Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Resin Sb2O3 Brominated Resin Subtotal Item Cu Fe Zn P Subtotal SOIC_W 300 mil 20 Pb-free Molding Compound % of Compound 87.0 10.9 1.5 0.6 Leadframe % of Leadframe 97.5 2.35 0.12 0.03 Weight (g) 3.22 E-01 4.04 E-02 5.55 E-03 2.22 E-03 3.70 E-01 PPM 564874 70771 9739 3895 649279 Weight (g) 1.65 E-01 3.98 E-03 2.03 E-04 5.10 E-05 1.69 E-01 PPM 289609 6980 356 89 297035 Item PPM Ag Internal Leadframe Plating Weight (g) % of Plating 2.01 E-03 100 Item PPM Sn External Leadframe Plating % of Plating Weight (g) 3.70 E-03 100 Item Weight (g) 7.67 E-04 PPM Item Si Chip % of Chip 100 Weight (g) 2.00 E-02 PPM 35142 Weight (g) 3.07 E-03 8.20 E-04 2.05 E-04 4.10 E-03 PPM Ag Filler Resin Aromatic Amine Subtotal Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected 6480 Au Die Attach % of Die Attach 75 20 5 PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected 3530 Bond Wires % of Wire 99.99 Item Item Pb Cd Hg Cr+6 PBB PBDE 1345 5391 1438 360 7189 Package Totals PPM Weight (g) 1000000 5.70 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liab any inaccuracy of such information. ADI Proprietary Molding Compound Method EPA Method 3051/3052. ICP-OES EPA Method 3051/3052. ICP-OES EPA Method 3051/3052. ICP-OES EPA Method 3060A & 7196A. UV-VIS. EPA Method 3550/3540C. GC/MS. EPA Method 3550/3540C. GC/MS. Die Attach Paste Method EPA Method 3051/3052. ICP-OES EPA Method 3051/3052. ICP-OES EPA Method 3051/3052. ICP-OES EPA Method 3060A & 7196A. UV-VIS. EPA Method 3550/3540C. GC/MS. EPA Method 3550/3540C. GC/MS. AMK-RW-F bility to Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Resin Sb2O3 Brominated Resin Subtotal Item Cu Fe Zn P Subtotal SOIC_W 300 mil 20 SnPb Molding Compound % of Compound 85 14.2 0.5 0.35 Leadframe % of Leadframe 97.5 2.35 0.12 0.03 Weight (g) 3.22 E-01 4.04 E-02 5.55 E-03 2.22 E-03 3.70 E-01 PPM 564573 70734 9733 3893 648933 Weight (g) 1.65 E-01 3.98 E-03 2.03 E-04 5.10 E-05 1.69 E-01 PPM 289455 6976 356 89 296876 Ag Internal Leadframe Plating Weight (g) % of Plating 2.01 E-03 100 Sn Pb Subtotal External Leadframe Plating % of Plating Weight (g) 3.40 E-03 85 6.00 E-04 15 4.00 E-03 Item Item Item Au Item Si Item Ag Filler Resin Aromatic Amine Subtotal PPM PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected 3528 PPM 5958 1052 7010 Bond Wires % of Wire 99.99 Weight (g) 7.67 E-04 PPM Chip % of Chip 100 Weight (g) 2.00 E-02 PPM 35123 Weight (g) 3.07 E-03 8.20 E-04 2.05 E-04 4.10 E-03 PPM Die Attach % of Die Attach 75 20 5 Item Pb Cd Hg Cr+6 PBB PBDE 1344 5388 1437 359 7185 Package Totals PPM Weight (g) 1000000 5.71 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liabi any inaccuracy of such information. ADI Proprietary Molding Compound Method EPA Method 3051/3052. ICP-OES EPA Method 3051/3052. ICP-OES EPA Method 3051/3052. ICP-OES EPA Method 3060A & 7196A. UV-VIS. EPA Method 3550/3540C. GC/MS. EPA Method 3550/3540C. GC/MS. Die Attach Paste Method EPA Method 3051/3052. ICP-OES EPA Method 3051/3052. ICP-OES EPA Method 3051/3052. ICP-OES EPA Method 3060A & 7196A. UV-VIS. EPA Method 3550/3540C. GC/MS. EPA Method 3550/3540C. GC/MS. AMK-RW-A lity to