pdf

Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Epoxy Resin
Phenol Resin
Sb2O3
Subtotal
Item
Cu
Ni
Si
Mg
Subtotal
Ag
Item
Sn
TQFP
7 X 7 X 1.0
32
Pb-free
Molding Compound
% of Compound
82.5
8
8
1.5
Weight (g)
7.13 E-02
6.91 E-03
6.91 E-03
1.30 E-03
8.64 E-02
PPM
523716
50781
50781
9519
634796
Weight (g)
4.00 E-02
1.25 E-03
2.70 E-04
6.20 E-05
4.16 E-02
PPM
293969
9166
1983
455
305573
Internal Leadframe Plating
% of Plating
Weight (g)
4.12 E-04
100
PPM
3026
External Leadframe Plating
% of Plating
Weight (g)
3.62 E-03
100
PPM
26610
Leadframe
% of Leadframe
96.2
3
0.65
0.15
Au
Bond Wires
% of Wire
99.99
Weight (g)
5.46 E-04
PPM
4010
Si
Chip
% of Chip
100
Weight (g)
2.81 E-03
PPM
20638
Weight (g)
5.49 E-04
1.37 E-04
2.10 E-05
2.10 E-05
7.28 E-04
PPM
4032
1006
154
154
5347
Item
Ag
Epoxy resin
Gamma Butyrolactone
Curing agent & hardener
Subtotal
Die Attach
% of Die Attach
75.47
18.87
2.83
2.83
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Molding Compound
Method
EPA 3051/3052. ICP-OES
EPA 3051/3052. ICP-OES
EPA 3051/3052. ICP-OES
USEPA 3060A & 7196A. UV-VIS.
USEPA 3540C/3550C.Analysis was performed by GC/MS.
USEPA 3540C/3550C.Analysis was performed by GC/MS.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Die Attach Paste
Method
EPA 3051/3052. ICP-OES
EPA 3051/3052. ICP-OES
EPA 3051/3052. ICP-OES
USEPA 3060A & 7196A. UV-VIS.
USEPA 3540C/3550C.Analysis was performed by GC/MS.
USEPA 3540C/3550C.Analysis was performed by GC/MS.
Package Totals
PPM
Weight (g)
1000000
1.36 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Epoxy Resin
Phenol Resin
Sb2O3
Item
Cu
Ni
Si
Mg
TQFP
7 X 7 X 1.0
32
SnPb
Molding Compound
% of Compound
82.5
8
8
1.5
Leadframe
% of Leadframe
96.2
3
0.65
0.15
Weight (g)
7.13 E-02
6.91 E-03
6.91 E-03
1.30 E-03
8.64 E-02
PPM
523716
50781
50781
9519
634796
Weight (g)
4.00 E-02
1.25 E-03
2.70 E-04
6.20 E-05
4.16 E-02
PPM
293969
9166
1983
455
305573
Internal Leadframe Plating
% of Plating
Weight (g)
4.12 E-04
100
Ag
Item
Sn
Pb
External Leadframe Plating
% of Plating
Weight (g)
3.08 E-03
85
5.43 E-04
15
3.62 E-03
PPM
Molding Compound
Method
EPA 3051/3052. ICP-OES
EPA 3051/3052. ICP-OES
EPA 3051/3052. ICP-OES
USEPA 3060A & 7196A. UV-VIS.
USEPA 3540C/3550C.Analysis was performed by GC/MS.
USEPA 3540C/3550C.Analysis was performed by GC/MS.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Die Attach Paste
Method
EPA 3051/3052. ICP-OES
EPA 3051/3052. ICP-OES
EPA 3051/3052. ICP-OES
USEPA 3060A & 7196A. UV-VIS.
USEPA 3540C/3550C.Analysis was performed by GC/MS.
USEPA 3540C/3550C.Analysis was performed by GC/MS.
PPM
22621
3988
26610
Bond Wires
% of Wire
99.99
Weight (g)
5.46 E-04
PPM
Si
Chip
% of Chip
100
Weight (g)
2.81 E-03
PPM
20638
Weight (g)
5.49 E-04
1.37 E-04
2.10 E-05
2.10 E-05
7.28 E-04
PPM
Die Attach
% of Die Attach
75.47
18.87
2.83
2.83
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
3026
Au
Item
Ag
Epoxy resin
Gamma Butyrolactone
Curing agent & hardener
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
4010
4032
1006
154
154
5347
Package Totals
PPM
Weight (g)
1000000
1.36 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary