MBR8H100MFS, NRVB8H100MFS Switch Mode Power Rectifiers Features • Low Power Loss / High Efficiency • New Package Provides Capability of Inspection and Probe After • • • • • • Board Mounting Guardring for Stress Protection Low Forward Voltage Drop 175°C Operating Junction Temperature WF Suffix for Products with Wettable Flanks NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These are Pb−Free Devices www.onsemi.com SCHOTTKY BARRIER RECTIFIERS 8 AMPERES 100 VOLTS 5,6 1,2,3 MARKING DIAGRAM Mechanical Characteristics: • • • • • Case: Epoxy, Molded Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in. Lead Finish: 100% Matte Sn (Tin) Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds Device Meets MSL 1 Requirements MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 100 Average Rectified Forward Current (Rated VR, TC = 165°C) IF(AV) 8.0 A Peak Repetitive Forward Current, (Rated VR, Square Wave, 20 kHz, TC = 162°C) IFRM 16 A Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM 75 A Storage Temperature Range Tstg −65 to +175 °C Operating Junction Temperature TJ −55 to +175 °C Unclamped Inductive Switching Energy (10 mH Inductor, Non−repetitive) EAS 75 mJ 3B ESD Rating (Machine Model) M4 A SO−8 FLAT LEAD CASE 488AA STYLE 2 B8H100 A Y W ZZ A C B8H100 AYWZZ C Not Used = Specific Device Code = Assembly Location = Year = Work Week = Lot Traceability ORDERING INFORMATION Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. NOTE: The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RJA August, 2015 − Rev. 2 1 V ESD Rating (Human Body Model) © Semiconductor Components Industries, LLC, 2015 A 1 Device Package Shipping† MBR8H100MFST1G SO−8 FL 1500 / (Pb−Free) Tape & Reel MBR8H100MFST3G SO−8 FL 5000 / (Pb−Free) Tape & Reel NRVB8H100MFST1G SO−8 FL 1500 / (Pb−Free) Tape & Reel NRVB8H100MFST3G SO−8 FL 5000 / (Pb−Free) Tape & Reel NRVB8H100MFSWFT1G SO−8 FL 1500 / (Pb−Free) Tape & Reel NRVB8H100MFSWFT3G SO−8 FL 5000 / (Pb−Free) Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: MBR8H100MFS/D MBR8H100MFS, NRVB8H100MFS THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction−to−Case, Steady State (Assumes 600 mm2 1 oz. copper bond pad, on a FR4 board) Symbol Typ Max Unit RθJC − 2.2 °C/W 0.68 0.81 0.76 0.90 180 0.06 300 2 ELECTRICAL CHARACTERISTICS Instantaneous Forward Voltage (Note 1) (iF = 8 Amps, TJ = 125°C) (iF = 8 Amps, TJ = 25°C) vF Instantaneous Reverse Current (Note 1) (Rated dc Voltage, TJ = 125°C) (Rated dc Voltage, TJ = 25°C) iR V mA 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. TYPICAL CHARACTERISTICS 100 TA = 175°C 1 150°C 125°C 25°C 0.1 0 IR, INSTANTANEOUS REVERSE CURRENT (A) iF, INSTANTANEOUS FORWARD CURRENT (A) 10 0.2 −40°C 0.4 0.6 10 TA = 175°C 150°C 1 125°C 25°C 0.1 1.2 1.0 0.8 0 0.2 0.4 −40°C 0.8 0.6 1.0 1.2 VF, INSTANTANEOUS FORWARD VOLTAGE (V) VF, INSTANTANEOUS FORWARD VOLTAGE (V) Figure 1. Typical Instantaneous Forward Characteristics Figure 2. Maximum Instantaneous Forward Characteristics 1.E+00 IR, INSTANTANEOUS REVERSE CURRENT (A) iF, INSTANTANEOUS FORWARD CURRENT (A) 100 1.E+00 1.E−01 1.E−02 1.E−01 1.E−02 TA = 175°C 1.E−03 TA = 150°C TA = 125°C 1.E−04 1.E−05 1.E−06 1.E−07 TA = 175°C 1.E−03 TA = 150°C TA = 125°C 1.E−04 1.E−05 1.E−06 TA = 25°C 1.E−08 1.E−09 1.E−10 1.E−11 1.E−12 1.E−07 TA = 25°C 1.E−08 1.E−09 TA = −40°C 0 10 20 30 TA = −40°C 1.E−10 1.E−11 40 50 60 70 80 90 100 0 10 20 30 40 50 60 70 80 90 100 VR, INSTANTANEOUS REVERSE VOLTAGE (V) VR, INSTANTANEOUS REVERSE VOLTAGE (V) Figure 3. Typical Reverse Characteristics Figure 4. Maximum Reverse Characteristics www.onsemi.com 2 MBR8H100MFS, NRVB8H100MFS TYPICAL CHARACTERISTICS 20 TJ = 25°C 18 IF(AV), AVERAGE FORWARD CURRENT (A) C, JUNCTION CAPACITANCE (pF) 1,000 100 16 14 dc 12 10 Square Wave 8 6 4 RqJC = 2.2°C/W 2 0 10 0 10 20 30 40 60 50 70 80 90 60 100 80 100 120 140 VR, REVERSE VOLTAGE (V) TC, CASE TEMPERATURE (°C) Figure 5. Typical Junction Capacitance Figure 6. Current Derating 160 PF(AV), AVERAGE FORWARD POWER DISSIPATION (W) 8 IPK/IAV = 20 TJ = 175°C 7 IPK/IAV = 10 6 IPK/IAV = 5 5 4 3 Square Wave 2 dc 1 0 0 1 2 3 4 IF(AV), AVERAGE FORWARD CURRENT (A) Figure 7. Forward Power Dissipation 100 R(t) (°C/W) 10 1 50% Duty Cycle 20% 10% 5% 2% 1% 0.1 Assumes 25°C ambient and soldered to a 600 mm2 − oz copper pad on PCB Single Pulse 0.01 0.001 0.000001 0.00001 0.0001 0.001 0.01 0.1 PULSE TIME (sec) Figure 8. Thermal Response www.onsemi.com 3 1 10 100 1,000 MBR8H100MFS, NRVB8H100MFS PACKAGE DIMENSIONS DFN6 5x6, 1.27P (SO8 FL) CASE 488AA ISSUE M 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION D1 AND E1 DO NOT INCLUDE MOLD FLASH PROTRUSIONS OR GATE BURRS. 0.20 C D A 2 B D1 2X 0.20 C 4X E1 q E 2 c 1 2 3 DIM A A1 b c D D1 D2 E E1 E2 e G K L L1 M q A1 4 TOP VIEW C SEATING PLANE DETAIL A 0.10 C A 0.10 C DETAIL A 2X 0.495 0.10 0.05 c STYLE 2: PIN 1. ANODE 2. ANODE 3. ANODE 4. NO CONNECT 5. CATHODE RECOMMENDED SOLDERING FOOTPRINT* SIDE VIEW b C A B MILLIMETERS MIN NOM MAX 0.90 1.00 1.10 0.00 −−− 0.05 0.33 0.41 0.51 0.23 0.28 0.33 5.00 5.15 5.30 4.70 4.90 5.10 3.80 4.00 4.20 6.00 6.30 6.15 5.70 5.90 6.10 3.45 3.65 3.85 1.27 BSC 0.51 0.575 0.71 1.20 1.35 1.50 0.51 0.575 0.71 0.125 REF 3.00 3.40 3.80 0_ −−− 12 _ 4.560 2X 8X 1.530 e/2 e L 1 4 3.200 4.530 K E2 PIN 5 (EXPOSED PAD) L1 M 1.330 2X 0.905 1 0.965 G D2 4X BOTTOM VIEW 1.000 4X 0.750 1.270 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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