Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Epoxy Resin Phenol Resin Sb2O3 Subtotal Item Cu Ni Si Mg Subtotal Ag Item Sn TQFP 7 X 7 X 1.0 32 Pb-free Molding Compound % of Compound 82.5 8 8 1.5 Weight (g) 7.13 E-02 6.91 E-03 6.91 E-03 1.30 E-03 8.64 E-02 PPM 523716 50781 50781 9519 634796 Weight (g) 4.00 E-02 1.25 E-03 2.70 E-04 6.20 E-05 4.16 E-02 PPM 293969 9166 1983 455 305573 Internal Leadframe Plating % of Plating Weight (g) 4.12 E-04 100 PPM 3026 External Leadframe Plating % of Plating Weight (g) 3.62 E-03 100 PPM 26610 Leadframe % of Leadframe 96.2 3 0.65 0.15 Au Bond Wires % of Wire 99.99 Weight (g) 5.46 E-04 PPM 4010 Si Chip % of Chip 100 Weight (g) 2.81 E-03 PPM 20638 Weight (g) 5.49 E-04 1.37 E-04 2.10 E-05 2.10 E-05 7.28 E-04 PPM 4032 1006 154 154 5347 Item Ag Epoxy resin Gamma Butyrolactone Curing agent & hardener Subtotal Die Attach % of Die Attach 75.47 18.87 2.83 2.83 Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Molding Compound Method EPA 3051/3052. ICP-OES EPA 3051/3052. ICP-OES EPA 3051/3052. ICP-OES USEPA 3060A & 7196A. UV-VIS. USEPA 3540C/3550C.Analysis was performed by GC/MS. USEPA 3540C/3550C.Analysis was performed by GC/MS. Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Die Attach Paste Method EPA 3051/3052. ICP-OES EPA 3051/3052. ICP-OES EPA 3051/3052. ICP-OES USEPA 3060A & 7196A. UV-VIS. USEPA 3540C/3550C.Analysis was performed by GC/MS. USEPA 3540C/3550C.Analysis was performed by GC/MS. Package Totals PPM Weight (g) 1000000 1.36 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Epoxy Resin Phenol Resin Sb2O3 Item Cu Ni Si Mg TQFP 7 X 7 X 1.0 32 SnPb Molding Compound % of Compound 82.5 8 8 1.5 Leadframe % of Leadframe 96.2 3 0.65 0.15 Weight (g) 7.13 E-02 6.91 E-03 6.91 E-03 1.30 E-03 8.64 E-02 PPM 523716 50781 50781 9519 634796 Weight (g) 4.00 E-02 1.25 E-03 2.70 E-04 6.20 E-05 4.16 E-02 PPM 293969 9166 1983 455 305573 Internal Leadframe Plating % of Plating Weight (g) 4.12 E-04 100 Ag Item Sn Pb External Leadframe Plating % of Plating Weight (g) 3.08 E-03 85 5.43 E-04 15 3.62 E-03 PPM Molding Compound Method EPA 3051/3052. ICP-OES EPA 3051/3052. ICP-OES EPA 3051/3052. ICP-OES USEPA 3060A & 7196A. UV-VIS. USEPA 3540C/3550C.Analysis was performed by GC/MS. USEPA 3540C/3550C.Analysis was performed by GC/MS. Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Die Attach Paste Method EPA 3051/3052. ICP-OES EPA 3051/3052. ICP-OES EPA 3051/3052. ICP-OES USEPA 3060A & 7196A. UV-VIS. USEPA 3540C/3550C.Analysis was performed by GC/MS. USEPA 3540C/3550C.Analysis was performed by GC/MS. PPM 22621 3988 26610 Bond Wires % of Wire 99.99 Weight (g) 5.46 E-04 PPM Si Chip % of Chip 100 Weight (g) 2.81 E-03 PPM 20638 Weight (g) 5.49 E-04 1.37 E-04 2.10 E-05 2.10 E-05 7.28 E-04 PPM Die Attach % of Die Attach 75.47 18.87 2.83 2.83 PPM None Detected None Detected None Detected None Detected None Detected None Detected 3026 Au Item Ag Epoxy resin Gamma Butyrolactone Curing agent & hardener Item Pb Cd Hg Cr+6 PBB PBDE 4010 4032 1006 154 154 5347 Package Totals PPM Weight (g) 1000000 1.36 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary