-03 PPM 12201 3254 813 16269 Item Ag Filler Resin Aromatic Amine Subtotal Die Attach % of Die Attach 75 20 5 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected EPA Method 3051A /3052. ICP-OES Not Detected EPA Method 3051A /3052. ICP-OES Not Detected EPA Method 3051A /3052. ICP-OES Not Detected EPA Method 3060A & 7196A. UV-VIS Not Detected EPA Method 3540C/3550C. GC/MS Not Detected EPA Method 3540C/3550C. GC/MS Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM Not Detected EPA Method 3051A /3052. ICP-OES Not Detected EPA Method 3051A /3052. ICP-OES Not Detected EPA Method 3051A /3052. ICP-OES Not Detected EPA Method 3060A & 7196A. UV-VIS Not Detected EPA Method 3540C/3550C. GC/MS Not Detected EPA Method 3540C/3550C. GC/MS Package Totals PPM Weight (g) 1000000 8.19 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Biphenyl resin Antimony_Sb2O3 Brominated Resin Subtotal Item Cu Ni Si Mg Subtotal Ag Item Sn Pb Subtotal TSSOP 4.4 24 Sn/Pb Molding Compound % of Compound 85 14.15 0.5 0.35 Weight (g) 3.66 E-02 6.03 E-03 2.15 E-04 1.51 E-04 4.30 E-02 PPM 446540 73548 2627 1839 524553 Weight (g) 2.68 E-02 8.37 E-04 1.81 E-04 4.19 E-05 2.79 E-02 PPM 327733 10220 2214 511 340679 Internal Leadframe Plating % of Plating Weight (g) 1.28 E-03 100 PPM 15678 External Leadframe Plating Weight (g) % of Plating 1.86 E-03 85 3.29 E-04 15 2.19 E-03 PPM 22722 4010 26732 Leadframe % of Leadframe 96.2 3 0.65 0.15 Au Bond Wires % of Wire 99.99 Weight (g) 1.01 E-03 PPM 12327 Si Chip % of Chip 100 Weight (g) 5.22 E-03 PPM 63763 Weight (g) 1.00 E-03 2.67 E-04 6.66 E-05 1.33 E-03 PPM 12201 3254 813 16269 Item Ag Filler Resin Aromatic Amine Subtotal Die Attach % of Die Attach 75 20 5 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected EPA Method 3051A /3052. ICP-OES Not Detected EPA Method 3051A /3052. ICP-OES Not Detected EPA Method 3051A /3052. ICP-OES Not Detected EPA Method 3060A & 7196A. UV-VIS Not Detected EPA Method 3540C/3550C. GC/MS Not Detected EPA Method 3540C/3550C. GC/MS Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Die Attach Paste Method EPA Method 3051A /3052. ICP-OES EPA Method 3051A /3052. ICP-OES EPA Method 3051A /3052. ICP-OES EPA Method 3060A & 7196A. UV-VIS EPA Method 3540C/3550C. GC/MS EPA Method 3540C/3550C. GC/MS Package Totals PPM Weight (g) 1000000 8.19 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary